Progress in 3DG

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Progress in 3DG

Adviser ： PhD Jin-Hua Hongstudent ： Jun-Yi WuDate ： 2008/12/18

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outline

3DG system Test architecture

Testing core and wrapper Future work

Low Power Test Architecture

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3DG system Test architecture

Testing core and wrapper Future work

Low Power Test Architecture

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3DG system

IEEE-1500

DecoderDecoderArbiterArbiter

IPIP

Testing/Normal wrapper Testing/Normal wrapper

AHB

TICTIC

Default Slave

Default SlaveDecoderDecoderArbiterArbiter

IPIP

Testing/Normal wrapper Testing/Normal wrapper

AHB

TICTIC

Default Slave

Default Slave

TIC and IEEE-1500 in 3DG

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TIC architecture in 3DG

Utilize TESTACK to select Normal/Test function. In test mode TESTACK will be HIGH.

TIC

MUX

TESTREQA

TESTREQB

TESTACK

Normal/Test Function

Input

EBITicRead/STicRead

HADDR

HRDATAin

TESTBUS TESTOUT

Normal/Test Function Output

Normal Function

Internal External

32

32

32

32

32

32

AHB

Normal Function

32

HWDATA

Control signals

Control signals

32

32

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IEEE-1500 architecture in 3DG

RM

RM Boundary scan cell

RM Boundary scan cell

RM AHB Wrapper

RM AHB Wrapper

458 bit 458 bit 330 bit 330 bit

IEEE-1500MUX

Cell control Cell control

RM WSI RM WSO

By_pass

GM

GM Boundary scan cell

GM Boundary scan cell

GM AHB Wrapper

GM AHB Wrapper

172 bit 172 bit 382 bit 382 bit

IEEE-1500MUX

WSC

Cell control Cell control

TAP controller

WSI WSOTMSWRCK WRSTN

GM WSI GM WSO

By_pass

Internal

External

Between IP and AHB wrapper put boundary scan cell, and IEEE-1500 to control boundary scan cell.

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External pins in 3DG

TIC: TESTREQA TESTREQB TESTACK IEEE-1500: WSI WSO WRCK TMS WRSTN

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3DG system Test architecture

Testing core and wrapper Future work

Low Power Test Architecture

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Testing Architecture with IEEE-1500 and TIC

Include IEEE-1500 and TIC

AHB BUS

TIC

AMBA Core

IEEE-1500

IEEE-1500 Test data

TIC Test data

wrapper

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Testing Core by IEEE-1500

Utilize IEEE-1500 to testing AMBA core

AHB BUS

TIC

AMBA Core

IEEE-1500

IEEE-1500 Test data

TIC Test data

wrapper

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Testing Core by TIC

Utilize TIC to testing AMBA core

AHB BUS

TIC

AMBA Core

IEEE-1500

IEEE-1500 Test data

TIC Test data

wrapper

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Testing Wrapper by IEEE-1500 and TIC

Utilize TIC and IEEE-1500 to testing wrapper output.

AHB BUS

TIC

AMBA Core

IEEE-1500

IEEE-1500 Test data

TIC Test data

wrapper

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Testing Wrapper by IEEE-1500 and TIC

AHB BUS

TIC

AMBA Core

IEEE-1500

IEEE-1500 Test data

TIC Test data

wrapper

Utilize TIC and IEEE-1500 to testing wrapper input.

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3DG system Test architecture

Testing core and wrapper Future work

Low Power Test Architecture

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Low Power Test Architecture

Arbiter

TIC

ARM 7

Other Master

GM

RM

Other slave

Decoder

Other slave

HADDRHWDATA

HRDATA

HADDRHWDATA

HRDATA

HADDRHWDATA

HRDATA

HWDATA

HRDATA

HADDRHWDATA

HRDATA

HADDRHWDATA

HRDATA

HADDRHWDATA

HRDATA

Address and

Control MUX

Write data

MUX

Read data

MUX

HADDR

Power Management

CLK

POWER

TESTACK

In test mode, TIC will use address and TESTACK to control power management, then power management will cut don’t test IP’s power and clock.

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整合進度 之前 GM 的 SCAN CHAIN 有誤，導致整合時模擬跑到

一半當機，目前重新進行加入 SCAN CHAIN 中

ARM7 裡的 SCAN CHAIN 無法與現有 GM 與 RM 的 SCAN CHAIN 整合，因此將會將 ARM7 從新加入可以與GM 與 RM 整合的 SACN CHAIN