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©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Application Processor for SmartphonePackaging Technology & Cost ReviewAdvanced Packaging report by Stéphane ELISABETHNovember 2016
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o AP I/O count & Footprint
o AP I/O count & L/S width
o Reverse Costing Methodology
Company Profile 10
o Apple, Huawei, Samsung, Qualcomm
o Apple, Huawei, Samsung, Qualcomm AP history
o Apple, Huawei, Samsung, Qualcomm Supply Chain History
o iPhone 7 Plus, Huawei P9, Samsung Galaxy S7 Teardown
o PoP Packaging Technology
Physical Analysis 32
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o A10, Kirin 955, Exynos 8, Snapdragon 820 Package 34
Package Views & Dimensions
Package Opening
Package Opening Comparison
o PoP Cross-Section 47
Package Details Cross-Section
Package Cross-Section Comparison
o Die & Land-Side Decoupling Capacitor Comparison 66
Die View & Dimensions
LSC Capacitor View & Dimensions
LSC Capacitor Footprint
Embedded LSC Capacitor Cross-Section
Soldered LSC Capacitor Cross-Section
o Summary of the physical Data 72
Manufacturing Process Flow 73
o Global Overview
o Package Fabrication Unit
Cost Analysis 76
o Synthesis of the cost analysis
o Main Steps of Economic Analysis
o Yields Explanation & Hypotheses
o Die cost 81
Front-End Cost
Wafer & Die Cost
o Package Manufacturing Cost 83
A10 Package Cost Breakdown
Kirin 955 Package Cost Breakdown
Exynos 8 Package Cost Breakdown
Snapdragon 820 Package Cost Breakdown
o Component Cost 88
Wafer/Panel & Component Cost
Component Cost Breakdown
Company services 91
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• Located under the DRAM chip on the main board, the application processors (AP) are packaged using PoPtechnology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in theHuawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the SamsungGalaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for theExynos).
• In this report, we highlight the differences and the innovations of the packages chosen by the end-userOEMs. Whereas some AP provider like for HiSilicon or Samsung choose to consider conventional PoP withembedded land-side capacitor (LSC), others like Apple or Qualcomm used innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. Thedetailed comparison between the four players will give the pros and the cons of the packagingtechnologies.
• This report also compares the costs of the different approaches and includes a detailed technicalcomparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8,the HiSilicon Kirin 955 and the Apple A10.
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 4
Overview / Introduction
Company Profile & Supply Chain o InvenSenseo ICG-20660L Characteristics
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Smartphones Teardown
Apple iPhone 7 Plus Main Board (Top view)
Huawei P9 Main Board (Top view)
Samsung Galaxy S7 Edge Main Board (Top view)
USA Version
EU Version
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package View & Dimensions
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Opening
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Opening
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Opening Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Dies Comparison
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Packages Land-Side Decoupling Capacitor
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Land-Side Decoupling Capacitor Footprint
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Soldered Land-Side Decoupling Capacitor Cross-Section
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Summary of the physical Data
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
A10 Wafer & Die Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
A10 Package Manufacturing Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 24
COMPANYSERVICES
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models a Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Feedbacks
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©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr
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©2016 System Plus Consulting | 2016 Comparison of Application Processor (AP) packaging 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Legal
DISCLAIMER
System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic componentsand systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in thereport. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of thisreport. The quoted trademarks are property of their owners.
Reverse Costing® is a deposed brand, by System Plus Consulting.
SERVICES
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed byindustry experts.
These results are open for discussion. We can reevaluate this circuit with your information.
COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Manufacturing process flow comparison
• Supply-chain evaluation
• Manufacturing cost comparison
• Comparison of the Apple A10, HiSiliconKirin 955, Samsung Exynos 8 and Qualcomm Snapdragon 820
2016 Comparison of Application Processor (AP) Packaging:TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP
Title: 2016 Application Processor Packaging Comparison
Pages: 100
Date: December 2016
Format: PDF & Excel file
Price: Full report: EUR 3,490
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955
& Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP)market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose themost powerful AP. They use almost the same technology node for the die, andthe innovation is now at the packaging level. During this year, we observeddifferent technologies inside the four main smartphone flagships: classicPackage-on-Package (PoP) developed by Amkor for the Kirin 955 and for theExynos 8, Molded Core Embedded Package (MCeP) technology developed byShinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO)developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoPtechnology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin955 can be found in the Huawei P9 and the Samsung Exynos 8 as the QualcommSnapdragon 820 can be found in the Samsung Galaxy S7 series depending on theworld version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packageschosen by the end-user OEMs. Whereas some AP providers like for HiSilicon orSamsung choose to consider conventional PoP with embedded land-side capacitor(LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoPand silicon based Deep Trench LSC or embedded die packaging with advanced PCBsubstrate. The detailed comparison between the four players will give the pros andthe cons of the packaging technologies.
This report also compares the costs of the different approaches and includes adetailed technical comparison between the packaging structure of the QualcommSnapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
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TABLE OF CONTENTS
Overview/Introduction
Company Profile and Supply Chain
Smartphone Teardowns: iPhone 7 Plus, Huawei P9, Samsung Galaxy S7
Physical Analysis
• Physical Analysis Methodology• A10 inFO Packaging Analysis Package view and dimensions Package opening Package cross-section
• Kirin 955 PoP Packaging Analysis Package view and dimensions Package opening Package cross-section
• Snapdragon 820 MCeP Packaging Analysis Package view and dimensions Package opening Package cross-section
• Exynos 8 PoP Packaging Analysis Package view and dimensions Package opening Package cross-section
• Package Opening Comparison• Package Cross-Section Comparison
• Die Comparison• Package Land-Side Decoupling Capacitor Comparison LSC capacitor view comparison LSC capacitor footprint
comparison Embedded LSC capacitor
cross-section comparison Soldered LSC capacitor cross-
section comparison• Summary of the Physical Data
Manufacturing Process Flow
• Global Overview• Packaging Fabrication Unit
Cost Analysis
• Synthesis of the Cost Analysis• Supply Chain Descriptions• Yield Hypotheses• PoP Die Cost Analysis Wafer cost Die cost Package manufacturing cost
Cost Comparison between Apple A10 inFO, HiSilicon Kirin 955 PoP, Qualcomm Snapdragon 820 MCeP & Samsung Exynos 8 PoP
ANALYSIS PERFORMED WITH OUR COSTING TOOL 3D PACKAGE COSIM+
System Plus Consulting offerspowerful costing tools toevaluate the production cost &selling price from single chip tocomplex structures.
3D Package Cosim+
Cost simulation tool to evaluatethe cost of any packagingprocess: Wafer-level packaging,TSV, 3D integration…
3D Package CoSim+ is a process-based costing tool used toevaluate the manufacturing costper wafer using your own inputsor using the pre-definedparameters included in the tool.
It is possible to enter anypackage process flow.
3D-Package CoSim+
tronics systems. He holds anengineering degree in electronicsand numerical technology, and aPhD in materials for micro-electronics.
Stéphane Elisabethh a s a d e e pk n o w l e d g e o fmaterials characte-rizations and elec-
mical and physical analyses. Hepreviously worked in micro-electronics R&D for CEA/LETI andSTMicroelectronics.
Nic olas Radufe(Lab) is in charge ofphysical analysis.He has a deepknowledge in che-
sical technical analyses. Hepreviously worked for 25 years inAtmel Nantes Laboratory.
Yvon Le Goff (Lab)is the laboratorymanager. He hasdeep knowledge inchemical & phy-
AUTHORS:
TSMC Integrated Fan-Out (inFO) Package in
Apple’s A10 Application Processor
TSMC Deep Trench Capacitor Land-Side Decoupling
Capacitor in Apple’s A10 Application Processor
Samsung’s Galaxy S7 Processor Packages:
Qualcomm/Shinko’s MCePvs. Samsung’s PoP
Reverse engineering and costing ofthe new inFO packaging technologyfrom TSMC used for Apple’s latestA10 application processor, found inthe iPhone 7 and 7 Plus.
Reverse engineering and costing ofthe new Integrated Passive Devicetechnology from TSMC used forApple’s latest A10 applicationprocessor, found in the iPhone 7.
A comparison of QualcommSnapdragon 820 MSM8996 withMCeP packaging technology vs.Samsung Exynos 8 with TMVPoP.
Pages: 100Date: October 2016Full report: EUR 3,490*
Pages: 100Date: October 2016Full report: EUR 3,490*
Pages: 113Date: June 2016Full report: EUR 3,790*
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liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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