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MEMS Released Products
1975
Pressure Sensors Strain Gauges • TI Thermal Print Heads
TODAY (to name a few)
Pressure Sensors (everywhere !!) Accelerometers (everywhere) Oscillators (soon to be everywhere) Gyroscopes Ink Jet Print Heads Microphones FBAR Filters for Cell Phones AFM Probe Tips • Digital Light Projectors • Wafer Probers • Variable Optical Attenuators • Tunable Lasers for Telecom • IR Image Detectors • Near IR Spectrometers • Gas Chromatographs • Microfluidics for BioTech • Implantable Pressure Monitors • Cochlear Implants
High Volume, Low Cost
Growth of MEMS
80’s - 90’s
Automotive
2000’s
Consumer
80’s
Medical
60’s - 70’s
Industrial
109 108 107 106 105
Market Size - units
1010
2010’s
Bio-MEMS + Consumer + Environmental
Billions of MEMS Devices Sold
Avago >2B Cell phone filters As of Q2 2010 Robert Bosch >1B Automotive sensors As of Nov 2008
Knowles >1B Microphones As of Sept 2009
Texas Instruments >1014 Light modulators As of Dec 2009
GE NovaSensor >750M Pressure sensors As of Aug 2011
ST Micro >1B Accels and Gyros As of Dec 2010
HP Et
Cepheid ~$1B Microfluidic systems As of Q4 2010
SiTime >100M MEMS Oscillators As of Q2 2012
“Billions and Billions of ink jet nozzles”
MEMS allows HUGE size reductions
Inertial Measurement Unit 1960’s
Inertial Measurement Unit 2011
Which translates to HUGE cost reductions
The Road to Miniaturization
• If the size of an object has no correlation with its function, technology will eventually make it shrink – i.e. houses and cars and TVs will NOT shrink (much)
• Why? • Data is the perfect candidate for shrinkage • Electronic circuits for data are perfect candidates • The size of a sensor has little to NO correlation
with its function - so, sensors will shrink
History and economics tells us this.
Leverage from Semi Industry
• During 70’s and 80’s; we bragged that we leveraged the Semiconductor Industry – litho, implantation, oxidations, diffusion, wet etch, etc
• However, MEMS manufacturers always used obsolete IC equipment, 2 generations back
• Today, we are only at 1 generation back • But, most specialty MEMS equipment, bonders,
DS aligners, KOH, EDP, used to be custom made • Today, equipment suppliers compete to sell
specialty MEMS equipment
Economics
Starving Markets are desperate . . . .
A Few Examples :
• Ink jet printing HP 1985 • Accelerometer ADI 1992 • DLP TI 1995 • Gyroscope Bosch 1998 • Microphone Knowles 2002 • Oscillator SiTime 2007 • Variable Cap Array WiSpry 2011
What is the Competition?
• Ink Jet Printing low resolution dot matrix printer
• Accelerometer steel ball in tube
• DLP transparent LCD • Gyroscope expensive quartz assembly • Microphone electret could not be soldered
• Oscillator quartz with 50X higher dpm • Variable Cap Array low Q CMOS capacitors
Rapid Adoption of Knowles Microphone
Mill
ions
of M
EMS
Mic
roph
ones
0
100
200
300
400
500
600
700
800
2003 2004 2005 2006 2007 2008 2009 2010
~2/3 of all cell phones
University/Corporate/Government Open Research Environment
• Major universities led the way – Basic research, particularly processes – Many early basic device demos – Dedicated Professors – Classes and curriculum – Continuing supply of new MEMS students
• NSF and DARPA funded heavily – NSF did the initial funding in the early 80’s; still funds – DARPA has funded over ~25 years
• Corporate funding of R&D has been extensive – DRIE invented at Bosch – Si Fusion Bond developed for MEMS at NovaSensor
MEMS Mechanical Capabilities
• Anisotropic etching • Double-sided lithography • Piezo-resistive sensing • Anodic bonding • Sacrificial etching • Electrochemical etching • Capacitive sensing; electrostatic actuation • Fusion bonding • DRIE • Vapor HF etching • XeF2 etching • SOI • Wafer bonding with transfer of electrical contacts
Manufacturability
• DS aligners became commercially available in the mid 80’s
• DRIE became commercially available in the early-mid 90’s
• Wafer bonders became commercially available • Vapor HF etchers became commercially available • XeF2 etchers became commercially available • SOI wafers became commercially available • Extensive modeling capabilities became available • The semi packaging industry evolved to
accommodate MEMS requirements
MEMS Packaging
Gold thermosonic wire bonds Standoff Stitch Bonds
Kobe
Leadframe
Insulative Die Attach Conductive Die Attach
CMOS Chip
MEMS Chip
CMOS die
MEMS die 0.8mm
Maxim – 2 chips in one package
Maxim buys the chip from SiTime and licenses the signal conditioning circuitry
Will we really get to a trillion?
• We will need a 100x increase ($) from today • 100x increase for semis took 35 years • Medical monitoring?
– 7B units nowhere near 1T • The combination of wireless and environmental
monitoring “could” get us to 1T – buildings, bridges, planes, lawn-mowers, roads, every
machine and structure on the planet, uninhabited areas • But, the transformation of the infrastructure
of the planet will take YEARS • Thumb in the air - 25 years to 1T
MEMS: where are we going?
• MEMS is now where semiconductors were when the first PC was introduced in 1981
• In 1981, MEMS was 1.0% of semi shipments • In 2010, MEMS was 3.5% of semi shipments • MEMS $ shipments has grown at ~15%/year • MEMS infrastructure is in place to fuel growth • Environmental monitoring + wireless will drive
MEMS to a trillion units in 25 years
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