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Material Solution
H-VLP New Parameters for surface roughness
RTF
Measured by the cross sectional image of SEM
Measured by the cross sectional image of SEM
Measured by using Zygo
Measured by using Zygo
Measured by using Wyko
Measured by using Wyko
0
1
2
3
4
0 1 2 3 4Con
tact
typ
e R
z (μ
m)
Grade0 1 2 3 4
Grade0 1 2 3 4
Grade0 1 2 3 4
Grade
Op
tical
typ
e S
Rz
(μm
)
0
100
200
300
400
500
Op
tical
typ
e S
dr
(%)
0
1
2
3
0
1
2
3N
odul
e he
ight
(μm
)
0
1
2
3
4
Con
tact
typ
e R
z (μ
m)
1 2 3
Grade1 2 3
Grade1 2 3
Grade1 2 3
Grade
Op
tical
typ
e S
dr
(%)
Op
tical
typ
e S
Rz
(μm
)
0
1
2
3
Nod
ule
heig
ht (μ
m)
0
100
200
300
400
500
600
0
0.5
1
1.5
2
2.5
Under development
H-VLP4
F1N-WS, F1X-WS
H-VLP3
FZ-WS, FZTW-WS
H-VLP2
FV-WS, FX-WS
H-VLP1
F2-WS, FT2-WS
VLP
Laminate-side
Resist-side
Laminate-side
Resist-sideUnder development
RTF3
DX-MP
RTF2
DGTSEU2-MP
RTF1
-5
-4
-3
-2
-1
0
0 20 40
S21
(dB
/3in
ch)
Frequency (GHz)
H-VLP3H-VLP2H-VLP
0.38mm
0.15mm
Resin
Cu foil
0.0
0.5
Pee
ling
stre
ngth
(kN
/m)
H-V
LP3
H-V
LP2
H-V
LP
H-V
LP3
H-V
LP2
H-V
LP
H-V
LP3
H-V
LP2
H-V
LP
H-V
LP3
H-V
LP2
H-V
LP
as lamina
ted
boiling t
estoven
test HCI test
New Products
Extremely low transmission loss
Good peeling strength
Excellent heat and acid resistance
H-VLP
RTF
Recommended