Microcool general liquid cooling presentation 10215

Micro Deformation Technology

MicroCool® Liquid Cooling Overview Presentation

October 2015

Who is Wolverine?

A Rich History, A Solid Foundation, A Bold Future− Wolverine has 90+ years history with decades long customer partnerships

− In 1935, Wolverine invented the first high performance heat transfer tubes and revolutionized the HVAC commercial chiller industry

− Wolverine is the premier heat transfer design partner for OEM’s

− Metal Joining, Brazing Products, Tubular Assembly

− Global core markets served: HVAC, Refrigeration & Appliance, Water Heater/Boiler, Process & Chemical, Electronics Cooling

2Wolverine - MicroCool Confidential 2015

Global Customer Partnerships

Wolverine - MicroCool Confidential 20153

Wolverine Operations


Global Locations

San Diego, CA

Bend, OR

Rapid City, SD

Decatur, AL

Shanghai, China

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MicroCool Division

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WLV MicroCool division has taken the same deformation process used on tubes and adapted it be used on flat plates.

The flat plate surface enhancement range has been optimized to suit liquid cooling of electronics.

Leveraging Wolverine's core high temperature joining and fabricated assembly technologies they can turn these enhanced surfaces into complete cold plate assemblies.

MicroCool is able to create custom, cost effective, high performance mezzo and micro channel cold plates quickly and with a high degree of flexibility.

Enhanced Tube Enhanced Flat Surface


MDT – Micro Deformation Technology

•Patented tooling and process.

•Work piece is cut, deformed and stretched by up to 150%.

•No loss of material during the fining operation.

•Fining is done without the addition of heat and can be done

without lubrication if needed.

•Little tooling or setup required, similar to CNC machining.


MDT Flexibility

Fins per inch: 650-8 (255-3 Fins/Centimeter) Fin thickness to fin gap ratio: 1:1 – 1:3 Fin height to fin thickness ratio up to 15:1 Max fin gap: 1.2mm + Pins can be formed in either an in-line or staggered pattern. Pin diameter and gap vary from 1mm to 0.5mm Pin height to diameter ratio up to 8:1 Fins or pins can be applied over large surfaces up to 1X1 meter Fins or pins can be added in specific “island” locations or on across entire surface All of these options can be varied with little to no setup or tooling (a customer could

easily try multiples of different fin or pin geometries with one fixture)

150 fins per inch (60 f/cm)1mm tall

12 fins per inch (5 f/cm)5 mm tall

GapThk

ExamplePin array


MDT Geometry Options - Fins

4mm tall50 fpi.25mm thk.25 mm gap

4mm tall25 fpi.5 mm thk.5 mm gap

Common Fin Pitches

200 fpi = 0.0625mm thk100 fpi = 0.125mm thk50 fpi = 0.25mm thk25 fpi = 0.5mm thk12 fpi = 1.0mm thk

•Fins can be created in both copper and aluminum•Fins can have knife edge or be flat (see above)•Fins can be straight or slightly curved (see above)•Back-wall minimum thickness 1mm•Fin thickness to gap normally 1:1 but can vary

Design Flexibility


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MDT Geometry Options – Pins

Staggered Pin~1mm gap

In-line Pin~1mm gap

•Pins can be staggered or in-line

•Pins can be created from 12 FPI to 200fpi, [20fpi (0.5mm) shown to the left)]

•Pins can be created on both aluminum and copper.

•Pins can have pointed or flat tops (see above)


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MDT Material Options

Copper

C110 C101 Most copper

alloys

Aluminum 1000 series 3000 series 5000 series 6000 series* 7000 series*

Other Clad Metals CuNi Steel* Titanium* Plastics Brass CTE

materials**

* More difficult **Limited success with current materials but open to R&D of new materials


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Power Electronic Coldplates

2015

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MicroCool’s standard liquid cooled IGBT coldplates are designed to fit most of the common IGBT configurations used today. At the heart of each MicroCool® cold plate is our patented MDT in line pin fin surfaces. CFD optimized for balanced flow for parallel cooling. The MicroCool 3000 Series has unmatched performance and price. Visit our On-Line Store to purchase any of these standard.

MicroCool’s® parallel cooling and flow balancing system provides best in class performance and uniform IGBT temperature

MicroCool’s® MDT™ geometry is strategically placed under high heat flux areas to maximize heat transfer coefficient and minimized wasted flow.

MDT In-Line Pin Fin ™ offers the best thermal performance per pressure drop while maintaining a 1mm flow gap on the market today

MicroCool 3000 Series Standard Coldplates


http://www.microcooling.com/technology/micro-deformation-technology

http://www.microcooling.com/cold-plate-products/3000-series-plate-series



MicroCool’s 3000 Series standard coldplates are built around a set of 4 standard extrusions. This reduces cost and increases volume manufacturability.



4 Different aluminum extrusion sizes to fit 90% of the power modules on the market today.

Balanced parallel flow path

FSW plugs

Friction stir welded construction

MicroCool’s standard liquid cooled IGBT coldplates are designed to fit most of the common IGBT configurations used today. At the heart of each MicroCool® cold plate is our patented MDT in line pin fin surfaces. CFD optimized for balanced flow for parallel cooling. The MicroCool 2000 Series has unmatched performance and design flexibility. Visit our On-Line Store to purchase any of these standard.

MicroCool’s® parallel cooling and flow balancing system provides best in class performance and uniform IGBT temperature

MicroCool’s® MDT™ geometry is strategically placed under high heat flux areas to maximize heat transfer coefficient and minimized wasted flow.

MDT In-Line Pin Fin ™ offers the best thermal performance per pressure drop while maintaining a 1mm flow gap on the market today




http://www.microcooling.com/cold-plate-products/2000-series-standard-cold-plates



MicroCool’s 2000 Series Standard Coldplate design is very similar to the 3000 Series.



While the same fin plate is used a machined tub is made versus an extrusion. While this design is more expensive it allows for more flexibility in use.

2000 Series Semi-Custom Coldplates


Performance Graphs

Coolant used: Water

Thermal Resistance is calculated as the difference from maximum coldplate temperature to the inlet temperature coldplate temp divided by the total power on the coldplate.

Pressure drop is calculated from inlet to outlet and includes a Parker 05TB-6-6 barbed fitting.

*Performance data based off empirical testing of CP-3004XP.

MDT STD In-line pin fin:• 4mm tall • 12 fin per inch• 1mm min gap• Twisted in line pin

MDT XP In-line pin fin:• 4mm tall • 20 fin per inch• 0.5mm min gap• Twisted in line pin

Standard Coldplate Performance and Specifications

Specifications

Material: 6061 (tub), 1100 (fin area)Ports: 9/16-18 UNF-2B SAE-J1926/1 Pressure: tested to 80 psiSurface: 0.8umFlatness: 0.25/25.4mm

Semi-Standard Options

Fitting type and location (NPT, BSPP)Light weight options (remove excess material)Double sided coolingCopper options

Visit us on-line to see our full list of

Semi Standard and custom coldplate

options

www.microcooling.com


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Performance Graphs

Coolant used: Water

Thermal Resistance is calculated as the difference from maximum coldplate temperature to the inlet temperature coldplate temp divided by the total power on the coldplate.

Pressure drop is calculated from inlet to outlet and includes a Parker 05TB-6-6 barbed fitting.

*Performance data based off empirical testing of CP3010XP.

MDT STD In-line pin fin:• 4mm tall • 12 fin per inch• 1mm min gap• Twisted in line pin

MDT XP In-line pin fin:• 4mm tall • 20 fin per inch• 0.5mm min gap• Twisted in line pin

Standard Coldplate Performance and Specifications

Specifications

Material: 6061 (tub), 1100 (fin area)Ports: 9/16-18 UNF-2B SAE-J1926/1 Pressure: tested to 80 psiSurface: 0.8umFlatness: 0.25/25.4mm

Semi-Standard Options

Fitting type and location (NPT, BSPP)Light weight options (remove excess material)Double sided coolingCopper options

Visit us on-line to see our full list of

Semi Standard and custom coldplate

options

www.microcooling.com


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Custom Coldplates

Let MicroCool® develop a custom, micro-channel cold plate for your specific application by providing you a design that becomes your unique solution. Our engineers will build a custom cold plate cooling solution designed to achieve your performance requirements by using our patented Micro Deformation Technology (MDT), which is highly flexible and can create a wide variety of fin, pin and micro-channel geometries.


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Custom Power Electronic Applications


Power Electronic MicroCool® Product Evolution

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MicroCool®

Integrated base plateMicroCool®

Advanced cold plateMicroCool®-DBC™ Direct Cooled Chip


Automotive Baseplate - CFD fin and pin optimization

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•10 fins per inch•Fin height: 5 mm•Fin thickness: 1.27 mm•Fin gap: 1.27 mm

•8 fins per in /w 90 ° x-cut•Fin height: 5 mm - 6mm•Fin thickness: 1 - 1.6 mm•Fin gap: 1 - 1.6 mm

CFD analysis data comparing different fin structures to meet customer challenging requirements:

•Cool 92 W/cm2 with a 20°C temp rise from the coolant to the coldplate surface

•Thermal resistance less than 0.12 c/w

•Maintain a pressure drop of less than 1.5psi (0.103 bar)

•Maintain a gap between the fins greater than 1mm to prevent particulates from blocking the flow channels


Automotive Baseplate - Contour Plots: In-Line Pin Fin 6mm Tall - 5l/min

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•6mm tall spiral pin fins, 8fpi•Flush with cover

39.240.141.5

42.543.344.2

Thermal Resistance: .115 c/w


Aluminum Comparison of MicroCool® to Folded Fin

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MicroCool Straight Fin•8 FPI •4mm tall•1.5mm fin •1.5mm gaps

MicroCool Staggered Pin•8 FPI•4mm tall•1.5mm fin•1.5mm gaps

MicroCool In-Line Pin•8 FPI•4mm tall•1.5mm fin•1.5mm gaps

Brazed Folded Fin•4mm tall•Offset Folded Fin •0.05mm fin thickness•2mm min gap

Not Tested


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0.010

0.020

0.030

0.040

0.050

0.060

0.5 1.0 1.5 2.0 2.5 3.0

Ther

mal

Res

itanc

e (C

/W)

Pressure Drop (PSI)

Thermal Resistance per Pressure Drop

Aluminum Folded Fin

MicroCool™ Aluminum Straight Fin 12fpi

MicroCool™ Aluminum In-Line Pin Fin 8fpi

For the same amout of pressure drop the coldplates with MicroCoolTM MDT surfaces have a much lower thermal resistance. For example: At 1psi pressure drop the folded fin coldplate has a thermal resistence of about 0.049 C/W and for the same pressure drop the MicroCool Straight Fin has about 0.026 C/W thermal resistance. This is over 1.8X better, at a



MicroCool-CAP™ integrated base plate with metal cover

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Heatsink or coldplate

MicroCool®Integrated base plate

MicroCool®advanced cold plate


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MicroCool® Cap for Maximum Power Density

• Size, Weight, Power• Reduces thermal resistance by eliminating TIM and extra copper thickness• No need for customer to purchase as cooling solution. • Integrated baseplate with cover eliminates the need for customer to design a “tub” and

customer designed o-ring seal.• Since its all copper construction it eliminates the corrosion issues between copper

baseplate and dissimilar metal covers.• This design allows use of a hot fluid to solder die to the baseplate/coldplate.• Bottom area of coldplate normally reserved as a cooling surface can now be used for

power or other connections.


Wolverine MicroCool Confidential 201128

Plastic IGBT Module Cover

IGBT/Diodes/Electronics

Liquid Cooled Copper MicroCool Baseplate with Cover

Snap-in Plastic Bottom Cover

Concept Exploded View

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3 Phase Inverter Example – Thermal Performance

30 to 50% improvement in thermal performance



MicroCool®-CLAD™ integrated base plate with clad metal

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Aluminum fins with copper backing – reliable bond

Creates a high power copper IGBT module that can be cooled in an automotive style aluminum die cast manifold/tub

Less weight and cost


Results Summary

MicroCool Cu Inline Pin MicroCool Al Inline Pin MicroCool Clad Inline Pin Forged Cu Round PinTemp CP Surface (°C) 32.80 38.53 36.12 36.23Temp Junction (°C) 44.35 49.66 47.79 47.73Temp Outlet Fluid (°C) 20.89 20.84 20.91 20.90Pressure Drop (bar) 0.0131 0.0131 0.0131 0.0159

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6 l/min of 50/50EGW at 20°C with 300 watts

• As expected MicroCool Clad is performance is in between that of pure aluminum and pure copper.

• When MicroCool Clad with inline pin fin offers the same performance as the forged copper part but with 17% less pressure drop.


Wolverine Tube acquires HFW

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• Best in class friction stir welding for large and small aluminum designs• Specializing in mixed aluminum joining AL6061, cast, extrusion, AL1100• Precision machining capability for large and small parts.• www.hfwebster.com


http://www.hfwebster.com/

MicroCool Tool


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MicroCool Services

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Design / Simulation / CFD / Testing


Microprocessor Single PhaseApplications


• Single Phase Closed Loop (Stand alone)• Single Phase Open Loop (Distributed pump)• Single Phase Open Loop (Centralized pump)

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CoolIT – Commercial Liquid Cooling Systems

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Worlds leading manufacturer of active liquid cooling systems for the enthusiast consumer, high end server market

•Based in Calgary, Canada•Manufactures in Shenzhen China•Purchased Delphi’s liquid cooling div.•Major Supplier to Corsair•High volume of base plates per month•100% supplied by MicroCool™ in China

•Fully Certified ISO 9001 Plant•Potential blade server partner, data center•Retail for $80.


CoolIT - MicroCool® Advantage

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Design of the copper coldplate and manifold was highly optimized to take advantage of a very dense fin pitch but still provide low pressure drop.

Thermal resistance of 0.05 c/w at a flow rate of only 0.5 l/min


Example High Volume Customer

Leading manufacturer of liquid cooling systems for consumer & high performance server market•Based in Calgary, Canada•Assembly in Shenzhen, China•MicroCool® As Supplier:

•High volume of base plates per month•100% supplied by MicroCool® in China•Fully Certified ISO 9001 Plant•100% On Time Delivery for 3 years• 21 DPPM in 2013


IBM – Aquasar with MicroCool® inside

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IBM Committed to Zero Emissions Data Center

•Wolverine designed the basic cold plate design, 2008

•Integrated with EPFL and IBM Zurich blade design, 2009

•Only cold plate to meet thermal performance, 2008

•Lowest cost cold plate option

•First 100 cold plates still in test at ETH, Zurich, 2010

•Wolverine awarded total cooling loop for initial pilot application and certification, 2009.

•Five systems installed in ETH 2010. Working well today.



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Fujitsu Current Liquid Cooling Loop


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Microprocessor Two Phase

Applications


• Two Phase Closed Loop (Stand alone, air cooled)

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Thermosyphon Cooling Loop


• Requires no wicking material• Requires no pump for fluid • Can handle substantially higher heat

flux than single phase systems• Closed loop system, no fittings to leak• Refrigerant leaks are low risk to damaging electronics

Advantages

Wolverine’s MicroCool division brings decades of experience both engineering and manufacturing enhanced boiling surfaces. MicroCool’s MDT technology fills the unique application of both pool boiling or flow boiling.

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CPU Thermosyphon Cooling Loop

• 245fa Refrigerant• 3003 and 1100 Aluminum• Brazed Construction• MicroChannel Evaporator• Multiport tube/Folded Fin Condenser


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CPU Thermosyphon Cooling Loop

• Air Inlet Temp: 20C (+/- 1C)• 10 CFM (1.5 m/s velocity)


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Dual CPU Thermosyphon Cooling Loop

• 245fa Refrigerant• 3003 and 1100 Aluminum• Brazed Construction• MicroChannel Evaporator• Multiport tube/Folded Fin Condenser


Use Case:• 350 CFM AirFlow• 40 C inlet Air• 500 W per processor (1,000W total)• Max Coldpate temperature 75 C


Rack level thermosyphon evaporator• 134a Refrigerant• 6061 and 1100 Aluminum• Brazed Construction• MicroChannel Evaporator• 18 independent heat sources (2Kw total)

• 1 to 18 heat sources running at a time• TIM interface to heat source

Thank You