Molding Compounds - Compression Molding.pdf

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C o m pr es s i o n Mo ld i n g

Compression molding is the earliest process used for phenolic compounds. It is an easy technology with simple

low cost molds. It is still widely used as it can provide a large number of cavities per mold, as well as is otropic

orientation of the fibers leading to high impact resistance and compressive strength. The drawbacks are high

manual labor requirements and difficulty of process automation, as well as limited part complexity.

Processing Guidelines

Suggested start-up conditions:

Compression Molding Phenolic Epoxy DAP Silicone

Preforming Pressure 55 -85 MPa

Preheat Temperature and

Time (RF)

100-110C

at 45 s

85-105C 105-110C

at 45 s

80-90C

Mold Temperature 165-190C 165-190C 160-175C 140-150C

Molding Pressure 15-34 MPa 7-34 MPa 25-40 MPa 15-55 MPa

Curing Time (~3.2mm) 40-50 s 60-90 s 45-70 s ~180 s

Preheating of the material can reduce cycle times and improve part quality.

Specific advice on processing depends on the type of material used, how the mold is constructed and the type of

machine. Consult your SBNA representative for further assistance.

The information and guidelines contained in this page are intended to assist you in the use of SBNA

Engineering Thermosets. It is not intented to and does not create any warranties.

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