TCAD: SUPREM,PISCESSUPREM, PISCESbandi.chungbuk.ac.kr/~ysk/devnot6.pdf · 2012. 1. 21. · TCAD:...

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TCAD: SUPREM, PISCESTCAD SUPREM, PISCES

김 영 석

충북대학교 전자정보대학

2012.9.1

E il ki @ b kEmail: kimys@cbu.ac.kr

전자정보대학 김영석 1

TCADTCAD(Technology Computer Aided Design, Technology CAD)

Electronic design automation

Process CAD

M d l t (diff i I/I) > Si l t d iModels process steps (diffusion, I/I) => Simulates device structure (junction depth, doping profiles), e.g., SUPREM

Device CAD

Models devices based on fundamental physics (mobilities, doping profiles) => Simulates device behavior, e.g., PISCES

Ci it CADCircuit CAD

Compact Modeling of the device (not based on fundamental physics) => Simulates circuit behavior, e.g., SPICEp

전자정보대학 김영석 2

TCAD

From WikiDFM: Design For Manufacturing PSM: Phase Shift Masking

전자정보대학 김영석 3

DFM: Design For Manufacturing, PSM: Phase Shift MaskingCMP: Chemical Mechanical Planarization, STI: Shallow Trench Isolation

TCAD Work Flow

전자정보대학 김영석 4

http://www3.ntu.edu.sg/eee/eee6/LectureNotes/E425/index.htm

Process Simulation

전자정보대학 김영석 5

Process Simulation

ModelsInput- Grid Generation

OutputS / h- Diffusion

- OxidationI l t ti

- Grid Generation- Mask Definition- Structure Initialization

- Structure/Mesh- Doping profiles

Junction Depths- Implantation- Deposition/masking

- Process Step Spec.- Junction Depths

/masking/etching

전자정보대학 김영석 6

Process SimulatorsProcess flow simulators are tools which simulate the full semiconductor manufacturing flow

Process Simulators

SUPREM3: 1-D Standford UnivSUPREM3: 1-D, Standford Univ.

SUPREM4: 2-D

FEDSS: IBM

PROPHET: AT&T

DIOS: ISE (Swiss)

TSUPREM4: commertial, based on SUPREM4

TAURUS-PROCESS

ATHENA: commertial based on SUPREM4ATHENA: commertial, based on SUPREM4

FLOOPS: U. of Florida

Equipment Simulators

ILLUM2D/3D: the Institute for Microelectronics at the Technical University of Vienna, lithography

SPLAT/SAMPLE2D/3D PROLITH SOLID E ACESSPLAT/SAMPLE2D/3D, PROLITH, SOLID E, ACES

전자정보대학 김영석 7

http://www.iue.tuwien.ac.at/phd/minixhofer/node4.html

Summary of NMOS Process Flow

전자정보대학 김영석 8

TCAD InputLayout

P C ditiProcess Conditions

Diffusion: Temp., Pressure, Time, Flow Rates

Oxidation: Temp. Ramps, Gas RampsOxidation Temp. Ramps, Gas Ramps

Ion Implantation: Dose, Energy, Tilt, Revolving, Beam Div., Ionization Level

전자정보대학 김영석 9

NMOS Process Simulations with TSUPREM4

Mesh Generations

전자정보대학 김영석 10

NMOS Process Simulations with TSUPREM4

Oxidation

전자정보대학 김영석 11

NMOS Process Simulations with TSUPREM4

Nitride Deposition p s

전자정보대학 김영석 12

NMOS Process Simulations with TSUPREM4

Nitride Etch

전자정보대학 김영석 13

NMOS Process Simulations with TSUPREM4

Field Oxidation

전자정보대학 김영석 14

NMOS Process Simulations with TSUPREM4

Nitride Remove

전자정보대학 김영석 15

NMOS Process Simulations with TSUPREM4

Field Implant Profiles p s

전자정보대학 김영석 16

NMOS Process Simulations with TSUPREM4

VTH Adjust Implant Profiles j s p s

전자정보대학 김영석 17

NMOS Process Simulations with TSUPREM4

Before Gate Oxidation

전자정보대학 김영석 18

NMOS Process Simulations with TSUPREM4

Gate Oxidation

전자정보대학 김영석 19

NMOS Process Simulations with TSUPREM4

Polysilicon Gate Depositionys p s

전자정보대학 김영석 20

NMOS Process Simulations with TSUPREM4

Gate Poly Etch y

전자정보대학 김영석 21

NMOS Process Simulations with TSUPREM4

LDD and S/D Implant p

전자정보대학 김영석 22

NMOS Process Simulations with TSUPREM4

LDD Spacer Oxide Etch p

전자정보대학 김영석 23

NMOS Process Simulations with TSUPREM4

Metal Etch

전자정보대학 김영석 24

Device Simulation

전자정보대학 김영석 25

Device Simulation

Basic Eqs.i i ’

Input- Structure/Mesh

OutputS / h- Poission’s eq.

- Continuity eq.Drift Diffusion eq

- Structure/Mesh- Doping Profiles- Structure Initialization

- Structure/Mesh- Doping Profiles

Junction Depths- Drift-Diffusion eq.Models- Rec-Gen

- Process Step Spec.- Junction Depths

- Mobility- F-D, Boltzmann

전자정보대학 김영석 26

Device SimulatorsGeneric Device Simulators

PISCES 2ET: Standford Univ.

FIELDAY

PADREPADRE

MINIMOS-NT

MEDICI: based on PISCESMEDICI: based on PISCES

DESSIS

ATLAS

FLOODS

Specialized Device Simulators

MINIMOS: f MOSFETMINIMOS: for MOSFET

PISCES: for MOSFET, Standford Univ.

SEQUOIASEQUOIA

BIPOLE: for Bipolar

전자정보대학 김영석 27

NMOS Device Simulations with MEDICI

Initial Grid

전자정보대학 김영석 28

NMOS Device Simulations with MEDICI

Doping Regridp g g

전자정보대학 김영석 29

NMOS Device Simulations with MEDICI

Potential Regrid g

전자정보대학 김영석 30

NMOS Device Simulations with MEDICI

Impurity Profilesp y s

전자정보대학 김영석 31

NMOS Device Simulations with MEDICI

Impurity Contoursp y s

전자정보대학 김영석 32

NMOS Device Simulations with MEDICI

Gate Characteristics s s

전자정보대학 김영석 33

NMOS Device Simulations with MEDICI

Drain Characteristics s s

전자정보대학 김영석 34

NMOS Device Simulations with MEDICI

Drain Characteristics: Potential Contours s s s

전자정보대학 김영석 35

NMOS Device Simulations with MEDICI

Substrate Currents

전자정보대학 김영석 36

NMOS Device Simulations with MEDICI

Gate Current

전자정보대학 김영석 37

NMOS Device Simulations with MEDICI

Drain Current Snapback p

전자정보대학 김영석 38

NMOS Device Simulations with MEDICI: Ex2

Definition of Mesh, Electrodes, Contacts s , s, s

전자정보대학 김영석 39

NMOS Device Simulations with MEDICI: Ex2

Doping Profilesp g s

전자정보대학 김영석 40

NMOS Device Simulations with MEDICI: Ex2

ID-Vg Curveg

전자정보대학 김영석 41

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