NeSSI – The “New Sampling Sensor Initiative” - An Enabling Technology A CPAC Sponsored Open...

NeSSI – The “New Sampling Sensor Initiative” - An Enabling Technology

• A CPAC Sponsored Open Initiative

• Prepared by: – Rob Dubois – Dow Chemical– Peter van Vuuren – ExxonMobil Chemical– Jim Tatera – Tatera & Associates, Inc.

• ISA AD2002 April 16, 2002

Presentation Outline

• Introduction, Drivers & History

• NeSSI Generation I and II comparison

• Elements of a NeSSI Generation II System

• What will a Generation II prototype look like?

• Status Update and New Developments

• NeSSI Roadmap & Summary

• How do I get involved with NeSSI?

NeSSI Initiative

• An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in Process Analysis.– NeSSI mail-out has now grown to 250+ subscribers

– Composed of End Users, Manufacturing Companies, Integrators

• Sponsored by the Center for Process Analytical Chemistry (CPAC) - legal umbrella

• Originated from various CPAC focus sessions • IFPAC 2000 plenary paper presented NeSSI vision• Focus Groups and Workshops

– Pittcon 2000; ISA Expo 2000; IFPAC 2001, Pittcon 2001, CPACT Edinburgh, ISA Analytical Division, ISA 2001, IFPAC 2002

• Tutorials:– ISA2001 Houston, INTERMAC 2001 Tokyo, Pittcon2002

A Brief History of

NeSSI Objectives

• Facilitate the acceptance/implementation of...– modular, miniature & smart process analytical

technology• Promote the concept of...

– at the pipe/field-mounted (“byline”) analytical systems

• Lay the groundwork for...– open connectivity communication architecture

• Provide a technology bridge to the process for...– “sensor/lab-on-a-chip” microanalytical devices

The drivers for change...

• Reduce Cost to Build– Design and Engineering

– Manufacturing and Installation

• Reduce Cost of Ownership– Design Standardization

– Simpler, less expensive maintenance

• Enhance Reliability– Validate sample, data, communication

Project Segmentation

Gen III

Gen II

Gen I Mechanical (mostly)

Electrical/Smart (Diagnostic)

MicroAnalytical & Wireless

Value

Gen I - Standardize on a miniature, modular system

• Concept “Borrowed” from the semiconductor industry

• LEGO® like design• ISA Standard

– rugged

Courtesy of CIRCOR

Elastomer Seals are desired in HP Industries

Courtesy of the Swagelok Co

Manufacturers…

• Parker-Hannifin

• Autoflow

• CIRCOR

• Kinetics

• Swagelok

• Fujikin

What is ISA SP76?

Copyright 2001 ISA. All rights reserved.

Reproduced and distributed with permission of ISA.

Note: Draft provided for promotion

only.

Refer to ISA SP76.

A Future Analytical SystemA Future Analytical System...Will Look More Like Us!

• Single Processor - Overall Control– Sensor Analytical Manager (SAM)

• System will be Multifunctional– Emphasis on all sensors

• System will be Adaptable– Predictive maintenance; self-healing

• Capable of Multivariate Analysis– Use many sensors for analysis

Courtesy of Ken Creasy, Honeywell. IFPAC 2001

Gen. I versus Gen. IIFeatureSignalProtection MethodsClassificationSensorsIntelligenceControl PhilosophyRegulating Comp.Passive Comp.ActuatorsHeatingWiring

Generation I4-20 mAPurgeDiv 2Non-substrateLimitedCentralizedSelf-containedMechanicalStand-aloneExternalConduit/Cable

Generation IISerial BusISDiv 1SubstrateSmartDistributed (SAM)PID control loopsElectro-mechanicalSubstrate MountSubstrate integratedIS Wiring

Generation II Dimensions- 7 Elements

• 1. Heated Substrate• 2. Physical t-Sensors• 3. Combi Valves

• 4. SAM • 5. PC with HMI

• 6. IS Multi-drop bus• 7. Enclosure

1. Heated, Programmable Substrate

AC PowerAC Power

Conduction Heating- cartridge heater(s)

- over-temperature cut-off

Furn. by

substrate mfg.

Heating Fluids

(alternative)

2a. Physical Sensors for System Diagnostics

• Doing analytical is not good enough!• Miniature Flow, Pressure, Temperature

– Gas and/or liquid service– Rugged construction– Intrinsically Safe (IEC Ex ia)– Div/Zone 1 Gp A-D; T4 (135 C)

A/D

COM

FLOW:

P, coriollis,

thermal, other?

Substrate

2b. Conceptual Sensor for NeSSI

Process Cavity- no unswept voids

- low volume

BARRIER- Process Seal- Electrical Isolation- Thermal

Insulation Skirt- engineered

A/D

Comm.

Sensor

Base - pressure rated

µP

Mem

ory

Body- encapsulated

“Top Hat” Comm. Chip

A

Port- standard size/pin

- daisy chain

1.50”

Digital “Smart” Sensor- engineering units

- memory

3a. Electrical Actuators on the Substrate - COMBO

• Miniature substrate mount– Gas and/or liquid service

– Wide P & T service

– Intrinsically Safe (IEC Ex ia)

– Div/Zone 1 Gp A-D; T4 (135 C)

COMBO Valve /w integral solenoid

SV

Comm.

Act.

AIR

On/Off and Proportional

3b. Conceptual “Combo” Valve A

Actuator

Instrument Air

Valve

Vent

Vent

Comm.

D/A

Solenoid

Conventional pneumatic valve

“TopHat” Comm. Chip

3-way “pilot” solenoid valve - Intrinsically Safe

Actuator- NO or NC

Engineered InsulationSkirt

Port- standard size/pin

- daisy chain

Digital On-Board

Thermal Barrier

4a. Introducing SAM “I do 5 jobs!”

Gateway to an Ethernet LAN

- OPC perhaps

Host to a

Sensor/Actuator Bus

Field Interface

- Graphical

- Wireless

- e.g. Bluetooth™, 802.11

Software Applets for

Sample System

Repetitive Tasks

(Industry Common)

“Open” Development Space for Custom Software

4b. Standalone “SAM” - Wired Sensor/Actuator Bus

SensorAnalyticalManager

(SAM)

Analyzer System Ethernet LAN

PLegend: Pressure Sensor Temp Sensor Valve/Actuator Analytical SensorVA

T

PC or Analyzer Controller

VTP

A

?

4c. Embedded SAM - Wired Sensor/Actuator Bus

Analyzer System Ethernet LAN

PLegend: Pressure Sensor Temp Sensor Valve/Actuator Analytical SensorVA

T

VTP

A

?Analyzer Controller

w/ Embedded SAM Functionality

4d. SAM “Pick-list” for Common Sampling Tasks

Zero & span validation Pressure regulation Temperature monitoringStream switching Maintenance diagnostics

• Interoperability– talk to all analytical systems

SAM

Enabling Technology

for microAnalytical

5. PC/PDA Graphical HMI (Human Machine Interface)

F Vv T P

FVvA

HMIPersonal digital

assistant

PC

Hello?

Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor;T=Temp. Sensor

HMI

6. Serial Multi-drop Bus - “Au Revoir 4-20 mA?”

• CANbus– DeviceNet, SDS, etc.– Intrinsically Safe

• Engineering units on board sensors

• Reduces wiring load– multi-drop

• Eliminates I/O• Rugged, low cost

VTP

A

7. Enclosure “X-team” Haz. Review Process

AC Power

Div/Zone 1GP. A-D, T4

Enclosure- NEMA 4/IP56 Rated- all climate operation- no purges- no X-proof tubs- low cost of operation

Sensor Bus

Intrinsically Safe (IEC Ex ia)- no gas “sniff” tests req..- allows hot disconnects- plug & play

Heaters- Substrate & Enclosure- IEC Ex d- programmable temp.

AC Power

Designed for Global Use

Gen III Wireless SignalAnalyzer System Ethernet LAN

VTP

A

• Eg Bluetooth , 802.11• Plug and Play!• Power Supplied by...

– X-proof or IS miniature power bus

SensorAnalyticalManager

(SAM)

P.S.

Generation IIIPlug & Play Analytical

F Vv T

A

SAM

Fiber Optic

ATOne sensor

per component“lab on a chip”

One Sensor and Multiple Analytes

A

Ethernet

Transducer Bus

Enabling Technologyfor Analytical

- GC-on-a-chip

- micro MS

- chem. sensors

Keys to speedy development

Don’t (re)invent…leverage existing standards

• Make use of existing connectivity and communication...

• Ethernet

• OPC

• CANbus

• wireless e.g. Bluetooth™

• WEB servers/Internet

Personal Digital Assistant (PDA)

Communicate…globally!

• International– Europe, Japan, Canada,

USA

• Consortia– CPAC, CPACT

• Conferences– ISA, Pittcon, IFPAC,

etc.

Design & certify to global requirements...

• NEC, UL, FM (USA)• CEC, CSA (Canada)• CENELEC (Europe)• ATEX Directive

(Europe)• CE Mark• JAPAN, ASIA…

Around the Loop: The New Sampling/Sensor Initiative

CONTROL MAGAZINE

Great publicity...

“It's estimated that 70-80%

of analyzer outages can

be traced to the sample system”Terrence McMahon

August 01, 2001

Also ISA InTech Magazine; Chem. & Eng. News

How difficult are these substrates to work with ?

The following section (compliments of John Cumbus of ExxonMobil) should give you an idea.

Expected Advantages

• Minimum Engineering /Drafting Effort

• Simplicity of Construction

• Ease of Maintenance

• Leverage Technicians for Higher Priority Activity

• Higher Service Factors

SupplyFilter

Bypass FlowController

SampleSupply

SampleBypass

SupplyPressure

ToAnalyzer

CalibrationSupply Stream

Valve(config-1)

GuardFilter

StreamValve

(config-2)

FromAnalyzerAnalyzer

Return

F

SupplyShut-Off

NC

NO

NC

NC

NC

Atmos.Vent

Calib.Shut-Off

FE

PI

F

Analyzer FlowController

FE

PE

PressureTransmitter

Engineering Package

• Provided by Configurator

• Pressure Indicator left for Technicians

• Eight Single Stream and One Dual Stream

• Three Analog Outputs, Two Inputs

Modular Sample System (minus MFMs)

Modular System Connections Inside Enclosure

New System in an Old Box

Assembly Test of Smaller System (76 Pieces)

Assembly Test Configuration

Assembly Drawings Provided

Completed Assembly

Example of Mechanic’s Previous Work

The “Mechanic”, Age 9

Comparison of “Old” and “New” Sample Systems

New Developments

NeSSI Analyzers - here today

Courtesy of Panametrics & Swagelok Courtesy of Rosemount Analytical

Courtesy of Rosemount AnalyticalCourtesy of Panametrics & Swagelok

Oxygen

H2O

pH

Conductivity

Courtesy of Porter Instruments and the Swagelok Co.

MFC’s here today

– Porter Inst. (Div. 2)

– Others…Gen Purpose• Unit Instruments

• Brooks

Undergoing

Certification

Just announced...

Courtesy of Applied Analytics

MIR ATR

Enabling technology for...

– Miniature physical sensors

– Flow– Temperature– Pressure

– Miniature chemical sensors

• “lab-on-a-chip”

– Component Mfgs.• Calibrators, pumps &• dryers, etc.

Courtesy of Mass-Sensors Inc.

Petrochemical installs...

Coutesy of a

gulf coast

petrochemical facility

Courtesy of an east coast petrochemical facility

and Parker-Hannifin

What’s New - Generation II Specification

• Draft version now compete

• Global Review Teams in Progress – X-team (hazardous areas)– C-team (connectivity issues)– A-team (simple applets)

White Paper in Progress

• Driven by Honeywell Automation

• Will adapt final NeSSI Gen II spec as criteria for build

• Expand End Users, Manufacturers– Looking for involvement!!

• 10-20 Gen II prototypes will be built

• DoE being approached for funding in June

Time (years)

03 04

NeSSI Roadmap

02

Mechanical Components e.g. filters, valves, etc.

Mechanical FieldInstallations

SP76 Substrate Available

NeSSI/CPAC Vision & Roadmap

2000

Design /Prototype - Gen II Smart/Heating/SAM

Smart Field Installations

MechanicalGen. I

Smart/”Electrified”Gen. II

Analytical & WirelessGen. III

01 0605

Rev. 1, Dec. 2001

Analytics/Sensors (e.g. laser based)/Wireless

Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)

References & involvement...

...a few references you may want tolook over. The NeSSI portion of the CPAC web site at

www.cpac.washington.edu The ISA Draft Standard - ISA Draft 76.00.02 , “Modular

Component Interfaces for Surface-Mount FluidDistribution Components--Part 2: Elastomeric Seals”

"The New Sampling/Sensor Initiative", Terence K.McMahon, Control, August/2001, Vol XIV, No. 8, page158

"Molding the Future of Process Analytical Sampling",Ellen Fussell, InTech, August/2001, page 32

Acknowledgements I

• Dow– Danny Quevillon

– Reg Hartwig

– Walt Henslee

– Bac Vu (SP76)

– John Leach II

– Craig Snook

• ExxonMobil Chemical– Dan Podkulski (SP76)

– Jeff Gunnell

– John Cumbus

– Rajko Puzic

• CPAC– Mel Koch

– Dave Veltkamp

Acknowledgements II

– Doug Mitchell - Panametrics

– John Wawrowski, Rick Ales, Dave Simko - Swagelok

– Yoav Barshad - Applied Analytics

– Nick van Bruggen - Porter

– Gary Frank, Raj Adani - Kinetics

– CD Feng - Rosemount Analytical

– Bob Nickels, Ulrich Bonne, Ken Creasy - Honeywell

– Chris Towle/Don Long - MTL

– Steve Doe - Parker

– X-Team

A parting thought...

"When men got structural steel, they did not use

it to build steel copies of wooden bridges."

Ayn Rand. Atlas Shrugged. 1957.

MicroAnalytical

• Do you have any questions regarding the the standard footprint and/or the relevance of your technology to this concept and/or its suitability beyond plant applications (lab, pilot plant, etc)?

• Do you understand the Process Safety issues and requirements (e.g. I.S. Ex ia)? Would your like to discuss any of them?

Sensor/Actuator Bus

SensorAnalyticalManager

(SAM)

Analyzer System Ethernet LAN

Analyzer Controller

VTP

A

Sensor Requirements:

Simple Sensor Host Communications Configurable Sensor AttributesSmall Footprint of SensorEngineering UnitsInexpensive but reliable

Host Requirements:

Controls all Sensor/Actuator Functions Support Common SS tasks (Applets)Gateway to Analyzer LAN/Imbedded

Sensor/Actuator Bus

SensorAnalyticalManager

(SAM)

Analyzer System Ethernet LAN

Analyzer Controller

VTP

A

CAN-bus:

Simple Sensor Host Communications Configurable Sensor AttributesMeasurement and DiagnosticsSmall Footprint of SensorEngineering UnitsInexpensive but reliable (proventechnology)Attributes Flashable (DeviceNet/SDS..)

Sensor/Actuator Bus

SensorAnalyticalManager

(SAM)

Analyzer System Ethernet LAN

Analyzer Controller

VTP

A

Workgroup Question/Feedback:

Is CAN the right answer?

Is IS the right answer?

Embedded or Standalone SAMEthernet LAN

Analyzer or PC Controller

VTP

A

CANbus

Q1. Who Should Manage the Applets?

• Foundation like organization?

• Applet creator?

• Analyzer Vendors?

Q2. SAM Concept

• Would you agree that SAM would be useful device for interfacing and interacting with both the Sensor bus and the larger world of the Ethernet – What do you (or don’t you) like….?– What would you like improved or added?