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_______________________________________________________________________________________
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XGSPON OLTSFP+N1C-temp Transceiver
PLGS1-11A
Features Single fiber bi-directional data links with
9.953Gbps downstream and
9.953Gbps/2.488Gbps(compatible)upstream
1577nm continuous-mode transmitter with EML
laser
1270nm burst-mode receiver with APD-TIA
2-wire interface for integrated digital diagnostic
Monitoring
Digital receiving signal strength indication (RSSI)
SFP+ MSA package with SC/UPC receptacle
optical interface
Operating case temperature: 0~70°C
+3.3V power supply, power consumption<2.5W
Applications Support ITU-T G.9807.1XGS-PON OLT side
Application
Compliance Compliant with ITU-T G.9807.1
Compliant with SFF-8432, SFF-8472
Compliant with Class 1 FDA
Compliant with IEC60825-1
DescriptionThe HG Genuine PLGS1-11A Transceiver is a
high performance, cost effective module for serial
optical data communication applications to
10G.The PLGS1-11A is designed to XGSPON
OLT.It employs a 1577nm CW mode downlink
transmitter EML operating at 9.953Gbps and a
1270nm APD/TIA burst mode uplink receiver
operating at 9.953Gbps and 2.488Gbps.
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Absolute Maximum Ratings
Table1-Absolute Maximum Ratings
Parameter Symbol Min Typical Max Unit Notes
Storage Temperature TSTG -40 +85 ºC
Operating Case Temperature Tc 0 70 ºC
Operating Relative Humidity RH 5 85 %
Supply Voltage VCC3 0 3.6 V
Recommended Operating Conditions
Table2-Recommended Operating Conditions
Parameter Symbol Min Typical Max Unit Notes
Case temperature Tcase 0 - 70 ℃ Note 1
Supply Voltage VCC3 3.14 3.3 3.47 V
Supply Current ICC3 750 mA
Module Power Dissipation P 2.5 W
Notes:
[1]Commercial Temperature:0 ºC ~ +70 ºC.
Optical,Electrical Characteristic
PLGS1-11A(1577 EML and APD, 20Km)Tested under recommended operating conditions, unless otherwise notedTable3-Transmitter Operating Characteristic-Optical,Electrical
Parameter Symbol Min Typical Max Units Notes
Transmitter(9.953G)
Data Rate BR 9.953 Gb/s
Center Wavelength λC 1575 1577 1580 nm
Spectral Width(-20dB) ΔλC 1 nm
SMSR 30 dB
Optical Power Output PO 2 5 dBm
Extinction Ratio ER 8.2 dB
Eye Mask Margin EMMCompliance ITU.T G.9807.1
requirement
Optical Output Power with Tx OFF Poff -39 dBm
RIN12OMA -128 dB/Hz
Data Input Differential Swing Vin 120 850 mVp-p
Input Differential Impedance Zin 80 100 120 Ω
TX_DISABLE (asserted) VDH 2.0 3.3 V
TX_DISABLE (negated) VDL 0 0.8 V
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Tx Fault Output Voltage High 2.4 3.3 V
Tx Fault Output Voltage Low 0 0.4 V
Table4-Receiver Operating Characteristic-Optical,Electrical
Parameter Symbol Min Typical Max Units Notes
Receiver(9.953/2.488G)
Input Operating Wavelength λRX 1260 1270 1280 nm
Receiver Sensitivity(BER 10^-3) @9.953 -26 dBm
Receiver Sensitivity(BER 10^-4) @2.488 -27.5 dBm
Receiver Overload(BER 10^-12) @9.953 -5 dBm
Receiver Overload(BER 10^-12) @2.488 -7 dBm
Max Input Power -3 dBm
Receiver Reflectance RRX -12 dB
Receiver tolerance to reflected
optical power10 dB
Signal Detected Deassert Level Psdd -40 dBm
Signal Detected Assert Level Psda -29 dBm
SD Hysteresis SD_Hys 0.5 dB
Differential Output Differential Swing VRXDIFF 400 - 800 mVp-p
Signal Detected Voltage_high Vsd_h 2 3.3 V
Signal Detected Voltage_low Vsd_l 0 0.4 V
Digital Diagnostic Functions and Control and Status I/O Timing Characteristics
Table5-Digital Diagnostic Functions
Parameter Range Unit Accuracy Notes
Temperature 0℃ to 70℃ ℃ ±3 LSB equal to 1/256C
Supply Voltage(3.3V) 3.14V to 3.47V V ±3% LSB equal to100uV
Tx Bias Current 0 mA to 150mA mA ±10% LSB equal to 4 uA
Tx Optical Power 2dBm to 5dBm dBm ±2 LSB equal to 0.2 uW
Rx Power -30dBm to -6dBm dBm ±3 LSB equal to 0.1 uW
Table6-Control and Status I/O Timing Characteristics
Parameter Symbol Min Typical Max UnitsPacket Length - 1000 ns
RSSI Trigger Signal Width Tw 600 ns
Sample Time Ts 350 ns
I2C read time TI2C 500 us
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Figure 1 RSSI Timing
Pin-out Definitions
Figure2Transceiver Pin-out Definitions
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Pin Dimension
Figure 3 20Pin Dimension
Table7-Pin Function DefinitionsPin Logic Name Description Note
1 LVTTL Rateselect Rateselect
2 LVTTL TX_Fault High Voltage : TX Laser fault or safety;
Low Voltage: Normal operation.
3 LVTTL Tx_Disable Active high to disable laser
4 SDA 2-Wire Serial Interface SDA
5 SCL 2-Wire Serial Interface SCL
6 GND Module Ground.
7 RESET Reset for TIA/LIA
8 LVTTL SD Logic 1 indicates normal operation
9 LVTTL RSSI_Trig RSSI trigger
10 GND Module Ground.
11 GND Module Ground.
12 LVCML RD- 2.5/10G LVCML output with DC coupling
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13 LVCML RD+ 2.5/10G LVCML output with DC coupling
14 GND Module Ground.
15 VccR 3.3V Power supply
16 VccT 3.3V Power supply
17 GND Module Ground.
18 LVCML TD+ 10G LVCML input with AC coupling
19 LVCML TD- 10G LVCML input with AC coupling
20 GND Module Ground.
Block Diagram of Transceiver
Figure 4Block Diagram of Transceiver
Transmitter SectionTX_DisableTX disable is an input pin that is used to shut down the XGSPON transmitter optical output at the same time. It is
pulled up within the module with a 4.7 – 10 KΩ resistor. Its states are: Low (0 – 0.8V): Transmitter on; (>0.8, < 2.0V):
Undefined; High (2.0 – VCC): Transmitter Disabled; Open: Transmitter Disabled. The TX disable signal is high
(LVTTL logic “1”) to turn off the laser output. The laser will turn on when TX_Disable is low (LVTTL logic “0”).
XGSPON TD+/-XGSPON_TD+/- are the differential XGSPON transmitter inputs. They are AC-coupled, differential lines with 100Ω
differential termination inside the module. It allows a differential input swing of 120-850mV, 9.953Gbps data rate.
Receiver SectionXGSPON_SDSD (Signal Detect) is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩresistor to voltage
between 2.4V and Vcc+0.3V. When low, this output indicates the received optical power is below the worst-case
receiver sensitivity (as defined by the standard in use). High indicates normal operation. In the low state, the output
will be pulled to < 0.4V.
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XGSPON RD+/-These are the XGSPON differential receiver outputs. They are DC coupled 100Ω differential lines which should be
terminated with 100 Ω (differential) at the user SERDES. The AC coupling is done on the host board. The voltage
swing on these lines will be between 400 and 800 mV differential output when properly terminated.
Recommended Interface Circuit
TX_Fault
SDA
SCL
RSSI Trig
Rateselect
Reset
SD
RD-
RD+
TX_Disable
TD+
TD-
VCCHost Board
MAC Txdisable
SerDes Data out+
SerDes Data out+
SerDes Data out-
SerDes Data out-
MAC SD
MAC Ratesel
RSSI Trig
LimitingAmplifier
EMLLaserDriver
MAC SDA
MAC SCL MCU
VCC VCC
MAC Reset
VCC
TX_Fault
Transceiver
Figure5 Recommended Interface Circuit
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DimensionsUnit: mm
Figure6Transceiver Dimensions
PCB Layout RecommendationNA
Digital Diagnostic Memory MapCompatible with SFF-8472.
Figure7 Transceiver Digital Diagnostic Memory Map
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EEPROM Information
Table8-EEPROM Serial ID Memory Contents (A0h)
A0H
Addr.Field Size
Name of Field Hex(or Value) Description(Bytes)
0 1 Identifier 0x03: SFP transceiver
1 1 Extended Identifier 0x04: XGSPON
2 1 Connector Values 0x01: SC
3~10 8 Transceiver Codesxx xx xx xx xx xx xx
xx
11 1 Encoding Codes 0x03: NRZ
12 1 Nominal Bit Rate 0x63: 9.953Gbps
13 1 Reserved 0x00 Reserved
14 1 9 micron fiber length 0x14: 20 km
15 1 9 micron fiber length 0xC8: 200 100m
16 1 Length (50um) 0x00: Not Support MMF
17 1 Length (62.5um) 0x00: Not Support MMF
18 1 Length (Copper) 0x00: Not Support Copper
19 1 Reserved 0x00
20~35 16 Vendor name
0x48 47 20 47 45 4E
55 49 4E 45 20 20 20
20 20 20:
HG GENUINE
36 1 Reserved 0x00 Reserved
37~39 3 Vendor OUI 0xDA 28 EC Vendor OUI
40~55 16 Vendor PN
0x50 4C 47 53 31 2D
31 31 41 20 20 20 20
20 20 20:
PLGS1-11A
56~59 4 Vendor rev 0x30 31 20 20 Vendor rev
60~61 2 Laser Wavelength 0x06 29: Wavelength = 1577 nm
62 1 Reserved 0x00 Reserved
63 1 CC_BASE xx
64~65 2 Option Values 0x00 1C:SD, TX_FAULT and TX_DISABLE
implemented
66 1 BR, max 0x00 BR, max
67 1 BR, min 0x00 BR, min
68~83 16 Serial Number
xx xx xx xx xx xx xx
xx xx xx xx xx xx xx
xx xx
Serial Number
84~91 8 Date codexx xx xx xx xx xx xx
xxDate code
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92 1DiagnosticMonitoring
Type0x58 DiagnosticMonitoring Type
93 1 Enhanced Options 0xE0 Enhanced Options
94 1 8472 Compatibility 0x02 8472 Compatibility
95 1 CC_EXT xx CC_EXT
96-127 32 Vendor Specific Not defined Vendor Specific
For more information,reference to SFF-8472 Rev 10.4
Table9-EEPROM Serial ID Memory Contents(A2h)Byte
Address(DEC)
ByteAddress(HEX)
ByteNumber
Description Value
0~1 00~01 2 Temp High Alarm 80℃
2~3 02~03 2 Temp Low Alarm -15℃
4~5 04~05 2 Temp High Warning 75℃
6~7 06~07 2 Temp Low Warning -10℃
8~9 08~09 2 Voltage High Alarm 3.63V
10~11 0A~0B 2 Voltage Low Alarm 2.97V
12~13 0C~0D 2 Voltage High Warning 3.47V
14~15 0E~0F 2 Voltage Low Warning 3.13V
16~17 10~11 2 Bias High Alarm 120mA
18~19 12~13 2 Bias Low Alarm 5mA
20~21 14~15 2 Bias High Warning 115mA
22~23 16~17 2 Bias Low Warning 10mA
24~25 18~19 2 TX Power High Alarm 7dBm
26~27 1A~1B 2 TX Power Low Alarm 0dBm
28~29 1C~1D 2 TX Power High Warning 6dBm
30~31 1E~1F 2 TX Power Low Warning 1dBm
32~33 20~21 2 RX Power High Alarm -3dBm
34~35 22~23 2 RX Power Low Alarm -30.5dBm
36~37 24~25 2 RX Power High Warning -5dBm
38~39 26~27 2 RX Power Low Warning -28.5dBm
40~55 28~37 16 Reserved 0x00…
56~59 38~3B 4 Rx_PWR(4) 0x00 00 00 00
60~59 3C~3F 4 Rx_PWR(3) 0x00 00 00 00
64~67 40~43 4 Rx_PWR(2) 0x00 00 00 00
68~71 44~47 4 Rx_PWR(1) 0x3F 80 00 00
72~75 48~4B 4 Rx_PWR(0) 0x00 00 00 00
76~77 4C~4D 2 Tx_I(Slope) 01 00
78~79 4E~4F 2 Tx_I(Offset) 00 00
80~81 50~51 2 Tx_PWR(Slope) 01 00
82~83 52~53 2 Tx_PWR(Offset) 00 00
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84~85 54~55 2 T (Slope) 01 00
86~87 56~57 2 T (Offset) 00 00
88~89 58~59 2 V (Slope) 01 00
90~91 5A~5B 2 V (Offset) 00 00
92~93 5C~5E 3 Reserved 0x00
95 5F 1 Checksum xx
96 60 1 Temperature MSB xx: Internally measured module temperature.
97 61 1 Temperature LSB xx: Internally measured module temperature.
98 62 1 Vcc MSBxx:Internally measured supply voltage in
transceiver.
99 63 1 Vcc LSBxx:Internally measured supply voltage in
transceiver.
100 64 1 TX Bias MSB xx: Internally measured TX Bias Current.
101 65 1 TX Bias LSB xx: Internally measured TX Bias Current.
102 66 1 TX Power MSB xx: Measured TX output power.
103 67 1 TX Power LSB xx: Measured TX output power.
104 68 1 RX Power MSB xx: Measured RX output power.
105 69 1 RX Power LSB xx: Measured RX output power.
106~109 6A~6D 4 Reserved 0x00 00 00 00
110 6E 1
Bit7:Tx Disable StateDigital state of the TX Disable Input Pin. Updated
within 100ms ofchange on pin.
Bit6:Soft TX DisableRead/write bit that allows software disable of
laser. Writing ‘1’ disables laser.
Bit5:Reserved Reserved
Bit4: Reserved Reserved
Bit3: Reserved Reserved
Bit2: TX Fault Tx Fail Status: 1=TX Fail; 0=TX Normal
Bit1: LOS Signal Detect Status. Active High.
Bit0:Data_Ready_Bar State
Indicates transceiver has achieved power up and
data is ready. Bit remains high until data is ready
to be read at which time the device sets the bit
low.
111 6F 1 Reserved 0x00
112 70 1
Bit7: Temp High AlarmSet when internal temperature exceeds high
alarm level.
Bit6: Temp Low AlarmSet when internal temperature is below low alarm
level.
Bit5: Vcc High AlarmSet when internal supply voltage exceeds high
alarm level.
Bit4: Vcc Low AlarmSet when internal supply voltage is below low
alarm level.
Bit3: TX Bias High AlarmSet when TX Bias current exceeds high alarm
level.
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Bit2: TX Bias Low AlarmSet when TX Bias current is below low alarm
level.
Bit1: TX Power High AlarmSet when TX output power exceeds high alarm
level.
Bit0: TX Power Low AlarmSet when TX output power is below low alarm
level.
113 71 1
Bit7: RX Power High AlarmSet when Received Power exceeds high alarm
level. Not required for OLT burst receiving.
Bit6: RX Power Low AlarmSet when Received Power is below low alarm
level.Not required for OLT burst receiving.
Bit5: Reserved Reserved
Bit4: Reserved Reserved
Bit3: Reserved Reserved
Bit2: Reserved Reserved
Bit1: Reserved Reserved
Bit0: Reserved Reserved
114 72 1 Reserved Reserved
115 73 1 Reserved Reserved
116 74 1
Bit7: Temp High WarningSet when internal temperature exceeds high
warning level.
Bit6: Temp Low WarningSet when internal temperature is below low
warning level.
Bit5: Vcc High WarningSet when internal supply voltage exceeds high
warning level.
Bit4: Vcc Low WarningSet when internal supply voltage is below low
warning level.
Bit3: TX Bias High WarningSet when TX Bias current exceeds high warning
level.
Bit2: TX Bias Low WarningSet when TX Bias current is below low warning
level.
Bit1: TX Power High
Warning
Set when TX output power exceeds high warning
level.
Bit0: TX Power Low
Warning
Set when TX output power is below low warning
level.
117 75 1
Bit7: RX Power High
Warning
Set when Received Power exceeds high warning
level.Not required for OLT burst receiving.
Bit6: RX Power Low
Warning
Set when Received Power is below low warning
level.Not required for OLT burst receiving.
Bit5: Reserved Reserved
Bit4: Reserved Reserved
Bit3: Reserved Reserved
Bit2: Reserved Reserved
Bit1: Reserved Reserved
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Bit0: Reserved Reserved
118 76 1 Reserved Reserved
119 77 1 Reserved Reserved
120~127 78~7F 8 Vendor Specific Vendor Specific
128~247 80~F7 120 User EEPROM User writable EEPROM
248~255 F8~FF 8 Vendor Specific Vendor Specific
For more information, reference to SFF-8472 Rev 10.4
Ordering Information
Table10- Ordering Information
Part No.Specification
Pack Rate Tx Pout Rx SENS Temp Reach
PLGS1-11A SFP+
9.953G(Down)
9.953G/ 2.488G
(Up)
1577nm
EML
2~5
dBm
1270nm
APD
<-26dBm@9.953G,
<-27.5dBm@2.488G0~70℃ 20km
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Contact InformationWuhanHuagong Genuine Optics Technology Co., LtdAddress: Science & Technology Region of HUST, DonghuHigh-Tech Zone
Wuhan, HubeiProvince, 430223, China Tel: +86-27-87180102 Fax: +86-27-87180220Email:market@genuine-opto.comWebsite: http://www.genuine-opto.com
StatementHG Genuine possesses the authority for ultimate explanation of all information contained in this document, which is
subject to change without prior notice. All the information was obtained in specific environments; and HG Genuine
will not be responsible for verifying the products performance in customers’ operating environments, neither liable
for the performance of users' products. All information contained is only for the users' reference and shall not be
considered as warranted characteristics. HG Genuine will not be liable for damages arising directly or indirectly from
any use of the information contained in this document.
Publishing Date: 2019-08-09
Copyright HG Genuine
All Right Reserved
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