SECON 2012 Final Presentation. Team Michael Helmbrecht Electrical Engineer Measurement Tasks Course...

SECON 2012Final Presentation

Team

Michael HelmbrechtElectrical Engineer• Measurement Tasks• Course Construction

Chris NicholasComputer Engineer• Measurement Tasks• Course Construction

Kristin SharpElectrical Engineer• Measurement Tasks• Course Construction

Ryan RougeauElectrical Engineer• Navigation• PCB Design

Erin TateElectrical Engineer• Navigation• PCB Design

Jason WarrenComputer Engineer• Navigation• PCB Design

Dr. Robert ReeseAdvisor

Outline

• Competition Overview• Practical Constraints & Related Testing• Technical Constraints & Related Testing• System Testing• Summary & Future Goals

Outline

• Competition Overview– Playing Field– Tasks– Scoring• Preliminary Rounds • Final Rounds

Playing Field• Carpet with white tape• Task Boxes• 4-Minute Rounds

Tasks

• Approach Task Box• Take Measurement• Make Decision• Repeat

Scoring• Qualifying Round:– Push start and move 1 ft.

• Preliminary Rounds: 3 Rounds– Average of the three scores– Top 6 teams advance to finals

• Final Round:– Team with highest score wins

• Points:– 100 initial points per round– +10 points for correct decisions– –10 points for incorrect decisions

Outline

• Practical Constraints & Related Testing– Modular Design• PCB parts placed with headers• FSM coding style

– Troubleshooting• Bluetooth and debugging testing

Modular Design• PCB Layout

PCBPIC24 Breakout Board

Bluetooth Module

Motor ControlBreakout Board

Modular Design• FSM Coding Style– Separate states for

Navigation and Measurement programming

Troubleshooting

• Bluetooth and Debugging Testing– Bully Bootloader COM ports

Outline

• Technical Constraints & Related Testing– Voltage– Capacitance– Temperature– Waveform– Navigation

Voltage Testing

Voltage Testing

Voltage Testing

Plate Voltage Measured Voltage Multimeter Reading Percent Error

15V 3.08V 3.16V 2.5%

11V 2.68V 2.76V 3.0%

9V 2.48V 2.55V 2.7%

0V 1.59V 1.64V 3.0%

-9V 0.70V 0.73V 4.0%

-11V 0.50V 0.53V 5.7%

-15V 0.10V 0.12V 16.7%

MAX VOLTAGE MIN VOLTAGE THRESHOLDS15V -15V 9V < V < 11V

Capacitance Testing

Capacitance Testing

Capacitance Testing

Plate Capacitance Measured Capacitance Percent Error

10.7μF 11.4μF 6.5%

1.01μF 1.06μF 5%

46.9nF 56.9nF 21%

MAX CAPACITANCE MIN CAPACITANCE THRESHOLDS10.0μF 10.0nF 100nF< C < 1μF

Temperature Testing

Temperature TestingPlate

TemperatureMeasured Plate

TemperatureMeasured Ambient Temperature

68.7F 69.7F 76.4F

75.0F 75.6F 76.4F

89.6F 89.6F 76.4F

102F 102F 76.4F

Waveform Testing

Output waveform

Input waveform

Vref

+

-

Waveform Testing

Waveform TestingSquare Wave Sawtooth Wave

Vref

Navigation Testing

• Line Sensing• Distance Sensing

Line Sensor Testing

• Sensor Mounting

Line Sensor Testing• Proportional Drive

-4 -3 -2 -1 1 2 3 4

• Each sensor has:– Priority– Weight

Line Sensor Testing

• LabVIEW Debug

Line Sensor Testing

Test Type Laps Attempted Laps Successful Rate of Success

Initial Line Following: Non-Latching

25 12 48%

Post-Debugging: Latching

25 21 84%

• Discovered a latching turn state helped stay on line

Distance Sensor Testing

Location Actual Distance (cm)

Test 1Count

Test 2Count

Test 3Count

Test 4Count

Test 5Count

Average Count

Out of Range > 17 53 75 80 73 68 70

Stop Line 11.2 354 297 362 309 312 327

Contact with Box 1.8 703 688 633 629 641 659

Outline

• System Testing– Integration testing– Demo video

System Testing

• Integration of both subsystems• Ensure probes are accurate and relays

switch correctly• Measurement must be taken once box

is reached and before decision is made

System Testing

Outline

• Summary & Future Goals– Timeline– Future goals• Fix Bugs• Populate PCB• Improve performance

TimelineAugust September October November December

Strategy and Course Construction

Research and Purchasing

Programming

Circuit Design

Debugging

Prototype

Fix Bugs

• Three bugs to correct– Measurement• Transition between tests

– Navigation• Right turn problem• Box approach error

Populate PCB

Improve Performance

• Balance speed with reliability of navigation and measurements

• Improve measurement accuracy• Finalize entire package– Sensor and probe location– Mounting of PCB

SECON 2012Final Presentation