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DESCRIPTION
IMS substrates; TC 1.0 and 2.0 W/mK
Citation preview
Taconic’s MCCL
Korea Taconic
A stunning choice for “LED Light”
TacLED
Features
Product Portfolio
Heat Dissipation
Dielectric Breakdown Voltage
Hipot
Peel strength
Aluminium surface treatment
Punchability
General Properties
UL
How to order
Contents
- 1 -
2
3
4-7
8-9
10-14
15-16
17
18
19
20-21
22
Features
Customized Products Line Up
(Commercial/Bendable MCCL, Various Copper Thickness)
Guaranteed Hipot Reliability – 100% sorted out
Higher PCB yield
(Good PCB processability & stable punchability)
Bigger width than 700mm is available
Excellent Heat Dissipation
Superior Dielectric Breakdown Voltage
Ultra High Thermal Resistance
Outstanding Dielectric Adhesion Strength on Al & Cu
- 2 -
Grade
Available Metal
Dielectricconstituent
Real ThermalConductivity
(W/m/K)
Dielectric Thickness(㎛)
Type Thickness Standard Available
TacLED-10/85 AluminiumA-5052,
CopperC-106
0.6mm1.0mm1.5mm2.0mm
Epoxy+Filler
1.0 85
50~
100
TacLED-20/85 1.7 85
Copper Foil
Dielectric
Base Metal
Product Portfolio
Structure
Portfolio
- 3 -
Heat Dissipation
Overall T/C & T/I
Trace
Copper Foil
(oz)
Dielectric
Thermal
Conductivity
(W/mK)
Metal
Over-all
Thermal Conductivity
(W/mK)
Dielectric
Thermal Impedance
(℃㎠/W)
Al-5052
(mm)
Cu Plate
(mm)Real Value*(Calc.) Calc. Value
1 1 1.0 25.0 (12.1) 0.85
1 1 1.0 34.0 (12.8) 0.85
1 1.7 1.0 40.0 (19.5) 0.50
1 1.7 1.0 56.0 (21.3) 0.50
* Measured in Laser Flash in Ajou Univ. Lab. in 2010
- 4 -
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.1
1.7
1.3
1.6
1.21.3
0.7
1.9
Comparative Thermal Conductivity
- Measuring Method : Laser Flash Type(ASTM E1461)
- Analyzer : Thermal Diffusivity Instrument by NETZSCH
Heat Dissipation
- 5 -
Heat Sink
(1.2 ℃/W, Size 15cm×14.7cm×5cm)
Heat Generation Chip
(20W)
Load
50mm
50mm
Cu
Dielectric
Al
Electric Power
Supplier
Heating Controller
Thermocouple
Sample 20
25
30
35
40
45
50
55
60
0 600 12001800240030003600420048005400600066007200
Time(sec)
Te
mp
era
ture
[ Heat Release Curve ]
ΔT
Measuring heat dissipation by chip temp.
- Measuring System : Chip Temperature Convergence
Heat Dissipation
- 6 -
44
46
48
50
52
54
56
58
53.1
52.351.7
50.5
54.3
53.553.9
53.3
54.1
56.8
Comparative Chip Temperature
Heat Dissipation
- 7 -
Specimen and Equipment
Dielectric breakdown voltage
Specimen : Unclad 85㎛ thick Test Equipment : Puncture Tester
- 8 -
Test Condition & Results
Dielectric break down voltage
Condition Need n Min. Max. Avg.
A
above
5kV
30 7.1 8.7 7.8
C-500/85/85 10 5.0 6.4 5.9
C-168/121/100 10 5.1 7.0 6.1
D-2/100 30 5.0 7.4 5.7
E-0.5/260 10 5.2 8.3 7.6
E-1000/160 10 5.0 5.9 5.4
1000cycle 150℃/30min
-50℃/30min10 5.2 6.5 5.8
Unit : kV
- 9 -
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85
Definition An abbreviation for High Potential test
Also called a dielectric withstand test
Below the established Breakdown Voltage is applied
To verify electrical insulation in PCB, cables, motors, etc.
Objective
Apparatus & Test
What is a Hipot test
- 10 -
0
500
1000
1500
0 1 2 3 4 5
VD
C
Seconds
Test Condition
@1mA
Q-Policy Performed as a 100% production line test
on all products upon customer request
Pass Go, Fail No Go
Assuring customers electric safety
How to operate Hipot
- 11 -
Burnt shape
Burnt shape by short @1200VDC
Hipot result
- 12 -
Hipot Reliability
2.5φ Copper dot
Specimen and Equipment
Specimen : Etched MCCL with copper dot
Test Equipment : Hipot Tester
- 13 -
Hipot Reliability
Test Condition & Results
Condition Need Tested Passed
A
above
3kV
@1mA
30 30
C-500/85/85 10 10
C-168/121/100 10 10
D-2/100 30 30
E-0.5/260 10 10
E-1000/160 10 10
1000cycle 150℃/30min
-50℃/30min10 10
Unit : pcs
- 14 -
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85 –C1/Al 1.5mm
Specimen and Equipment
Peel Strength
Specimen : 3.2mm width trace Test Equipment : Instron
- 15 -
Specimen and Equipment
Peel Strength
Condition Need n Min. Max. Avg.
A
above
1.2kg/cm
10 1.80 2.00 1.93
C-500/85/85 5 1.50 1.59 1.54
C-168/121/100 5 1.52 1.62 1.56
D-2/100 5 1.85 1.96 1.93
E-0.5/260 5 1.67 1.75 1.72
E-1000/160 5 1.65 1.91 1.76
1000cycle 150℃/30min
-50℃/30min5 1.88 1.97 1.90
Unit : kg/cm
- 16 -
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85 –C1/Al 1.5mm
Aluminum surface treatment
Roughness by Ra & SEM(x500)
Taconic D company P company
0.33~0.44㎛ 0.36~0.62㎛ 0.31~0.77㎛
※ A larger surface area brings a faster heat transfer and a stronger bonding!
- 17 -
Die Punching in 150MT Press – 10/85-C1/AL1.5mm
Punchability
Cross-sectional View
Die punched sample
Edge side View
Left
Right
- 18 -
General PropertiesTypical Values
Properties Test Method Unit TacLED-10 TacLED-20
Thermal Conductivity(k) ASTM E1461 W/m∙K 1.0 1.7
Dielectric Thickness(t) - µm 85 85
Thermal Impedance(t/k)*1 - ℃cm2/W 0.85 0.5
Peel Strength(1oz ED Cu)IPC-TM-650 2.4.8
(Test Condition A)
kg/cm 1.8 1.8
lbs/in 10.0 10.0
Dielectric Breakdown Voltage(AC)ASTM D149
(Test Condition A)kV(kV/mm) > 6(70.5) > 6(70.5)
Dielectric Constant @1MHz IPC-TM-650 2.5.5.3 - 4.5 6.0
Dissipation Factor @1MHz IPC-TM-650 2.5.5.5.1 - 0.022 0.029
Solder Resistance(@300℃) - min > 20 > 20
Surface Resistivity IPC-TM-650 2.5.17.1 Mohm > 1.0E+16 > 1.0E+16
Volume Resistivity IPC-TM-650 2.5.17.1 Mohm∙cm > 1.0E+16 > 1.0E+16
Moisture Absorption IPC-TM-650 2.6.2.1 % < 0.5 < 0.5
Tg DMA ℃ 135 116
CTE(α1/α2, Z axis) ASTM D3386(TMA) ppm/℃ 41/127 34/123
Flammability Rating UL-94 - V-0 V-0
- 19 -
Life time by UL746E
Mechanical and Electrical Life Time Prediction for Dielectric
10,000
100,000
115 125 135 145 155 165 175
Temperature (℃)
Life t
ime (
UL746E 5
0% initia
l va
lue)
- 20 -
UL
Certification
- File No. : QMTS2.E335041
RTI
- Acquired RTI up to date
: 90℃
- Raising to 130℃
: in April. 2012
- 21 -
CTI
- Acquired 600V
Standard : 510x610 mm (quarter sheet)
Available : smaller panel sizes; also > 700mm panel length
Available Size
How to order
Available Aluminium
grade 5052
0.5, 0.6, 0.8, 1.0 and 1.5 mm
- 22 -
Recommended