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The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 2010o
The ATLAS IBL Project
The 5th "Trento" Workshop on Advanced Silicon Radiation Detectors
Manchester, 24-26 February 2010G. Darbo - INFN / Genova
Conference Site: • http://www.hep.man.ac.uk/Radiation-Detectors2010/agenda.html
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20102
ATLAS Pixel DetectorATLAS Pixel Detector• 3 Barrel + 3 Forward/Backward disks• 112 staves and 48 sectors• 1744 modules• 80 million channels
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20103
The ATLAS Pixel ModuleATLAS Pixel Module• 16-frontend chips (FE-I3)
modules with a module controller chip (MCC)
• 47232 pixels (46080 R/O channels), 50 x 400 µm2 (50 x 600 µm2 for edge pixel columns between neighbour FE-I3 chips)
• Planar n-on-n DOFZ silicon sensors, 250 µm thick
• Designed for 1 x 1015 1MeV fluence and 50 Mrad
• Opto link R/O: 40÷80 Mb/link
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20104
Pixel Integration and Installation
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20105
Mission impossible… fit an additional layer in between Pixel and beam-pipe:
• Reduce beam-pipe by 4 mm in radius… and make it possible!
IBL: Project HistoryThe ATLAS Pixel B-Layer initially designed for replacement• September 2007 B-Layer replacement Workshop outcome: replacement not possible
in 1 year shutdown.• January 2008: ATLAS Task Force (A. Clark & G. Mornacchi) Report July 2008 (Bern):
preferred (only) option Insertable B-Layer (IBL)• February 2009: project approved by ATLAS May 2009 IBL management organization
in place.• Now: design fast advancing, IBL Technical Design Report (TDR) draft, interim
Memorandum of Understanding (i-MoU) in discussion.
Existing B-Layer
IBL
Iourii Gusakov
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20106
Motivation for IBL
The existing B-Layer cannot be replaced in a long LHC shutdown (8-months):• This was a major finding of the B-Layer task force. Many reasons make it very difficult:
• Extraction, moving to surface and opening the whole Pixel Detector package.• Work on an activated material.• Risk of damage (many last moment operations made the process “irreversible” in
the final phase of the detector integration).
Reasons for an IBL to back-up existing B-Layer:Radiation damage• Sensor and electronics degradation of the existing B-Layer reduce detector efficiency
after 300÷400 fb-1 (last forecast of LHC integrated luminosity move it more far away)
Insurance for hard failures in the Pixel B-Layer• The Pixel Detector cannot be repaired in case of cooling, opto-links, module hard
failure. Inefficiencies of the B-layer have high impact on many Physics channels.
Improve existing B-Layer Physics performance• A low mass detector (~50% of existing B-Layer) improves Physics performance.
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20107
IBL LayoutBeam-pipe reduction:• Inner R: 29 25 mm
Very tight clearance:• “Hermetic” to straight
tracks in Φ (1.8º overlap)• No overlap in Z: minimize
gap between sensor active area.
Layout parameters:• IBL envelope: 9 mm in R• 14 staves.• <R> = 33 mm.• Z = 60 cm (active length).• η = 2.5 coverage.
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20108
BP Extraction & IBL+BP Insertion
Material from Raphael/NealThe present 7m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ:The new beam-pipe with the IBL will be inserted at its place:
• A carbon tube (IST) is inserted before the IBL: to support the new detector and to simplify the insertion procedure.
ISTIBL Support Tube
StaveStave
InsertTo fix to support, survey reference
Alignment wirers
Sealing service ring
PP1 Collar
Ref.: Y.Gusakov, N.Hartman, R.Vuillermet
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 20109
B-Layer ScenariosPhysics performance studies ongoing for the IBL TDR (ATHENA/GEANT4).Preliminary studies (ATLSIM/GEANT3) show improved performance with the addition of IBL (see low mass Higgs b-jet tagging plot on the right).Performance improvement due to low mass and smaller radius:
• Aggressive reduction of material budget is a must!
ATLAS
b-inserted as 4-layer R=3.5 cm
b-replaced
SV1 εb=70%
2-layers R=3.5
cm and 8 cm
2-old layers
SV1 εb=60%
Component % X0 (*)
beam-pipe 0.6
New BL @ R=3.5 cm 1.5
Old BL @ R=5 cm 2.7
L1 @ R=8 cm 2.7
L2 + Serv. @ R=12 cm 3.5
Total 11.0
WH(120 Gev)
Light jets rejection
Ref.: A. Rozanov(*) Material budget used in the simulation
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201010
• Fit made for 2 < r < 20 cm for L=550fb-1
• Gives for IBL @ 3.2 cm (550 fb-1):
Φ1MeV=3.3x1015 neq/cm2 (1.6 MGy)
• Safety factors not included in the computation (σpp event generator: 30%, damage factor for 1 MeV fluences: 50%)
Requirements for Sensors/Electronics
Requirements for IBL• IBL design peak luminosity = 3x1034 cm-2s-1 FE-I4 architecture & R/O bandwidth:
must be understood after Chamonix• Integrated luminosity seen by IBL = 550 fb-1 Survive to sLHC phase II• Design sensor/electronics for total dose:
• NIEL dose = 3.3 x 1015 ± (“safety factors”) ≥ 5 x 1015 neq/cm2
• Ionizing dose ≥ 250 Mrad
€
Φ(r) =2.9
r2 +0.14
r
⎛
⎝ ⎜
⎞
⎠ ⎟×1016
Ref.: Ian Dawson
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201011
FE-I4 Architecture: Obvious Solution to Bottleneck
>99% or hits will not leave the chip (not triggered)• So don’t move them around
inside the chip! (this will also save digital power!)
This requires local storage and processing in the pixel array• Possible with smaller feature
size technology (130 nm)
Large chip - design methodology:• Custom digital layout
substituted by automatic place & route of synthesized design.
• Chip verification is the challenge: analog/digital and mix-mode test bench simulation.
Ref.
: M
. B
arb
ero
et
al.
FE-I3 @ R = 5 cm
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201012
FE-I3 FE-I4FE-I4 Collaboration:Bonn: D. Arutinov, M. Barbero, T. Hemperek, A. Kruth, M. Karagounis.CPPM: D. Fougeron, M. Menouni. Genova: R. Beccherle, G. Darbo.LBNL: S. Dube, D. Elledge, M. Garcia- Sciveres, D. Gnani, A. Mekkaoui.Nikhef: V. Gromov, R. Kluit, J.D. Schipper
The first version of full FE-I4 chip will be submitted by end of March 2010
~70 million transistors, 0.13 µm CMOS technology6 Cu and 2 Al routing layers.
7.6mm
8mm active
2.8mm
FE-I3 74%
20.2mm
active16.8mm
~2mm
~200μm
FE-I4 ~89%
Ch
art
ere
d r
eti
cu
le (
24 x
32)
IBM
reti
cu
le
~19 mm
FE-I3 FE-I4
Pixel size [µm2] 50x400 50x250
Pixel array 18x160 80x336
Chip size [mm2] 7.6x10.8 20.2x19.0
Active fraction 74% 89%
Analog current [µA/pix] 26 10
Digital current [µA/pix] 17 10
Analog Voltage [V] 1.6 1.5
Digital Voltage [V] 2.0 1.2
Pseudo-LVDS out [Mb/s] 40 160
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201013
FE-I4-P1
LDORegulator
ChargePump
CurrentReference
DACs
Co
ntr
ol
Blo
ck
Ca
pa
cit
an
ce
Me
as
ure
me
nt
3mm
4mm
61x14 array
SEU test IC
4-LVDS Rx/Tx
ShuLDO+trist LVDS/LDO/10b-DAC
CLKGEN proto: PLL core + PRBS + 8b10b coder + LVDS driv
low power discriminator
The Way to FE-I4: Test Chips
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201014
FE-I4
periphery
digital 4-pixel region
analog 1-pixel
4-pixel region
pixel array336×80 pixels
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201015
FE-I4: Sensor Related SpecsSpecifications Value Unit Conditions/comments
Pixel size 50 x 250 µm2
Bump pad opening 12 µm diameter
Input -Q DC coupled
Maximum charge 100,000 e
DC leakage current tolerance 100 nA
Pixel array size 80 x 320 Col x Row
Last bump to physical edge ≤ 100 µm
Normal pixel input capacitance range
100÷500 fF
Edge pixel input capacitance 150÷700 fF Sides for long pixels and top for ganged
Radiation tolerance 250 Mrad Specs met at this dose
In-time discriminator threshold with 20 ns gate and 400 fF load
≤5000 e Region can still assign small hits below in-time threshold to correct time bin
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201016
FE-I4: Discriminator & R/O Specs
Specifications Value Unit Conditions/comments
Hit-trigger association resolution 25 ns
Same pixel two-hit discrimination 400 ns At 5000 e in-time threshold and when both hits are 20 ke
Single channel ENC sigma <300 e 400 fF load, nominal current
Tuned threshold dispersion <100 e sigma
Charge resolution 4 bits
ADC method ToT
Average hit rate with 1% data loss
400 MHz/cm2 3.2 µs trigger latency, 100 kHz trigger rate
Max number consecutive triggers 16
Trigger latency (max) 6.5 µs
Maximum sustained trigger 200 kHz
Serial command/clock input 40 Mb/s - MHz
1 + 1 input per chip
Serial data output 160 Mb/s 1 output per chip
Output data encoding 8b/10b
I/O signals ~LVDS Current balanced differential
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201017
FE-I4: The Pixel Cell
2-stage architecture optimized for low power, low noise, fast rise time.• regular cascode preamp.
NMOS input.• folded cascode 2nd stage PMOS
input.
• Additional gain, Cc/Cf2 ~6.• 2nd stage decoupled from
leakage related DC voltage shift.
• Cf1 ~17 fF (~4 MIPs dynamic range).150 µm
13-bit memory/pixel: 4 FDAC, 5 TDAC, 2 cap, 1 HitEN, 1 HitOR
Ref.: A. Mekkaoui
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201018
Noise and Radiation Resultsa) ENC on “Collaboration Proto 1”
before and after irradiation (200 Mrad)
b) Measured ENC for pixels with and without Cload
c) Simulated ENC and time-walk @ 10 µA/pixel (preamp + amp2 + comparator)
ENC @ Low Current (10µA)
(loaded ~400 fF)
<ENC> ~ 65 e<ENC> ~ 90 e
(10 µA)
200Mrad, Cload~400fF
a)
b)
c)
20 ns timewalk for 2 ke- < Qin < 52 ke- & threshold @ 1.5 ke-
ENC=160e- @ Cd=0.4pF & IL=100nAENC[e-]
Cd[F]
Qin[C]
tLE[s]
100f 200f 300f
60
100
150
10k 20k 30k 40k
IL = 0 nA
20n
10n
0
IL=100 nA
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201019
Module Design: Sensor Technology Independent
Decision on sensors after TDR• Need module prototypes with FE-I4 (second half 2010)
Common sensor baseline for engineering and system purposes• 3D / Diamond sensors – single chip modules / Planar sensors – 2
chip modules
Sensor/module prototypes for ~10% of the detector in 2010• Stave prototype tested with modules and cooling
Credits: M.Garcia-Sciveres – F. Hügging
Single chip module:Edge < 325 µm
Double chip module:Edge < 450 µm
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201020
Sensors3 sensor technologies considered for IBL• Planar, 3D and Diamonds• Full scale prototypes with FE-I4 – Decision on spring 2010
Some specifications agreed:• Max fluence > 5 x 1015 1MeV neutrons / cm2
• Max power after full life dose < 200 mW/cm2
• Low dead area in Z: slim or active edge• Maximum bias voltage (system issue) : 1000 V
Sensor R&D and prototype work for IBL are presented in many talks in the Workshop…
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201021
Bump BondingLarge volume bump-bonding experience from Pixel Detector (see table):• PbSn and Indium bumps: PbSn AgSn
Program to qualify for the larger FE-I4 and different sensor technologies.• Setting up with mechanical/electrical
dummies, but finally real parts needed: thermo-mechanical process strongly dependent on actual metal layers of electronic chip and sensor.
• Goal to go below 190 µm of the Pixel Detector: target to 90 µm.
“dummy – sensor”(monitor wafer)
ATLAS Pixel bump-bonding production – Ref: Jinst 3 P07007 (2008)
Prototype test of advanced AgSn bumping with 90µm FE-I4 size dummies.
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201022
Thermal Figure of Merit and Thermal Run-away
Thermal runaway happens in sensors if not adequately cooled• Leakage current shows exponential
behavior.
Stave thermal figure of merit (Γ = [ΔT•cm2/W]) main parameter for thermal performance.
Power design requirements for IBL:Sensor Power 200 mW/cm2 @ -15 CFE power 400 mW/cm2
Stave prototype qualification program:Titanium / carbon fiber pipes (D = 2÷3 mm)
Cooling CO2 and C3F8
Carbon foam density: 025÷0.5 g/cm3
Radiation length: 0.36÷0.66 %X/X0
Pipe + stave structure + coolant
-45.00
-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0
Sens
or Te
mp
[C]
Integrated Luminosity [fb-1]
Thermal run-away Plot-40CF MonopipeWorst Thermal Figure of MeritTi Monopipe
C Evaporation TemperatureEvaporation T = -40 ºC = 30.0 C•cm2/W = 18.5 C•cm2/W
= 3.2 C•cm2/W
Thermal Runaway Plot
Ref.: D Giugni, H. Pernegger, M. Gilchriese
IBL including safety
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201023
Stave StructureStave structure made of carbon foam + cooling pipe (carbon fiber or titanium boiling channel)
The stiffness is provided by a carbon fiber laminate:
Fiber YS-80A; resin EX-1515; lay-up (0/60/-60)S2
Carbon foam diffuses the heat from the module to the cooling pipePoco Foam r=0.55g/cm3; K=135/45 W/mK OR Kopers KFOAM L1-250 r=0.245g/cm3; K=30 W/mK
0
10
20
30
40
50
60
70
80
90
100
0 0.1 0.2 0.3 0.4 0.5
K(W
/m-K
)
Density(g/cc)
K = 1070(( - 0.045)/2.2)1/0.67
Module (sensor + bumps + FE-I4)
Carbon foam
Omega CF laminate
Ti or CF pipe
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201024
Stave Prototype OptionsSTAVE CARACTERISTICS SIMULATION RESULTS
Pipe ID/OD[mm]
Omega Thickness
[µm]
Foam Density[g/cm3]
Coolant X/X0 [%] Thermal Figure of Merit (Γ)
[ºC•cm2/W]Bare
Stave with Coolant
Full layer (+ Module
+ Flex)
CF pipe, heavy foam 2.4 / 3.0 150 0.55 C3F8 0.48 1.056 17.25
CF pipe, light foam 2.4 / 3.0 150 0.25 CO2 0.36 0.956 18.56
Ti 3mm pipe, light foam 2.8 / 3.0 300 0.25 C3F8 0.66 1.276 2.79
Ti 2mm pipe, light foam 2.0 / 2.2 300 0.25 CO2 0.57 1.166 3.22
Module parameters• Sensor thickness = 250 µm• FE-I4 thickness = 90 µm• Flex Hybrid (η = 0) = 0.18 % of X0
Additional technical requirements (prototype work)• Max pressure of cooling pipe: 100 bar.• Develop pipe joints and fittings.• Gravitational / thermal deformation < 150 µm.• Isolation of the carbon foam from sensor high
voltage.• Mock-up for thermal measurements.
Carbon Foam 0.25g/cm3
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201025
When IBL in ATLAS?IBL plans to be ready for installation by end of 2014.
• Cannot be much before without compromising performance• A shut down of the machine of 8 month needed (4 to open/close ATLAS)
LHC plans after Chamonix are not clear: how peak and integrated luminosity increase and when machine shutdown will be scheduled:• Only plans up to 2012 are known.• Many LHC upgrades need shutdowns:
• Linac4, Collimators phase II, new interaction region quadrupole triplets, etc.
• Probably in one year from now we will know next 5 years plans.
Chamonix Agenda: • http://indico.cern.ch/conferenceDisplay.py?confId=67839
Summary of the Chamonix Workshop at Cern:• http://indico.cern.ch/conferenceDisplay.py?confId=83135
IBL
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201026
ConclusionsIBL will improve physics performance of ATLAS and it is a “safety insurance” for present B-Layer
TDR and MoU in progress – project cost evaluated • Motivated groups and institutes support
Challenging project:• Tight envelopes, material budget reduction, radiation dose and R/O
bandwidth requirements
New technologies in advanced prototype phase:• FE-I4, light supports, cooling, but mainly…
SENSORS !!!
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201027
BACKUP SLIDES
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201028R. Vuillermet
• The support carbon tube is fixed in 2 point of PP0 and on PP1 walls on side C and A.
• The structural pipe with a support system is moved out from the support carbon tube.
. The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted from A-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side A and C.
Two global support / installation scenarios: IBL support tube (1) / no tube (2):An IBL support tube would have advantage on stiffness and simplicity/safety for IBL installation, but drawback are envelope needs (~1÷1.5 mm) and increase of radiation length
Procedure studied on mock-up at bld.180 - procedure (1) animation:• The beam pipe flange on A-side is to close to the B-layer envelope - Need to be cut on the
aluminum section• A structural pipe is inserted inside the Beam Pipe and supported at both sides. • The support collar at PP0 A-side is disassembled and extracted with wires at PP1.• Beam pipe is extracted from the C-side and it pulls the wire at PP1• New cable supports are inserted inside PST at PP0.• A support carbon tube is pushed inside the PST along the structural pipe.
Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180
A-side C-side
Installation Scenarios
The ATLAS IBL Project – 5th Trento WorkshopG. Darbo – INFN / Genova Manchester, 24-26 February 201029
IBL Organisation Structure
Module WG(2 coordinators)• FE-I4• Sensors• Bump-Bonding• Modules• Test & QC• Irradiation
Stave WG(1 Phys + 1
Eng.)• Staves• Cooling Design
& Stave Thermal Management
• HDI• Internal
Services• Loaded Stave• Test & QC
IBL Integr.-Install.(2 Eng.)
• Stave Integration
• Global Sup.• Beam Pipe (BP)• Ext.services
inst.• IBL+BP
Installation• Cooling Plant• Test & QC
Off-detector(1 Phys + 1 E.Eng.)• Power• DCS• ROD• Opto-link• Ext.serv.design/
proc.• Test Beam• System Test
IBL Management BoardMembership:• IBL PL + IBL TC• 2 coordinators from each WG• Plus “extra” members
MembershipIBL Project Leader: G. DarboIBL Technical Coordinator: H. Pernegger“Module” WG (2 Physicists): F. Hügging & M. Garcia-Sciveres“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni“IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux“Extra” members:Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling)Offline “liaison” Pixel Off-line coordinator: A. AndreazzaTDR editor (temporary): K. Einsweiler
Whole project divided into 4 working groups• IBL Management Board has 10 members, plus
“extra” and ex-officio members.• Frequent meetings (every ~14 days) in this phase
of the project.
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