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Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Topics
SCMOS scalable design rules. Reliability. Stick diagrams.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
MOSIS SCMOS design rules
Designed to scale across a wide range of technologies.
Designed to support multiple vendors. Designed for educational use. Ergo, fairly conservative.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
and design rules
is the size of a minimum feature. Specifying particularizes the scalable
rules. Parasitics are generally not specified in
units
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Wires
metal 36
metal 23
metal 13
pdiff/ndiff3
poly2
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Transistors
2
3
1
3 2
5
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Vias
Types of via: metal1/diff, metal1/poly, metal1/metal2.
4
1
4
2
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Metal 3 via
Type: metal3/metal2. Rules:
– cut: 3 x 3– overlap by metal2: 1– minimum spacing: 3– minimum spacing to via1: 2
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Tub tie
4
1
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Spacings
Diffusion/diffusion: 3 Poly/poly: 2 Poly/diffusion: 1 Via/via: 2 Metal1/metal1: 3 Metal2/metal2: 4 Metal3/metal3: 4
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Overglass
Cut in passivation layer. Minimum bonding pad: 100 m. Pad overlap of glass opening: 6 Minimum pad spacing to unrelated
metal2/3: 30 Minimum pad spacing to unrelated metal1,
poly, active: 15
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Scmos VARIATIONS
SCMOS SCMOS submicron
SCMOS deep
Poly space 2 3 3
Active extension beyond poly
3 3 4
Contact space 2 3 4
Via width 2 2 3
Metal 1 space 2 3 3
Metal 2 space 3 3 4
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Lithography for nanometer processes
Interference causes drawn features to be distorted during lithography.
Optical proximity correction pre-distorts masks so they create the proper features during lithography.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
3-D integration
3-D technology stacks multiple levels of transistors and interconnect.
Through-silicon-via (TSV) with die stacking uses special via to connect between separately fabricated chips.
Multilayer buried structures build several layers of devices on a substrate.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Reliability
Failures happen early, late in chip’s life.
Infant mortality is caused by marginal components.
Late failures are caused by wear-out (metal migration, thermal, etc.).
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Mean-time-to-failure
MTF for metal wires = time required for 50% of wires to fail.
Depends on current density:– proportional to j-n e Q/kT – j is current density– n is constant between 1 and 3– Q is diffusion activation energy
Can determine lifetime from MTTF.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Traditional sources of unreliability
Diffusions and junctions: crystal defects, impurity precipitation, mask misalignment, surface contamination.
Oxides: Mobile ions, pinholes, interface states, hot carriers, time-dependent dielectric breakdown.
Metalization: scratches/voids, mechanical damage, non-ohmic contacts, step coverage.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
TDDB
Time-dependent dielectric breakdown: gate voltages cause stress in gate oxides.
More common as oxides become thinner. TDDB failure rate:
– MTTF = A 10 E eEs/kt
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Hot carriers
Hot carrier has enough energy to jump from silicon to oxide.
Accumulated hot carriers create a space charge that affects threshold voltage.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
NTBI
Negative bias temperature instability is particular to pMOS devices.
Threshold voltage, transconductance change due to stresses.
Can be reversed by applying a reverse bias to the transistor.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Electromigration and stress migration
Degenerative failure for wires. Grains in metal have defects at grain
surface that cause electromigration. Stress migration caused by mechanical
stress.– Can occur even with zero current.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Soft errors
Caused by alpha particles. Packages contain small amounts of uranium
and thorium, which generate error-inducing radiation.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
PVT
Borkar et al.: variations in process, supply voltage, temperature are key design challenges in nanometer technology.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
PVT challenges
Process variations: channel length and threshold significantly in nanometer technologies.
Supply voltage: non-ideal wires introduce variations in supply across chip.
Temperature: higher chip operating temperatures degrade both transistors and interconnect.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
On-chip temperature sensors
Temperature sensors are used to shut off part or all of the chip to stop thermal runaway.
Use a pn junction from a parasitic bipolar transistor.– Can also use MOS transistor.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Stick diagrams
A stick diagram is a cartoon of a layout. Does show all components/vias (except
possibly tub ties), relative placement. Does not show exact placement, transistor
sizes, wire lengths, wire widths, tub boundaries.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Stick layers
metal 3
metal 2
metal 1
poly
ndiff
pdiff
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Dynamic latch stick diagram
VDD
in
VSSphiphi’
out
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Sticks design of multiplexer
Start with NAND gate:
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
NAND sticks
VDD
a
VSS
out
b
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
One-bit mux sticks
VDD
VSS
N1(NAND)se
lect
’ out
a
b
N1(NAND)
out
a
b
N1(NAND)
out
a
b
sele
ct
ai
bi
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
3-bit mux sticks
m2(one-bit-mux)select’ select VDD
VSSoi
ai
bi
m2(one-bit-mux)select’ select VDD
VSSoi
ai
bi
m2(one-bit-mux)select’ select VDD
VSSoi
ai
bi
select’ select
a2
b2
a1
b1
a0
b0
o2
o1
o0
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Layout design and analysis tools
Layout editors are interactive tools. Design rule checkers are generally batch---
identify DRC errors on the layout. Circuit extractors extract the netlist from the
layout. Connectivity verification systems (CVS)
compare extracted and original netlists.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Automatic layout
Cell generators (macrocell generators) create optimized layouts for ALUs, etc.
Standard cell/sea-of-gates layout creates layout from predesigned cells + custom routing.– Sea-of-gates allows routing over the cell.
Modern VLSI Design 4e: Chapter 2 Copyright 2008 Prentice Hall PTR
Standard cell layout
routing area
routing arearout
ing
area
routing area
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