:N/A - SMP Tech...SBU1 SSTXn1 SSRXn2 SSTXp2 GND VBUS VBUS SBU2 Dn2 Dp2 CC2 SSRXn1 SSTXn2 SSTXp2...

Rev0 Issued S.M.S.M.B.S. 08/12/18 SMP TECHNOLOGY, INC.

SCALETOL. DEC. .X +/- 0.35 .XX +/- 0.25 .XXX +/ UNIT: mm SERIES: U045-0518-004-Z Pg: 1 of 2

USB 3.1 Type C, Female,24 Position, Mid Mount, Waterproof, IP-X7

ELECTRICAL:

MATERIAL:

CURR

WATERPROOF RATINGIP-X7

ENT RATING: 5A (VBUS Pin 1.5A/Pin)

5A (GND Pin 1.25A/Pin Max) 0.25A/Pin (Other Ping) CONTACT RESISTANCE: < 40 milliohm Max.INSULATION RESISTANCE: > 100 Mgeaohm Min.DIELETRIC WITHSTANDING VOLTAGE: 100 VAC for 1 MinuteOPERATING TEMPERATURE: - 40° C ~ 80° C

INSULATOR: High Temperature Plastic, UL94V-0CONTACTS: Copper AlloyCONTACT PLATING:

30u” Gold Plating on Contact Area, 1u” Min. Au Plating on Solder AreaSHELL: 50u”~ 150u” Nickel Under Plating Overall

Mechanical:INSERTION FORCE: 5 ~ 20N Max.WITHDRAWAL FORCE: 8 ~ 20N KgDURABILITY: 10,000 Cycles

:N/A

ApprovedCheckedDrawn Date

HOW TO ORDER:

- 0 5 1 -8 0 0 4 X

# OF POSITIONSMOUNTING STYLE18 - Surface Mount: Top Mount, Thru Hole Shell Legs, 10.25mm Between Shell Legs

05 -24 Position SMT

- Z

4 - 30u” Au 0 - Tray23 - Tape & Reel + Cap4 - Tape & Reel

- Tape & Reel

CONTACT AREA PLATING RoHSCOMPLIANT

PACKAGING

U 0 4 5

BODY STYLE4 - Female Right Angle Waterproof

Insulator Color0 - Black

Detail A

Mated Condition (Ref.)

MatingSequence

SHELL GGND GNDB1

ND

GND First

First

First

Second

Second

SecondSecondSecond

SecondSecond

First

First

First

Second

Second

SecondSecondSecond

SecondSecond

VBUS

VBUS

CC1

Dp1Dn1

SBU1

SSTXn1

SSRXn2SSTXp2

GND

VBUS

VBUS

SBU2

Dn2Dp2CC2

SSRXn1

SSTXn2SSTXp2

SHELL GND

SignalName

Pin

A1

A3A4A5A6

A7A8A9A10A11A12

B12

B10Second SecondSSTXp1 SSRXp1A2 B11

B9B8

B7B6B5B4B3B2

MatingSequence

SignalName

Pin

Recommended PCB Layout

24 -

0.90

±0.0

5

5.25

±0.0

51.

380.

12

X

1.525

A01 0.25

2.6255.50

0.50 1.525

A12 Detail A

PCB Edge Z

B12 B01

0.65

3.60

Y

10.257.20±0.03

2 - 2

.30±

0.05

2 - 1

.70±

0.05

0.05

XY

0.65

±-0.

025

2 - 1

.50±

0.05

2 - 1

.90±

0.05

2 - 1.10±0.0524 - 0.27±0.05

0.10

0.152 - 0.65

2 - 3.60

D

D0.105.50

2.625

0.500.25

0.15 E

(8.10)

Laser

1.80±0.05

7.20±0.05

2 - 10.25±0.15

(4 - 0.30)Pin B12

Pin A1 Pin A12

Pin B12.

56±0

.04

(She

ll)

(Shell Opening)

10.32±0.05

9.42±0.05

(10.55)Pick Area

(9.5

8)

(6.0

0)

8.34+0.06-0.02

(24 - 0.20)

12 -

1.13

±0.1

0

12 -

0.37

±0.1

0

-(2 - 00.60)

-03.50 Max.

Panel

(3.40)

(4.70)

(6.65)

(1.95)

Plug

PCB Board

Mating Bottom Face

O - Ring

(4.1

4)

(Pos

t)2

- 0.4

5±0.

10

4 - 0

.70±

0.10

1.92

±0.1

5C

H H

eigh

t

4.54

±0.0

5

3.64

±0.0

5

(All

DIP

Sol

derin

g Ta

ils)

(2 - 1.00)

Of Post

All SMTSoldering Tails

E

0.95±0.025

0.05 X Y4 - 0.70±0.05

Isometric View