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C o n n e c t w i t h I o T
Ver.6.0
Wireless Communication LSIs/Modules
01
Devices and equipment all around us are connected in a variety of different ways, and going forward this number is
expected to only increase as the range of networked products continues to grow and a greater emphasis is placed on
convenience, energy savings, and cost effectiveness. Our wireless communication LSIs and modules support the
connected needs of customers in various markets by leveraging CMOS RF circuit, low power consumption, network, and
other proprietary technologies. From the Sub-GHz to the 2.4GHz band, a broad lineup is offered, including modules
optimized to meet application demands.
Ver.6.0
20 years of experience
MODEM
FILTERRF
CMOS RF
Technology
20 years of experience with CMOS RF technology
We have been working on CMOS
RF development since 1998,
releasing a number of products
ranging from RF LSIs to SoC. And
in addition to advancing RF circuit
technologies such as digital
control and correction technology,
we are making efforts to improve
performance and reduce current
consumption utilizing precision
CMOS processes.
01
Low current consumption
Wireless communication LSIs and modules
achieve lower current consumption by adopting
power shutdown cells, low voltage drive
regulators, and multi Vt low power consumption
processes, contributing to lower standby power
and longer battery life in portable wireless devices.
02Low power technologies
PowerCutoffCells
Multi VtLow PowerProcesses
Low VoltageRegulators
Feature Broad lineup in communication distances ranging from mm to km
ROHM offers a wide lineup
optimized for a variety of
applications requirements, from
communication distances of several
mm within close reach to longer
distances as much as a few
kilometers.
03Broad lineup
LPWAN(Low PowerWide Area)
Sub-GHz Bluetooth®
Wi-Fi
13.56MHzWirelessCharger
IEEE802.EIE15.415
Wireless Communication LSIs/Modules
EN300-220(Europe)
FCC(North America)
Q/GDW374.3(China)
02
Applicable LSI: ML7421GD
2 Diversity Applicable LSIs : ML7396xGD, ML7406xGD, ML7345xGD, ML7414GD,
ML7404GD, ML7416N, ML7421GD, ML7436N
Applicable LSIs : ML7396xGD, ML7404GD, ML7416N, ML7421GD, ML7436N
Bluetooth low energy Applicable Modules: MK71351-xxx, MK71251-xx
IEEE802.15.4 Compatible LSI : ML7404GD
Sigfox® Compatible LSIs : ML7414GD, ML7404GD
Applicable LSIs: ML7416N, ML7436N
Step-down DC/DC is built-in to
reduce current flow from the
battery in portable devices such
as wearables. This ensures high
efficiency power consumption,
even if the battery terminal
voltage fluctuates, contributing
to longer battery life.
Built-in buck DC/DC04
Radio Law certified modules enable immediate evaluation and implementation
All ROHM wireless communication LSIs have
already acquired certification under Japan's Radio
Law, making it possible to immediately begin
evaluation and development of wireless
communication. The Bluetooth® modules
MK71351-xx series are FCC, IC, and CE compliant.
09
Prolongs battery life
Po
we
r C
on
su
mp
tio
n (
V)
100 1Battery Level (%)
Constant power consumption - regardless of
battery level
MLxxxx
Conventional
Functions such as 2 diversity and FEC are built-in to
improve wireless communication quality. This contributes
to stabler communication in a variety of areas.
Robust communication05Stabler communication
Conventional
Product
Applicable
Models
Stable RFtransmission even
with obstacles
Supports the latest wireless communication standards
LPWAN wireless product lineup for ultra-long-distance
communication ideal for IoT. We offer models compatible
with IEEE802.15.4k and Sigfox®.
Products compatible with Bluetooth® Low Energy v4.1
optimized for IoT edge nodes are also available.
07The latest
wireless standards
Embedded MCU system
We supply system LSIs that incorporate LAPIS
Semiconductor's RF LSI and MCU in a single package.
Our market-proven RF LSIs feature greater ease-of-use.
08Monolithic
LSIMCU
Low power wireless
system LSI with
built-in MCU
Evaluation Kits
Complete DevelopmentEnvironment
We offer a variety of
evaluation kits, software,
documents, and other
materials that support
customer evaluation and
development of wireless
characteristics.
10
Applicable Modules:
MK71351-xxx, MK71251-xx, BP35A1, BP35C0, BP35C0-J11,
BP35C2, BP3580, BP3591, BP3595, BP3599, BP359B
Radio LawCertified Module
EN300-220 Applicable Models : ML7396DGD, ML7406yGD, ML7344JyGD, ML7345GD,
ML7345DGD, ML7414GD, ML7411GD
FCC Applicable Models : ML7396AGD, ML7411GD
Q/GDW374.3 Applicable Models : ML7344CyGD, ML7345CGD
Complies with wireless communication standards
Our short-range wireless communication LSIs and
modules, manufactured using thorough quality control,
are optimized solutions that satisfy both transmission
and reception characteristics specified by the
EN300-220, FCC and Q/GDW374.3 specifications.
06Broad range of wireless
communication standards
,
Broad range of wireless communication standards
EN300-220(Europe)
EN300-220(Europe)
FCC(North America)
FCC(North America)
Q/GDW374.3(China)
Q/GDW374.3(China)
03
Smart Agri
Anti-disaster
Infra Monitoring
Asset Tracking
CloudWireless communication technologies that support IoTIoT
We offer a broad lineup of low power short-and long-range wireless products
optimized for IoT. This allows users to select the ideal product based on
application needs, from specified low power wireless and Bluetooth® low energy
to LPWAN.
01
Bluetooth® low energy is a 2.4GHz wireless communication standard used all over
the world to communicate over a distance of several meters or less with very low
power consumption. Applications include fitness/medical devices and smart
watches driven by coin batteries, and are expanding to the IoT sector for data
transmission and position detection utilizing beacon technology.
03
LPWAN is a new wireless protocol that allows communication over longer distances
than existing short-range radio. As a result, long-distance communication up to 10km
is enabled with a single device, making it possible to configure wide range networks
using fewer components. Prospects include repeaters that until now were required for
short-range wireless, and adoption is expected for wirelessly collecting and
transmitting data over a wide area with IoT systems.
04
Specified low power radio is characterized by the ability to communicate over
distances of several hundred meters using very low power. Since the Sub-GHz band
being used differs from the 2.4GHz band widely used for wireless LAN, Bluetooth®,
and other protocols, it is less susceptible to interference, and the lower frequency
makes it easy to travel around objects, facilitating communication. However, because
the frequency used will vary by country, it will be necessary to adapt to the standards
at each region. Wi-SUN, which is an international standard utilizing the Sub-GHz band,
is expanding its applicable range to include both indoor and outdoor use.
02
A broad lineup of wireless communication LSIs and modules are offered that utilize a variety of technologies. This ensures compatibility
with a range of applications and markets, from IoT, industrial equipment, and automotive to electronic toys and consumer devices. ROHM
also support customer development through proposals and development tools based on decades of experience.
LineupWireless Communication LSIs/Modules
Wi-Fi
Modules
13.56MHz
Wireless
Charger LSI
Multiband
Wireless ICBluetooth®
LSI/Modules
Ultra-Low-PowerConsumption
High-SpeedCommunicationWireless Charging
Low-Power Consumption Large DiffractionBatteryless
Universal Frequency Bands Long-Distance CommunicationUltra-Long-Distance
Communication
Specified
Low Power
Wireless
LSIs/Modules
LPWAN
(Low Power
Wide Area
Network)
Wireless LSIs
Specified
Low Power
Wireless System
LSI with
Built-in MCU
EnOcean®
Communication
Module
Specified Low Power Wireless
Frequency Band
Communication Distance
Transmission Rate
Market
1.2kbps to300kbps
2.4GHz400 to 960MHz
1Mbps
Approx. 10m
2.4GHz
Bluetooth®
low energy Multiband Wireless IC
72Mbps
Tens of meters
2.4GHz
Wi-Fi(IEEE802.11b/g/n)
212kbps
Few mm
13.56MHz
13.56MHzWirelessCharger (Narrow Area)
more than9,600bps
Hundredsof meters
426/429MHz
LPWAN(Low PowerWide AreaNetwork)
100 to thousands
of bps
Tens of kilometers
900MHz
The frequency band will differ based on country
50kbpsor more
Hundredsof meters
Hundredsof meters
900MHz
(Wide Area)
125kbps
Approx. 100m
868.3/928.35MHz
EnOcean®
Worldwide
04
CloudCloudCloudWi-Fi
Modules13.56MHz Wireless
Charger LSIEnOcean®
CommunicationModule
Bluetooth® LSI/Modules
Specified Low PowerWireless System
LSI with Built-in MCU
Multiband Wireless IC
Specified Low PowerWireless
LSIs/Modules
LPWAN(Low Power Wide Area Network) Wireless LSIs
Lighting Control
Home Electronics ControlHome Gateway
Illumination Household Appliance
Smartphone Connection
Smartphone Connected
Smart Meters
Smart Meter
Position Detection/Monitoring
Position Sensing
Low power consumption products
that combine a variety of technologies
Advanced Technologies
· RF CMOS Technology
· IEEE802.15.4· IEEE802.15.4d· IEEE802.15.4g· Bluetooth®
ROHM group
WirelessCommunication
Technologiesimprove quality
and performanceTransmission Circuit· S-NWK· Sigfox®
· Orthogonal Modulation Technology· Direct Modulation Technology· High Efficiency Power Amplifier Technology· 13.56MHz Wireless Charger
Frequency Synthesizer Circuit Security Technologies· Fractional-N PLL Technology· Phase Noise Reduction Technology
· AES 32bit/64bit/128bit· CCM· SHA-1/SHA-224/SHA-256
PHY Processing· Coding/Decoding Technology· Frame Processing Technology· FEC Technology
Network Technology
Device Technologies
· OFDM· DSSS· QPSK/O-QPSK· BPSK· FSK/GFSK· MSK/GMSK· ASK
Modulation/Demodulation
· Low IF Technology· Zero IF Technology· Digital IF Technology· Double Super Heterodyne Technology· 13.56MHz Wireless Power Reception
Receiver Circuit
MAC Processing
05
P.09
ML7345xGD
ML7386xGD
ML7396xGD
ML7406yGD
ML7344xyGD
ML7414GD
L I N E U P
P.07
MK71511
MK71251-01
MK71251-02A
MK71521
MK71351-NNN
P.11
ML7421GD
2M
2M5.0
5.1
750~960
750~960
160~510
160~960
315~960
400~960
426
Communication Distance vs Data Transmission Speed
P.19 to 20
Ap
plic
atio
n D
ata
Tra
nsm
issio
n S
peed
Communication Distance
P.07 to 08
P.9 to 10
P.21 to 22
P.23 to 24
1Mbps
10Mbps
100kbps
100Mbps
10kbps
1kbps
100bps
Bluetooth®
low energyBluetooth®
low energyBluetooth®
low energy
13.56MHz Wireless ChargingNFC Type3 Tag
13.56MHz Wireless ChargingNFC Type3 Tag
13.56MHz Wireless ChargingNFC Type3 Tag
900MHz SpecifiedLow Power Wireless900MHz SpecifiedLow Power Wireless
Power MetersPower Meters HEMSHEMS
MK71351-NNNMK71251-01, MK71251-02A
BP3580, BP3591,BP3595, BP3599,
BP359B
400MHz SpecifiedLow Power Wireless400MHz SpecifiedLow Power Wireless
EnOcean®EnOcean®EnOcean®
0.01m 10m1m 100m 1km 10km
P.09 to 10P.15 to 16
P.11 to 12P.15 to 16
ML7421GD,ML7436N
Electrical Devices/Remote ControlElectrical Devices/Remote Control
AV Equipment/Remote ControlAV Equipment/Remote Control
EnOcean® WirelessCommunication
Modules
ML7630,ML7631
2.4GHzIEEE802.15.4
2.4GHzIEEE802.15.4
2.4GHzIEEE802.15.4
Gas AlarmsGas AlarmsP.13 to 14
2.4GHz Short-range Wi-Fi Modules
2.4GHz Short-range Wi-Fi Modules
2.4GHz Short-range Wi-Fi Modules
BridgesBridges
LPWANLow Power Wide
Area NetworkWireless
LSI
LPWANLow Power Wide
Area NetworkWireless
LSI
LPWANLow Power Wide
Area NetworkWireless
LSI
LPWANLow Power Wide
Area NetworkWireless
LSI
ACAC SecurityMonitorsSecurityMonitors
WirelessHeadphones
WirelessHeadphones
Bluetooth® Modules2.4GHz Short-range Wireless
Specified Low Power Wireless LSIsSub-GHz Short-range Wireless
Multiband Wireless LSISub-GHz & 2.4GHz Wireless
ML7416N, ML7396xGD,ML7406yGD,
ML7345xGD,BP35A1, BP35C0,BP35C0-J11,
BP35C2
ML7404GDML7386xGD,ML7344xyGD
PedometerPedometer
30 50 70 90 F
kcalTOTAL
0606
Icon Descriptions
TQFP
FEC
Connection
type
Bluetooth®
low energy
Transmission/
Reception
Product Form
Factor
Compatible
RCR Standard
Data Transmission
Rate cps
Data Transmission
Rate bps
Memory I/F
Encryption
Functions
Built-in Low-Power
General-purpose CPU
Compatible
EU Standards
Compatible
ARIB Standards
Compatible
IEEE Standards
Intermittent
Reception Operation
Integrated
Antenna type
Wi-SUN
Wi-Fi
Sigfox®
Compatible
US Standards
Built-in TCP/IP
Protocol Stack
Security
Compatible
User Application
Memory
Bluetooth® core
specification
Wireless
Frequency Bands
Host I/F
Compatible
Chinese Standards
Support for 2
Diversity Antenna
Operating
Temperature
Package type
Transmission
Output NFC I/F
Internal
Applications
Charging
Powe
P.23
BP35A1
BP35C0
P.17
BP35C2
ML7631
P.19
ML7630
P.13
ML7404GD
BP3580
BP3591
P.21
BP3599
BP359B
BP3595
ML7416N
P.15
ML7436N TQFP
1024KB
256KB
2M
5.0 5.1
M3
M3
315~960
400~960
750~960
750~960
160~510
160~960
315~960
400~960 426
920
920
BP35C0-J11920
920
13.56
13.56
13.56
Bluetooth®
low energy
13.56MHz Wireless ChargingNFC Type3 Tag
Power Meters HEMS
EnOcean®
Electrical Devices/Remote Control
AV Equipment/Remote Control
2.4GHzIEEE802.15.4
Gas Alarms
2.4GHz Short-range Wi-Fi Modules
LPWANLow Power Wide
Area NetworkWireless
LSI
AC SecurityMonitors
WirelessHeadphones
LPWAN (Low Power Wide Area Network) Wireless LSISub-GHz Long-range Wireless
Specified Low Power Wireless System LSI with Built-in MCUSub-GHz Short-range Wireless
Specified Low Power Wireless ModulesSub-GHz Short-range Wireless
Wi-Fi Modules2.4GHz Short-range Wireless
13.56MHz Wireless Charger Chipset13.56MHz Wireless Charger
EnOcean® Communication ModulesSub-GHz Batteryless Communication
Communication frequencies based on the radio laws of each country are being prepared. Please refer to page 23 for additional information.
Pedometer
LAPIS Semiconductor offers easier-to-use Bluetooth low energy modules (than LSIs).
The entire lineup is Bluetooth SIG End Product qualified, allowing users to easily develop Bluetooth compliant devices by simply
embedding the module without having to undergo the troublesome qualification process.
In addition, the antenna and all peripheral devices required for operation are built in, and radio certification has been acquired not only
in Japan, but in the US (FCC), Canada (SED), and EUY (CE) as well.
07
MK71521
Modules
MK71351-NNN
Bluetooth low energy Modules
MK71251-01MK71251-02A
Bluetooth low energy Modules
www.lapis-semi.com
MK71511
MK71251-01
MK71251-02A
MK71351-NNN
LINEUP
Built-in inductor for low-current operationEnables low current
operation without requiring
an external inductor for the
DC/DC converter.
Bluetooth SIG End Product QualifiedIntegrating the module eliminates
the need to obtain Bluetooth
qualification for user devices.
(Product declaration/registration
required)
Antenna
DC/DCLC Filter
X’tal26MHz
X’tal32.768kHz
GPIO
ADC
PWM
I2C
SPI
UART
Bluetoothlow energyController
Bluetoothlow energy
HOST Stack
2.4GHzRF Block
FlashROMRAM
07 www.la
MK71351
5.0
5.12M
2M
2.4GHz Short-range Wireless
Bluetooth® Modules
Ultra-Low-Power
Ultra-Low-Power
Ultra-Low-Power
Ultra-Low-Power
Serial Communication Applications
Please refer to page 6 for icon descriptions.
Part No.CommunicationFrequencyTransmission
SpeedHost I/F EncryptionAntennaCompliant and
Compatible StandardsOperating
Temp.Type RoleInternal
Applications
Radio certification enables immediate useCertified under radio laws in Japan,
the US, Canada, and the EU.
Bluetooth Modules Function/Block Diagram
End Product qualification facilitates commercialization/ radio law compliant
MK71351 Developer Kit (MK71351-DVK-01)
Radio certification allows for immediate evaluation and implementation
Significantly lower current consumption vs conventional productsPOINT 01
LAPIS Semiconductor’s Bluetooth low energy modules
provide low current consumption that extends battery life
while enabling the use of smaller batteries.
For example, the MK71351-NNN achieves low current
consumption (approx. 3mA) during sending/receiving
operation, making it ideal for smartphone peripheral and
beacon devices that operate on compact batteries (i.e. coin).
Ultra-low power consumption prolongs battery life
POINT 03
LAPIS Semiconductor’s Bluetooth low energy modules are
already Bluetooth SIG End Product qualified.
Embedding the module enables the development of
products without the need to undergo the Bluetooth
qualification process. (Registration required)
The modules also comply with radio laws in Japan, the US,
Canada, and the EU.
Bluetooth compliance
1.7 to 3.6MK71521 9.7×13.96×2.1
POINT 02
LAPIS Semiconductor’s Bluetooth low energy module for
serial communication applications supports proprietary
connectivity testing with commercially available
smartphones and tablets. This allows customers to verify
connectivity in advance to ensure worry-free use and
proceed with commercialization.
Conducting own connectivity tests
08
1.7 to 3.6MK71511 9.7×13.96×2.1
2.0 to 3.6MK71251-01 8.0×11.0×2.0
2.0 to 3.6
Ver.5.0
Ver.5.1
Ver.4.1
Ver.4.1
Pattern
Pattern
Pattern
Pattern
Master/Slave
Master/Slave
Master/Slave
Slave
Blank
Blank
—
Serialcommunication
MK71251-02A 8.0×11.0×2.0
–40 to +85
–40 to +85
–20 to +75
–20 to +75
Bluetooth low energyApplicable Models
Bluetooth low energyApplicable Models
Bluetooth low energyApplicable Models
Bluetooth low energyApplicable Models
www.lapis-semi.com
This is the development kit for the MK71351. An application
for serial communication is written into the module that makes
it possible to immediately carry out communication evaluation
by connecting to a PC. Communication evaluation of peer
devices can be performed with the smartphone app BLE
TOOL or utilizing two MK71351 development kits.
This kit is designed to evaluate the beacon sample software
for the MK71351. The sample software leverages low power
beacon operation utilizing sensors with the low power
characteristics of the MK71351 to enable location detection of
people and things* for up to 3 years on a single coin battery
(CR2032).
Applicable Models: MK71351-NNN
Applicable Models: MK71351-NNN, MK71251-02A
2.0 to 3.6 Ver.4.2 PatternMaster/Slave BlankMK71351-NNN 9.7×11.95×2.0–40 to +85
Bluetooth low energyApplicable Models
Applicable Models: MK71351-NNN
Applicable Models: All models
POINT 04
Various tools for evaluating and developing applications
using LAPIS Semiconductor’s Bluetooth low energy
modules are available.
Comprehensive user development support is also offered,
such as the “MK71351 Development Kit” that enable
immediate evaluation by connecting a PC, the “MK71351
Beacon Evaluation Kit” for evaluating the beacon software,
the “BLE Tool” smartphone application that makes it easy
to evaluate and develop communication device, the “BLE
Tool for BCS” application for carrying out updating and
reading of control parameters for the beacon evaluation kit
using a smartphone, and the SDK (Software Development
Kit) that includes sample software.
Supporting evaluation and development with a variety of tools
OK!
Android™
iOS
MK71251
8(mA)
7
6
5
4
3
2
1
0
MK71351
Transmission: 2.9mAReception: 3.0mA
Transmittion mode
Reception mode
*Transmits accelerator and voltage values at one-second intervals. Actual operating time: 6hrs/day.
MK71351 Beacon Evaluation Kit (MK71351-BCN-EVK-01)
Dimensions(mm)
Supply Voltage(V)
Part No.
Specifications
Bluetoothcore spec.
IntegratedAntenna type
RoleInternal
Applications
OperatingTemperature
(˚C)Functions
NorthAmerica
(FCC/IC)
Europe(CE)
Japan(TELEC)
Instantly begin broadcasting and
evaluation development
09
Specified Low Power Wireless LSIs Function/Block Diagram
LNA
PA
OscillationCircuit
Crystal Oscillatoror
TCXO
PARegulator
Fractional-NPLL
DemodulatorIFMixer
TIMER Data ComparatorAntenna
Reception Block
Transmission Block
Received Data
Transmission Data
Data Clock
Synchronous Serial I/F
SPI I/F
Logic
Register
Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger
signal ensures more stable reception.
Applicable Model: ML7396xGD, ML7406yGD,
ML7345GD, ML7345DGD,
ML7414GD
Direct modulation method reduces transmission currentAchieves a simple configuration for
2-value FSK (MSK) modulation (by direct
PLL modulation) to reduce current.
Regulator for PA ensures stable transmission powerThe built-in regulator for PA delivers
stable transmission power without
being affected by voltage fluctuations.
Built-in variable band filter achieves optimum reception sensitivityOptimum reception sensitivity can be achieved by
switching the IF frequency and reception filter band
based on the data rate.
Applicable Model: ML7396xGD, ML7406yGD, ML7345xGD
Low system power consumption functionAutonomous intermittent operation is performed,
allowing the MCU to sleep until data is received.
Applicable Model: ML7406yGD, ML7344xyGD,
ML7345xGD, ML7414GD
Register control allows for detailed settingsEnabling direct control of the registers
makes it possible to fine-tune settings
(i.e. frequency expansion) based on
system characteristics.
Applicable Model: ML7386xGD, ML7396xGD,
ML7406yGD, ML7344xyGD,
ML7345xGD
Supports direct TCXO inputLevel conversion circuitry is not required even when
TCXO (Temperature Compensated Oscillator) is used.
Applicable Model: ML7386xGD, ML7396xGD, ML7406TGD,
ML7344xTGD, ML7345xGD
Dedicated transmission LSIThe transmission block
was configured into an
LSI.
Applicable Model: ML7386xGD
RSSI DetectionBlock
HostMCU
426MHz Transmission type (10mW)
426MHz Transmission type (10mW/1mW)
868MHz Transceiver type for Europe
868/920MHz Transceiver type
470MHz Transceiver type for China
P-WQFN28-0404-0.40
426/429/433MHz Transceiver type
P-WQFN32-0505-0.50
P-WQFN40-0606-0.50
ML7344JyGD
ML7344CyGD
ML7406yGD
ML7396EGD
ML7386BGD
ML7386GD
Co. AWireless LSI
Co. BWireless LSI
Co. CWireless LSILAPIS
SemiconductorWireless LSI
920MHz Transceiver type for Japan
ML7396DGD
www.lapis-semi.com
470MHz Transceiver type for China
ML7345CGD
315 to 960MHz Transceiver type
ML7414GD
160 to 960MHz Transceiver type
ML7345GD315 to 960MHz Transceiver type
ML7345DGD
750~960
470~510
470~510
750~900
900~960
160~510
160~960
315~960
315~960
426
426
Top Bottom
Top Bottom
Top Bottom
Part No. OthersOperating
Temp.Package
type
MaxTransmission
Speed
MinTransmission
SpeedCommunication Host I/FFrequency
LINEUPCompliant and
Compatible StandardsType Package Code
70% of actual size shown.Please refer to page 6 for icon descriptions.* Optional
**
**
**
**
**
**
**
**
Specified Low Power Wireless LSIsSub-GHz Short-range Wireless
LAPIS Semiconductor Sub-GHz specified low power wireless LSIs have been adopted in a variety of applications, including
telemeters, fire alarms, home security, and industrial remote control. And the broad lineup supports adoption in smart meters which
have become increasingly popular in recent years. Each LSI undergoes thorough quality control and allow customers to develop
products that meet all laws and regulations for transmission and reception.
POINT 01
In addition to basic transmission/reception functions,
support for IEEE802.15.4d and IEEE802.15.4g packet
transmission/reception along with whitening and CRC
attachment functions are provided. Interconnectivity is
also enabled using standard protocols.
Standards compliance (IEEE)supports interconnectivity
Applicable Model: ML7396xGD, ML7406yGD, ML7345xGD
Configure systems using products from other companies
Co. A Meter
Co. B Meter
Co. C MeterPOS System
8
F1
.
F2
F3
Co. AWireless LSI
Co. AWireless LSI
Co. BWireless LSI
Co. BWireless LSI
Co. CWireless LSI
Co. CWireless LSILAPIS
SemiconductorWireless LSI
LAPISSemiconductor
Wireless LSI
POINT 02
When radio waves are transmitted, the frequency waves will
continue to spread.
However, due to reflection and other phenomena, areas with
predominately weaker signals may not be always be constant,
since in actual space both weak and strong signals exist.
2 diversity is a technology that utilizes 2 antennas to capture bit
synchronization signals at the beginning of the transmission frame,
then selects the antenna receiving the stronger signal to achieve
stable reception.
2 diversity compatibility ensures stable reception
Applicable Model: ML7396xGD, ML7406yGD, ML7345GD, ML7345DGD, ML7414GD
2 diversity operation captures stronger signals
Transmitter Weak Signal
Strong Signal
A
B
LSI
RSSIDetection
Block
Automatically selects Antenna B
receivingthe stronger signal
POINT 03
A variety of devices that utilize the same frequency as
specified low power systems exist. To distinguish between
data intended for the target device or other equipment,
a special system-level data string is placed at the beginning
of the data packet. Conventional specified low-power
products typically only include a wireless block and function
for outputting demodulated data, so an external MCU is
needed to perform data discrimination. Unfortunately, this
requires that the MCU continually operate when receiving
data. In contrast, with autonomous operation a built-in timer
enables intermittent receiving operation and a comparator is
utilized to detect special data patterns, allowing the MCU to
operate only when relevant data is received. This reduces
operating time vs conventional solutions, even with the same
system configuration.
Address filter reduces device power consumption
Applicable Model: ML7396xGD, ML7406yGD, ML7344xyGD, ML7345xGD, ML7414GD
Built-in address filter function minimizes MCU load, reducing power consumption
Conventional LAPIS Semiconductor
MCU
Cu
rren
t C
on
su
mp
tio
n
RF LSI
ReceptionData
MCU continuously operates while
wireless signals are received
The MCU operates only when
relevant data is received
Signal Discrimination
MCU
RF LSI
MCUData Comparator
RF LSI
Current
Host CPU
Current
Received data intended
for other devices
Received data intended
for this device
Sleep Current
Data Discrimination Period
Reduces total system current consumptionReceived data intended
for this deviceReceived data intended
for other devices
Unnecessary
No MCU LoadMCU Load
Interrupt Signal
ReceptionData
Is this data intendedfor this device?
Read datahas arrived
10www.lapis-semi.com
ML7396DGD —FCC part15, ARIB STD-T108,
IEEE802.15.4d/g, Wi-SUN–40 to +85 P-WQFN40-0606-0.501.8 to 3.6 915/920
ML7396EGD —ETSI EN300-220, IEEE802.15.4g –40 to +85 P-WQFN40-0606-0.501.8 to 3.6 868
ML7386BGD —ARIB STD-T67, RCR STD-30 –25 to +85 P-WQFN28-0404-0.401.8 to 3.6 426
ML7386GD —ARIB STD-T67, RCR STD-30 –25 to +85 P-WQFN28-0404-0.401.8 to 3.6 426
ML7406yGD ETSI EN300-220, EN13757-4:2011, IEEE802.15.4g, Wi-SUN
–40 to +85 P-WQFN32-0505-0.501.8 to 3.6 868
ML7344CyGD Q/GDW374.3 –40 to +85 P-WQFN32-0505-0.503.3 to 3.6(100mW)
470
ML7345GD —ARIB STD-T67, ARIB STD-T108, RCR STD-30
ETSI EN300-220, EN13757-4:2013, IEEE802.15.4d/g–40 to +85 P-WQFN32-0505-0.501.8 to 3.6
169/426/429/433/868/915/920
ML7344JyGD ARIB STD-T67, RCR STD-30 –40 to +85 P-WQFN32-0505-0.501.8 to 3.6 426/429/433
ML7345CGD —Q/GDW374.3 –40 to +85 P-WQFN32-0505-0.503.3 to 3.6(100mW)
470
ML7414GD —ARIB STD-T67, ARIB STD-T108, RCR STD-30
ETSI EN300-220, EN13757-4:2013, Sigfox® (Rev 2.E)IEEE802.15.4d/g
–40 to +85 P-WQFN32-0505-0.501.8 to 3.6 315 to 960
ML7345DGD ARIB STD-T67, ARIB STD-T108, RCR STD-30ETSI EN300-220, EN13757-4:2013, IEEE802.15.4d/g
–40 to +85 P-WQFN32-0505-0.501.8 to 3.6426/429/433/868/915/920
—
Specifications
Supported Standards Package CodePart No.Operating
Temperature(˚C)
Supply Voltage(V)
Supported Frequencies(MHz)
Clock Input
y=(C)rystal inputy=(S)PXO direct inputy=(T)CXO direct input
y=(C)rystal inputy=(S)PXO direct inputy=(T)CXO direct input
y=(C)rystal inputy=(S)PXO direct inputy=(T)CXO direct input
*
*
*
*
*
*
*
*
11 www.lapis-semi.com
LINEUP
400-960MHz/2.4GHz Transceiver type
ML7421GDP-WQFN36-
0606-0.50
POINT 01
Compatible with both the 315 to 960MHzsub-GHz and 2.4GHz ISM bands
915MHz
915MHz
868MHz
868MHz
868MHz
920MHz
920MHz
2.4GHz???
Multiband Wireless LSISub-GHz & 2.4GHz Wireless
LAPIS Semiconductor’s multiband wireless LSI enables communication using the ISM band at 2.4GHz as well as the Sub-GHz band
within the range of 169MH to 920MHz, supporting product development in areas where the Sub-GHz band is unregulated. In addition to
the expansion of smart meters, smart cities, smart homes, and smart factories in Japan, EU, the US, and China, regional deployment
strategies are progressing in emerging areas such as Southeast Asia.
Multiband Wireless LSI Function/Block Diagram
PASub-GHz
DemodulatorIF
LNASub-GHz
Mixer
TIMERDC/DC Converter Data Comparator
Crystal Oscillator
or
TCXO
Antenna
Reception Block
Transmission Block
Received Data
Transmission Data
Data Clock
Synchronous Serial I/F
SPI I/F
Logic
Register
Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger
signal ensures more stable reception.
Regulator for PA ensures stable transmission powerThe built-in regulator for PA delivers stable transmission
power without being affected by voltage fluctuations.
Register control allows for detailed settingsEnabling direct control of the registers
makes it possible to fine-tune settings
(i.e. frequency expansion) based on
system characteristics.
Supports direct TCXO inputLevel conversion circuitry is not required even when
TCXO (Temperature Compensated Oscillator) is used.
Built-in RF front end compatible with the 400 to
960MHz and 2.4GHz frequencies enables
support not only for the sub-GHz band, but the
mainstream 2.4GHz band as well.
Multimode-compatible RF front end
Low system power consumption functionAutonomous intermittent operation is
performed, allowing the MCU to sleep until
data is received.
RSSIDetection
Block
HostMCU
Built-in variable band filter achieves optimum reception sensitivityOptimum reception sensitivity can be achieved by
switching the IF frequency and reception filter band
based on the data rate.
Fractional-NPLL
OscillationCircuit
Antenna
LNA2.4GHz
PA2.4GHz
Mixer
Command instructions simplify controlA series of register setting are allocated for
command, facilitating control.
PARegulator
400~960
400~960
Part No.Communication OthersCompliant and
Compatible StandardsFrequencyType Host I/F
PackageCode
OperatingTemp.
Packagetype
MinTransmission
Speed
MaxTransmission
Speed
Multiband Wireless Provides Worldwide Compatibility
When expanding products worldwide, only the Sub-GHz
band from 400 to 960MHz cannot be marketed in
unregulated areas such as Southeast Asia.
Therefore, it is necessary to market 2.4GHz wireless, which
is one of the ISM bands, early on in Sub-GHz unregulated
regions. As a result, LAPIS Semiconductor’s multiband
wireless LSI compatible with both the Sub-GHz and 2.4GHz
bands supports product development worldwide.
Please refer to page 6 for icon descriptions. 60% of actual size shown.
Top Bottom
12www.lapis-semi.com
Specifications
Supported StandardsSupply Voltage
(V)Package CodePart No.
OperatingTemperature
(˚C)
Supported Frequencies(MHz)
POINT 02
When radio waves are emitted, the frequency waves will
continue to spread. However, due to reflection and other
phenomena, areas with predominately weaker signals may
not be always be constant, since in actual space both
weak and strong signals exist. 2 diversity is a technology
that utilizes 2 antennas to capture bit synchronization
signals at the beginning of the transmission frame, then
selects the antenna receiving the stronger signal to
achieve stable reception.
2 diversity compatibility ensures stable reception 2 diversity operation captures stronger signals
Weak Signal
Strong Signal
A
B
LSITransmitter
RSSIDetection
Block
Automatically selects Antenna B
receivingthe stronger signal
POINT 03
A variety of devices that utilize the same frequency as
specified low power systems exist. To distinguish between
data intended for the target device or other equipment,
a special system-level data string is placed at the
beginning of the data packet. Conventional specified
low-power products typically only include a wireless block
and function for outputting demodulated data, so an
external MCU is needed to perform data discrimination.
Unfortunately, this requires that the MCU continually
operate when receiving data. In contrast, with autonomous
operation a built-in timer enables intermittent receiving
operation and a comparator is utilized to detect special
data patterns, allowing the MCU to operate only when
relevant data is received. This reduces operating time vs
conventional solutions, even with the same system
configuration.
Address filter reduces device power consumption Built-in address filter function minimizes MCU load, reducing power consumption
POINT 04Prolongs battery life
Integrating a buck DC/DC converter as a power supply
makes it possible to achieve lower operating current.
When the external supply voltage is higher than the
operating voltage due to energy conversion of the internal
DC/DC converter when driven by an external constant
voltage source, the current extracted from the external
supply can be significantly reduced. When the power
supply is a battery, current supplied from the battery can
be reduced when the battery voltage is high, prolonging
battery life.
Built-in buck DC/DC converter reduces current consumption
RF
RFLonger
battery life
Smaller current
Same current
Conventional LAPIS Semiconductor
MCU
Cu
rren
t C
on
su
mp
tio
n
RF LSI
ReceptionData
MCU continuously operates while
wireless signals are received
The MCU operates only when
relevant data is received
Signal Discrimination
MCU
RF LSI
MCUData Comparator
RF LSI
Current
Host CPU
Current
Received data intended
for other devices
Received data intended
for this device
Sleep Current
Data Discrimination Period
Reduces total system current consumptionReceived data intended
for this deviceReceived data intended
for other devices
Unnecessary
No MCU LoadMCU Load
Interrupt Signal
ReceptionData
Is this data intendedfor this device?
Read datahas arrived
ML7421GD P-WQFN36-0606-0.50ARIB STD-T66, ARIB STD-T67, ARIB STD-T108,
ETSI EN300-220, FCC part15, IEEE802.15.4d/g, Wireless M-BUS
–40 to +85400 to 960/
24001.8 to 3.6 (DC/DC Unused)
2.1 to 3.6
LPWAN (Low Power Wide Area Network) Wireless LSISub-GHz Long-range Wireless
LAPIS Semiconductor's LPWAN (Low Power Wide Area Network) LSI is compatible with Sigfox's wireless protocol which is expected to see widespread
adoption for IoT wireless communication and has already been adopted in over 50*1 countries around the world, primarily in Europe. It is the first in the world*2 to support
the international IEE802.15.4K standard which is extremely robust against interference from the same system and can cover more terminals under one network, and the
first*2 2+1 mode wireless communication LSI compatible with IEEE802.15.4g, a near-field communication method used as the physical layer for Wi-SUN.*1 Announced by Sigfox® on July 10, 2018 *2 LAPIS Semiconductor October 2017 study
LPWAN (Low Power Wide Area Network) Wireless LSI Function/Block Diagram
LNA
PA
OscillationCircuit
Crystal Oscillator
or
TCXO
PARegulator
Fractional-NPLL
DemodulatorIFMixer
TIMER Data ComparatorAntenna
Reception Block
Transmission Block
Received Data
Transmission Data
Data Clock
Synchronous Serial I/F
SPI I/F
Logic
Register
Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger
signal ensures more stable reception.
Direct modulation method reduces transmission currentAchieves a simple configuration for
2-value FSK (MSK) modulation (by
direct PLL modulation) to reduce
current.
Regulator for PA ensures stable transmission powerThe built-in regulator for PA
delivers stable transmission
power without being affected by
voltage fluctuations.
Register control allows for detailed settingsEnabling direct control of the registers
makes it possible to fine-tune settings
(i.e. frequency expansion) based on
system characteristics.Supports direct TCXO inputLevel conversion circuitry is not required
even when TCXO (Temperature
Compensated Oscillator) is used.
The industry’s first*2 Sub-GHZ BPSK modulator
compatible with Sigfox® and direct spread
modulation compliant with IEEE802.15.4k.
Multimode compatible modulator
Low system power consumption functionAutonomous intermittent operation is performed,
allowing the MCU to sleep until data is received.
RSSI DetectionBlock
HostMCU
Reverse diffusion circuit provides high sensitivityDirect sequence spread spectrum transmission is detected
via IEEE802.15.4k below the environmental noise level,
resulting in accurate demodulation and high sensitivity which
cannot be achieved with conventional FSK communication.
Modulator
No wireless method is perfect. Each one is suitable for different
purposes. Various LPWAN protocols have been proposed, but each
has its advantages and disadvantages, and even the suitability of
the LPWAN method itself may be called into question. In response,
we are offering a proposal.
Base installation is unnecessary, and terminals are cheap. Sigfox®
has been adopted in 50 countries around the world*1, primarily in
Europe. IEEE802.15.4k is strong against interference from the same
system, can accommodate a larger number of terminals in the
same network, and enables easy connection even in urban areas
with wireless congestion. In addition to these 2 LPWAN methods,
our 2+1 mode wireless LSI is the first*2 to support the IEEE802.15.4g
standard, a short-range communication protocol used as the
physical layer for Wi-SUN that provides faster speeds than LPWAN.
This LSI is the ML7404GD.
POINT 01
In addition to IEEE802.15.4k and Sigfox® for LPWAN, support is provided for the near-field IEEE802.15.4g standard
2+1 Mode Advantages
ADSL, etc.
ADSL, etc.
HTTP, etc.
Billing
WW Backbone
Cloud
Sigfox® radiowaves cannotreach
Enables interpolation of area coverage from
IEEE802.15.4x via Sigfox® bridge communication
Coverage for up to 85%*3 of the
population planned by March 2019
*3 Published by Kyocera Communication Systems Co., Ltd. in June 2018
13 www.lapis-semi.com
LINEUP
ML7404GD P-WQFN32-
0505-0.50
Part No.Communication OthersCompliant and
Compatible StandardsFrequencyType Host I/F
PackageCode
OperatingTemp.
MaxTransmission Speed
Packagetype
MinTransmission Speed
315-960MHz Transceiver type
55% of actual size shown.Please refer to page 6 for icon descriptions.
Top Bottom
Diffusion
Propagation
Despreading
Interference
14www.lapis-semi.com
Specifications
ML7404GD P-WQFN32-0505-0.50
ARIB STD-T67, ARIB STD-T108, RCR STD-30,ETSI EN300-220, EN13757-4:2013,IEEE802.15.4d/g, IEEE802.15.4k,
Sigfox® Rev 2.E
Supported Standards
1.8 to 3.6
Supply Voltage(V)
Package CodePart No.
−40 to +85
OperatingTemperature
(˚C)
315/426/429/433/470/868/915/920
Supported Frequencies(MHz)
POINT 04
A Sigfox® Verified reference design is available that
integrates the ML7416S protocol control MCU with the
ML7404GD wireless transceiver.
In addition to the BOM list and circuit/layout diagrams for
this design, various driver software is provided free of
charge.
Sigfox® Verified reference design offered MK74Q0410 Reference Design for Japanese Market
POINT 02
Sigfox® utilizes BPSK modulation, which is not used in
conventional Sub-GHz communication. However,
conventional Sigfox® compatible wireless communication
LSIs do not support BPSK modulation, making it necessary
to create BPSK symbol data using control MCU software.
But this requires that the control MCU be activated each
time wireless communication is performed, resulting in
unnecessary set power consumption. In contrast, the
ML7404GD integrates a hardware-based BPSK modulation
circuit that supports Sigfox®. This eliminates the need for
the control MCU to operate (in the physical layer) during
wireless communication, reducing system power
consumption.
The first*2 hardware-based BPSK modulator for Sigfox®.Contributes to lower set power consumption
Advantages of Hardware-based BPSK Modulation
Block Diagram
NWK
MAC
FSK → BPSK Conversion
Module
RF Transceiver
Control MCU
Required for
every transmission
Block Diagram
Current Consumption Profile Current Consumption Profile
<Competitor's Sigfox®> <LAPIS Semiconductor's Sigfox®>
NWK
MAC
Module
Modulator
RF Transceiver
Control MCU
Only operates
when necessary
POINT 03
The LPWAN is tasked with accommodating a number of
terminals within a cell that other wireless methods cannot
compete with. As a result, disturbance tolerance in the
same system is considered to be an extremely important
factor in LPWAN.
We offer the industry’s first*2 ASSP (Application Specific
Standard Product) -based wireless transceiver compliant
with IEEE802.15.4k, which utilizes the DSSS (Direct
Sequence Spread Spectrum) technique that provides
greater resistance to interference within the same system
and security against interception. As a result, it is strong in
urban areas, and can accommodate more terminals under
one network.
Compatible with the strongest IEEE802.15.4k standard against interfering waves
IEEE802.15.4k Advantages
DiffusionDiffusionDiffusion
PropagationPropagationPropagation
Desired Wave
DespreadingDespreadingDespreading
Disturbance
InterferenceInterferenceInterference
Original Signal
Spread Signal
Received Signal
Restoration Signal
Despreading :
Noise → Original signal
Signal → Noise
Same operation
as despreading
Same operation
as diffusion
Becomes noise
due to diffusion
Advantages of the Same System Disturbance Tolerance
Other Method
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
TerminalTerminal
IEEE802.15.4k
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
TerminalTerminal
Base StationBase Station
RF Operation (Communication)
MCU Operation (Code Conversion)
Communication startCurrent
Operating Time
RF Operation (Communication)
Communication startCurrent
Operating Time
Hardware-based
modulation
eliminates the need
for CPU operation
BottomTop
22.0mm
35.0
mm
CPU power used
for code conversion
www.lapis-semi.com15
920MHz Transceiver (Japan)
ML7416NP-LFBGA81-
1010-1.00
TQFP48-
0707-0.50
DAP
STD GPIO AHB/APBBridge
Cortex®-M3 or M0+CPUUp to
81MHz or 40MHz
MTB
FlashControl
AHBRAM
SWD
SysTick
NVIC
WIC
Single-cycle I/O AHB-lite
CRY PTO(AES, SHA) TRNG Flash
DMASystemControl
DMAC
UART
RAND
ADC TEMP. RC OSC (40MHz)
SPI
SSIS
I2C
WDT
VDET
Res
etC
ont
rol
Reset
Co
ntr
ol
GPIO
FTM
Timer
CLK Timer
RTC
RF-IF
FlashControl
AHBSRAM
Brg
Registers PLLPo
wer
Man
agem
ent
32.768kHz 48MHzor
36MHz
APB
ClockControl
Flash
FlashMemory
RC OSC (32kHz)
X'tal OSC(32.768kHz)
CPUCPUCPU
LINEUP
SubGitz
2.4GHz
(ML7436N)
ML7421or
ML7396D
RF
ML7436NTQFP
1024KB
1024KB
256KBM3
M3
or
or
400~960
750~960
Specified Low Power Wireless System LSI with Built-in MCU
Sub-GHz Short-range Wireless
LAPIS Semiconductor's market-proven Sub-GHz specified low power wireless system LSI integrates a high-performance MCU
optimized for implementing the protocol stack and is designed to meet the needs of the expanding IoT market, including
HEMS/BEMS.
55% of actual size shown.Please refer to page 6 for icon descriptions.
Type Part No.CommunicationOperating
Temp.
MaxTransmission
Speed
MinTransmission
SpeedFrequency
Packagetype
OthersMemoryCPUCore
Top Bottom
PackageCode
Compliant andCompatible Standards
400 to 960MHz&2.4Ghz Transceiver type
Antenna
Specified Low Power Wireless System LSI with Built-in MCU Function/Block Diagram
Built-in high performance low power MCUCortex®-M0+ decreases current by 30%
and improves processing power by 10%
Hardware-based encryption processing engineBuilt-in encryption processing engine and DMA
controller ensure that the main part of the
encryption processing engine is hardware-based,
significantly decreasing software load.
Store all layers up to the HEMS profile in the high capacity flash ROMAll layers up to Echonet Lite for HEMS devices
can be stored in the large capacity internal
1024KB (Max) memory.
Compatible with OTA (Over The Air) ISP2 flash controllers support 512KB × 2
(or 265KB × 2) memory for firmware
updates from external systems.
Support for 2 diversity ensures stable receptionSwitching to the antenna with a stronger signal
ensures more stable reception.
Supports data flashAllows for high reliability data
rewrites.
Multilayer pathEnables program rewriting
without placing a load on the
CPU.
Built-in low-speed oscillation circuit reduces the number of external partsThe integrated 32kHz RC circuit eliminates
the need for an external oscillator.
16www.lapis-semi.com
CPU
POINT 03
During standby when no data is being transmitted/received
ultra-low power consumption is achieved by only supplying
power to the blue areas at left in the Function/Block
Diagram that are necessary for time division. In addition,
it is possible to partially cut off power supply to memory
blocks with large working currents depending on usage.
Built-in power supply isolation functionreduces power consumption during standby
POINT 04
Enables program rewriting without impacting CPU load.
Multilayer Path Application
POINT 02
Security processing is reduced by over 2000×, improving
performance while reducing power consumption.Built-in Hardware
Encryption Engine
AES
DMAC
Integrated security hardware engine
RAM
SPI RF
Encryption Key Length: 128/192/256bit
Authentication/Encryption Modes: AES-CCM/GCM
Basic Encryption Modes: AES-ECD/CBC/CTR/OFB
Note: AES CCM processing for 1 block (16 Bytes)
ML7416Standard MCU(No encryption hardware)
24 cycles
Approx. 48,000 cycles
PowerConsumption
≈CPU Processing
Load
POINT 01
1024KB (512KB) flash ROM can be used as 512KB (256KB)
× 2 banks. This makes it possible to easily configure
systems capable of firmware updates to meet the needs of
the IoT market along with Wi-SUN updates, bug fixes, and
security enhancements.
2 flash ROM banks support OTA (Over The Air) ISP
OR
AC
ML7436N: 512KB x 2 configurable
(ML7416N: 256KB x 2 configurable)
ECONET Lite
TLS / PANA
(TCP/) UDP
iPv6 (/ RPL)
6LoWPAN
IEEE802.15.4/4a
IEEE802.15.4g
ECONET Lite
TLS / PANA
(TCP/) UDP
iPv6 (/ RPL)
6LoWPAN
IEEE802.15.4/4a
IEEE802.15.4g
HGW
Built-in Wi-SUN Stack
ECONET Lite
TLS / PANA
(TCP/) UDP
iPv6 (/ RPL)
6LoWPAN
IEEE802.15.4/4a
IEEE802.15.4g
SupportedFrequencies
(MHz)Supported Standards
SupplyVoltage
(V)Package CodePart No.
OperatingTemperature
(˚C)
CPU CoreOperating Frequency
(MHz)
Specifications
RF(ML7421 or
ML7396D)
Cortex®-M3
or M0 +
RAM
FlashFlash
EncryptionProcessing
EngineAES128
CCM,GCM, etc
DMA
FlashDMA
ML7436N 2.6 to 3.6400 to 960
2400P-TQFP48-0707-0.50
ARIB STD-T108, T67, T66ETSI EN300-220, IEEE802.15.4d/g, Wi-SUN
Wireless M-bus, FCC, Port 15–40 to +85 up to 81
ML7416N 1.8 to 3.6 750 to 960 P-LFBGA81-1010-1.00ARIB STD-T108, IEEE802.15.4d/g, Wi-SUN –40 to +85up to 40
Specified Low Power Wireless ModulesSub-GHz Short-range Wireless
www.rohm.co.jp17
ModulesConnector type
BP35A1
Surface Mount type
BP35C0
BP35C0-J11
USB Dongle type
BP35C2
BP35C0/BP35C0−J11/BP35C2 Function/Block Diagram
ML7416N(RF+MCU)
TRX_SW
LCfilter
UART/USB
USB
LDO
filter
OSC36MHz
OSC32.768kHz
BP35C2
RFSW
HostMCU
Host I/F
BP35C0/BP35C0-J11
UART
UART
BP35A1920MHz Transceiver type for Japan
BP35C0920MHz Transceiver type for Japan
LINEUP
BP35C2920MHz Transceiver type for Japan
BP35C0-J11920MHz Transceiver type for Japan
10mW1mW920
920
920
920
ROHM Sub-GHz specified low power wireless communication modules are capable of transmitting and receiving over longer
distances with very low power, making them ideal for smart meters and smart communities along with the M2M and IoT markets.
Wi-SUN compatible modules that integrate a Wi-SUN communication protocol stack are also offered.
USB I/FBuilt-in USB interface.
Facilitates connection with
other systems.
Applicable Model: BP35C2
Antenna
Please refer to page 6 for icon descriptions.
Pre-adjusted transmission powerThe adjusted transmission power value and MAC
address are loaded before shipment.
ML7416N built-inLAPIS Semiconductor's RFIC is integrated.
Antenna-equipped moduleBuilt-in antenna and pre-adjusted
wireless characteristics facilitate
development.
IEEE802.15.4g compatibilityEnables development of an IEEE802.15.4g-compatible
communication system.
Usage NotesROHM specified low power wireless modules are wireless communication modules. When developing products using this module it is also necessary to develop application
software. Many applications are supported by third parties. Sample code for demonstrating and evaluating our modules can be downloaded from our website.
Also, please refer to our website for technical support.
Part No. AntennaType Frequency OutputTransmission
SpeedCommunication Host I/F
OperatingTemp.
Compliant andCompatible Standards
www.rohm.co.jp 18
BP35A1
Applicable Model: BP35A1, BP35C0, BP35C0-J11, BP35C2
UART Wi-SUN/B Route −20 to +80 22.0×33.5×4.0BP35A1
UARTWi-SUN/B Route/
HAN −30 to +85 15.0×19.0×3.0BP35C0
UART Wi-SUN/B Route/ En hanced HAN −30 to +85 15.0×19.0×3.0BP35C0-J11
USBWi-SUN/B Route/
HAN −20 to +50 21.4×49.7×8.5BP35C2
Radio Law certification enables immediate evaluation and implementation
Construction DesignCertification Number
Worry-free Wi-SUN communication as a CTBU
Wi-SUN E-NET Profile Certified
2.7 to 3.6(Single power supply)
2.6 to 3.6(Single power supply)
2.6 to 3.6(Single power supply)
4.5 to 5.5(Single power supply)
POINT 03
Evaluation boards enable immediate use
For Evaluating BP35C0/BP35C0-J11
• RS-232C I/O built-in
• USB-UART conversion
• Compatible with USB BUS power
Specified Low Power BP35C0-T01Module BP35C0-J11-T01
Motherboard BP359C
POINT 01
ROHM wireless communication modules have already
acquired certification under Japan's Radio Law. This,
combined with the built-in antenna and pre-tuned wireless
characteristics, make it possible to immediately begin
evaluation and development by broadcasting without the
need for characteristics adjustment by the customer. Of
course this makes it unnecessary for the customer to
obtain Radio Law certification.
Certification under Japan's RadioLaw enables immediate use
The BP35A1/BP35C0/BP35C0-J11 wireless
communication modules have already obtained Wi-SUN
certification, along with the BP35C2 USB dongle. The
modules are also registered as CTBUs (Certified Test Bed
Units) by the Wi-SUN Alliance, playing the role as reference
units for Wi-SUN communication (Wi-SUN for ECHONET
Lite Profile).
POINT 02
Wi-SUN certified, registered as a CTBU
Specified Low Power Module
BP35A1
Adapter Boards BP35A7A
Motherboard BP359C
For Evaluating BP35A1
• RS-232C I/O built-in
• USB-UART conversion
• Compatible with USB BUS power
ML7396B(LAPIS Semiconductor)
ML7416N(LAPIS Semiconductor)
ML7416N(LAPIS Semiconductor)
ML7416N(LAPIS Semiconductor)
Specifications
Supply Voltage(V)
Dimensions(mm)
Part No. Host CPU I/FSupportedStandard
Built-in System LSIOperating
Temperature(˚C)
LINEUP
ML7631
ML7630
P-WQFN32-0505-0.50-A63
S-UFLGA34-2.59x2.59-0.4-W
19 www.lapis-semi.com
13.56
13.56
13.56MHz Wireless Charger Chipset13.56MHz Wireless Charger
LAPIS Semiconductor’s wireless charger chipset combines power transmission and reception LSIs for wireless charging utilizing
the 13.56MHz band. This makes it possible to reduce antenna size, enabling greater miniaturization of the wireless charging block.
13.56MHz Wireless Power Transmission
13.56MHz Wireless Power Reception
Part No.CommunicationType Frequency Host I/FCharging
PowerNFC I/F
OperatingTemp.
Packagetype
Package Code
BottomTop
BottomTop
Please refer to page 6 for icon descriptions. 70% of actual size shown.
13.56MHz Wireless Charger LSI Function/Block Diagram
Built-in Wireless Charging Control ProtocolThe ML7631 can be used alone
without program development.
Set the power transmission output levelAllows users to optimize power
transmission based on the charging
side.
Reduces wasted power and heat
generation.
Integrated 10bit SA-ADCEnables 3ch AD conversion of external signals. In addition, monitoring the
transmission current makes it possible to change the impedance during
power transmission, enabling device desorption and abnormality detection.
ADC
Controller
ML7631(Power Transmission)
WirelessChargingControlBlock Transmission Circuit
Antenna
Receiver Circuit
MCU(Option)
I2C
5V
27.12MHz
USBBUS
Power
5V Power SupplyCan be driven using
standard 5V USB BUS
power.
Shared antenna for power reception and NFC TagSharing one antenna for makes it
possible to reduce mounting area.
Built-in data flashEquipped with 496B data Flash for
NFC Tag functionality. Allows any data
to be set.
Integrated NFC Forum Type 3 Tag functionNFC Tag functionality enables support for
smartphones
Provides support for Bluetooth® pairing
and application specific functions.
Integrated comparatorThe specified temperature range for charging can be set
using an ADC or comparator. The threshold value can be
set and charging control based on charge temperature
monitoring important when charging Li-ion batteries can
be duplexed, ensuring safe charging operation.
ML7630(Power Receiver)
Controller
Comparator Thermistor
Antenna
CommunicationControl Block
ChargingIC
Battery
Power Reception/LDO
(3.5V to 5.0V)
Rectifier(Diodes)
HostMCU
Built-in variable voltage LDOEquipped with a 200mW output LDO featuring
adjustable output voltage. Output setting for low
voltage applications is enable from 3.5V to 5V
optimized for standard Li-ion battery chargers.
Integrated 10bit SA-ADCEnables 3ch AD conversion of external
signals. Makes charging possible
within the specified temperature range
by connecting an external thermistor.
In addition, by measuring the charging
voltage/current and battery voltage,
the battery status can be confirmed.
Data Flash Built-in Wireless Charging Control ProtocolThe ML7630 can be used alone
without program development.
ADC
NFC ForumType3 Tag
NFC ForumType3 Tag v1.0
20www.lapis-semi.com
POINT 01
Performing wireless charging at 13.56MHz makes it possible
to use a smaller antenna on the order of 1μH.
For example, adopting an ultra-compact cube antenna
reduces board area by approx. 50% compared to the
charging area utilized by conventional Micro USB connectors.
Utilizing a smaller antenna contributesto greater space savings
Specifications
Part No.
ML7631
Features
Wireless PowerTransmission
Wireless PowerReception
Functions
Adjustabletransmission power
200mWMax output
I/F
I2C Slave×1ch
NFC Forum Type3 TagI2C Slave×1ch
ADC(Method)
10bit(SA type) ×3ch
10bit(SA type) ×3ch
DataFlash
496B
496B
OperatingTemperature
(˚C)
−40 to +85
−40 to +85
Package Code
P-WQFN32-0505-0.50-A63(WQFN32)
S-UFLGA34-2.59x2.59-0.4-W(WCP34)ML7630
Saves valuable board space
Conventional
Mounting Board
80mm2
Mounting Board
New Wireless Charging Solution
40mm2
MicroUSBconnector 10×8mm
Cube Antenna for Power Reception 4×4mm
ML76302.6×2.6mm
Peripheral Components
50% smaller
Both the ML7630 and ML7631 integrate all functions
necessary for power reception/transmission in a single chip,
making it possible to achieve wireless charging control
without an MCU. This eliminates the need for software
development while contributing to set miniaturization by
reducing the space required for the MCU.
POINT 02
MCU-less design saves space and enables systemconfiguration without the need for software development
Standalone Design (No Control Software Needed)
USB Block
An
ten
na
ML7631(Transmission)
Charger Device
WQFN325V
TX1
RX0
RX1
An
ten
na
ML7630(Reception)
Charging IC
Battery
2.6mm×2.6mm WCSP
RX0
RX1
BAT
VDDIO
BAT2
Thermistor
The ML7630 integrates a 200mW output LDO capable of
charging Li-ion batteries by using a charging IC at the output.
In addition, the built-in 10bit AD converter and comparator
provide programmable temperature control (temperature
detection, threshold management) important for Li-ion
batteries, ensuring high reliability charging control.
POINT 03
200mW output LDO and temperaturemanagement support Li-ion battery charging
Receiver LSI (ML7630)
Charging IC
Battery
LDO(3.5V to 5.0V)
Rectifier(Diodes)
Antenna
ThermistorComparator
CommunicationControl Block
10bit ADC
ControllerFlash ROM
200mW Output LDO
Dualtemperature control
with ADC andcomparator
ML7630
TX0
Reference Kit
This kit allows users to verify antenna characteristics for
13.56MHz wireless charging and charge control in advance.
In addition, an NFC Forum Type3 Tag function is installed on
the power reception board that makes it possible to confirm
compatibility between NFC and charging operation. The kit
includes a power transmission board, power reception board,
and LCD board for displaying charging conditions, providing
a standalone 13.56MHz wireless charging solution.
POINT 05
Optional reference kit enables immediate evaluation
ML7630 EVA Board
(Power Reception)
ML7631 EVA Board
(Power Transmission)LCD Board
The ML7630 incorporates NFC Forum Type3 Tag
functionality that makes it possible to read Tag information
written in the internal ROM from NFC-equipped devices
such as smartphones, providing support for Bluetooth
pairing using NFC touch that eliminates the need for screen
or switch operation.
POINT 04
Integrated NFC Forum Type3 Tag function NFC Forum Type3 Tag
ML7630 Power Reception LSI
Thermistor
Charging IC
Battery
Rectifier LDO(3.5V to 5.0V)
CommunicationControl Block 10bit ADC
ControllerFlash ROM
Comparator
Antenna
r
Charging
ML7631-Equipped
Charger
ML7631 Power Transmission
edeed
Communication
Pairing between
ML7630-equipped
device and
smartphone, etc.
AntennaAntenna receives
magnetic field to generatepower and begin operation
Antenna
NFC ForumType3 Tag v1.0
NFC ForumType3 Tag v1.0
Anten
21 www.rohm.com
Modules
BP3591 BP3599 BP359BBP3595BP3580
Wi-Fi Modules Function/Block Diagram
ROHM Baseband LSICompatible with IEEE802.11b/g/n.
BP3580
3.3VRFSW
RFIC
Antenna
HostMCU
32bitMCU
BB/MAC
FLASH Memory
FLASH Memory
EEPROM
OSC
XTAL
LDO
LDO
Firmware must be
downloaded after every
startup and reset.
The appropriate firmware can
be selected from the lineup.
4Kbit flip-chip EEPROM for
storing personal information
such as MAC addresses and
RF adjustment parameters.
BP3599BP359B
BP3591 BP3595
Usage NotesROHM Wi-Fi modules are wireless communication modules. When developing products using this module it is also necessary to develop application and device drivers.
The device drivers are offered on our website as sample code (Linux). Other OS and applications are supported by third parties.
Also, please refer to our website for technical support.
2.4GHz Short-range Wireless
ROHM Wi-Fi modules are wireless communication modules. When developing products using these modules, it is also necessary to
develop application and device drivers. The device drivers are offered on our website as sample code (Linux). Other OS and applications
are supported by third parties. Also, please refer to our website for technical support.
Built-in Antenna type Built-in Antenna/Flash Memory type Internal Antenna/MCU typeCompact type with Built-in AntennaSurface Mount type
BP3591/BP3599 mounted
BP3580
BP3591
BP3595
BP359B
LINEUP
BP3599
Wi-Fi Modules
OperatingTemp.
Antenna Encryption OtherTransmission
SpeedCommunicationFrequencyType Part No.Host I/F
Compliant andCompatible Standards
High-Speed Data Transmission
High-Speed Data Transmission
High-Speed Data Transmission
High-Speed Data Transmission
High-Speed Data Transmission
Please refer to page 6 for icon descriptions.
22www.rohm.com
POINT 01
LAPIS Semiconductor wireless communication modules
have acquired certification under Japan's Radio Law.
Built-in antenna and pre-adjusted wireless characteristics
allow for immediate broadcasting and application
evaluation/development. Of course this eliminates the need
to certify customer sets.
Certification under Japan's RadioLaw enables immediate use
Specifications
Supported Standards/Module Specifications
OperatingTemperature
(˚C)
Dimensions(mm)
Part No.
BP3580
BP3591
17.0×17.0×2.3
24.0×33.1×4.7
BP3599 24.0×33.1×4.7
15.3×27.6×2.6BP3595
HostCPU I/F
USB/SDIO/UART
USB/SDIO/UART
USB/SDIO/UART
USB/SDIO/UART
USB/SPI/UART
· IEEE802.11b/g/n
· IEEE802.11b/g/n· Module incorporating the BP3580 and chip antenna
· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Preloaded firmware
· IEEE802.11b/g/n· Compact version of the BP3591
· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Preloaded firmware
Built-inSystem LSI
BU1805GU
BU1805GU
BU1805GU
BU1805GU
BU1805GU
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +70 24.0×33.1×4.7BP359B
POINT 02
Selectable software stack
Software configuration with standard firmware
User Applications
TCP/IP Protocol Stack
Wireless LAN Device Driver
USB2.0/SDIO Device Driver
HOST side Software
HOST Interface Device Driver (USB2.0/SDIO)
WPS Registrar/Enrollee
WPA/WPA2-PSK
BB/MAC Controller
Wireless LAN Firmware
*Wireless LAN compliant software
for performing authentication and
encryption processing
ROHM originaldevice driver
Supplicant*stored within
module
Radio Law certification enables immediate evaluation and implementation
BP3595BP3580 BP3591 BP3599 BP359B
Construction DesignCertification Number
Evaluation Boards
BP359C UART I/F board
• RS-232C I/O built-in
• USB-UART conversion
• Compatible with USB BUS power
UART
Note: BP359D can be used for both BP3591 and BP3599.
(In the case of BP3591, startup is initiated using flash memory
on BP359D, while flash memory on the BP3599 is used for startup.)
USB/SDIO
USB SDIO
Top Bottom Top Bottom
BP3591/BP3599 mountedBP3591/BP3599 mountedBP3591/BP3599 mounted
Wireless LAN Modules
BP3591
Adapter Boards
BP359D(for BP3591)
Supports conversion to 2.54mm pitch
Top
Bottom
BP359F(for BP3595)
Top
Bottom
BP3595
BP359E(for BP3599)
Top
Bottom
BP3599 BP359B
Supply Voltage(V)
3.1 to 3.5(Single power supply)
3.1 to 3.5(Single power supply)
3.1 to 3.5(Single power supply)
3.1 to 3.5(Single power supply)
3.1 to 3.5(Single power supply)
Software stack with HTTP/SSL firmware
User Applications
HOST side Software
For BP359B
TCP/IP Protocol Stack
SSL/TLS
HTTP
HOST Interface Device Driver (UART only)
WPS Enrollee
WPA/WPA2-PSK
BB/MAC Controller
Wireless LAN Firmware
Software stack withbuilt-in TCP/IP firmware
User Applications
HOST side Software
TCP/IP Protocol Stack
HOST Interface Device Driver (UART only)
WPS Registrar/Enrollee
WPA/WPA2-PSK
BB/MAC Controller
Wireless LAN Firmware
HTTP, SSL and TCP/IP
protocol stack provided
AP firmware supports DHCP
and WPS Registrar
STA firmware compatible with
DHCP Client WPS Enrollee
Enables simple control through WID commands
(ROHM original) and achieveswireless LAN even with a non-powered
Host without the need for a driver.
Built-in supplicantand TCP/IP
protocol stack
UART
Adapter Boards
Wireless LAN Modules
23 www.rohm.com
EnOcean® Communication ModulesSub-GHz Batteryless Communication
EnOcean® modules combine ultra-low power communication elements with power generating devices that utilize energy harvesting
technology (i.e. light, electromagnetic induction). Their wire-free, batteryless design enables installation virtually anywhere and
eliminates the need for periodic maintenance. In addition, interconnectivity makes it easy to add devices.
LINEUP
Switch Modules
Circuit Boards for Switch Modules
Humidity Sensor Modules
Humidity Sensor Modules
Humidity Sensor Modules
Wireless Energy Harvesting Modules
Programmable Wireless Modules for Transmission/Reception
USB Receiver Modules
Wireless switch modules for push mechanisms. Integrates a switch
power generation element and wireless communication module.
Wireless transmission board modules for switches. Used in combination
with electromagnetic induction generator elements for switches.
Used for open/close detection of doors and windows.
Power generated from weak indoor light using photovoltaic cells
is used to wirelessly transmit open/close status.
Can be used as temperature sensors. Power generated from weak
indoor light using photovoltaic cells is used to wirelessly transmit
temperature data.
An expansion board for temperature sensor modules that adds
a humidity sensor. Includes a connector for connecting to temperature
sensor modules.
Wireless modules optimized for energy harvesting.
Programmable transceiver modules that can be used
for receiving signals from switch modules.
Transceiver modules that support USB connection.
Power generating switch elements that generate electricity using
electromagnetic induction. Used in combination with
switch module circuit boards.
Part No.
HSM 100
PTM 210J
WirelessFrequency928.35MHz
(Japan)
PTM 430J
STM 429J
STM 431J
STM 400J
TCM 410J
USB 400J
PTM 210
WirelessFrequency868.3MHz(EU/China)
PTM 330
STM 329
STM 331
STM 300
TCM 310
USB 300
ECO 200Electromagnetic Induction Generator Element for Switch Modules
Product Name Overview ImageCompliant and
CompatibleStandards
OperatingTemp.
Please refer to page 6 for icon descriptions.
Usage NotesEnOcean® modules are wireless communication modules. When developing products using these modules, it is also necessary to develop application software.
Many applications are supported by third parties.
For technical information on these products, please refer to EnOcean® GmbH’s website.
EnOcean® Module EDK 400J Evaluation Kit
Kit Contents
· PTM 210J (Switch Modules)
· USB 400J (USB Receiver Module)
· PTM 430J (Circuit Boards for Switch Modules)
· ECO 200 (Electromagnetic Induction
Generator Element for Switch Modules)
· STM 431J (Temperature Sensor Modules)
· STM 400J
(Wireless Energy Harvesting Module) *1
· EOP 350 (Programming Board) *2
· USB Cable
(for connecting the EOP 350 to a PC)
*1 STM 400 in the EDK 400J is mounted on a dedicated board for connecting to EOP 350.
*2 Used when rewriting firmware for STM 400J and STM 431J.
Programming kit ideal for application/firmware development, prototyping, and training purposes.
Dolphin V4 API (S/W)Requires purchase of EDK 400J
· Library files
· Peripheral functions manual
· Sample source code
Dolphin V4 Suite (S/W)Software bundle that performs program writing,
product settings, and chip calibration
Keil Integrated Development Environment (μVision)In conjunction with Dolphin V4 API/Suite (S/W), makes it possible to carry out a series of firmware
(F/W) development tasks such as original firmware coding, compiling, and writing.
Dolphin ViewAn evaluation tool for evaluating and analyzing EnOcean® wireless signals
Note: Representative image
24www.rohm.com
POINT 01
Combining ultra-low-power wireless communication
devices with energy harvesting technology capable of
generating electricity from a push of a switch, temperature
differences, or even light makes batteryless, wireless
communication possible. The batteryless design
eliminates the need for maintenance, enabling easy
installation even in places conventionally difficult to install.
In addition, ultra-low power communication 10x lower than
the IEEE802.15.4 standard (i.e. ZigBee®) is achieved.
And application support is provided in the form of an
easy-to-use module, facilitating practical use.
Wireless communication without batteries PTM 210J Block Diagram and ECO 200 Operating Principle
ECO 200(Electromagnetic
induction)
Current/
Voltage
Converter
Contact/
Nipple
Microcontrollers
RF IC
Pattern
Antenna
ECO 200 utilizes
electromagnetic
induction to
generate electricity
POINT 03
EnOcean® products for Japan are certified under Japan’s
Radio Law, allowing for immediate use by incorporating in
existing sets.
Note: EnOcean® products are available in multiple frequency bands to support the radio laws in different countries. Therefore, it is necessary to select the EnOcean® product according to the frequency band of the country used (destination).
Certification under Japan's RadioLaw enables immediate use
EnOcean® Product List
Part No.Region
Switch Modules
Circuit Boards for Switch Modules
Electromagnetic Induction Generator Element for Switch Modules ECO 200
Magnetic Contact Modules
Temperature Sensor Modules
Humidity Sensor Modules HSM 100
Wireless Energy Harvesting Modules
Programmable Wireless Modules for Transmission/Reception
USB Receiver Modules
868.30MHz
EU/China
PTM 210
PTM 330
STM 329
STM 331
STM 300
TCM 310
USB 300
928.35MHz
Japan
PTM 210J
PTM 430J
STM 429J
STM 431J
STM 400J
TCM 410J
USB 400J
Specifications
Part No.
Supply Voltage
Supply from internal ECO 200
Supply from external ECO 200
Electromagnetic induction power
generation: 120μJ Min at 2V
Solar power generation
Solar power generation
Supply from STM 431J
2.1 to 5.0V
(2.5V startup voltage)
2.6 to 5.0V
(via USB)
Antenna
Pattern Antenna
Whip Antenna
Helical Antenna
Helical Antenna
Pattern Antenna
OperatingTemperature
(˚C)
−25 to +65
−25 to +65
−25 to +65
−20 to +60
−20 to +60
−20 to +60
−25 to +85
−25 to +85
−20 to +50
Dimensions(mm)
40.0×40.0×11.2
26.2×21.15×3.5
29.3×19.5×7.0
64.8×16.0×5.4
64.8×16.0×8.4
18.0×13.0×3.5
22.0×19.0×3.1
22.0×19.0×3.1
70.0×23.0×9.0
PTM 210J
PTM 430J
STM 429J
STM 431J
STM 400J
TCM 410J
USB 400J
HSM 100
928.35MHz (Japan)
PTM 210
PTM 330
STM 329
STM 331
STM 300
TCM 310
USB 300
868.30MHz (EU/China)
ECO 200
POINT 02
EnOcean® modules require no wiring, making it possible to
reduce both labor and wiring costs.
Installation work is minimized. And no wiring allows for
easy removal and reinstallation virtually anywhere.
The wire-free design lends a clean aesthetic that makes it
an attractive option for buildings and hotels. It has also
been used to light up important cultural assets.
Wire-free design reduces installation time Example of reducing wiring with stairway lighting
PowerSupply
PowerSupply
Wiring for powersupply switchnot required
—
—
—
—
25
ML7404GD P-WQFN32-0505-0.50
315 to 960
Up to 100kbps(xFSK)80k to
200kcps(DSSS)
2-level(G)FSK(G)MSK4-level(G)FSK(G)MSKBPSKDSSS
IEEE802.15.4k
–119.5dBm[2.4kbps,
BER=1%]*1
(xFSK)–121dBm[200kcps,
SF=64, PER=1%]*2
(DSSS)
ARIB STD-T67,ARIB STD-T108,
RCR STD-30,ETSI EN300-220,EN13757-4: 2013,Sigfox® (Rev 2.E),
IEEE802.15.4k
MK71521
MK71511
MK71251-01
1.7to3.6
2.0to3.6
Bluetooth core spec. v5.0(Single mode)
Bluetooth core spec. v5.1(Single mode)
Bluetooth core spec. v4.1(Single mode)
Bluetooth certificationRadio certifications:
TELEC/FCC/ISED/CE(To be acquired)
Bluetooth certificationQDID: 77987 (End Product)
Radio certifications: TELEC/FCC/IC/CEMK71251-02A
(BACI*1) SPI(HCI*2) UART
UART
Flash: 512KBRAM: 64KB
Flash: 128KBRAM: 128KB
Flash: 192KBRAM: 24KB
Flash: –RAM: 28KB
9.7×13.96×2.1
9.7×11.95×2.00
TBD
TBD9.7×13.96×2.1
8.0×11.0×2.00M-FLGA33-8.0X11.0-0.65-9Y
–20to
+75
MK71351-NNN
UART SPI
UART SPI
UART SPI
Role: Master/SlaveApplication
blank
Role: Master/SlaveApplication
blank
Role: Master/SlaveApplication
blank
–40to
+85
–40to
+85
ML7344CyGD
ML7344JyGD
ML7396DGD
ML7386BGD
ML7396EGD
ML7386GD
ML7345DGD
470 to510
Up to 50,100, 150,200, 400
Up to 15
Up to 100
10
–107dBm[100kbps,
BER=0.1%]*1
–123dBm[2.4kbps,
BER=1%]*1
–119.5dBm[2.4kbps,
BER=1%]*1
–123dBm[2.4kbps,
BER=1%]*1
–117dBm[4.8kbps,
BER=0.1%]*1
–40to
+85
–40to
+85
–40to
+85
1/10
1/10/20
1/10/20
1/10/20
1/10/20
20/100
20/100
ARIB STD-T67,ARIB STD-T108,
RCR STD-30,EN300-220,
EN13757-4: 2013
Q/GDW374.3
1.8 to 3.6
900 to960
750 to900
470 to510
160 to510
Up to 100
Up to 100
ARIB STD-T108,FCC part15
EN300-220
ARIB STD-T67,RCR STD-30
Q/GDW374.3
ML7345GD 160 to960
315 to960
ARIB STD-T67,ARIB STD-T108,
RCR STD-30,EN300-220,
EN13757-4: 2013
1.8 to 3.6
1.8 to 3.6
ML7345CGD
2-level (G)FSK(G)MSK
2-level (G)FSK(G)MSK
2-level (G)FSK(G)MSK4-level (G)FSK
2-level (G)FSK(G)MSK4-level (G)FSK
2-level (G)FSK(G)MSK4-level (G)FSK
3.3 to 3.6(100mW)
ML7414GD 315 to960
ARIB STD-T67,ARIB STD-T108,Sigfox® (Rev 2.E),
RCR STD-30,EN300-220,
EN13757-4: 2013
1.8 to 3.6
3.3 to 3.6(100mW)
P-WQFN40-0606-0.50
P-WQFN32-0505-0.50
P-WQFN32-0505-0.50
–40to
+85
P-WQFN32-0505-0.50
–40to
+85
P-WQFN32-0505-0.50
–106dBm[100kbps,BER=1%]*1
1/10/20
1/10/20
1/10/20
Up to 100–40to
+85
P-WQFN32-0505-0.50
Up to 500–106dBm[100kbps,
BER=0.1%]*1
–40to
+851/10/20ML7406yGD 750 to
960EN300-220,
EN1357-4: 2011
2-level (G)FSK(G)MSK
P-WQFN32-0505-0.50
ML7421GD–40to
+85
P-WQFN36-0606-0.50
400 to 9602400
1.2 to 300
2-level(G)FSK(G)MSK4-level(G)FSK
–107dBm[100kbps,BER=1%]*1
(860/920MHz)–95dBm
[100kbps,BER=1%]*1
(2.4GHz)
ARIB STD-T66,ARIB STD-T67,
ARIB STD-T108,EN300-220,FCC part15
1.8 to 3.6
1.8 to 3.6
Role :Master/Slave
Role: Slave onlySerial communication
application
*1 BER refers to Bit Error Rate. *2 Halogen-free products are indicated by the mark. For details, please contact a sales representative.
PackageCode
Part No.Operating
Temp.(˚C)
FrequencyBands(MHz)
TransmissionRate
(kbps)
ModulationMethod
ControlI/F
FECMode
ReceptionSensitivity
SupportedStandards
SupplyVoltage
(V)
TransmissionOutput(mW)
HalogenFree*2
*1 BER refers to Bit Error Rate. *2 Halogen-free products are indicated by the mark. For details, please contact a sales representative.
Bluetooth core spec. v4.2(Single mode)
M-FLGA33-9.7×11.95-0.75-9Y
−40to
+85
2.0to 3.6
Specifications
*1:BACI (Bluetooth Application Controler Interface), LAPIS Semiconductor’s original host I/F *2 HCI (Host Control Interface), a Bluetooth compliant interface
Note 1: When purchasing MK71251 series Bluetooth modules, we ask that the user verify the application, operating environment, equipment used, and other factors.
Note 2: Please contact a distributor or ROHM sales representative in advance when considering the adoption of MK71351 series Bluetooth modules.
Bluetooth® Modules2.4GHz Short-range Wireless
Specified Low Power Wireless LSIsSub-GHz Short-range Wireless
−25to
+85
P-WQFN28-0404-0.40
1.8 to 3.6Sync serial(Control)DI (DATA)
2-level FSK2-level MSK
426ARIB STD-T67,RCR STD-30
2.4,4.8,7.2
IEEE802.
15.4g
IEEE802.
15.4g
IEEE802.
15.4g
2-level (G)FSK(G)MSK4-level
(G)FSK, BPSK(transmission only)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control)
DIO (DATA)
Sync serial(Control ·
DATA)DIO (DATA)
— —
—
—
—
—
—
Multiband Wireless LSISub-GHz & 2.4GHz Wireless
1.8 to 3.6
1.8 to 3.6
*1 BER refers to Bit Error Rate. *2 PER refers to Packet Error Rate . *3 Halogen-free products are indicated by the mark. For details, please contact a sales representative.
LPWAN (Low Power Wide Area Network) Wireless LSISub-GHz Long-range Wireless
–40to
+85
PackageCode
Part No.Operating
Temp.(˚C)
FrequencyBands(MHz)
CommunicationSpeed
ModulationMethod
ControlI/F
FECMode
ReceptionSensitivity
SupportedStandards
SupplyVoltage
(V)
TransmissionOutput(mW)
HalogenFree*3
Part No.SupplyVoltage
(V)
PackageCode
OperatingTemp.
(˚C)
ControlI/F
ModulationMethod
FrequencyBands(MHz)
SupportedStandards
HalogenFree*2
ReceptionSensitivity
TransmissionOutput(mW)
TransmissionRate
(kbps)
FECMode
Part No.SupportedStandard Certification
HostCPU I/F
Built-in Flash/RAM
Dimensions(mm)
PackageCode
ModuleSpecifications
OperatingTemp.
(˚C)
SupplyVoltage
(V)
Bluetooth certificationQDID: 127008 (End Product)Radio certifications: TELEC/FCC/IC/CE
26
BP35A1
BP35C0
2.6 to 3.6(Single Power Supply) UART Wi-SUN
ML7416N(LAPIS Semiconductor) 15.0×19.0×3.0BP35C0-J11
BP35C2
ML7631
ML7630
PTM 210J
PTM 430J
STM 429J
STM 431J
STM 400J
TCM 410J
USB 400J
HSM 100
40.0×40.0×11.2
26.2×21.15×3.5
64.8×16.0×5.4
64.8×16.0×8.4
22.0×19.0×3.1
22.0×19.0×3.1
70.0×23.0×9.0
18.0×13.0×3.5
29.3×19.5×7.0
Supply from internal ECO 200
Supply from external ECO 200
Solar power generation
Solar power generation
2.1 to 5.0V (2.5V startup voltage)
2.6 to 5.0V
(via USB)
Supply from STM 431J
Electromagnetic induction power generation: 120μJ Min at 2V
−25 to +65
−25 to +65
−20 to +60
−20 to +60
−25 to +85
−25 to +85
−20 to +50
−20 to +60
−25 to +65
Pattern Antenna
Whip Antenna
Helical Antenna
Helical Antenna
Pattern Antenna
ECO 200
ML7416N
ML7436N P-TQFP48- 0707-0.50
–40to
+85
400 to 9602400
2-level(G)FSK(G)MSK4-level(G)FSK
ARIB STD-T66ARIB STD-T67ARIB STD-T108
EN300-220FCC part115
Cortex®-M3
FLASH1024KB, RAM256KB
1.2 to 300 1/10/20
–107dBm[100kbps,BER=1%]*1
(860/920MHz) –95dBm
[100kbps,BER=1%]*1
(2.4GHz)
Specifications
Part No.
928.35MHz(Japan)
*1 BER refers to Bit Error Rate. *2 Halogen-free products are indicated by the mark. For details, please contact a sales representative.
Wi-Fi Modules2.4GHz Short-range Wireless
Dimensions(mm)
Part No.
BP3580 17.0×17.0×2.3
24.0×33.1×4.7BP3591
24.0×33.1×4.7BP3599
15.3×27.6×2.6BP3595
Supply Voltage(V)
3.1 to 3.5(Single Power Supply)
3.1 to 3.5(Single Power Supply)
3.1 to 3.5(Single Power Supply)
3.1 to 3.5(Single Power Supply)
3.1 to 3.5(Single Power Supply)
HostCPU I/F
USB/SDIO/UART
USB/SDIO/UART
USB/SDIO/UART
USB/SDIO/UART
USB/SPI/
UART
· EEE802.11b/g/n
· IEEE802.11b/g/n· Module incorporating the BP3580 and chip antenna
· IEEE802.11b/g/n· BP3591 with built-in Flash memory· Preloaded firmware
· EEE802.11b/g/n· Compact version of the BP3591
· IEEE802.11b/g/n· BP3591 with built-in MCU and flash memory· Pre-installed firmware
Built-inSystem LSI
BU1805GU
BU1805GU
BU1805GU
BU1805GU
BU1805GU
Operating Temp.(˚C)
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +70 24.0×33.1×4.7BP359B
Supported Standards/Module Specifications
Specified Low Power Wireless System LSI with Built-in MCUSub-GHz Short-range Wireless
P-LFBGA81-1010-1.00
750to
960
2-level(G)FSK(G)MSK
ARIB STD-T1081.8to3.6
2.6to3.6
Cortex®-M0+
FLASH 512KB,RAM 64KB
to 50,100, 150,200, 400
1/10/20−106dBm[100kbps,
BER=0.1%]*1
−40to
+85
Part No.Supported
Frequencies(MHz)
ModulationMethod
SupportedStandards
SupplyVoltage
(V)
CPUCore
MemoryResources
CommunicationSpeed (kbps)
TransmissionOutput(mW)
ReceptionSensitivity
PackageCode
OperatingTemp.
(˚C)
HalogenFree*2
2.7 to 3.6(Single Power Supply)
2.6 to 3.6(Single Power Supply)
UART
UART
Wi-SUN
Wi-SUN
ML7396B(LAPIS Semiconductor)
ML7416N(LAPIS Semiconductor)
−20 to +80
−30 to +85
22.0×33.5×4.0
15.0×19.0×3.0
4.5 to 5.5(Single Power Supply) USB Wi-SUN
ML7416N(LAPIS Semiconductor)
−20 to +50 21.4×49.7×8.5
−30 to +85
Part No.Supply Voltage
(V)Host
CPU I/FSupportedStandard Built-in System LSI
Operating Temp.(˚C)
Dimensions(mm)
Specified Low Power Wireless ModulesSub-GHz Short-range Wireless
13.56MHz Wireless Charger Chipset13.56MHz Wireless Charger
−40 to +85Wireless PowerTransmission
Wireless PowerReception
Adjustabletransmission power
200mW Max outputOutput voltage setting
I2C Slave×1ch
NFC Forum Type3 TagI2C Slave×1ch
496B
496B
10bit(SA type)×3ch
10bit(SA type)×3ch
−40 to +85
P-WQFN32-0505-0.50-A63(WQFN32)
S-UFLGA34-2.59x2.59-0.4-W(WCP34)
PackageCode
Part No. Operating Temp.(˚C)Features Functions I/F Data Flash
ADC(Method)
EnOcean® Communication ModulesSub-GHz Batteryless Communication
Dimensions(mm)
Supply Voltage Operating Temp.(˚C)
Antenna
—
—
—
—
• ARM® and Cortex® are registered trademarks of ARM Limited (or one of its subsidiaries) in the EU and other countries.
• The Bluetooth® word mark and logo are registered trademarks owned by Bluetooth SIG, Inc, and are used under license.All other trademarks and trade names are the property of their respective owners.
• Sigfox® is a registered trademark of SIGFOX S.A.
• EnOcean® is a registered trademark of EnOcean® GmbH.
Catalog No.62B7238E-B 03.2020 PDF © 2020 ROHM Co., Ltd.
March 1st, 2020.
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