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Date: May, 2008 / Issue 1.0
Serv
ice M
an
ual
Mo
del : K
F750/K
F755c
Service ManualKF750/KF755c
Internal Use Only
- 3 -
1. INTRODUCTION .............................. 51.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................72.1 System Overview.....................................7
2.2 Usable environment .................................8
2.3 Radio Performance ..................................9
2.4 Current Consumption.............................18
2.5 RSSI.......................................................18
2.6 Battery Bar .............................................18
2.7 Sound Pressure Level............................19
2.8 Charging ................................................20
3. TECHNICAL BRIEF ........................213.1 Digital Baseband(DBB) & Multimedia
Processor...............................................21
3.2 GAM Hardware Subsystem ...................45
3.3 Audio Part ..............................................57
3.4 GPADC(General Purpose ADC) andAUTOADC2 ...........................................65
3.5 Charger control ......................................663.6 Voltage Regulation.................................72
3.7 RF Technical Description.......................73
4. TROUBLE SHOOTING ...................844.1 Power ON Trouble .................................84
4.2 USB Trouble ..........................................85
4.3 SIM Detect Trouble ................................86
4.4 MicroSD card Trouble ............................87
4.5 Keypad, Touch Button and Touch Screen Trouble ...........................88
4.6 Multi EL lighting Trouble ........................93
4.7 Camera Trouble .....................................97
4.8 Main LCD Trouble................................103
4.9 Keypad Backlight Trouble ....................105
4.10 Folder ON/OFF Trouble .....................107
4.11 Audio Trouble Shooting .....................109
4.12 Charger Trouble Shooting..................128
4.13 Checking Bluetooth Block ..................131
4.14 RF Component...................................138
4.15 Procedure to check ............................139
4.16 Checking Common Power Source Block......................................140
4.17 Checking VCXO Block .......................145
4.18 Checking Front End Module Block.....150
4.19 Checking Front End Module Block input logic .................................151
4.20 Checking WCDMA Block ...................154
4.21 Checking GSM Block .........................169
5. DOWNLOAD .................................1845.1 LGDP2 .................................................184
5.2 Download .............................................186
6. BLOCK DIAGRAM........................188
7. Circuit Diagram ............................191
8. BGM Pin Map................................203
9. PCB LAYOUT................................209
10. Calibration & RF Auto TestProgram (Hot Kimchi)................219
10.1 General Description ...........................219
10.2 XCALMON Environment ....................219
10.3 Calibration Environment.....................220
10.4 Program Operation ............................221
11. Stand-alone Test ........................22611.1 General Description ...........................226
11.2 Program Operation ............................227
11.3 Stand-alone Test................................230
12. EXPLODED VIEW &REPLACEMENT PART LIST ......233
12.1 EXPLODED VIEW .............................233
12.2 Replacement Parts ............................235
12.3 Accessory ..........................................258
Table Of Contents
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download thefeatures of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,persons other than your company’s employees, agents, subcontractors, or person working on yourcompany’s behalf) can result in substantial additional charges for your telecommunications services.System users are responsible for the security of own system.There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. Themanufacturer does not warrant that this product is immune from the above case but will preventunauthorized use of commoncarrier telecommunication service of facilities accessed through orconnected to it. The manufacturer will not be responsible for any charges that result from suchunauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as long asrepair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If thesechanges could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the userto take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorizedagent. The user may not make any changes and/or repairs expect as specifically noted in this manual.Therefore, note that unauthorized alternations or repair may affect the regulatory status of the systemand may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by localregulatory agencies. In accordance with these agencies, you may be required to provide informationsuch as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference fromunsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.• Use a suitable, grounded soldering iron.• Keep sensitive parts in these protective packages until these are used.• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
- 6 -
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 7 -
2.1 System Overview
2. PERFORMANCE
Item Specification
Shape GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset
Size 50.8X102.8X11.8 mm
Weight 116g (with standard battery)
Power 800mAh Li-Ion
Talk Time Over 170 Min (WCDMA, Tx=12 dBm, Voice)
Over 190 Min (GSM, Tx=Max, Voice)
Standby Time Over 220 hrs (WCDMA, DRX=2.56)
Over 220 hrs (GSM, Paging period=5)
Antenna Intenna type
Main LCD 2.4"(320x240), 260K TFT Color LCDs
Main LCD BL White LED Backlight
Vibrator Yes (Coin Type)
Speaker Yes
MIC Yes (SMD Type)
Receiver Yes
Earphone Jack Yes
SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V
Volume Key Push Type ( + , - )
Voice Key Push Type
External Memory T - Flash Socket
I/O Connect 18 Pin
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12~24V(DC).
2. PERFORMANCE
- 8 -
Item Specification Unit
Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) V
Operation Temp -20 ~ + 60 °C
Storage Temp -30 ~ + 85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 9 -
2.3 Radio Performance
1) Transmitter-GSM Mode
No Item GSM DCS/PCS
1 Conducted MS allocated 100k~1GHz -39dBm 9k~1GHz -39dBm
Spurious Channel 1G~1710MHz -33dBm
Emission 1G~12.75GHz -33dBm 1710M~1785MHz -39dBm
1785M~12.75GHz -33dBm
Idle Mode 100k~880MHz -60dBm 100k~880MHz -60dBm
880M~915MHz -62dBm 880M~915MHz -62dBm
915M~1000Mz -60dBm 915M~1000MHz -60dBm
1G~1.71GHz -50dBm 1G~1.71GHz -50dBm
1.71G~1.785GHz -56dBm 1.71G~1.785GHz -56dBm
1.785G~12.75GHz -50dBm 1.785G~12.75GHz -50dBm
Radiated MS allocated 30M~1GHz -36dBm 30M~1GHz -36dBm
Spurious Channel 1G~1710MHz -30dBm
Emission 1G~4GHz -30dBm 1710M~1785MHz -36dBm
1785M~4GHz -30dBm
Idle Mode 30M ~ 880MHz -57dBm 30M~880MHz -57dBm
880M ~ 915MHz -59dBm 880M~915MHz -59dBm
915M~1GHz -57dBm 915M~1GHz -57dBm
1G~1.71GHz -47dBm 1G 1.71GHz -47dBm
1.71G~1.785GHz -53dBm 1.71G~1.785GHz -53dBm
1.785G~4GHz -47dBm 1.785G~4GHz -47dBm
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 10 -
No Item GSM DCS/PCS
2 Frequency Error ± 0.1ppm ± 0.1ppm
3 Phase Error ± 5(RMS) ± 5(RMS)
± 20(PEAK) ± 20(PEAK)
4 Frequency Error 3dB below reference sensitivity 3dB below reference sensitivity
Under Multipath and RA250 : ± 200Hz RA250: ± 250Hz
Interference Condition HT100 : ± 100Hz HT100: ± 250Hz
TU50 : ± 100Hz TU50: ± 150Hz
TU3 : ± 150Hz TU1.5: ± 200Hz
5 Output RF Due to 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
Spectrum modulation 200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -33dB
400kHz -60dB 400kHz -60dB
600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
3000 ~ 6000kHz -71dB ≥ 6000kHz -73dB
≥ 6000kHz -77dB
Due to 400kHz -19dB 400kHz -22dB
Switching 600kHz -21dB 600kHz -24dB
transient 1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
7 Intermodulation attenuation - Frequency offset 800kHz
Intermodulation product should
be Less than 55dB below the
level of Wanted signal
No Item GSM DCS/PCS
8 Transmitter Output Power Level Power Toler. Level Power Toler.
5 33 ±3 0 30 ±3
6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3
8 27 ±3 3 24 ±3
9 25 ±3 4 22 ±3
10 23 ±3 5 20 ±3
11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing Mask IN Mask IN
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 11 -
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 12 -
2) Transmitter-WCDMA Mode
No Item Specification
1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
2 Frequency Error ± 0.1ppm
3 Open Loop Power control in uplink ± 9dB@normal, ± 12dB@extreme
4 Inner Loop Power control in uplink Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group)
+1 +8/+12 +
5 Minimum Output Power -50dBm(3.84MHz)
6 Out-of-synchronization handling of output power Qin/Qout : PCCH quality levels
Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
8 Transmit ON/OFF Time Mask ± 25us
PRACH,CPCH,uplinlk compressed mode
9 Change of TFC ± 25us
Power varies according to the data rate DTX :
DPCH off (minimize interference between UE)
10 Power setting in uplink compressed ± 3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
12 Spectrum emission Mask -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M -39-
10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 13 -
No Item Specification
14 Spurious Emissions (*: additional requirement) -36dBm@f=9~150KHz, 1K BW -
-36dBm@f=150KHz~30MHz, 10k
-36dBm@f=30~1000MHz, 100k
-30dBm@f=1~12.75GHz, 1M
-41dBm*@1893.5~1919.6MHz, 300k
-67dBm*@925~935MHz, 100k
-79dBm*@935~960MHz, 100k
-71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude (EVM) 17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
17 Transmit OFF Power -15dB@SF=4, 768kbps,
multi-code transmission
- 14 -
2. PERFORMANCE
3)Receiver-GSM Mode
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Item GSM850/900 DCS & PCS
1 Sensitivity (TCH/FS Class II) -105dBm -105dBm
2 Co-Channel Rejection (TCH/FS C/Ic=7dB C/Ic=7dB
Class II, RBER, TU high/FH)
3 Adjacent 200kHz C/Ia1=-12dB C/Ia1=-12dB
Channel
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
4 Intermodulation Rejection Wanted Signal: -98dBm Wanted Signal :-96dBm 1st
1’st interferer: -44dBm 1’st interferer: -44dBm
2’st interferer: -45dBm 2’st interferer: -44dBm
5 Blocking Response Wanted Signal: -101dBm Wanted Signal: -101dBm
(TCH/FS Class II, RBER) Unwanted Signal: Unwanted Signal:
Depend on freq. Depend on freq.
- 15 -
2. PERFORMANCE
4) Receiver-WCDMA Mode
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Item Specification
1 Reference Sensitivity Level -106.7dBm(3.84M)
2 Maximum Input Level -25dBm(3.84MHz)
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
3 Adjacent Channel Selectivity (ACS) 33dB
UE@+20dBm output power(class3)
4 In-band Blocking -56dBm/3.84MHz@10MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)
5 Out-band Blocking -44dBm/3.84MHz@f=2050~2095 &
2185~2230MHz, band a)
UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 &
2230~2255MHz, band a)
UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 &
2255~12500MHz, band a)
UE@+20dBm output power(class3)
6 Spurious Response -44dBm CW
UE@+20dBm output power(class3)
7 Intermodulation Characteristic -46dBm CW@10MHz &
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
8 Spurious Emissions -47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz
- 16 -
2. PERFORMANCE
5) Transmitter
5.1 Transmitter
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Item Specification
1 Out Power Class 2 : -6~4dBm
2 Power Density Power density < 20dBm per 100kHz EIRP
3 Power Control Option
2dB ≤ step size ≤ 8dB
4 TX Output Spectrum -Frequency range fmax & fmin @ below the level of -30dBm
(100khz BW) within 2.4GHz~2.4835GHz
5 TX Output Spectrum -20dB Bandwidth ≤ 1MHz
6 Tx Output Spectrum -Adjacent channel Po ≤ -20dBm @ C/I = 2MHz
≤ -40dBm @ C/I ≥ 3MHz
7 Modulation Characteristics 140kHz ≤ delta f1 avg ≤ 175kHz
delta f2max ≥ 115kHz at least 99.9% of all
deltaf2max delta f2avg/deata f1avg ≥ 0.8
8 Init. Carrier Freq. Tolerance ≤ ±75KHz
9 Carrier Frequency Drift 1 slot : ≤ ±25kHz
3 slot : ≤ ±40kHz
5 slot : ≤ ±40kHz
Maximum drift rate ≤ 20KHz/50usec
10 Out of Band Spurious Emissions Freq.Range Operating Standby
30MHz~1GHz -36dBm -57dBm
Above 1GHz~ -30dBm -47dBm
12.75GHz
1.8~1.9GHz -47dBm -47dBm
5.15~5.3GHz -47dBm -47dBm
- 17 -
2. PERFORMANCE
5.2 Transmitter
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Item Specification
1 Sensitivity single slot packets BER ≤ 0.1%@-70dBm
2 Sensitivity multi slot packets BER ≤ 0.1%@-70dBm
3 C/I performance BER ≤ 0.1%@ (Low,Mid,High Frequency)
2405MHz, 2441MHz, 2477MHz
Interference Ratio
Co-Channel interference, C/I co-channel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent( ≥ 3MHz)interference, C/I ≥ 3MHz -40dB
Adjacent( ≥ 3MHz)interference to in band -9dB
mirror frequency, C/I image ±1MHz -20dB
4 Blocking Characteristic BER ≤ 0.1%@wanted signal -67dBm
interfering Signal Frequency Power Level
30MHz~2000MHz -10dBm
2000MHz~2400MHz -27dBm
2500MHz~3000MHz -27dBm
3000MHz~12.75GHz -10dBm
5 Intermodluation Performance BER ≤ 0.1%@wanted signal -64dBm
static sinwave signal at f1=-39dBm
a BT modulated signal f2=-39dBm(payload PRBS15)
6 Maximum Input Level BER ≤ 0.1%@-20dBm
- 18 -
2. PERFORMANCE
2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
2.5 RSSI
2.6 Battery Bar
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Stand by Voice Call VT
WCDMA Only 220 Hours = 3.6 mA 170 Min = 280 mA 125 Min= 380 mA
(DRX=2.56) (Tx=12dBm) (Tx=12dBm)
GSM 220 Hours = 3.6 mA 190 Min = 250 mA
(paging=5period) (Tx=Max)
No WCDMA GSM
1 BAR 7 → 5 -93 (+/- 2dB) -90 (+/- 2dB)
2 BAR 5 → 4 -98 (+/- 2dB) -104 (+/- 2dB)
3 BAR 4 → 2 -101 (+/- 2dB) -108 (+/- 2dB)
4 BAR 2 → 1 -104 (+/- 2dB) -110 (+/- 2dB)
5 BAR 1 → 0 -106 (+/- 2dB) -112 (+/- 2dB)
Indication Standby
Bar 3 → 2 3.69 ± 0.05V
Bar 2 → 1 3.53 ± 0.05V
Bar 1 → Icon Blinking 3.40 ± 0.05V
Low voltage, warning message 3.40 ± 0.05V
Power OFF 3.26 ± 0.05V
- 19 -
2. PERFORMANCE
2.7 Sound Pressure Level
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
No Test Item Specification
1 Sending Loudness Rating (SLR)NOM
8 ± 3 dBMAX
2 Receiving Loudness Rating (RLR)NOM -1 ± 3dB
MAX -15 ± 3dB
3 Side Tone Masking Rating (STMR)NOM
17dB overMAX
4 Echo Loss (EL)NOM
40dB overMAX
5 Sending Distortion (SD) refer to TABLE 30.3
6 Receiving Distortion (RD) refer to TABLE 30.4
7 Idle Noise-Sending (INS)NOM
-64dBm0p underMAX
8 Idle Noise-Receiving (INR)NOM -47dBPA under
MAX -36dBPA under
9 Sending Loudness Rating (SLR)NOM
8 ± 3dBMAX
10 Receiving Loudness Rating (RLR)NOM -1 ± 3dB
MAX -12 ± 3dB
11 Side Tone Masking Rating (STMR)NOM 25dB over
MAX
12 Echo Loss (EL)NOM
40dB overMAX
13 Sending Distortion (SD) refer to TABLE 30.3
14 Receiving Distortion (RD) refer to TABLE 30.4
15 Idle Noise-Sending (INS)NOM
-55dBm0p underMAX
16 Idle Noise-Receiving (INR)NOM -45dBPA under
MAX -40dBPA under
MS
HEAD SET
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. PERFORMANCE
- 20 -
2.8 Charging
• Normal mode: Complete Voltage: 4.2V
Charging Current: 500mA
• Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
• Extend await mode: At Charging prohibited temperature(0°C under or 45°C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)
No Test Item Specification
TDMA NOISEGSM
SEND
GSM: Power Level: 5 REV.
DCS: Power Level: 0DCS
SEND
17(Cell Power: -90 ~ -105dBm) REV.
Acoustic(Max Vol.)GSM
SEND
MS/HEADSET SLR: 8 ± 3dB REV.
MS/HEADSET RLR: -13 ± 1dB/-15dBDCS
SEND
(SLR/RLR: mid-Value Setting) REV.
MS
Headset
-62dBm
under
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 21 -
3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
• Access subsystem
- Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG),
Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM
- Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA®, Universal
Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on
- Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory
(SRAM), and Program Data Read Only Memory (PDROM)
- EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators
- WCDMA subsystem - WCDMA hardware accelerators
• Application subsystem
- Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM
- Application peripheral subsystems - I2C¢‚, keypad, UART, and so on
- Graphics subsystem - XGAM subsystem
- Audio Processing Execution (APEX) and video encoder subsystems In addition to the two
subsystems above, there is also a test block, chip control block, and a pad multiplexing block
residing at the top level
• DSP
- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the
DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB
instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to
the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP
megacell is clocked at 208 MHz.
- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a
direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB.
The AHB slave interface allows the CPU and the DMA to access in the program and data RAM
residing in the DSPSUB.
3. TECHNICAL BRIEF
- 22 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
• Multi-media Processor(MMIC : ZR3453X )
- The ZR3453X is an advanced multimedia coprocessor for cellular devices. ZR3453X is an MCP
that includes a multimedia core and SDRAM memory chip. The multimedia core performs audio
and video recording, playback, and editing; still image capture (DSC), viewing, and editing;
MIDI/MP3 playback (for ring tones); 3D acceleration (for gaming). The memory chip in the MCP is
a 16MB (2MB) mobile SDRAM (that can be enlarged by packaging to 64MB), used both for
program code and for working data (both stream data and frame buffers).
• WCDMA subsystem
- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem
- An interface to the WCMDA together with memory control and an internal single port RAM. The
WCDMA subsystem has three AHB slave interfaces.
- The Ericsson DB 3150 also includes HSDPA class 6 functionality.
- The WCDMA subsystem is handled and provided by Ericsson.
• XGAM subsystem
- The XGAM subsystem is a graphics acceleration module that provides hardware support in the
creation of visual imagery and the transfer of this data to a display. The XGAM also provides
support for connecting a Camera module. The visual data could be graphics, still images, or video.
- The XGAM subsystem is handled and provided by Ericsson.
• Operation and Services
- I2C™ Interface
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM
- JTAG
- RTC
- ETM (in Prototype Package)
- 23 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
MMemorySDRAM (1G)NAND (2G)
<Numeric Key>
<u- SD card>
<5 Mega>
<VGA>
<LCD> < USB Transceiver >
<BT + FM Radio>
<Spk><Mic>
RF3100WCDMA
Transceiver
AB3000Analog
Baseband Process
or ((Audio)
RF3000GSM / EDGE
Transceiver
GSM/EDGE PA + Ant Sw.
ANT
DB3150Digital Baseband Processor (Dual
core)
Access CPU
Application CPU
BSU
18P
in C
radl
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onne
ctor
18P
in C
radl
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onne
ctor
tuO VT
TRAU
nocomeRkcajraE
SH0.2
AB3000Analog
Baseband Processor
(Power Management)
<SIM>
<Battery>
<Vibrator>
Amp
Touch Panel
SUB PMIC
EL Controller
Touch Button
AccelerometerLight Sensor
EMIF2
EMIF1
PDI
CDI
I2C_2S
D_I
F
I2C_1
GPIO_I2C_2
GPIO_I2C_1
GPIO_I2C_2
Key
_IF
Vibrator_IF(PWM)
BAT_IF
SIM_IF
Zoran_GPIOI2S_0
PCM
SPI
USB
TV_Out
USB
Headset
FM_ANT
Zoran_I2C
Zoran_CDI
LED
< Zoran >
I2S_1
To EMP CAM IF
From Zoran LCD IF
Figure 3-1-1 KF750 Block Diagram
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 24 -
3.1.2 External memory interface
RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
area.
A. KF750
• 2Gb NAND flash memory +1G SDRAM
DDevicece Part Nam e M akerer Itemem Tim e Size Speeeed
Program speed 200µs 1Page=(2K + 64)Bytes 10.32M Byte/s
Erase speed 1.5ms 1Block=(128K+4K)Bytes 88M Byte/s
NAND flash KAL00900BM -DJ55 Samsung
Figure 3-1-1 KF750 Block Diagram
Device Part Nam e M aker Item Tim e Size Speed
Device Part Nam e M aker Item Tim e Size Speed
Figure 3- 1- 2. External Memory Configuration of KF750
• Data Communication
- IrDA ® (SIR)
- UARTs (ACB, EDB (RS232))
- Slave USB
• Package
- 12 by 12 mm 344 balls, 0.5mm pitch
FPBGA Production Package
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 25 -
3.1.3 Hardware Architecture
A. Block Diagram
Figure 3-1-3. Access system of Ericsson DB3150
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 26 -
Figure 3-1-4. Application system of Ericsson DB3150
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 27 -
B. CPU Subsystem
• Access CPU subsystem
The digital baseband controller includes an access CPU subsystem, which includes the submodules
described below.
- 32 KiB I-cache
- 16 KiB D-cache
- Page table
- Memory Management Unit (MMU)
- JTAG
- ETM9
- 26 KiB I-TCM
- 8 KiB D-TCM
• Application CPU subsystem
The digital baseband controller includes an Application CPU subsystem, which includes the
submodules described below.
- 32 KiB I-cache
- 16 KiB D-cache
- Page table
- MMU
- JTAG
- ETM9
- 8 KiB I-TCM
- 8 KiB D-TCM
C. Peripheral Hardware Subsystem
The digital baseband controller includes hardware that supports mobile terminal peripherals such as a
MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the
Peripheral subsystem.
The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate
bridges, which provide a simple interface to support different timing and memory access
arrangements.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
D. DSP Hardware Subsystem
The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP
CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB
instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the
megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP
megacell is clocked at 208 MHz.
The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct
access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB
slave interface allows the CPU and the DMA to access in the program and data RAM residing in the
DSPSUB.
E. XGAM Subsystem
The XGAM subsystem is a graphics acceleration module that provides hardware support in the
creation of visual imagery and the transfer of this data to a display. The XGAM also provides support
for connecting a Camera module. The visual data could be graphics, still images, or video.
The XGAM subsystem is handled and provided by Ericsson.
F. System Control Subsystem
The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation
and clock and reset distribution within the digital baseband controller, as well as to external devices.
The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON
controls the fundamental modes of operation within the digital baseband controller. Individual blocks
can also be reset and their clocks held inactive by accessing the appropriate control registers.
3. TECHNICAL BRIEF
- 28 -
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 29 -
3.1.4 RF Interface
A. Asta Interface
Asta controls GSM RF part using these signals through GSM RF chip-Gimli.
• RF_DATA_A
• RF_DATA_B
• RF_DATA_C
• RF_DATA_STRB
B. WCDMA Radio Link Interface
• RF_WCDMA_PA_0_EN
• RF_WCDMA_PA_1_EN
• RF_WCDMA_DCDC_EN
• RF_WCDMA_PWRDET_EN
Y4RF_DATA_ARF_DATA_B
AA2Y3
RF_DATA_CY2
RF_DATA_STRB
QDATA_AMP_MSBIDATA_FREQ_MSB
AMP_LSB_FREQ_LSBDCLK_DATSTR
Figure 3-1- 5. Schematic of Asta RF Interface
TP300V7
RF_WCDMA_PWRDET_ENAB6
Y4RF_DATA_ARF_DATA_B
AA2Y3
RF_DATA_CY2
RF_DATA_STRB
AB5RF_WCDMA_DCDC_EN
AB8RF_WCDMA_PA_0_ENRF_WCDMA_PA_1_EN
Y8DAC_I_NEGDAC_I_POS
W8W7
Y10ADC_I_NEGADC_I_POS
W10W9
ADC_Q_NEGADC_Q_POS
Y9
QDATA_AMP_MSBIDATA_FREQ_MSB
AMP_LSB_FREQ_LSBDCLK_DATSTR
WDCDC_EN
WTX_BAND_1_EN
WPOW_DET_EN
WRX_I_NWRX_I_PWRX_Q_NWRX_Q_P
WTX_I_NWTX_I_P
Figure 3-1-6. Schematic of WCDMA RF Interface
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1.5 SIM Interface
SIM interface scheme is shown in Figure3-1-6.
SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(Asta) with ABB(Veronica) and
filter.
3.1.6 UART Interface
UART signals are connected to Asta GPIO through IO connector
3. TECHNICAL BRIEF
- 30 -
SIM (Interface between DBB and ABB)
SIMDAT0 SIM card bidirectional data line
SIMCLK0 SIM card reference clock
SIMRST0 SIM card async/sync reset
Resource Name Note
UART0
ACC_GPIO_2 ACC_UART_RX ACC Receive Data
ACC_GPIO_3 ACC_UART_TX ACC Transmit Data
UART1
APP_GPIO_0 APP_UART_RX APP Receive Data
APP_GPIO_1 APP_UART_TX APP Transmit Data
Table 3-1-2. SIM Interface
Table 3-1-3. UART Interface
VDD
DAT
CLK CARD
RST
SIMVCC
Veronica
SDAT SIMDAT
SCLK SIMCLK
SRST SIMRST
Asta
SIMDAT0
SIMCLK0
SIMRST0
VDDE
10K10K
Figure 3-1-7. SIM Interface
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1.7 GPIO (General Purpose Input/Output) map
In total 39 allowable resources. This model is using 39 resources.
GPIO Map, describing application, I/O state, and enable level are shown in below table.
3. TECHNICAL BRIEF
- 31 -
Table 3-1-4. Asta ACC GPIO Map Table
DB3150's GPIO GPIO Mapping Init Status
ACC_GPIO_0 ACC_GP00_USB_STP Output low
ACC_GPIO_1 ACC_GP01_USB_DIR input
ACC_GPIO_2 ACC_GP02_UART0_RX input
ACC_GPIO_3 ACC_GP03_UART0_TX Output
ACC_GPIO_4 ACC_GP04_USB_CLK input
ACC_GPIO_5 ACC_GP05_USB_NXT input
ACC_GPIO_6 ACC_GP06_USB_DAT4 input / Output
ACC_GPIO_7 ACC_GP07_USB_DAT5 input / Output
ACC_GPIO_8 ACC_GP10_USB_DAT6 input / Output
ACC_GPIO_9 ACC_GP11_USB_DAT7 input / Output
ACC_GPIO_10 ACC_GP12_TOUCH_LDO_EN Output low
ACC_GPIO_11 ACC_GP13_SPK_AMP_EN Output low
ACC_GPIO_12 ACC_GP14_BT_SPI_INT Input
ACC_GPIO_13 ACC_GP15_FLIPSENSE Input
ACC_GPIO_14 ACC_GP16_FM_GPIO2 Input
ACC_GPIO_15 ACC_GP17_PHFSENSE Input
ACC_GPIO_16 ACC_GP20_USB_CS_PD input / Output
ACC_GPIO_17 ACC_GP21_VC_IO_OFF Output low
ACC_GPIO_18 ACC_GP22_USB_DAT3 input / Output
ACC_GPIO_19 ACC_GP23_BT_SPI_CS0n Output
ACC_GPIO_20 ACC_GP24_BT_SPI_DAT0 Output low
ACC_GPIO_21 ACC_GP25_BT_SPI_DAT1 Input
ACC_GPIO_22 ACC_GP26_BT_SPI_CLK Output low
ACC_GPIO_23 ACC_GP27_AMP_SW_EN Output low
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 32 -
Table 3-1-5. Asta APP GPIO Map Table
Table 3-1-5. MMIC APP GPIO Map Table
DB3150's GPIO GPIO Mapping Init Status
APP_GPIO_0 APP_GP00_UART_RX Input
APP_GPIO_1 APP_GP01_UART_TX Output
APP_GPIO_2 APP_GP02_MMP_INT_n Input
APP_GPIO_3 APP_GP03_MMP_PWR_EN Output low
APP_GPIO_4 APP_GP04_TOUCH_SCREEN_INT Input
APP_GPIO_5 APP_GP05_TOUCH_SCREEN_SCL Output
APP_GPIO_6 MICROSD_DAT3 Input
APP_GPIO_7 APP_GP07_3AXIS_INT Input
APP_GPIO_8 APP_GP10_MMP_RESET_N Output low
APP_GPIO_9 APP_GP11_REMOTE_INT Input
APP_GPIO_10 APP_GP12_LCD_ID Input
APP_GPIO_11 APP_GP13_MC_CLKRET Input
APP_GPIO_12 SUB_PM_RESETB Output low
APP_GPIO_13 MOTOR_EN Output low
APP_GPIO_14 APP_GP16_TOUCH_SCREEN_SDA input / Output
DB3150's GPIO GPIO Mapping Init Status
GPIO_0 CI_VSYNC_WITHOUT_FF Output low
GPIO_1 APP_GP05_TOUCH_RESET Output low
GPIO_2 CI_VSYNC Output low
GPIO_3
GPIO_4 MMP_CAM_RESET_N Output low
GPIO_5 MMP_CAM_PWR_EN Output low
GPIO_6 MMP_CAM_PWDN Output low
GPIO_7 FLASH_LED_EN Output low
GPIO_8 FLASH_LED_TORCH Output low
GPIO_9 FLASH_LED_INH Output low
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 33 -
3.1.8 USB
The USB block supports the implementation of a °∞High-speed" device fully compliant to USB 2.0
standard. It provides an interface between the CPU (embedded local host) and the USB wire, and
handles USB transactions with minimal CPU intervention.
The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM
within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register
access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO
register access.
The USB block can request up to six DMA channels, three for IN endpoints and three for OUT
endpoints.
USB Function Note
USB_STP ULPI stop signal
USB_DIR ULPI direction signal
USB_CLK USB clock
USB_NXT ULPI next signal
USB_DAT0 USB data0
USB_DAT1 USB data1
USB_DAT2 USB data2
USB_DAT3 USB data3
USB_DAT4 USB data4
USB_DAT5 USB data5
USB_DAT6 USB data6
USB_DAT7 USB data7
USB_CS_PD USB chip select
VBUS Power supply for Asta USB block
Table 3-1-6. USB Signal Interface of Asta
- 34 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3_OIPG_CCA9N9M
4_OIPG_CCA5_OIPG_CCA
4N
6_OIPG_CCA3P
7_OIPG_CCA4P4R
8_OIPG_CCA9_OIPG_CCA
3R
0_OIPG_CCA1_OIPG_CCA
9K
2R
2P2_OIPG_CCA
9J
KLC_BSU_40PG_CCA
5TAD_BSU_70PG_CCA4TAD_BSU_60PG_CCA
6TAD_BSU_01PG_CCA7TAD_BSU_11PG_CCA
PTS_BSU_00PG_CCARID_BSU_10PG_CCAXR_0TRAU_20PG_CCA
XT_0TRAU_30PG_CCA
TXN_BSU_50PG_CCA
USB_DAT_VPL4
USB_OEM4L3
USB_SE0_VMUSB_DAT1
USB_DAT2USB_DAT0
Figure 3-1-8. Schematic of Asta USB block
V01
1%
deepS hgiH rof reviecsnarT BSU
0.1u
C60
4 3060
TABV
u7.4106C
R60
351
K
R60
612
K
0.1u
C60
3
4.7u
3060
C60
2
8V1_EDDV
3060u1.0006C
4.7u
C60
6
K1506R
0.1u
3060
C60
5
6D
TSET4C
4FSUBV
VC
CF
3
5B1OI_CCV2OI_CCV
2B
5F1LATX2LATX
6F
7ATAD
5ERID
MD1C1D
PDTLUAF
2E
GN
D1
C5
D2
GN
D2
GN
D3
E4
3DDI
NC
1F
1F
2N
C2
5DN_WSPTXN
4D
6E8V1FER
3E3V3GER
2CFERR
PTS
0GFC1E
4B1GFC2GFC
3B
LES_PIHC3C4A
KCOLC0ATAD
1B1A
1ATAD2ATAD
2A3A
3ATAD4ATAD
5A6A
5ATAD6ATAD
6B6C
TEA8051PSI106U
2.2u
C60
7
TXN_BSU_50PG_CCAPTS_BSU_00PG_CCA
1LATX_BSU
MD_BSU
XRT_BSU_SUBV
PD_BSU
DP_SC_BSU_02PG_CCAKLC_BSU_40PG_CCA
0TAD_BSU1TAD_BSU2TAD_BSU3TAD_BSU_22PG_CCA4TAD_BSU_60PG_CCA5TAD_BSU_70PG_CCA6TAD_BSU_01PG_CCA7TAD_BSU_11PG_CCA
RID_BSU_10PG_CCA
Figure 3-1-9. Schematic of USB Transceiver
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1.9 Slider ON/OFF Detection
There is a magnet to detect the slide module status, up or down.
If a magnet is close to the hall-effect switch U101, the voltage at Pin 4 of U101 goes to 0V.
Otherwise 1.8V.
This SLIDE_DET signal is delivered to Asta ACC_GP15_FLIPSENSE.
TCETED EDILS
4TUO
DDV1
5MB21006KT101U
21DNG
52DNG
6DDV_OI
CN3
211C
8V1_EDDV
u1.0
u1.0901C
57V2_GDDV
ESNESPILF_51PG_CCA
Figure 3-1-10. Slider On/Off Detector
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 36 -
3.1.10 Bluetooth Interface
KF750 supports Bluetooth operation using STLC2593C Bluetooth module.
A. General Description
The Bluetooth interface utilizes the SPI interface for control signals going to and from the Bluetooth
module. The SPI is also used for data transmissions.
It uses the PCM interface for transmitting audio to and from the Bluetooth module.
The Bluetooth module uses both the 26 MHz master clock signal and the 32,768 kHz low-frequency
clock signal for internal timing within the Bluetooth module. The intention is to use the low-frequency
clock as a low-power timing provider and to use the 26 MHz as a high precision timing reference used
mainly by the Bluetooth radio during operation.
The clock request mechanism is used to minimize current consumption for the total system.
The intention is to use the CLKREQ signal to ask for the master clock when needed, for example,
when the Bluetooth radio is operating.
B. SPI Interface
The physical SPI interface is made up of 5 signals : clock, chip select, data in, data out and interrupt.
When the SPI mode is selected , these signals are available through the BT_UART and
BT_HOST_WAKEUP pins.
The SPI interface is Master at the Host side, and Slave at the BT Controller side.
It is designed to work with the H4 protocol. It does not support HCI synchronous data packet transfer.
Data are transferred on the SPI interface in byte format, LSB first.
The SPI interface can operate only in half duplex mode.
C. PCM Interface
The PCM interface is used to send audio to and from the Bluetooth module. The interface is a
synchronous interface using a PCM clock and a PCM sync signal for synchronization. Two data
signals are used for data, one in each direction.
The PCM clock signal operates at frequencies as high as 1 MHz. The word length of the audio data
can be 8 or 16 bits. Furthermore, the PCM interface has a function known as MP-PCM, which is an
addressing scheme, used to have more than two devices talking on the bus.
To add this function, the data pins have to be bi-directional. Additionally, the position of the audio data
relative to the frame sync pulse must be selectable. During the periods within a frame that a device is
not transmitting audio data, it must put both PCM data signals in a high-impedance state to allow other
devices access.
D. Master Clock and Clock Request Interface
The master clock (MCLK) is a 26 MHz signal used as the high precision clock signal for the Bluetooth
module. The signal can be switched on and off by the platform. The master clock request (CLKREQ) is
used by the Bluetooth module to ask for the master clock.
If the Bluetooth module asserts the signal high, it gets the master clock. The other alternative for the
Bluetooth module is to set the clock request output to high impedance state, indicating that it does not
need the master clock. The Bluetooth module receives the master clock, if other parts of the chipset
request it.
E. Low Frequency Clock Interface
The low-frequency clock signal (RTCCLK) is used by the Bluetooth module as a low-power clock. The
clock is used in different Bluetooth modes, like sniff and park, to have a correct timing on the Bluetooth
air interface without having the master clock running.
The low-frequency clock is always present, in some applications even when the chipset is powered
down.
F. STLC2593C
WFBGA 5.0 x 7.5 x 0.8 mm lead-free/RoHs compliant 100 pins
External component: B-BPF (Bluetooth)
PCB footprint < 45mm2
Based on Ericsson Technology Licensing Baseband Core (EBC)
Bluetooth¢‚ specification compliance: V2.0 + EDR.
- Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability
- Support ACL and SCO links
- Extended SCO (eSCO) links
- Faster Connection
HW support for packet types
- ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5
- SCO: HV1, HV3 and DV
- eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5
- Adaptive Frequency Hopping (AFH)
Transmit Power
- Power Class 2 and Power Class 1.5 (above 4dBm)
- Programmable output power
- Power Class 1 compatible
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 37 -
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 38 -
HCI
- HCI H4 Transport Layer
- HCI proprietary commands (e.g. peripherals control)
- Single HCI command for patch/upgrade download
Supports Pitch-Period Error Concealment (PPEC)
Efficient and flexible support for WLAN coexistence in collocated scenario
Low power consumption
- Ultra low power architecture with 3 different low-power levels
- Deep Sleep modes, including Host power saving feature
- Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device
Communication interfaces
- Fast UART up to 4Mbit/s
- SPI interface
- PCM interface
- Up to 10 additional flexibly programmable GPIOs
- External interrupts possible through the GPIOs
- Fast master I2C interface
Clock support
- System clock input (digital or sine wave) at9.6, 10, 13, 16, 16.8, 19.2, 26, 33.6 or 38.4MHz
- Low Power clock input at 32.768 kHz
ARM7TDMI CPU
Memory organization
- On chip RAM, including provision for patches
- On chip ROM, preloaded with SW up to HCI
Ciphering support up to 128 bits key
Single power supply with internal regulators for core voltage generation
Supports 1.65 to 2.85 Volts IO systems
Auto calibration (VCO, Filters)
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 39 -
G. KF750 Bluetooth Schematic
• Clock
- Clock request
→ Connected to CLKREQ of Asta and Veronica, input to Gimly
- Fast clock : 26MHz
→ Supplied MCLK from Gimly
→ Frequency deviation : ± 20ppm
- Low power clock : 32.768kHz
→ Supplied RTCCLK from Veronica
• Power
- Supplied 2.75V, 1.8V from internal regulators of Veronica
• Reset
- RESOUT2_n signal of Asta controls STLC2593C reset.
• SPI
- Connected to SPI of Asta
- HCI interface between Asta and STLC2593C
• PCM
- Audio signal interface between Asta/Veronica and STLC2593C
• ANT
- 2.4GHz, 50 ohm matching
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6DNG_MF7C
7DNG_MF8DNG_MF
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TUOL_MF5B
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2F5ANASSV_TB6ANASSV_TB
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NI_KLC_FER_TB6F
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D_RVSR_TBMSD_RVSR_TB
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108TUO
PL_MFPR_MF
2OIPG_MF_61PG_CCA
1TAD_IPS_TB_52PG_CCA
KLC_IPS_TB_62PG_CCA
n0SC_IPS_TB_32PG_CCA0TAD_IPS_TB_42PG_CCA
n_1TUOSER
LCS_C2I_PPA
ADS_C2I_PPA
KLC_TB
TNA_MF
n_QERKLC_TB
TNI_IPS_TB_41PG_CCA
KLCCTR
DLD_MCP_CCADLU_MCP_CCA
KLC_MCP_CCACNYS_MCP_CCA
n_2TUOSER
KLCCTR
Figure 3-1-11. Schematic of STLC2593C
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 40 -
3.1.11 MicroSD Interface card
KF750 supports the MicroSD card interface as external memory card.
MicroSD card has 4-data line, so KF750 uses 4-data line.
All control and data line is connected to Asta.
Cause of the difference between Asta and MicroSD card, a level shifter should be added.
• Card detection
- When there are no card in MicroSD card socket, REAL_MICROSD_DAT3 pin is high cause of an
internal pull-up.
- If Card is inserted in socket, The pull up can be disconnected by using SET_CLR_DETECT
command.
- VDDG_2V75 always supply power.
R91
610
0K
8V1_EDDV
309Cu1.0
57V2_GDDV
R90
7
470K
2 4 6 8
1 3 5 7
DN
I
R94
1
RA
1
100K
5 7
2 4 6 8
1 3
RA
2
100K
2CBDMC
RID_DMC5B
2BB0TADA0TAD
2DRID_0TAD
5C
RID_321TAD1C
A1TAD1D2A
B1TAD4B
B2TADA2TAD4C
4AA3TAD
4DB3TAD
1DNG3B
2DNG3C
5AACCV
5DBCCV
RYXZE604ACVA47NS009U
3AAKLC
3DBKLC
F_KLC1A
ADMC1B
109Cu1.0
DMC_DSORCIM
0TAD_DSORCIM
1TAD_DSORCIM2TAD_DSORCIM
0TAD_DSORCIM_LAER
1TAD_DSORCIM_LAER2TAD_DSORCIM_LAER
DMC_DSORCIM_LAER
3TAD_DSORCIM_LAER
KLC_DSORCIM
3TAD_DSORCIM
KLC_DSORCIM_LAER
TERKLC_CM_31PG_PPA
RID_DMC_DSORCIM
RID_TAD_DSORCIM
Figure 3-1-12. MicroSD card and Schematic of MicroSD card Interface
MicroSD card Interface
MICROSD_CMD Command/Response
MICROSD_CLK Clock
MICROSD_DAT Data line
VDDG_2V75 Supply voltage from Veronica internal LDO
Table 3-1-7. MicroSD card Interface
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 41 -
3.1.1 Power On Sequence
User presses END key and then ONSWAn signal is changed to Low.
Veronica initiates the internal oscillator and powers on the regulators.
Veronica generates a power for Asta.
Veronica releases the power reset signal(PWRRSTn) and generates an interrupt(IRQ0n) to Asta.
Asta
RESPOW_N
IRQ0_N
Veronica
PWRRST
IRQ
ONSWA
Power for Asta
PWRRSTn
IRQ0nONSWAn
Press END key
Figure 3-1-13. Power On Sequence
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 42 -
3.1.13 KeyPad, Touch button and Touch screen
There are 21 buttons and 5 side keys and touch button in Figure 2-1-13/14. Shows the Keypad circuit.
‘END’ Key is connected ONSWAn for Veronica.
When Touch button and Touch screen is touched, Interrupt is given to Asta than, she read the status
register what button is touched by I2C. I2C is realize by Asta GPIO.
8
5TOH
4 5
7
YEK_REBMUN
6
3
0
2
4TOH
9
1
401 501
011
601
301201
701
201TOH101TOH
2 4 6 8
1 3 5 7 K01
101AR
101
801 901
8V1_EDDV
2NIYEK
0NIYEK
1NIYEK
1TUOYEK
3TUOYEK
2TUOYEK
4TUOYEK
3NIYEK
8V1_EDDV
RLC
009RK01
109RK01
009D
03-S125BR
KODNES
n_AWSNO
5NIYEK
4NIYEK
2TUOYEK
1TUOYEK
YEK WS_NO
DNE
009AV
RF053X4150SVCI
n_AWSNO307NC
1234
0TUOYEK
1NIYEK0NIYEK
23
4
1011WS
1
EMOH
ITLUM
3NIYEK
2TUOYEK
3TUOYEK
3NIYEK
1TUOYEK
4TUOYEK
Figure 3-1-14. KEY CIRCUIT
Table 3-1-8. Key Matrix Mapping Table
KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5
KEYOUT0 VOLUME1 VOLUME2
KEYOUT1 1 2 3 MULTI SEND OK
KEYOUT2 4 5 6 CAMAF CLR
KEYOUT3 7 8 9 CAMSHOT
KEYOUT4 * 0 # HOME
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 43 -
V1.3_HCUOT
R90
6
4.7K
4.7K
R90
7
6
87
9
6151
8171
1
01
11
21
31
41
2
3
4
5
109NC
DN
I
R90
5
TNI_NEERCS_HCUOT
LCS_NEERCS_HCUOT
ADS_NEERCS_HCUOT
Figure 3-1-15. Touch button and Touch screen connector
I2C interface
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 44 -
3.1.14 Multi EL lighting
There are 13 EL lighting channel. Each lighting channel is operated independently. EL
controller(U901) control AC generator and EL driver(U900). AC generator generate 190V AC signal.
And this 190V AC signal is switched by EL driver. Through EL driver, AC signal of the each lighting
channel is switched independently. Finally, switched AC signal illuminate EL sheet.
ISSP
I2C
D5
G
S1 S2
R91
556
K
Q900SIA450DJ
D1 D2 D3 D4
R90
9
0
TP902
TP905
HVOUT7
5HVOUT8
4HVOUT9
NC113
NC216
NC31823
NC4
25NC5
33SLUG
VBIAS26
VDD20
14VPP
22_LE
21_POL
24
GND15
HVGND27
HVOUT112
3HVOUT10HVOUT11
2HVOUT12
132
HVOUT13
31HVOUT14
30HVOUT15
29HVOUT16
HVOUT21110
HVOUT3
9HVOUT4HVOUT5
8HVOUT6
76
HV509U900
BP28
19CLK
DIN17
DOUT
2.2uC902
470pFC903
VREG_6.1V
TP906TP907
R91
3
100K
10M
R91
0
P2_422
P2_53
23P2_6
2P2_7
P3_018
P3_17
19P3_2
6P3_3
28V
DD
32V
SS
1
12V
SS
2
17XREX
26P
0_4
30P
0_5
P0_
627
P0_
729
P1_
013
P1_
111 14
P1_
2
10P
1_3
P1_
415
P1_
59 16
P1_
6
8P1_7
P2_020
P2_15
21P2_2
4P2_3
U901CY8C21434
33G
ND
P0_024
P0_11
P0_
225
P0_
331
0.1u
TP903
TOUCH_3.1V
C906
0.1uC907
RF051VA2S
D901
0.1u
C90
4
100K
R912150pC905
100uHL900
TOUCH_3.1V
HV_OUT_5HV_OUT_6HV_OUT_7HV_OUT_8HV_OUT_9
HV_OUT_13HV_OUT_14
BP
HV_OUT_2HV_OUT_3HV_OUT_4
TOUCH_SCREEN_SDATOUCH_SCREEN_SCL
HV_OUT_10HV_OUT_11HV_OUT_12
TOUCH_RST
TOUCH_BUTTON_SDATOUCH_BUTTON_SCL
Figure 3-1-16. Multi EL lighting
EL controller AC generator EL driver EL lighing channeloutput (connected withEL sheet)
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 45 -
3.2 GAM Hardware Subsystem
3.2.1 General Description
The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of
visual imagery and the transfer of this data to the display. GAM also provides support for the camera
module. The visual data could be graphics, still images or video. The GAM subsystem consists of five
modules:
• GRAM : graphics memory (160 kB).
• GAMCON : GAM controller.
• GRAPHCON : graphics controller.
• PDI/SSI : programmable display interface for parallel/serial displays.
• CDI : camera data interface.
Figure 3-2-1. GAM Subsystem Functional Block Diagram
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 46 -
3.2.2 Block Description
A. GAM Controller(GAMCON)
The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM
module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and
CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI.
The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display
module respectively, see Figure 2.28. The CIPCLK is used to clock the received data into the camera
data interface. The CIPCLK can be in the range of 100 kHz to 16 MHz.
B. Graphics RAM (GRAM) Block
GAM includes 160 kB of graphics memory (GRAM) in order to support display screen sizes of QCIF +
alfa display size and three frame buffers when decoding QCIF video.
The GRAM can be accessed in 8, 16 or 32-bit mode. Write access takes a single AHB clock cycle.
Non-sequential read and the first access of a sequential read access takes two AHB clock cycles.
Subsequent sequential read access take a single AHB clock cycle.
The GRAM contains both frame buffer and temporary data. There are three image areas with one
used for normal MMI graphics and the other two areas used for still images, video frames or camera
frames. The three image areas can be combined into one frame buffer.
GRAM is required to transfer a VGA (640 by 480 pixels) image from the camera data interface (CDI)
over DMA at 100 MBit/s, within a 50 ms timeframe. The GRAM is used as a buffer, but the average
transfer bandwidth required is approximately 3 Mword/s (32-bit word), that is 12 MByte/s.
C. Graphics Controller (GRAPHCON) Block
GRAPHCON is controlled by the application CPU and can perform operations on pixels and image
areas. Images can be moved and merged with other images and text.
The GRAPHCON block receives graphical objects from GRAM and performers the appropriate
graphical manipulation. The resulting data is transfers to the display interface (PDI).
GRAPHCON can receive images from the camera data interface (CDI) and send them to the PDI
automatically.
GRAPHCON performs conversion from YUV to RGB and can scale (zoom) still or video images.
D. Programmable Display Interface (PDI) Block
The programmable display interface (PDI) is designed to interface both parallel and serial display
modules. The display data is transferred from the 32 word FIFO on GAMCON to the display module
via the PDI block. The PDI block is built around a micro controller and executes 16-bit instruction
words to individually control the I/O ports. It has a 128 byte program memory, programmable by the
CPU, which can store up to 64 instructions.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 47 -
The CPU transfers all set-up and control data to the display. Data is transferred to PDI as 32- bit
words, which in turn writes 8-bit data to the display. The programmable PDI block is configured at the
software build stage, to support either parallel interface such as PPI or serial interface such as SSI or
I2C.
E. Camera Data Interface (CDI) Block
The camera data interface (CDI) block is designed to support a range of still image camera modules.
An 8-bit parallel bus supports data transfer from the camera module to the CDI.
The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the
parallel bus. One byte of data is captured on each rising edge of the pixel clock. CDI allows the pixel
clock to be in the range of 100 kHz to 16 MHz.
The horizontal synchronization line is an input from the camera module and defines one scanline of
image data. The horizontal synchronization line can be programmed to be active high or low. The
vertical synchronization line is an input from the camera module and defines one image frame (image
height) of data. The vertical synchronization line can be programmed to be active high or low.
The frame rate can be adjusted by skipping frames and various interrupts are used to inform the
application CPU regarding the progress of incoming images and potential errors. The normal data
format on the data bus is YUV 4:2:2 (raw binary image data) according to the CCIR-656 standard. A
function within the CDI can be programmed to reorder the YUV parameters as they pass through the
CDI. In addition, the CDI is able to detect the end of an image and perform some truncation as well as
overflow conditions. There is nothing preventing the use of other data types such as JPEG or RGB (as
long as the timing is followed), but only YUV data can be sent to the display.
Camera images can also be sent to a DMA channel to store the image in external memory.
The I2C interface and GPIO are part of the interface to the camera module, but they are not part of the
CDI block. The I2C is used to set-up and control the camera module.
The camera module I2C lines must go high impedance when the supply is removed from the camera.
The I2C commands needed to control the camera, as well as the functional behavior of the module,
are also different for each implementation.
The ON-signal (GPIO) is used to power-on the camera from Standby or Off mode (implementation
dependent). This signal must be held low when the mobile equipment is powered down and during the
mobile equipment reset period. The GPIO pin can also be an input or high impedance during mobile
equipment reset and start. In this case, it must have pull-down to ground.
The camera module reset signal is an output to the camera module.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 48 -
3.2.3 Camera & Camera InterfaceF
19
CI_
D1
G21
F21
CI_
D2
CI_
D3
G20
CI_
D4
H21
G19
CI_
D5
CI_
D6
G22
CI_
D7
H22
F18
CI_
HS
YN
C
CI_
PC
LKF
20E
20C
I_R
ES
_N
E19
CI_
VS
YN
C
CI_
D0
CI_
D4
CI_
D5
CI_
D6
CI_
D7
CI_
PC
LKC
I_V
SY
NC
CI_
HS
YN
C
CI_
D0
CI_
RE
S_n
CI_
D1
CI_
D2
CI_
D3
21PKLCMVKLCPV
01P
21KSVV
ADIV8P
BDIV8N
CDIV9P
01MDDIVEDIV
01N
FDIV9N11N
GDIV11P
HDIVIDIV
21N
JDIV7N8L
KDIVLDIV
31P
MDIV9L
31NNDIV
11MODIVPDIV
9M
FERHV21M
]8[ATAD_MAC_PMM
KLCP_MAC_PMM
]6[ATAD_MAC_PMM
]4[ATAD_MAC_PMM
]2[ATAD_MAC_PMM
]11[ATAD_MAC_PMM]01[ATAD_MAC_PMM
CNYSH_MAC_PMMCNYSV_MAC_PMM
]9[ATAD_MAC_PMM
]7[ATAD_MAC_PMM
]5[ATAD_MAC_PMM
]3[ATAD_MAC_PMM
KLCM_MAC_PMM
]0[ATAD_MAC_PMM]1[ATAD_MAC_PMM
Figure 3-2-2. Camera Interface (DB3150 and Zoran)
ECAFRETNI AREMAC M5
hgiH evitcA
01507R
3060
C71
1
3060p01
FB
7001B_TUONI
9
82B_TUONI
3B_TUONI7
64B_TUONI
RF001R070E48101EVCI
5G
110
G2
11A_TUONI
2A_TUONI2
33A_TUONI
44A_TUONI
CA
M_V
DD
_1.8
V
007LF
607CIND
VA
700
ICV
L051
8100
Y50
0FR
p01
C70
8
3060
VA
701
306001707R
ICV
L051
8100
Y50
0FR
01607R3060
3060
01407R
3060
C70
9
p01
G1
5
G2
10
1A_TUONI1
22A_TUONI
33A_TUONI
4A_TUONI4
91B_TUONI
2B_TUONI8
73B_TUONI
4B_TUONI6
u1.0207C
207LFRF001R070E48101EVCI
V8.2_FA_DDV_MAC
3060
33207R
IND507C
VA
702
ICV
L051
8100
Y50
0FR
407C
3
0313233343
456789
3060u1.0
5161
817191
2
02122232425262728292
107NC1
0111213141
u1307C 007C
u01
707Cu1.0
CA
M_A
VD
D_2
.8V
3060
01307R
3A_TUONI
4A_TUONI4
91B_TUONI
82B_TUONI
3B_TUONI7
64B_TUONI
RF001R070E48101EVCI107LF
G1
510G
2
11A_TUONI
2A_TUONI2
3
u1.03060
107C
p01 3060
C71
0
CNYSH_MAC_PMMCNYSV_MAC_PMM
ADS_C2I_PMM
KLCM_MAC_PMM
]0[ATAD_MAC_M5]1[ATAD_MAC_M5]2[ATAD_MAC_M5]3[ATAD_MAC_M5
]4[ATAD_MAC_M5]5[ATAD_MAC_M5]6[ATAD_MAC_M5]7[ATAD_MAC_M5
]9[ATAD_MAC_PMM]8[ATAD_MAC_PMM
]0[ATAD_MAC_PMM]1[ATAD_MAC_PMM]2[ATAD_MAC_PMM]3[ATAD_MAC_PMM
]4[ATAD_MAC_PMM]5[ATAD_MAC_PMM]6[ATAD_MAC_PMM]7[ATAD_MAC_PMM
KLCP_MAC_PMM
]8[ATAD_MAC_M5
]1[ATAD_MAC_M5
]3[ATAD_MAC_M5
]5[ATAD_MAC_M5
]7[ATAD_MAC_M5
]0[ATAD_MAC_M5
]2[ATAD_MAC_M5
]4[ATAD_MAC_M5
]6[ATAD_MAC_M5
]11[ATAD_MAC_PMM]01[ATAD_MAC_PMM
]11[ATAD_MAC_M5]01[ATAD_MAC_M5
LCS_C2I_PMM
]9[ATAD_MAC_M5]8[ATAD_MAC_M5
NDWP_MAC_PMM
N_TESER_MAC_PMM
]11[ATAD_MAC_M5]01[ATAD_MAC_M5]9[ATAD_MAC_M5
Figure 3-2-3. 5M Camera Connector(34Pin - Main Board)
VGA Camera 5 Mega Camera
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 49 -
1059100YBNE
G741027KXA
6001C
u1.0
u1.0
201C
4G3G
V8.2_DDV_AGV
5161718191202
3456789
2G1G 401NC1
1101213141
301Cu1.0
2D_IC
5D_IC
V8.1_DDV_AGV
CNYSH_IC
n_SER_IC
CNYSV_IC
6D_IC7D_IC
ADS_C2I_PPALCS_C2I_PPA
3D_IC
1D_IC
4D_IC
FFO_OI_CV_12PG_CCA0KLCSYS
KLCP_IC0D_IC
Figure 3-2-5. VGA LCD FPCB Connector
The 5M Camera modules are connected to 34-pin main board and VGA Camera module is connected
to LCD FPCB with 20-pin Board to Board through 70 pin Board to Board connector.
VGA interface is dedicated camera interface port in DB3150, but 5 Mega camera is connected to
MMIC (Multi-media IC).
5 mega camera supply 24MHz master clock to camera module and receive 80MHz pixel clock(30fps),
vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module. The
camera module is controlled by I2C port.
VGA camera port supply 24MHz master clock to camera module and receive 32.2MHz pixel
clock(15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera
module. The camera module is controlled by I2C port.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 50 -
Pin Symbol Symbol Pin
1 MMP_CAM_MCLK CAM_AVDD_2.8V 34
2 GND GND 33
3 MMP_CAM_PCLK CAM_VDD_1.8V 32
4 GND CAM_VDD_1.8V 31
5 5M_CAM_DATA[0] GND 30
6 5M_CAM_DATA[1] MMP_CAM_RESET_N 29
7 5M_CAM_DATA[2] GND 28
8 5M_CAM_DATA[3] MMP_I2C_SDA 27
9 5M_CAM_DATA[4] MMP_I2C_SCL 26
10 5M_CAM_DATA[5] GND 25
11 5M_CAM_DATA[6] MMP_CAM_VSYNC 24
12 5M_CAM_DATA[7] MMP_CAM_HSYNC 23
13 5M_CAM_DATA[8] GND 22
14 5M_CAM_DATA[9] MMP_CAM_PWDN 21
15 5M_CAM_DATA[10] GND 20
16 5M_CAM_DATA[11] CAM_VDD_AF_2.8V 19
17 GND GND 1 8
Table 3-2-1. Interface between Main board and 5M camera
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 51 -
Pin Symbol Symbol Pin
1 ACC_GP21_VC_IO_OFF VGA_VDD_2.8V 20
2 SYSCLK0 VGA_VDD_1.8V 19
3 GND CI_RES_n 18
4 CI_PCLK APP_I2C_SCL 17
5 CI_D0 APP_I2C_SDA 16
6 CI_D1 VGA_VDD_1.8V 15
7 CI_D2 CI_HSYNC 14
8 CI_D3 CI_VSYNC 13
9 CI_D4 CI_D7 12
10 CI_D5 CI_D6 11
Table 3-2-2. Interface between VGA Camera Module
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 52 -
3.2.4 Camera Regulator
MMP_CAM_PWR_EN enables 1.8V & 2.8V Camera Regulator for 5M Camera.
(2.8V for analog and AF, 1.8V for I/O, 1.5V for digital)
SUB PMIC gives power to VGA camera.
It controlled by I2C (VGA : 2.8V for analog, 1.8V for I/O, digital)
REWOP AREMAC M5
1uC
724
NIV1
1TUOV87
2TUOV
WQPGM-1109TR
21NE2NE
35
DNG1CN4
2CN6
PG
ND
9
307U
6EC
1DNG2
2DNG5
CN4
1TUOVDDV
3
TABV
F-RT-D182D4111R207U
C72
21u
V8.1_DDV_MACV8.2_FA_DDV_MAC V8.2_DDVA_MAC
1uC
723
TABV
C72
1
1u 1u
NE_RWP_MAC_PMM
C72
0
NE_RWP_MAC_PMM
Figure 3-2-6. 1.8V and 2.8V Camera Regulator
R93
0
0
03-SC125BR 539R0
129C
u1
u1029C
239R0V8.2_DDV_AGV0
439R03-SC125BR
u2.2519C
819C
DN
I
R94
2
u1
u1719C
229C
u1
V8.1_DDV_AGV519PT
339R0
919C
TABV
u1.0
139R0
8V1_EDDV
C91
610
u
SAIBS5F
5DLCS
4DADS
5EDNGS
SNESS3F
A1
T1
A6
T2
T3
F6
F1
T4
4F1TABV
PCTABV5B
ODLTABV1E
6EOIV
4BTUOV
NIMWPW1D
N3C4A
P3C5A
3ADNGPC
TNCHSALF3D
1CG4E3E
2CG
O1ODL2F
O2ODL2E
2D1DEL
2C2DEL3DEL
1C
4DEL1B
5DEL2B2A
LFDEL
3BDNGDEL
BTESER4C
LUG5906DB
309UN1C
6D5C
P1C
6CN2CP2C
6B
BTESER_MP_BUS
2DELW3DELW4DELW5DELW
SNES
MWP_DCL
LCS_MP_BUSADS_MP_BUS
1NIAG
SAIBS
1DELW
2NIAG
RWP_DELW
Figure 3-2-7. VGA Camera LDO in SUB PMIC
VGA Camera POWER
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 53 -
3.2.5 Display & LCD FPC Interface
LCD module include device in table 3-2
LCD Module is connected to multi Key PCB with 37-pin Connector in sub PCB.
The LCD is controlled by 8-bit PDI(Parallel Data Interface) in DB3150.
ODL DCL
109Cu1.0
ICV
N05
05X
150F
RV
A90
5
K15409R
4.7K
R90
2
0.1u
C90
8
009Cu1.0
6373
45
67
89
1222
3242
5262
7282
92
3
0313
2333
4353
1
0111
2131
4151
6171
8191
2
02
009NC
VA
906
ICV
N05
05X
150F
R
8V1_EDDV
V6.2_DCL_DDV
DI_DCL_21PG_PPA
TUO_N_TESER_DCL
TUO_]1[ATAD_DCLTUO_]0[ATAD_DCL
5DELW4DELW3DELW2DELW1DELWRWP_DELW
CNYSV_DCLN_DR_DCLTUO_N_EW_DCLTUO_N_SDA_DCLTUO_N_SC_DCL
TUO_]7[ATAD_DCL
MWP_DCL
TUO_]6[ATAD_DCLTUO_]5[ATAD_DCLTUO_]4[ATAD_DCLTUO_]3[ATAD_DCLTUO_]2[ATAD_DCL
Table 3-2-4. LCD module Connector
Table 3-2-3. Device in LCD Module
Type Device
Main LCD 240 x RGB x 320 262K Color TFT LCD
Main LCD Backlight 5 White LEDs
3.2.6 LCD Module Block diagram
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 54 -
Figure 3-2-9. LCD Module Block diagram
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 55 -
3.2.7 LCD Backlight Illumination
There are 5 white LEDs in LCD Backlight circuit which is driven SUB PMIC(BD6095).I2C is used for
Backlight brightness control.
3.2.8 Keypad Illumination
There are 2 WHITE LEDs in Main board backlight circuit, which are driven by LEDC port in ABB
(Veronica) and light guide is used for luminance Uniformity
THGILKCAB DCL
R93
0
0
03-SC125BR 539R0
129C
u1
u1029C
239R0V8.2_DDV_AGV0
439R03-SC125BR
u2.2519C
819C
DN
I
R94
2
u1
u1719C
229C
u1
V8.1_DDV_AGV519PT
339R0
919C
TABV
u1.0
139R0
8V1_EDDV
C91
610
u
SAIBS5F
5DLCS
4DADS
5EDNGS
SNESS3F
A1
T1
A6
T2
T3
F6
F1
T4
4F1TABV
PCTABV5B
ODLTABV1E
6EOIV
4BTUOV
NIMWPW1D
N3C4A
P3C5A
3ADNGPC
TNCHSALF3D
1CG4E3E
2CG
O1ODL2F
O2ODL2E
2D1DEL
2C2DEL3DEL
1C
4DEL1B
5DEL2B2A
LFDEL
3BDNGDEL
BTESER4C
LUG5906DB
309UN1C
6D5C
P1C
6CN2CP2C
6B
BTESER_MP_BUS
2DELW3DELW4DELW5DELW
SNES
MWP_DCL
LCS_MP_BUSADS_MP_BUS
1NIAG
SAIBS
1DELW
2NIAG
RWP_DELW
Figure 3-2-10. SUB PMIC Circuit LCD Backlight
201R
mho001
VB
AT
mho001
101R
RS
B6.
8CS
T2R
ZD
101
ZD
102
RS
B6.
8CS
T2R
1
A
2
C
101DL
7001STWS-CSS
1
A
2
C
7001STWS-CSS
201DL2DEL_YEK
1DEL_YEK
Figure 3-2-11. Keypad Backlight LED Interface and Backlight Circuit
3.2.9 Three-axis-accelerometer
The SMB380 is a triaxial low-g acceleration sensor IC with digital output for motion applications. It
allows measurements of acceleration in perpendicular axes as well as absolute temperature
measurement. If Motion is detected, then interrupt is issued to CPU and CPU read its motion value by
I2C(SMB_SDA,SMB_SCL) interface.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 56 -
R91
2
390
DNG34
TNI
1CN011
2CN
11N
OT
1N
OT
212
KCS6
8IDS
7ODS
2OIDDVDDV
9
051AMB109U
BSC5
57V2_BMS_HDDV
n22509C
0
R91
1
DN
I
R91
0
R90
9D
NI
409Cu1.0
8V1_EDDV
ADS_BMSTNI_SIXA3_70PG_PPA
LCS_BMS
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 57 -
3.3 Audio Part
3.3.1 Audio Part Block Diagram
3.3.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmit it to DBB Chip (Asta).
This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip.
The downlink path amplifies the signal from DBB chip (Asta) and outputs it to Receiver (or Speaker).
The audio interface consists of PCM encoding and decoding circuitry, microphone amplifiers and
earphone drivers.
The PCM encoder and decoder blocks are two-channel, 16-bit circuits with programmable gain
amplifiers (PGA).
The decoder has a receive volume control. The audio inputs and outputs can be switched to normal or
auxiliary ports.
Figure 3-3-1. Audio Part Block Diagram
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 58 -
Figure 3-3-2. Audio Interface Detailed Diagram(Veronica)
saiV elpitluM esU
enalP dnuorG lacoL
.pmA rekaepS
BA ot esolC
%1
%1
%1
V01
%1
%1
%1
n74135C
51915R
SSAPYB1C
DNG2B
2C+NI
3C-NI
3ADDV
+OV3B
-OV1A1B
NWODTUHS_
RVQZ1A5026APT005U
415Cu01
3060u1.0815C
u1325C
220n
C53
6
u1.0515C
3060
0
705R
3060
3060
205PT
K01125R
K93715R
47K
R52
5
3060
n74425C
505PT405PT305PT
u1225C
805PT
905PT
22p
C53
0
5A2
20B2
31B2
DNG4
1S7
2S6
CCV9
XMUT8622ASF105U
A1801
0B1
11B1
n01535C
3060
025Cu1
615Cu01
TABV
51815R22p
C52
7
TABV
R52
210
0K
3060
C52
822
p
22p
C52
9
u2.2525C
3060 K01025R
K93425R
n74235C
TSOOB_V3B
1SW3D
2SW3C
TSOOBSSV
KCUBSSV1B
5E
2ODS
KLCMIS5H
TADMIS2H
N_TSRMIS2J
CCVMIS1F
NRKPS3M2M
PRKPS
4ATSOOBWS
RDIM
SAIBP1D
1KCS4D
4E2KCS
1IDS2C
2D2IDS
1ODS1C
4F
01L1NIENIL
01K2NIENIL
N1CIM8J8K
P1CIM
N2CIM9M
P2CIM8L
N3CIM8H
01MP3CIM
9LN4CIM
9KP4CIM
5L
3CED5J4J
4CED
6K
2OXUA6M
6JNRAEBPRAEB
4M
5D+BF_TSOOB
5B+ESNESI_TSOOB
5C-ESNESI_TSOOB
4C1WS_TSOOB
4B2WS_TSOOB
3A3WS_TSOOB
7M1OCC2OCC
7K
1OXUA
D50
2
RB
521S
-30
R_RAEL_RAE
P1CIMN1CIM
CCVMIS
N2CIMP2CIM
NRAEB
NE_WS_PMA_72PG_CCA
NE_PMA_KPS_31PG_CCA
PRKPS
NRKPS
RDIM
SW_0S2I
SW_1S2I
+VCR_KPS
-VCR_KPS
PRAEB
DLU_1S2I
DLD_0S2I
DLD_1S2I
KLCMIS
TADMIS
n_TSRMIS
NRKPSPRKPS
PR_MF
PL_MF
KLC_0S2I
KLC_1S2I
DLU_0S2I
NRAEBPRAEB
1OCC2OCC
Figure 3-3-3 . Audio Section scheme
%1
%1
PU
LL-U
P R
EM
OV
ED
200
7.10
.01
306BF
IND
888R
u1.0016C
3060
006BF
K2.2
818R
u1u2.2918C
818CEC6
21DNG
52DNG
4CN
DDV31
TUOV
u1.0
D181D4111R308U
3060
906C
106BF
74618R
506BF
074016R
406BF
074216R
74718Ru001416C
K74
706R
806C
3060n01
21CN
33CN2CN
67
4CN1TUO
8
52TUO
PG
ND
9
NM4112FUN106LF
1NI1
2NI4
u001316C
2OCC
P2CIM
KOOH
RDIM
TUO_VT
L_RAE
R_RAE
N2CIM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 59 -
3.3.3 Audio Mode
Audio Mode includes three states.( Voice call, Midi.MP3).
Each states is sorted by the total 7 Modes according to external Devices (Receiver,Loud
Speaker,Headset).
Video Telephony Mode Operate on state of the WCDMA CALL.
Voice ca ll
MIDI
MP3
Receiver Mode
Loud Sp eaker Mode
Headset Mod e
Video Telephony Mode
Only Loud Speaker
Loud Speaker Mode
Headset Mode
ModeVeron ica In /Out Port
OUTIN
MIC1P/MIC1N BEARP/BEARN
SPKRP/SPKRN
AUXO1/AUXO2
AUXO1/AUXO2
MIC1P/MIC1N
MIC1P/MIC1N
MIC2P/MIC2N
SPKRP/SPKRN
SPKRP/SPKRN
SPKR/SPKN
Table 3-3-1. Audio Mode
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.3.4 Voice Call
A. Voice call Downlink Mode(Receiver, Speaker, Headset)
This section provides a detailed description of the Voice Call RX functions.
The voice decoder accepts a serial input stream of linear PCM coded speech. The receive bandpass
filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA
enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in
the RX path. The final step in the receive path is the auxiliary output. The auxiliary audio amplifier is
intended to drive low impedance headphones. The earphone amplifier and the auxiliary audio outputs
can be powered down (muted) via I2C. Both the earphone driver and one of the auxiliary drivers can
simultaneously provide an output signal during voice decoding.
• Receiver Mode : BEARP/N Port → Receiver(32Ω)
• Loud Speaker / Video Telephony Mode : Veronica SPK Amp → SPKR/N → AUDIO AMP(TPA6205)
→ Speaker(8Ω)
• Headset Mode : Auxiliary audio amplifier → AUXO1/2 → AUDIO AMP(TPA4411) → Head Phone
3. TECHNICAL BRIEF
- 60 -
Figure 3-3-4. Voice call Downlink Scheme
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 61 -
B. Voice Call Uplink Mode (Receiver,Speaker,Headset)
This section provides a detailed description of the Voice Call TX functions.
From the audio path view point, voice call has the same structure as video telephony. The TXMIX
connection enables insertion of audio into the uplink audio path. This can, for example, be used to play
dictation recordings for the listener at the other party, in a voice call or video telephony call. The
connection to TXMIX from the Audio Mixer must be performed in 8 kHz mono, since this is supported
by the Voice mode. Due to performance reasons it may not be possible to decode every audio format
during video telephony.
Each Voice Uplink Mode paths shown below.
• Receiver Mode : C-MIC(SP0102BE3) → Veronica Input(MIC1N/1P)
• Loud Speaker Mode : C-MIC(SP0102BE3) → Veronica Input(MIC1N/1P)
• Video Telephony Mode : C-MIC(SP0102BE3) → Veronica Input(MIC1N/1P)
• Headset Mode : Headset MIC → Veronica Input(AUXI1N/1P)
When the headset is inserted, EAR_DETECT_n(Circuit Diagram net Name) converted into low state
So, the headset icon is displayed on Main LCD.
Figure 3-3-5. Voice call Uplink Scheme
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.3.5 MIDI (Ring Tone Play)
This section provides a detailed description of the MIDI and WAV-file functions.
In Figure 2-4-6, External MIDI path is the same as Voice Loudspeaker downlink Mode, except source
in Asta (DSP and Audio Mixer).
MIDI : Asta → PCM Decoder → Auxiliary audio amplifier → SPKRP/N Port → AUDIO AMP(TPA6205)
→ Speaker(8Ω)
3. TECHNICAL BRIEF
- 62 -
Figure 3-3-6. External MIDI path
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 63 -
3.3.6 MP3 (Audio Player)
This section provides a detailed description of the MP3 file functions.
MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used
as a audio amp and one speaker.
Figure 3-3-7. MP3 Scheme
- 64 -
3. TECHNICAL BRIEF
3.3.7 Video Telephony
This section provides a description of the Video Telephony functions.
Video Telephony Mode has same paths with Loud Speaker Mode.
3.3.8 Audio Main Component
There are 4 components in KF750 schematic Diagram. Part Number marked on KF750 Schematic
Diagram.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-3-8. Video Telephony Scheme
I - soundSGEY0005527 Ear-Jack SET4
TITPA6205A/TPA4411Audio AMP3
SisonicSP0102BE3MIC2
BRS201417SL08-P Speaker/Receiver1
MAKERPART NUMBERITEMNO
Table 3-3-2. Audio Component List
- 65 -
3. TECHNICAL BRIEF
3.4 GPADC(General Purpose ADC) and AUTOADC2
The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the
MUX and converted in the ADC.
The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without
software intervention. The AUTOADC2 periodically measures the battery voltage or current. (Fig.3-4-
1) shows the schematic of GPADC part. The GPADC channel spec is as following (Table 3-4-1).
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Fig 3-4-1. Schematic of GPADC and AUTOADC2
Fig 3-4-2. GPADC and AUTOADC2 Block diagram
ADC 6 channels
Resource Name Description
GPA0 RTEMP Radio temperature sense
GPA2 VLOOP Loop voltage sense
GPA3 WPOWERSENSE Reference voltage for PAM
GPA4 WRFLOOP Lock inform
GPA6 GPA6 Headset detect
GPA7 VBACKUP Backup battery
Table 3-4-1. GPADC channel spec
- 66 -
3. TECHNICAL BRIEF
3.5 Charger control
A programmable charger in AB3000 is used for battery charging. It is possible to set limits for the
output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-.
The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the
GPADC. Instead, the two measuring amplifiers translate these inputs to a voltage proportional to the
input and within the range of the GPADC. (Fig.3-5-1) shows the schematic of charging control part.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Name Type Unused Description
CHSENSE+ Analog VBAT Current sensing input positive
CHSENSE- Analog VBAT Current sensing input negative
W4/1
W4/1
DNG_TTAB
BA ot esolC
%12102
dnuorg enohPhtap nruter
riap laitnereffid a sa etuor3 niP ot esolC
Clo
se to
Pin
1
.nnoC yrettaB
2102%1
riap laitnereffid a sa etuor
915Cp74
0805R3060
1.0315R
TABV
p42315C
K74415R
0115R3060
105QJD119AIS
1D
2D
3D
4D
1G
2G
1S
2S
G1
G2
1 2 3
CN
500
0215R
905R
p42215C
520.0
300K
R50
6
33u
C51
7
21
005X
zHK867.23
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
TABV
21K1LATX2LATX
11K
D_TABV1H
SUBV1J
01GN_FFOMIS
2KN_TSRS
KLCS3J3K
TADS
3F
21G+ESNESGF
11G-ESNESGF
ATADB4H
GERHC2E
1E+ESNESHC
2F-ESNESHC
OICD
21JZHK23
105PT
A_NICDNICD
n_TSRS
SUBV
KLCSTADS
KLCCTR
Fig. 3-5-1. Battery charging circuit Fig. 3-5-2. Battery charging block diagram
Table 3-5-1. Charger Control channel spec
- 67 -
3. TECHNICAL BRIEF
3.5.1 Fuel Gauge
AB3000 supports the measurement of the current consumption/charging current in the U8100 with a
fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel
gauge block is used to determine the remaining battery capacity.
The function of the fuel gauge block is schematically described in (Fig.3-5-3). A sense resistor
R_FGSENSE is connected in series with the battery. The voltage across the resistor, equivalent to the
current entering/leaving the battery, is integrated using an ADC block.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Fig. 3-5-3. The analog front-end of the fuel gauge block
Fig. 3-5-4 The Schematic of the fuel gauge block
Name Type Unused Description
FGSENSE+ Analog VBAT Fuel gauge current sensing input positive
FGSENSE- Analog VBAT Fuel gauge current sensing input negative
Table 3-5-2. Fuel Gauge channel spec
- 68 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.5.2 Battery Temperature Measurement
The BDATA node, the constant current source, feed the battery data output while monitoring the
voltage at the battery data node with GPADC. This battery data is converted to the battery
temperature. (Fig.3-5-5) shows the schematic of battery temperature measurement part.
Clo
se to
Pin
1
p42315C
p42215C
300K
R50
6
21
005X
zHK867.23
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
21K1LATX2LATX
11K
01GN_FFOMIS
2KN_TSRS
KLCS3J3K
TADS
ATADB4H
21JZHK23
105PT
n_TSRSKLCSTADS
KLCCTR
Fig 3-5-5. Battery Temperature Measurement
Name Type Unused Description
BDATA Digital Input/Output Unconnected current output
Table 3-5-3 BDATA channel spec
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 69 -
3.5.3 Charging Part
The charging block in AB3000 processes the charging operation by using VBAT voltage. It is enabled
or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are
activated and deactivated depending on the level of VBAT. (Fig.3-5-6) shows the schematic of
charging part.
When VBAT is below a certain value, 3.2V, a current generator take care of initial charging of the
CHSENSE+ node and internal trickle charge signal is active. This part of the charging block is
powered on and active when DCIO is asserted. The DCIO signal is asserted when its voltage is above
the voltage at VBAT. As soon as generator is turned off and all parts of the charging block are
functional and active. Battery block indication as shown in (Fig.3-5-7)
W4/1
W4/1
DNG_TTAB
BA ot esolChtap nruter
2102%1
riap laitnereffid a sa etuor1.0315R
TABV
K74415R
0115R3060
105QJD119AIS
1D
2D
3D
4D
1G
2G
1S
2S
0215R
520.0
C
D_TABV1H
SUBV1J
3F
11G-ESNESGF
GERHC2E
1E+ESNESHC
2F-ESNESHC
OICD
A_NICDNICD
SUBV
Fig. 3-5-6. Charging Part
4.2 ~3.88 (V) 3.87 ~3.81 (V) 3.80 ~3.74 (V) 3.73 ~3.59 (V) 3.58 ~3.20 (V)100~66 (%) 65~44 (%) 43~25 (%) 24~3 (%) 2~0 (%)
Fig. 3-5-7 Battery Block Indication
- 70 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Trickle charging
When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge
signal is active. The charging current is set to 50mA.
Normal charging
When the VBAT voltage is within limits or the internal regulators are turned on, the current source for
trickle charging is turned off and all parts of the charging block are active. The charging method is
‘CCCV’. (Constant Current Constant Voltage)
This charging method is used for Lithium chemistry battery packs. The CCCV method regulates the
charge current and the VBAT voltage. This charging method prevents the battery voltage to go above
the charge set in the CCCV algorithm. (Fig.3-5-8) shows the charging voltage(a) and charging current
change(b).
Parameter Min Typ Max Unit
Trickle current 30 50 60 mA
Table. 3-5-4. Trickle charging spec
Fig 3-5-5. Battery Temperature Measurement
(a) Charging voltage
(b) Charging current
- 71 -
3. TECHNICAL BRIEF
• Charging Method : CCCV (Constant Current Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 700mA
• Nominal Battery Capacity : 860 mAh
• Charger Voltage : 4.8V
• Charging time : Max 3.5h
• Full charge indication current (icon stop current) : 80mA
• Low battery POP UP : Idle - 3.52V, Dedicated - 3.48V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1 min
• Cut-off voltage : WCDMA call - 3.1V, ELSE - 3.2V
Charging of Extended Temperature
When the battery temperature is outside the normal charging specification, the battery voltage, VBAT,
is maintained at 3.7V.
• Under 0 °C : Extended temperature
From 0 °C to 45 °C : Normal charging temperature
Over 45 °C : Extended temperature
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 72 -
3. TECHNICAL BRIEF
3.6 Voltage Regulation
The LDO regulators and the BUCK converter generate a range of programmable voltages, each
optimized for its load. When the analog baseband controller boots up or down, internal signals activate
or deactivate the LDO regulators and the BUCK converter. In active mode, the LDO regulators and the
BUCK converter are activated and deactivated through I2C. The low power regulator is on all the time
and has extremely low power consumption with limited output current. It provides power for the 32 kHz
oscillator and the real-time clock (RTC).
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LDO Net Name Output Voltage Output Current Usage
ABB_LDO a (VDD_A) VRADA_2V8 2.8V 150mA RF3000 and RF3100 analog
ABB_LDO c (VDD_C) VDDC_2V65 2.65V 200mA Hall Switch, Audio Amp
ABB_LDO d (VDD_D) VDDD_1V5 1.5V 200mA AB3000 CODECs/ ADC/ PLL
VDIGRAD_1V8 1.8V 200mA RF3000 and RF3100 digital
VDDE_1V8 1.8V 200mA All I/ O Supplies and Memory
ABB_LDO f (VDD_F) VDDF_2V5 2.5V 30mA DB3150 Analog
ABB_LDO g (VDD_G) VDDG_2V75 2.75V 100mA SD card and LCD
ABB_LDO h (VDD_H) VDDH_SMB_2V75 2.75V 100mA 3 Axis Accelerator
ABB_LDO k (VDD_K) VDDK_2V75 2.75V 200mA Bluetooth
ABB_LDO LP (VDDLP) VBACKUP 1.5V 6.5mA RTC module
ABB_BUCK (VBUCK) VCORE 1.2V 600mA DB3150 Core
ABB_SIM LDO (SIMVCC) SIMVCC 2.85V 50mA SIM card
ABB_LDO e (VDD_E)
Table. 3-6-1. LDO and Buck
- 73 -
3. TECHNICAL BRIEF
3.7 RF Technical Description
3.7.1 General Description
The RF platform of KF750 supports two different communication modes (WCDMA/GSM modes)
including four communication bands (WCDMA2100/GSM900/GSM1800/GSM1900). The all the RF
blocks can be divided into three main parts, which are a WCDMA part, a GSM, and a RF front-end.
Different from other general solutions, the RF front-end of KF750 consists of an antenna switch and an
EDGE power amplifier module (PAM).
The simplified block diagram is shown in Figure 3-7-1.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-1. Block diagram of RF part
- 74 -
3. TECHNICAL BRIEF
3.7.2 WCDMA Part
The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces, that is an
IQ-interface, both in the receiver and transmitter information path. The transceiver has the following
general features:• Power class : Power class 3 (+24dBm) in Band I• Zero-IF Receiver.No IF filter needed• Direct IQ modulation transmitter
A. Transmitter Part
The W-CDMA transmitter architecture is an on frequency linear direct up-conversion IQ-modulator.
The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to RF output
frequency and is designed to achieve LO and image suppression. The in-phase and quadraturephase
reconstruction filters are fully integrated and a programmable gain amplifier implements the gain
control. The transmit output stage provides at least +5 dBm at maximum power control at the single-
ended 50 Ω output. Gain is set through the 3-wire bus. An external SAW filter between the WCDMA
circuit and the power amplifier is used to improve noise performance. Two 10-bit DACs are used to
control the DC/DC converter and the PA gain. After the power amplifier, the signal is sent through an
isolator and through the duplex filter, which directs the transmit signal to the antenna connector
through the antenna switch. The supply voltage and bias of the power amplifier are adapted depending
on the output power to achieve high efficiency at every transmitter power level. A high efficiency
DC/DC converter regulates the supply voltage and the bias operation point is controlled by a D/A-
converter in the W-CDMA radio circuit.
These DACs are controlled through the 3-wire-bus
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-2. WCDMA RF structure
- 75 -
3. TECHNICAL BRIEF
B. Receiver Part
The W-CDMA receiver architecture is a direct down-conversion Zero Intermediate Frequency (ZIF)
receiver with integrated low-pass channel filter, i.e. the front-end receiver converts the aerial RF signal
from W-CMDA band I down to a ZIF. The first stage consists of one single-ended low noise amplifier
(LNA) with a 16 dB gain step. This LNA is followed through an external filter by an IQ down-mixer
which consists of a mixer in parallel driven by quadrature out-of-phase LO signals. The In phase (I)
and Quadrature phase (Q) ZIF signal are then low pass filtered to provide protection from high
frequency offset interferer fed into the channel filter.
The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter with a
provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6 pole, 2 zero filter
with a cut-off frequency around 2.15 MHz and a second order group delay compensation (2 poles, 2
zeroes). Once filtered, the zero IF I and Q signals are further amplified with provision of 31 x 1 dB
steps and DC offset compensation.
The zero IF output buffer provides close rail-to-rail outputs signal.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-3. WCDMA Transceiver Architecture
- 76 -
3. TECHNICAL BRIEF
C. Synthesizer
The RX and TX RF VCOs are fully integrated and self-calibrated on manufacturing tolerances.
They have 16 different frequency ranges that are selected internally depending on the frequency
programming. The calibration is done on each low to high logical transition of the SYNON bit in the
control register or on each change of the integer divider ratio of the RF fractional N synthesizer.
A high-performance RF fractional-N synthesizer PLL is included on-chip which enables the frequency
of the RF VCO to be synthesized. The frequency is set through the 3-wire serial programming bus.
The PLL is based on Sigma-Delta (∑.) fractional-N synthesis that enables the required channel
frequency, including Automatic Frequency Control (AFC) from a free running external 26 MHz
reference frequency. Very low close-in-phase noise is achieved. This allows widening of the PLL loop
bandwidth and shorter settling time. The programmable main dividers are controlled by a second order
∑-modulus controller. They divide the RF VCO signals down to frequencies of 26 MHz (12 Hz step
programmability). Their phase is then compared in a digital Phase/Frequency Detector (PFD) to the 26
MHz reference clock signal.
The phase error information is fed back to the RF VCO through the charge pump circuit that .sources.
into or .sinks. current from the loop filter capacitor, thus changing the VCO frequency such that the
loop finally gets phase-locked.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
IND222C
Hn7.4402L
IND022C
IND122C
522C
p65
102LF00F0AK59G1BEFAS
21G
52G
33G
NI1
TUO4
p2.8
322C
922C
712C
IND
IND
8V2_ADARV
022
502R
8BIXTAQXT
901
BQXT
41_XT
XROLCCV42
6XTOLCCV
31V
CC
RX
40V
CC
TX
22DDV
VG
AC
TL
11 16N
C4
5CN32
526CN7CN
62
8CN82
9CN03
PG
ND
41
RE
FIN
15
38R
F_D
AC
1R
F_D
AC
239
17R
XIA
18R
XIB
19R
XQ
AR
XQ
B20
12TST
AIXT7
13C
LKD
ATA
12
EN
14
1XTDNG
72NI_1ANL
92TUO_1ANL
35M
IX1_
AM
IX1_
B36
21CN
32N
C10
NC
113334
NC
12
37N
C13
2CN3
3CN5
NH5916MO_0013FR
302U
022
702R
p6.5422C
8V2_ADARV
822CIND
002PT
612C
p65
202PT
812C
p65
5.6n
HL2
03
8V1_DARGIDV
8V2_ADARV
IND722C
402PT
3O
14O
2
00F0AF41G2BEFAS002LF
2G
15G
2
1IN
022
802R
102PT
022
602R
8V2_ADARV
302PT
I_DNAB_DOMXTW
N_Q_XRW
P_Q_XRW
N_I_XRW
P_I_XRW
1_DNAB_XRW
KLC_LRTC_FR
ATAD_LRTC_FR
BRTS_LRTC_FR
KLCW
SAIB_APWCCV_APW
P_I_XTWN_I_XTWP_Q_XTWN_Q_XTW
Figure 3-7-4. WCDMA Transceiver schematic
- 77 -
3. TECHNICAL BRIEF
D. Power Amplifier Module
The SKY77174 Power Amplifier module is a fully matched 10-pad surface mount module developed
for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power
amplifier packs full coverage of the 1920-1980 MHz bandwidth into a single compact package.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-5. SKY77174 Functional Block Diagram
723-B9159G181CDL
TUO_C3
1DNG52
2DNG
NI1
TUO_M6
4ETANIMRET
002N
p22p01602C
402C
312CIND
p65
702C
302Cp0001
Hn2.8202L
AP_CCV
112CIND
502Cp0001
2DNG1DNG
4DNG3DNGTUONI
000BCD59G102SEC002SI
47177YKS002U
ELBANE2
61DNG
2DNG7
3DNG9
DNGP11
4TUO_FRNI_FR
8
5SAIBV
11CCV
012CCV
3LORTNOCV
R20
0
47
TABV
002LHn1
IND902C
IND012C
u10.0002C
ESNES_WOPW
SAIB_APW
NE_1_DNAB_XTW
I_DNAB_DOMXTW 1_DNAB_XTW
Figure 3-7-6. WCDMA PAM schematic
- 78 -
3. TECHNICAL BRIEF
3.7.3 EDGE/GPRS/GSM RF block
The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit
data. The receive interface is based on I and Q data and the transmitter interface is based on envelop
and frequency data. The quad band EDGE/GSM/GPRS transceiver has the following general features:
Power class
GMSK low bands: Class 4 (33 dBm)
GMSK high bands: Class 1 (30 dBm)
8PSK low bands: Class E2 (27 dBm)
8PSK high bands: Class E2 (26 dBm)
Multi slot class 12 (4+4=5)
Dual Transfer Mode (DTM) class 9 (3+2=5)
Zero-IF receiver
• Polar modulation transmitter
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-7. GSM Transceiver Architecture
- 79 -
3. TECHNICAL BRIEF
A. Transmitter Part
Polar modulation transmitter architecture based on the direct phase/frequency modulation/synthesizer
architecture is implemented for GSM, GPRS and EDGE. This architecture has the capability of
generating both the GSM/GPRS constant envelope GMSK modulation and the linear EDGE 8-PSK
modulation in a very cost efficient way. The motivation for a polar modulation transmitter architecture
compared to traditionally linear architectures is to reduce the output noise (thus eliminating the need
for off-chip filters) reduce the power consumption by utilizing non-linear switching analog signal
processing blocks, and to eliminate the need for an RF isolator.
The transmitter block consists of several sub-blocks: A separate block is used to convert the digital bit
streams from the baseband into parallel words to be used in the DACs and the Sigma Delta modulator.
The combined DAC and LP-filter is used to convert the digital words of the digital block into analog
signals. The second FM-path is used to add the high frequency part of the FM to the VCO. It also
includes an auto-tuning block that compensates VCO gain variations.
In the Sigma Delta modulator block, the phase/frequency modulator in this polar modulation
architecture is a sigma-delta controlled fractional-N frequency synthesizer with an additional frequency
insertion point after the loop filter at the input of the VCO. In addition, The TX-buffer is used to drive
the PA with the correct power level. A divide by 2 or 4 block is used to generate the correct output
frequency from the 4 GHz VCO. The phase locked loop has two information inputs:
the divider ratio in the feedback path and a direct path to the VCO. The phase locked loop generates
the radio frequency carrier including the phase modulation information at the desired channel
frequency.
B. Receiver part
Direct down-conversion zero-IF receiver architecture is used for the four EDGE/GSM/GPRS frequency
bands 800, 900, 1800 and 1900 MHz. The complete receiver with four Low Noise Amplifiers (LNAs),
one for each supported band, is integrated on chip. After the down-conversion, the in-phase and
quadrature-phase components are low pass filtered with two anti-alias filters before the signals are fed
to the integrated high dynamic range sigma-delta A/D-converters. The only required external
components are the band selectivity SAW filters in front of the LNAs. One filter is required per
supported frequency band. The digital output signals are sent over a serial interface to the digital base-
band circuit for further processing and detection.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 80 -
3. TECHNICAL BRIEF
C. Synthesizer
The synthesizer contains all the frequency generating blocks in the RF3000 circuit: The reference 26
MHz frequency generation is made in a external crystal oscillator, which is fully integrated in the circuit
(except for the crystal). The digital bus controls the center frequency of the XO. All RFfrequencies are
generated in a single 4GHz VCO, subsequently divided by 2 or 4 to arrive at the final frequency. To
cover the required frequency range, the integrated Voltage Controlled Oscillator (VCO) operates at
twice the frequency for band 1800/1900, and at four times the desired frequency for band 800/900.
The RF-VCO is locked to the XO in a fractional-N PLL consisting of a prescaler, a phase-frequency
detector, a charge-pump, a sigma-delta modulator and a fully integrated loop filter. Automatic trimming
of the VCO center frequency and the RC constant makes sure that the variation of the PLL dynamics
is sufficiently low.
The XO also has an external reference mode where a differential 26 MHz clock reference signal can
be supplied externally at the XoP and XoN pins. A single-ended clock reference buffer MCLK sources
a harmonically controlled square wave reference signal to be used in the baseband. An additional
single-ended clock is generated for use in the W-CDMA circuit. This output is activated by a control
signal in the digital bus.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 81 -
3. TECHNICAL BRIEF
3.7.4 Front-End Module (FEM)
A single antenna is used for all four bands. The antenna switch and the EDGE/GSM/GPRS power
amplifiers are integrated to a single circuit containing:
• Antenna Switch with support for W-CDMA band 1
• Power amplifiers for high and low band EDGE/GSM/GPRS
• AM modulator/control circuit
• Lowpass transmitter filtering
The antenna switch block connects the proper block in the radio system to the antenna connection. In
GSM/GRPS/EDGE systems, transmit and receive operations are divided in time, and the switch
connects the proper block in accordance with the mode of operation (that is, transmit or receive; one at
a time in the GSM, DCS, and PCS bands).
In W-CDMA systems, the transmitter and the receiver operate simultaneously (that is, full duplex).
The switch is used only for selecting the W-CDMA mode of operation . the split between transmit and
receive frequencies is handled by the W-CDMA duplexer.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-8. Front-End Module
- 82 -
3. TECHNICAL BRIEF
A. Front End Part
SKY77519 TX-RX Front End Module (FEM) offers a complete transmit VCO-to-Antenna and Antenna-
to-receive SAW filter solution in a low profile (1.2 mm), compact form factor for handsets comprising
GSM850/900, DCS1800, and PCS1900 operation. The FEM also supports Class 12 General Packet
Radio Service (GPRS) multi-slot operation, Polar EDGE modulation, and provides single UMTS band
(band 1 or band 2) antenna switch-through via a dedicated UMTS port.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-9. SKY77519 Functional Block Diagram
p22701C
801CIND
815-SMK001WS
AC
G1
G2
201Cu01n01
101C
401Cp22
TABV
C10
9D
NI
501Cp22
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
u01301C001C
p22
p22601C
0WSTNA
SCPSCD_XT
MSGE_XT
009XR
0081XR
058XR
1WSTNA
CPAV
0091XR2WSTNA
1_DNAB_FRW
Figure 3-7-10. Front End part schematic
- 83 -
3. TECHNICAL BRIEF
3.7.5 Control Flow
The access side of the digital baseband controller controls the overall radio system. In both
EDGE/GSM/GPRS and W-CDMA air interface mode, the digital baseband controller controls the radio
system through a three-wire serial bus.
The digital baseband controller also manages PA band control and the antenna switch mechanism in
the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE transceiver is turned on
only when required, the digital baseband controller initiates this.
The EDGE/GSM/GPRS RF system requires control, which is temperature dependent. The
temperature within the RF system is estimated by a voltage measurement performed by the analog
baseband controller. The control flow for the RF system is shown in Figure 3-7-11.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-7-11. RF Control Flow
- 84 -
4. TROUBLE SHOOTING
4.1 Power ON Trouble
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
TP(END)
< MULTIKEY PCB >
START
No
Change main board
changemain battery
Yes
Yes
No
No
The voltage of main batteryis higher than 3.2V ?
END key operates well?
ONSWAn(D900) level is low
when END key pressed.
Follow thekeypad Troubleshooting guide
Check the voltage.
VDD_A (C501) 2.75V
VDD_D (C502) 1.5V
VDD_E(C503) 1.8VVDD_F (C508) 2.5VVDD_G (C509) 2.5VVDD_H (C507) 2.75VVDD_K(C510) 2.75V
VDD_LP(C511) 1.5V
SWBUCK(L500) 1.2V
< MAIN PCB >
VDD_AVDD_D
VDD_E
VDD_F
VDD_G
VDD_H
VDD_K VDD_LP
SWBUCK
ON_SW KEY
EV
LC14
S02
050
VA
901
VA
904
EV
LC14
S02
050
EV
LC14
S02
050
VA
903
EV
LC14
S02
050
VDDE_1V8
VA
902
CLR
R90010K
10K R901
END
VA900
ICVS0514X350FR
D900
RB521S-30
OKSEND
ONSWA_n
ONSWA_n
KEYIN5
KEYIN4
KEYOUT2
KEYOUT1
KEYOUT2KEYOUT1
KEYIN4KEYIN5
205Cu1u1
105C
905Cu1u1
015C705Cu1u1
605Cu1
805C
u2.2305C
Fn33115C
11AC_DDV
21FD_DDVE_DDV
21D
9AF_DDVG_DDV
7A
21BH_DDV
K_DDV21M
11JPLDDV
21CA_DDVODLTXE
11B
TP01_BB(END)
TP01_BB(END)
TP01_BB(END)
VDD_A
VDD_D
VDD_E
VDD_FVDD_G
VDD_H
- 85 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.2 USB Trouble
START(Measure during the state of
USB module running)
Input power(R619) is 5V?No
Change main board
Check host USB portor USB cable
Yes
NoResolder or check the VBAT line
Yes
ACC_GP20_USB_CS_PD(R603) is 1.8V?No
Resolder or change U601
Yes
VBAT power(C601 or C600) is same to battery?
V01
1%
deepS hgiH rof reviecsnarT BSU
0.1u
C60
4 3060
TABV
u7.4106C
R60
351
K
R60
612
K
0.1u
C60
3
4.7u
3060
C60
2
8V1_EDDV
3060u1.0006C
4.7u
C60
6
K1506R
0.1u
3060
C60
5
6D
TSET4C
4FSUBV
VC
CF
3
5B1OI_CCV2OI_CCV
2B
5F1LATX2LATX
6F
7ATAD
5ERID
MD1C1D
PDTLUAF
2E
GN
D1
C5
D2
GN
D2
GN
D3
E4
3DDI
NC
1F
1F
2N
C2
5DN_WSPTXN
4D
6E8V1FER
3E3V3GER
2CFERR
PTS
0GFC1E
4B1GFC2GFC
3B
LES_PIHC3C4A
KCOLC0ATAD
1B1A
1ATAD2ATAD
2A3A
3ATAD4ATAD
5A6A
5ATAD6ATAD
6B6C
TEA8051PSI106U
2.2u
C60
7
TXN_BSU_50PG_CCAPTS_BSU_00PG_CCA
1LATX_BSU
MD_BSU
XRT_BSU_SUBV
PD_BSU
DP_SC_BSU_02PG_CCAKLC_BSU_40PG_CCA
0TAD_BSU1TAD_BSU2TAD_BSU3TAD_BSU_22PG_CCA4TAD_BSU_60PG_CCA5TAD_BSU_70PG_CCA6TAD_BSU_01PG_CCA7TAD_BSU_11PG_CCA
RID_BSU_10PG_CCA
V2.4+_TABV
XR_TRAU
HSALFPPVV5+_GHCV
n_BWSNO
DNG
CDA_TMR/MD_BSUn_TCETED_RAE
V2.4+_TABV
TNI_TMR/PD_BSU
XT_TRAU
V5+_GHCV
REWOP_BSU
206BFV
A60
3
ULC
E05
05C
015F
R
789011121314151617181
02
CP52-40S81-JESH
ULC
E05
05C
015F
R
VA
602
C62
022
p
u10.0426C
C62
222
p
326Cu1
RS
B6.
8CS
T2R
ZD
600
R62
2
DN
I
106PT526R
0
0
916R
VA
601
ULC
E05
05C
015F
R
22p
C62
1
916Cu2.2
8ETAG
TUO_ETAG9
2DNG
1NI1
2NI4
53NI
1CN1121
2CN
61TUO
2TUO7
01NE_
GALF_3
306UG2RTM843PCN
DN
I
R62
3
L31BFSU006D
TABV
R62
4
0
XRT_BSU_SUBV
A_NICD
SUBV
XR_TRAU_CCA_PPAXT_TRAU_CCA_PPA
E_HSALFPPV
NO_STC
< Main Board ñ Bottom side >
R619 C601C600
R603
TP04_BBR603
TP02_BBR619
TP03_BBC600
TP04_BBR603
TP03_BBC601
TP02_BBR619
TP03_BBC600C601
- 86 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.3 SIM Detect Trouble
• SIM control path
- Asta generates SIM interface signals(1.8V level) to AB3000.
- AB3000 converts SIM interface signals to 3V.
SIM work well? Finish
Finish
START
Yes
Yes
Yes
Reconnect SIM card
Resolder J901 on main PCBand check the contact
between J901 and SIM card
Change main board
SIM work well? Finish
No
No
SIM work well?
No
Change SIM card
< SOCKET PCB - SIM Connecto r >
J901
- 87 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.4 MicroSD card Trouble
Baseband chipset use polling method to detect the microSD Card.
< Socke tPCB side
mic roSD Socket >
MicroSD card work well?
START
Yes
Re-insert MicroSD card
Check operation of MicroSD card using other notebook or PDA
No
MicroSD work well? Change the MicroSDNo
Yes
FINISH
Finish
DS ORCIM
VA
908
EV
LC18
S02
015
57V2_GDDV
VA
910
EV
LC18
S02
015
EV
LC18
S02
015
VA
909
KLC5
DMC3
0TAD78
1TAD1
2TAD2
3TAD
91DNG
012DNG
113DNG4DNG
21
DDV4
SSV6
009J
VA
907
EV
LC18
S02
015
EV
LC18
S02
015
VA
911
VA
905
EV
LC18
S02
015
3TAD_DSORCIM_LAERDMC_DSORCIM_LAER
0TAD_DSORCIM_LAER
KLC_DSORCIM_LAER
1TAD_DSORCIM_LAER2TAD_DSORCIM_LAER
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 88 -
4.5 Keypad, Touch Button and Touch Screen Trouble
4.5.1 Keypad Trouble
(1) If one of the side key is short with other signal or pressed, some key is not work.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 89 -
CN1
Side key
RA101
VA101~ VA108
CN700
8V1_EDDV
4G3G
5161718191202
3456789
2G1G1NC
1
1101213141
57V2_GDDV
0081301R0081401R
VB
AT
1OCC
3NIYEK2NIYEK1NIYEK0NIYEK
N1CIMP1CIM
4TUOYEK2DEL_YEK
1TUOYEK2TUOYEK3TUOYEK
ESNESPILF_51PG_CCA
1DEL_YEK
VA
104
EV
LC14
S02
050
EV
LC14
S02
050
VA
106
VA
108
EV
LC14
S02
050
VA
103
EV
LC14
S02
050
VA
107
EV
LC14
S02
050
EV
LC14
S02
050
VA
101
VA
105
EV
LC14
S02
050
EV
LC14
S02
050
VA
102
3NIYEK2NIYEK1NIYEK0NIYEK
1TUOYEK2TUOYEK4TUOYEK3TUOYEK
elameF_ROTCENNOC nip 02
8V1_EDDV
2G1G
4G3G
31
41
51
61
71
81
912
02
3
4
5
6
7
8
9
007NC
1
1101
21
TABV
57V2_GDDV
N1CIM
1OCC
4TUOYEK
0NIYEK
1NIYEK
2NIYEK
3NIYEK3TUOYEK
ESNESPILF_51PG_CCA P1CIM
2TUOYEK
1TUOYEK
2DEL_YEK
1DEL_YEK
8
5TOH
4 5
7
YEK_REBMUN
6
3
0
2
4TOH
9
1
401 501
011
601
301201
701
201TOH101TOH
2 4 6 8
1 3 5 7 K01
101AR
101
801 901
8V1_EDDV
2NIYEK
0NIYEK
1NIYEK
1TUOYEK
3TUOYEK
2TUOYEK
4TUOYEK
3NIYEK
Main key PCB
Main board
TP08_BBCN1
TP06_BBRA101
TP05_BBSide key
TP08_BBCN700
TP07_BBVA101
~ VA108
4.5.2 Touch button and Touch screen Trouble
- 90 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CN702
CN106
CN108
Main Board
FLCD
Multikey
CN902
1#OIPG htiw C2I neercS hcuoT940515253545
3343536373 44
54647484
728292031323T
OU
CH
_3.1
V
8V1_EDDVDI_DCL_21PG_PPA
]6[ATAD_DCL]5[ATAD_DCL
]7[ATAD_DCL
LCS_NEERCS_HCUOTADS_NEERCS_HCUOT
TNI_NEERCS_HCUOT
445464748494051525354555
0313233343536373
62728292
TO
UC
H_3
.1V
8V1_EDDVDI_DCL_21PG_PPA
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
LCS_NEERCS_HCUOT
]7[ATAD_DCL
]5[ATAD_DCL]6[ATAD_DCL
]4[ATAD_DCL
40414243444
56
3
93
2
801NC1
V1.3_HCUOT
LCS_NEERCS_HCUOT
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
TOUCH_3.1V
6 39
44041424344
5
23
CN9021
TOUCH_SCREEN_SCL
TOUCH_SCREEN_INTTOUCH_SCREEN_SDA
- 91 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
TP09_BBCN702
TP09_BBCN106
TP09_BBCN108
TP09_BBCN902
- 92 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
U700
Main Board
U800
R906
Multikey
R907
ODL_HCUOT
D113D4111R007U
EC6
1DNG2
2DNG5
4CN
1DDV
3TUOV
TABV
u1717C
R71
00
V1.3_HCUOTV1.6_GERV
617Cu1
R70
9D
NI
NE_ODL_HCUOT_21PG_CCA
retfihS leveL NEERCSHCUOT
608PT
R80
22.
2K
R80
4
0
8V1_EDDV
318PT
408PT
708PT
C80
60.
1u
R80
02K2.
2KR
801
TO
UC
H_3
.1V
1A1A
2A2A
3A3A
A4
A4
1C1B
C2
B2
B3
C3
B4
C4
4BDNG
3BEO
VC
CA
B2
B1
VC
CB
008URUXZE4010SXT
0.1u
C80
5
508R
0
1uC
807
TSR_HCUOT
NE_ODL_HCUOT_21PG_CCA
TESER_HCUOT_50PG_PPA
LCS_NEERCS_HCUOT_50PG_PPA
ADS_NEERCS_HCUOT_61PG_PPA
TNI_NEERCS_HCUOT
LCS_NEERCS_HCUOT_NI
ADS_NEERCS_HCUOT_NI
TNI_NEERCS_HCUOT_40PG_PPA
TOUCH_CONNECTORTOUCH_3.1V
R90
6
4.7K
4.7K
R90
7
6
7 8
9
15 16
17 18
1
10
11
12
13
14
2
3
4
5
CN901
DN
I
R90
5
TOUCH_SCREEN_INT
TOUCH_SCREEN_SCL
TOUCH_SCREEN_SDA
The output must be 3.1V DC.
The output must be 3.1V DATA or Clock signal
Change Multikey PCB
TP10_BBU700
TP11_BBU800
TP12_BBR906
TP12_BBR907
- 93 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.6 Multi EL lighting Trouble
- 94 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CN702
CN106
CN108
Main Board
FLCD
Multikey
CN902
1#OIPG htiw C2I neercS hcuoT940515253545
3343536373 44
54647484
728292031323T
OU
CH
_3.1
V
8V1_EDDVDI_DCL_21PG_PPA
]6[ATAD_DCL]5[ATAD_DCL
]7[ATAD_DCL
LCS_NEERCS_HCUOTADS_NEERCS_HCUOT
TNI_NEERCS_HCUOT
445464748494051525354555
0313233343536373
62728292
TO
UC
H_3
.1V
8V1_EDDVDI_DCL_21PG_PPA
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
LCS_NEERCS_HCUOT
]7[ATAD_DCL
]5[ATAD_DCL]6[ATAD_DCL
]4[ATAD_DCL
40414243444
56
3
93
2
801NC1
V1.3_HCUOT
LCS_NEERCS_HCUOT
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
TOUCH_3.1V
6 39
44041424344
5
23
CN9021
TOUCH_SCREEN_SCL
TOUCH_SCREEN_INTTOUCH_SCREEN_SDA
TP13_BBCN702
TP13_BBCN106
TP13_BBCN108
TP13_BBCN902
- 95 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
U700
Main Board
U800
U400output
Main Board
ODL_HCUOT
D113D4111R007U
EC6
1DNG2
2DNG5
4CN
1DDV
3TUOV
TABV
u1717C
R71
00
V1.3_HCUOTV1.6_GERV
617Cu1
R70
9D
NI
NE_ODL_HCUOT_21PG_CCA
LE ROF CDCD V1.6_GERV
5.1K
R40
6 u7.4124C
TABV
004LHu01
NE4
DNG2
PG
ND
5
3NIV
1TUOV
004QTMY17049CIM
20K
R40
4
u2.2224C DGNA
4
NE63
BFCN
5
TUO81
DNGP
WS7
9DNG_T
2NIV
004U
LMY0922CIM
NE_CDCD_LE
retfihS leveL NEERCSHCUOT
608PT
R80
22.
2K
R80
4
0
8V1_EDDV
318PT
408PT
708PT
C80
60.
1u
R80
02K2.
2KR
801
TO
UC
H_3
.1V
1A1A
2A2A
3A3A
A4
A4
1C1B
C2
B2
B3
C3
B4
C4
4BDNG
3BEO
VC
CA
B2
B1
VC
CB
008URUXZE4010SXT
0.1u
C80
5
508R
0
1uC
807
TSR_HCUOT
NE_ODL_HCUOT_21PG_CCA
TESER_HCUOT_50PG_PPA
LCS_NEERCS_HCUOT_50PG_PPA
ADS_NEERCS_HCUOT_61PG_PPA
TNI_NEERCS_HCUOT
LCS_NEERCS_HCUOT_NI
ADS_NEERCS_HCUOT_NI
TNI_NEERCS_HCUOT_40PG_PPA
The output must be 3.1V DC.
The output must be 3.1V DATA or Clock signal
The output must be 6.1V DC.
TP14_BBU700
TP15_BBU800
TP16_BBU400
output
- 96 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
MultikeyEL sheet operating voltage generator(L900, D901, Q900, C903, R910 or R913)
Check the output of C903Output must be 190V AC about 800KHz
Replace U900
D5
G
S1 S2
Q900SIA450DJ
D1 D2 D3 D4
R90
9
0
2.2uC902
470pFC903
VREG_6.1V
R91
3
100K
10M
R91
0
0.1u
TOUCH_3.1V
C906
RF051VA2S
D901
0.1u
C90
4
100K
R912150pC905
100uHL900
EL sheet operating voltage generator(L900, D901, Q900, C903, R910 or R913)
TP17_BBCheck the output of C903
Output must be 190V AC about 800KHz
Replace U900
- 97 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.7 Camera Trouble
5M Camera control signals are generated by Zoran.
4.7.1 5M Camera
START
Press END Keyto turn on the power
Is the circuit powered?
Reconnect the 5M 34pin B to B connector
5M Camera Operation OK?
Or C722 = 2.8V?
Change 5M Camera
Follow the Power On Trouble Shooting
Change U703 or Change U702
YES
NO
YES
YES
5M Camera Works
NO
Change the Main Board
NO
1
2
NO
C721 = 1.8V?
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 98 -
CN701
1
5MCamera
off
34pin 5M Camera Connector in Main Board
- 99 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2
TP 2
5M Regulator in Main Board (Top)
U703
C721
5MCamera
TP18_BB (1.8V)
5M Regulator in Main Board (Bottom)
5MCamera
U702
C722
TP19_BB(2.8V)
NIV1
1TUOV87
2TUOV
WQPGM-1109TR
21NE2NE
35
DNG1CN4
2CN6
PG
ND
9
307U
V8.1_DDV_MACV8.2_FA_DDV_MAC
1uC
723
TABV
C72
1
1u 1u
NE_RWP_MAC_PMM
C72
0
1uC
724
6EC
1DNG2
2DNG5
CN4
1TUOVDDV
3
TABV
F-RT-D182D4111R207U
C72
21u
V8.2_DDVA_MAC
NE_RWP_MAC_PMM
TP18_BB
TP19_BB
- 100 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.7.2 VGA Camera
VGA Camera control signals are generated by DB3150.
START
Press END Keyto turn on the power
Is the circuit powered?
Reconnect the 80pin BtoB connectorCN702 and VGA 20 pin Camera Connector
VGA Camera Operation OK?
VGA Camera Operation OK?
Follow the Power On Trouble Shooting
YES
NO
YES
NOChange the Camera&LCD FPCB or Soket PCB
YES
VGA Camera Works Change the Main Board
NO
NO
1
Change U903
YES
NO2
NO
Change VGA Camera
c922 = 1.8V?c921 = 2.8V?
- 101 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Main Board 80 pin BtoB Connector
LCD FPCB 20 pin VGA Connector
CN702CN104
- 102 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
R93
0
0
03-SC125BR 539R0
129C
u1
u1029C
239R0V8.2_DDV_AGV0
439R03-SC125BR
u2.2519C
819C
DN
I
R94
2
u1
u1719C
229C
u1
V8.1_DDV_AGV519PT
339R0
919C
TABV
u1.0
139R0
8V1_EDDV
C91
610
u
SAIBS5F
5DLCS
4DADS
5EDNGS
SNESS3F
A1
T1
A6
T2
T3
F6
F1
T4
4F1TABV
PCTABV5B
ODLTABV1E
6EOIV
4BTUOV
NIMWPW1D
N3C4A
P3C5A
3ADNGPC
TNCHSALF3D
1CG4E3E
2CG
O1ODL2F
O2ODL2E
2D1DEL
2C2DEL3DEL
1C
4DEL1B
5DEL2B2A
LFDEL
3BDNGDEL
BTESER4C
LUG5906DB
309UN1C
6D5C
P1C
6CN2CP2C
6B
BTESER_MP_BUS
2DELW3DELW4DELW5DELW
SNES
MWP_DCL
LCS_MP_BUSADS_MP_BUS
1NIAG
SAIBS
1DELW
2NIAG
RWP_DELW
Charge Pump in Socket Board
U903
C921
C922
2
TP21_BB (2.8V)
TP20_BB (1.8V)
TP 2TP21_BB
TP20_BB
- 103 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.8 Main LCD Trouble
LCD control signals are generated by DB3150.
START
Press END Keyto turn on the power
Is the circuit powered?
Disconnect and Reconnect the 80pin (Main)or 44 pin (LCD PCB)
LCD Display OK?
Follow the Power On Trouble Shooting
Change LCD FPCB or Multikey PCB
YES
NO
YES
YES
NO
1
NO
Disconnect and Reconnect the LCD FPCB 44pin and 37pin LCD connector (Multikey PCB)
LCD Display OK?
The LCD Works
Follow the Power On Trouble Shooting
Change LCD Module
LCD Display OK?
Change the Main Board
NO
YES
2
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 104 -
Main Board 80 pin BtoB Connector
1
Multikey PCB 44pin & 37pin LCD Connector
LCD FPCB 44 pin BtoB Connector
2
CN702
CN108
CN900
CN902
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 105 -
4.9 Keypad Backlight Trouble
START
Press END Keyto turn on the power
Keypad Backlight Works?YES
NO
VBAT applied? Change Main BoardNo
Keypad Backlight Works?
Check V at R 101 or R 102 is confirmNo
Change LD101 or LD102
No
YES
YES
1
2
Crack Mainkey PCB to main board
YES
Change Mainkey PCB
YES
Keypad Backlight Works
No3 Change Main Board
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 106 -
3
TP22_BB
TP23_BB
R101 R102
TP24_BB
201R
mho001
VB
AT
mho001
101R
RS
B6.
8CS
T2R
ZD
101
ZD
102
RS
B6.
8CS
T2R
1
A
2
C
101DL
7001STWS-CSS
1
A
2
C
7001STWS-CSS
201DL2DEL_YEK
1DEL_YEK
TP22_BB TP23_BB
TP24_BB
1
2
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 107 -
4.10 Folder ON/OFF Trouble
START
Insert magnetIn component
No
Yes
Turn the power on
Check magnet
Pin 1 of U101 = 2.75V
Yes
No
Yes
Change Mainboard
1
2
Crack Mainkey PCB
Change Mainkey PCB
Yes
Finish
Slide OK?
Yes
No
Change Main board
No
3
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 108 -
Be sure that magnet is here
1
U101
3
2
TP25_BB(2.75V)
TCETED EDILS
4TUO
DDV1
5MB21006KT101U
21DNG
52DNG
6DDV_OI
CN3
211C
8V1_EDDV
u1.0
u1.0901C
57V2_GDDV
ESNESPILF_51PG_CCA
TP25_BB
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 109 -
4.11 Audio Trouble Shooting
4.11.1 Receiver• Signals to the receiver
- Receiver signals are generated at Veronica
• BEARP, BEARN
- Receiver path:
• 1. Veronica (BEARP, BEARN)r →
• 2. R518,R519 on main boardr →
• 3. U501 (Analog switch) on main boardr →
• 3. LCD FPCBr →
• 4. Speaker/Receiver
• Note: It is recommended that engineer should check the soldering of R, L, C along the
corresponding path before every step.
- 110 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Does the sine wave appearat R518, R519 ?
Change the main board
Does the sine wave appearat Number 65, 66 pin
in the main Bíd CN702?Check 5, 8 pin at U501
Does the sine wave appearat EAR(+) PAD in LCD FPCB? Change the LCD FPCB
Does the Receiver get incontact with the LCD
FPCB sus
Re-assemble the Receiver
Can you hear sine waveout of the receiver ?
Change the Receiver
END
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
1
2
3
4
The sine wave not appear
- 111 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
TP26_BB
R518, R519
LCD FPCB
3
2
TP27_BB
Pin 65, 66
CN702
TP28_BB
.pmA rekaepS
%1
%1
%1
%1
%1
%1
n74135C
51915R
SSAPYB1C
DNG2B
2C+NI
3C-NI
3ADDV
+OV3B
-OV1A1B
NWODTUHS_
RVQZ1A5026APT005U220n
C53
6
3060 K01125R
K93715R
47K
R52
5
3060
5A2
20B2
31B2
DNG4
1S7
2S6
CCV9
XMUT8622ASF105U
A1801
0B1
11B1
n01535C
3060
TABV
51815R
TABV
R52
210
0K
3060
u2.2525C
3060 K01025R
K93425R
n74235C
NRAEB
NE_WS_PMA_72PG_CCA
NE_PMA_KPS_31PG_CCA
PRKPS
NRKPS
+VCR_KPS
-VCR_KPS
PRAEB
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 112 -
2#OIPG htiw C2I LES-P
1#OIPG htiw C2I neercS hcuoT
2#OIPG htiw C2I nottuB hcuoT
8797
8
08
9
2636465666768696
7
0717273747576777
94
5
05152535455565758595
6
0616
33435363738393
4
140424344454647484
2
02122232425262728292
3
031323
207NC1
01112131415161718191
IND
0007R
517C
VD
D_L
CD
_2.6
V
IND417C
0107R
TO
UC
H_3
.1V
VR
EG
_6.1
V
IND217C
VG
317CIND
VG
A_
8V1_EDDVDI_DCL_21PG_PPA
N_TESER_DCL
N_SDA_DCLN_SC_DCLN_EW_DCL
MWP_DCL
RWP_DELW
4DELW3DELW2DELW1DELW
5DELW
LCS_NOTTUB_HCUOT
TSR_HCUOTADS_NOTTUB_HCUOT
N_DR_DCLCNYSV_DCL
n_AWSNO
]0[ATAD_DCL]1[ATAD_DCL]2[ATAD_DCL
]4[ATAD_DCL
]6[ATAD_DCL
]3[ATAD_DCL
]5[ATAD_DCL
]7[ATAD_DCL
LCS_NEERCS_HCUOTADS_NEERCS_HCUOT
TNI_NEERCS_HCUOT
KLCP_IC
CNYSV_ICCNYSH_IC
n_SER_IC
LCS_C2I_PPAADS_C2I_PPA
FFO_OI_CV_12PG_CCA
1TUOYEK2TUOYEK4NIYEK5NIYEK
2D_IC3D_IC4D_IC5D_IC
7D_IC6D_IC
+VCR_KPS-VCR_KPS
+RWP_ROTOM-RWP_ROTOM
0KLCSYS
1NIAG2NIAG
SAIBSSNES
0D_IC1D_IC
1
2
TP26_BBR518, R519
TP27_BBPin 65, 66
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 113 -
Measured 1khz Sine Wave Signal
1
3
2
Measured 1khz Sine Wave Signal
TP26_BBR518, R519
TP27_BBPin 65, 66
TP28_BB
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.11.2 Speaker (Voice Loud Speaker, Midi, MP3, Key Tone)• Signals to the speaker
- Speaker signals are generated at Veronica
• SPKRP, SPKRN
- Speaker path:
• 1.Veronica (SPKRP, SPKRN) →
• 2. C531, C532 on the main board →
• 3. U500(audio amp) on the main board →
• 4. U501 (Analog switch) on the main board →
• 5. LCD FPCB →
• 5.Speaker/Receiver
• Note: It is recommanded that engineer should check the soldering of R, L, C along the
corresponding path before every step.
4. TROUBLE SHOOTING
- 114 -
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 115 -
START
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Does the sine wave appearat C531, C532? Change the main board
Does the sine wave appearat U500 ? Change the U500
Does the sine wave appearat U501 ?
YES
YES
YES
YES
NO
NO
NO
NO
Can you hear sine waveout of a speaker ?
Change the Speaker
END
YES
NO
Change the main board
Does the sine wave appearat EAR(+) PAD in LCD FPCB?
1
4
3
2
The sine wave not appear
5
Change the LCD FPCB
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 116 -
1 3
2
B SIDE
4
TP29_BBC531, c532
TP30_BBU500
TP32_BB
TP31_BBU501
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 117 -
Measured 1khz Sine Wave Signal
5
.pmA rekaepS
%1
%1
%1
%1
%1
%1
n74135C
51915R
SSAPYB1C
DNG2B
2C+NI
3C-NI
3ADDV
+OV3B
-OV1A1B
NWODTUHS_
RVQZ1A5026APT005U220n
C53
6
3060 K01125R
K93715R
47K
R52
5
3060
5A2
20B2
31B2
DNG4
1S7
2S6
CCV9
XMUT8622ASF105U
A1801
0B1
11B1
n01535C
3060
TABV
51815R
TABV
R52
210
0K
3060
u2.2525C
3060 K01025R
K93425R
n74235C
NRAEB
NE_WS_PMA_72PG_CCA
NE_PMA_KPS_31PG_CCA
PRKPS
NRKPS
+VCR_KPS
-VCR_KPS
PRAEB
1
2 3TP29_BBC531, c532
TP30_BBU500
TP31_BBU501
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 118 -
4.11.3 Microphone (Voice call, Voice Recorder, Video Recorder)• Microphone Signal Flow
- MIC is enable by MIC Bias
- CCO1, MIC1P, MIC1N signals to ABB3000 (Veronica )
• Check Points
- Microphone bias
- Audio signal level of the microphone
- Soldering of components
• Signal from the mic
- MIC →
- C104 on mainkey PCB →
- C106, C108 on mainkey PCB →
- R103, R104 on mainkey PCB →
- Veronoca →
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 119 -
START
Is the level of CCO12.4Volt ?
Change the MIC
Check the signal level at C106, C108 at the putting
Audio signal in MIC
Does it work properly ?
END
Yes
YES
No
A few hundred of mV of the signal measured ?
Change the main B,d
Check the MIC bias level at the C104
Resolder C106, C108and try again.If fail again,
chage the main Bíd
3
2
1
No
Yes
Yes
No
- 120 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
2
eniL mm51.0 : DNGD etarepeS
CIM
n74601C
501C
u01 p74401C
4
101CIM
3-BP-5EH4020MPS
1G2
2G3
O1
P
n74801CP1CIM
N1CIM
1OCC
1
2
TP33_BBC106, C108
TP32_BBC104
TP32_BBC104
TP33_BBC106, C108
- 121 - LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Measured Some Noise Signal
2
TP33_BBC106, C108
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 122 -
4.11.4 Headset Receiver (Voice call, Video Telephony, MP3)
START
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Insert Headset.Does the Headset icon display
on the main LCD?
Can you hear sine waveout of the receiver ?
Change the main Bíd
END
YES
YES
YES
YES
NO
NO
NO
Does the level of R621under 0.5Volt ?
NO
Does the level of R621over 1.6Volt ?
YES
N0Change the main B,d
YES
Does the sine wave appearat C613, C614 ?
NO
Does the sine wave appearat FB600, FB601?
Resolder CN600 Pinsor change the Headset
1
2
6
3
8
Resolder R620And try again from the start
4Does the sine wave appear
at FL601 ?5
YES
Change the the FL601
NO
Change the FB600, FB601
YES
NO
Does the sine wave appearat R816, R817?7
Change the FB600, FB601
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 123 -
TP36_BB
R620
TP39_BB
R816, R817
TP35_BB
C613, C614
TP37_BB
FL601
TP38_BB
FB600, FB601
4
3
TP34_BB
R621
1
5
6
7
TP40_BB
CN600
8
- 124 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CDA_TMR/MD_BSU
V2.4+_TABV
L_RAE
CIM_SH
%1
XR_TRAU
HSALFPPV
TNI_TMR/PD_BSU
V5+_GHCV
)81.90.7002(TUO_VT
n_BWSNO
%1
R_RAE
DNG
CDA_TMR/MD_BSUn_TCETED_RAE
PU
LL-U
P R
EM
OV
ED
200
7.10
.01
V2.4+_TABV
rotcennoc ot raen
TNI_TMR/PD_BSU
TNA_MF
XT_TRAU
V5+_GHCV
REWOP_BSU
0
616R
306BF
3060
K022026R
u1.0016C
8V1_EDDV
3060
R62
1
0
206BF
VA
603
ULC
E05
05C
015F
R
516C
IND
006BF
006AVRF510C5050ECLU
u1.0
56789
3060
906C
1
011121314151617181
91
2
02
34
CP52-40S81-JESH
006NC
ULC
E05
05C
015F
R
VA
602
C62
022
p
u10.0426C
106BF
74618R
506BF
C62
222
p
074016R
816C
IND
326Cu1
RS
B6.
8CS
T2R
ZD
600
TABV
+1DSH
7-1DSH
2+2DSH
-2DSH6
LES01
9CCV
8EO_
R62
2
DN
I
206UXMU03BSUSF
+D3
-D5
DNG4
1
106PT526R
0
616Cu1.0
0
916R
074216R
74718R
VA
601
ULC
E05
05C
015F
R
22p
C62
1
u001416C
916Cu2.2
K74
706R
006PT
8ETAG
TUO_ETAG9
2DNG
1NI1
2NI4
53NI
1CN1121
2CN
61TUO
2TUO7
01NE_
GALF_3
306UG2RTM843PCN
806C
K1816R
3060n01
Hn072006L
DN
I
R62
3
L31BFSU006D
TABV
R62
4
0
21CN
33CN2CN
67
4CN1TUO
8
52TUO
PG
ND
9
NM4112FUN106LF
1NI1
2NI4
p22116C
u001316C
P2CIM
KOOH
RDIM
TUO_VT
XRT_BSU_SUBV
A_NICD
L_RAE
R_RAE
N2CIM
SUBV
TNA_MF
XR_TRAU_CCA_PPAXT_TRAU_CCA_PPA
E_HSALFPPV
NO_STC
1 4
3
TP36_BBR620
TP34_BBR621
TP35_BBC613, C614
5TP38_BBFB600, FB601
6TP39_BBR816, R817 7
TP39_BBR816, R817
7TP40_BBCN600
- 125 - LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.11.5 Headset MIC(Voice call, Video Telephony)
START
Insert Headset.Does the Headset icon display
on the main LCD?
Does it work properly ?? Try again from the start
END
YES
YES
YES
NO
NO
NO
Change the main Bíd
Does the level of R621under 0.5Volt ?
NO
Does the level of R621over 1.6Volt ?
YES
N0Change the main B,d
YES
Check the signal level
at U803 at the putting
Audio signal in MIC
Resolder U803and try again.If fail again,
Change the main Bíd
A few hundred of mV
of the signal measured at U803 ?
Resolder R620And try again from the start
3
1
2
4
5
6
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 126 -
3
1
4
TP43_BBU803
TP42_BBR620
TP41_BBR621
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 127 -
DA_TMR/MD_BSUTNI_TMR/PD_BSU
K022026R
8V1_EDDV
R62
1
0
516C
IND
816C
IND
+1DSH
7-1DSH
2+2DSH
-2DSH6
LES01
9CCV
8EO_
206UXMU03BSUSF
+D3
-D5
DNG4
1
616Cu1.0
5.6K
R61
7
R61
3D
NI
3060
R61
4D
NI
006PT
K1816R
K3.3
516R
CDA_ETOMER
AP
P_A
CC
AP
P_A
CC
TNI_ETOMER_11PG_PPA
ESNESFHP_71PG_CCA
PD_BSU
MD_BSU
IND
888R
K2.2
818R
u1u2.2918C
818CEC6
21DNG
52DNG
4CN
DDV31
TUOV
D181D4111R308U 406BF
2OCC
1
3
4
TP43_BBU803
TP41_BBR621
TP42_BBR620
- 128 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.12 Charger Trouble Shooting
• Charging Procedure
- Connecting TA and Charger Detection
- Control the charging current by AB3000
- Charging current flows into the battery
• Check Point
- Connection of TA
- Charging current path:
- Battery
• Trouble shooting setup
- Connect TA and battery to the phone
• Trouble Shooting Procedure
- Check the charger connecter
- Check the Charging current Path: Red Line( )
- Check the battery
W4/1
W4/1
DNG_TTAB
BA ot esolC
%12102
dnuorg enohPhtap nruter
riap laitnereffid a sa etuor3 niP ot esolC
Clo
se to
Pin
1
.nnoC yrettaB
2102%1
riap laitnereffid a sa etuor
915Cp74
0805R3060
1.0315R
TABV
p42315C
K74415R
0115R3060
105QJD119AIS
1D
2D
3D
4D
1G
2G
1S
2S
G1
G2
1 2 3
CN
500
0215R
905R
p42215C
520.0
300K
R50
6
33u
C51
7
21
005X
zHK867.23
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
TABV
21K1LATX2LATX
11K
D_TABV1H
SUBV1J
01GN_FFOMIS
2KN_TSRS
KLCS3J3K
TADS
3F
21G+ESNESGF
11G-ESNESGF
ATADB4H
GERHC2E
1E+ESNESHC
2F-ESNESHC
OICD
21JZHK23
105PT
A_NICDNICD
n_TSRS
SUBV
KLCSTADS
KLCCTR
Main Battery Charging Path
- 129 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
start
Check the pin and batteryconnect terminals of I/O
connector
Connection OK? Change I/O connectorNO
YES
Change TANO
YES
Is it charging properly ENDYES
NO
Change the board
1
2
3
start
Check the pin and batteryconnect terminals of I/O
connector
Connection OK? Change I/O connectorNO
YES
Is the TA voltage 5.1V? Change TANO
YES
Is it charging properly
after changing Q500?END
NO
Change the board
1
2
3
Trouble Shooting - Charging
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 130 -
W4/1
W4/1
DNG_TTAB
BA ot esolC
%12102
dnuorg enohPhtap nruter
riap laitnereffid a sa etuor3 niP ot esolC
Clo
se to
Pin
1
.nnoC yrettaB
2102%1
riap laitnereffid a sa etuor
915Cp74
0805R3060
1.0315R
TABV
p42315C
K74415R
0115R3060
105QJD119AIS
1D
2D
3D
4D
1G
2G
1S
2S
G1
G2
1 2 3
CN
500
0215R
905R
p42215C
520.0
300K
R50
6
33u
C51
7
21
005X
zHK867.23
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
TABV
21K1LATX2LATX
11K
D_TABV1H
SUBV1J
01GN_FFOMIS
2KN_TSRS
KLCS3J3K
TADS
3F
21G+ESNESGF
11G-ESNESGF
ATADB4H
GERHC2E
1E+ESNESHC
2F-ESNESHC
OICD
21JZHK23
105PT
A_NICDNICD
n_TSRS
SUBV
KLCSTADS
KLCCTR
Main Battery Charging Path
Q501
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 131 -
4.13 Checking Bluetooth Block
start
1. Check PMIC Block
2. Check BT IC Block
** BT - Bluetooth
<Top view><Bottom view>
PMIC
BT IC
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 132 -
<Bottom view>
BT IC
PMIC
BT ANT pad
2.75V(C810) 2.75V(C809)
2.75V(C808)1.8V(C804)
BT CLK(R803)
1.8V(C503) 2.75V(C510)
<PMIC Block>
<BT IC Block>
saiV elpitluM esU
enalP dnuorG lacoL
BA ot esolC
)zHM001@(mho021 8061
J1NS121GP81MLB
V01
%02 ?A7.0 0.1*6.2*8.2
57V2_BMS_HDDV
Hu7.4005L
205Cu1
TABV
D50
0
RB
521S
-30
415Cu01
3060u1.0815C
56V2_CDDV
8V1_DARGIDV
505R
K2.2
u1.0515C
3060
0
705R
3060
005BF
5V1_DDDV
205PT
8V2_ADARV
5V2_FDDV
C_TABV
0
405R
57V2_KDDV
u1105C
905Cu1u1
015C705Cu1
57V2_GDDV
025Cu1
u1605C
u1805C
615Cu01
u2.2305C
Fn33115C
5V1_DDDV
TABV
8V1_EDDV
EROCV
KCUBSSV1B
11AC_DDV
21FD_DDVE_DDV
21D
9AF_DDVG_DDV
7A
21BH_DDV
K_DDV21M
B6
VIB
R
H11
TX
ON
KCUBV2B
C8
VD
DA
DC
2AKCUBDDV
11JPLDDV
21CA_DDV
KLCMIS5H
TADMIS2H
N_TSRMIS2J
CCVMIS1F
1AKCUBWS
SAIBP1D
1KCS4D
H10
SC
LS
DA
H12
LED
1A
6
LED
2D
6B
7LE
D3
ODLTXE11B
D8
GP
A0
A10
GP
A1
GP
A12
F10
GP
A2
B10
GP
A3
C9
D9
GP
A4
E9
GP
A5
GP
A6
F11
E11
GP
A7
B2R-0003BA
205U
B9
AD
OU
T
G4
AD
ST
R
D50
2
RB
521S
-30
EROCV
SU
B_L
ED
CCVMIS
KE
Y_L
ED
1K
EY
_LE
D2
MO
TO
R_P
WM
SH
AR
ED
_I2C
_SD
A
PUKCABV
TABV
8V2_ADARV
56V2_CDDV
8V1_DARGIDV
5V1_DDDV
8V1_EDDV
5V2_FDDV
57V2_GDDV
57V2_BMS_HDDV
57V2_KDDV
KLCMIS
TADMIS
n_TSRMIS
TX
_AD
C_S
TR
B
KLC_0S2I
SH
AR
ED
_I2C
_SC
L
AD
OU
T
HO
OK
RE
MO
TE
_AD
CT
ES
TO
UT
RT
EM
P
VB
AC
KU
P
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 133 -
4.13.1 Checking BT IC Block
112
11
2
TP02_BT1.8V(C503)
TP02_BT1.8V(C503)
TP01_BT2.75V(C510)
TP01_BT2.75V(C510)
- 134 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
About 2.75V?
Check voltage level at C510 with Oscilloscope
About 1.8V?
Check voltage level at C503 with Oscilloscope
Check Next Stage
No
No
Yes
Yes
Check PMIC (U502)
Check Veronica (U502)
11
2
- 135 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.13.2 Checking BT IC Block
112
3 4
5
C81
00.
1u
4D1CN2CN
7F8F
3CN4CN
4L
5CN5L6L
6CN
DLC_DDV_TB6E
LRTC_GER_TB4J
1LC_RVSR_TB2B3C
2LC_RVSR_TB8M
D_RVSR_TBMSD_RVSR_TB
1C2C
N_RVSR_TBFR_RVSR_TB
2M
DVH_TB7NR
807
0
57V2_KDDV
C80
90.
1u
2
11
TP05_BT1.8V(C804)
TP04_BT2.75V(C810)
TP03_BT2.75V(C809)
TP04_BT2.75V(C810)
TP07_BTBT CLK(R803)
TP03_BT2.75V(C809)
TP06_BT2.75V(C808)
- 136 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
408Cu1.0
6H1GIDSSV_TB
7H2GIDSSV_TB3GIDSSV_TB
8H8K
4GIDSSV_TB8L
5GIDSSV_TB
__
6MA_OIV_TBB_OIV_TB
9J
C_OIV_TB3N5N
D_OIV_TBE_OIV_TB
8G
1ANASSV_TB1D2D
2ANASSV_TB3ANASSV_TB
3E1F
1JNFR_TBPFR_TB
1K
8V1_EDDV
008BF06
808Cu1.0
FR_TB_SSV
1FRSSV_TB1H1L
2FRSSV_TB3FRSSV_TB
2J2K
4FRSSV_TB
_3H
11ANASSV_TB4H
21ANASSV_TB
1TSET_TB2H2G
2TSET_TB
1AVH_TB2L3D
2AVH_TB3AVH_TB
1E2E
4AVH_TB4E
5AVH_TB
GRP_FA_TB6G
ANA_TB_SSV
108PT
IND108C008C
IND PUEKAW_TB9L
6JSTR_TRAU_TB
DXR_TRAU_TB9H
7GDXT_TRAU_TB
6MAOIVTB
NI_KLC_FER_TB6F7K
NTESER_TB
1JNFR_TBPFR_TB
1K
STC_TRAU_TB6K
KLC_PL_TB9K
108U7J
1_TUO_QER_KLC_TB
3952CLTS308R
0
1TAD_IPS_TB_52PG_CCA
KLC_IPS_TB_62PG_CCA
KLC_TBKLCCTR
n_2TUOSER
3
4
5
TP05_BT1.8V(C804)
TP06_BT2.75V(C808)
TP07_BTBT CLK(R803)
- 137 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
BT IC Output(C803)
1.8V, 2.75V ?
Check frequency atBT CLK (R803)with Oscilloscope
Check Next Stage
No
No
Yes
Check VCXO(X100) block26MHz ?
Check PMIC Block
Check voltage level atC804, C808, C809 and C810with Oscilloscope
Check Power levelat BT IC Output (C803) with Spectrum Analyzer
Range-2 ~ 2dBm ?
No
Yes
Change BT Chip (U801)
Yes
66
6
5
11 2
3 4
FR_TB_SSVFR_TB_SSV
1C3407-TB054212AED008LF5
1PB
4CD_PB2PB
2
3G
16
G2
1PB_U
C80
31n
H
208CHn9.3
208TUO
008LHn3.3
108Lp2.1
FR_TB_SSV
308TUO
108TUO
TP08_BTBT IC Output(C803) TP08_BT
BT IC Output(C803)
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 138 -
4.14 RF Component
(Top)
U100
U102
X100
FL102,FL101,FL100
(Bottom)
SW100
SW101
WCDMA Tx SAW FilterFL201Antenna ConnectorSW101
WCDMA DuplexerFL202
WCDMA Rx SAW FilterFL200RF Test ConnectorSW100
WCDMA IsolatorIS200GSM900 Rx SAW FilterFL102
WCDMA Power CouplerN200PCS Rx SAW FilterFL101
WCDMA Transceiver(RF3100)U203DCS Rx SAW FilterFL100
WCDMA Power DetectorU202GSM / EDGE Transceiver(RF3000)U102
WCDMA DC/DC ConverterU201GSM900/DCS/PCS/EDGE PA
+ Ant. SWU100
WCDMA PAU20026MHz CrystalX100
DescriptionReferenceDescriptionReference
U203
U200
U202
U201
IS200
FL202
N200
FL200
FL201
Figure 4-1. RF component
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 139 -
4.15 Procedure to check
start
Oscilloscope setting
1. CheckPower Source Block
2. CheckVCXO Block
Agillent 8960 : Test mode(WCDMA)Ch. 9750 (Uplink)Ch. 10700 (Downlink)
4. CheckWCDMA Block
Agillent 8960 : Test mode(GSM)Ch. 62, P.L. 7 level settingCh. 62, -60dBm setting
5. CheckGSM Block
Redownload SW, Cal
3. CheckAnt. SW Module
- 140 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.16 Checking Common Power Source Block
Step 1Power Source Block
Step 2GSM PAM Block
Step 4Checking VCC
(Top)
(Bottom)
Step 3WCDMA PAM Block
Figure 4-2. Common Source Block
- 141 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.16.1 Step 1
3.7V OK?Step 1
Check Point (C517) in Power Source Block
To Check Power source to Check if main power source input or not
Yes
No
Proceed to the Step 2
3.7V OK?
No
Yes
Check The PowerSupply
Short? No
Yes
Soldering Check Component(CN500)
In Power Source Block
Check Point (CN500)
in Power Source BlockTo Check Power source
Change Board
Check (C517 & CN500)
in Blockto check inner line connectionFrom CN500 to C517
Check point(C517)
Check point(CN500)
Figure 4-3. Power Source Block
4/1
DNG_TTAB
%1102
dnuorg enohPhtap nruter
Clo
se to
Pin
1
.nnoC yrettaB
G1
G2
1 2 3
CN
500
300K
R50
6
33u
C51
7
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
TABV
TP02_RF(C517)
TP01_RF(CN500)
TP02_RF(C517)
TP01_RF(CN500)
- 142 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.16.2 Step 2
Step 2Check VBATT (C102, C103)in GSM PAM Block to Check if main powersource input or not
Check (C517 & C102,C103)
in Blockto check inner line connectionFrom C517 to C102, C103
Check Point (C517)
in Power Source BlockTo Check Power source
3.7V OK?
Yes
No
Proceed to the Step 3
3.7V OK? No
Yes
Check The PowerSupply
Short? No
Yes
Soldering Check Component(CN500)
In Power Source Block
Change Board
C103
C102
GSM PAM
Figure 4-4. Step 2 : GSM PAM Block
p22701C
801CIND
815-SMK001WS
AC
G1
G2
201Cu01n01
101C
TABV
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
u01301C001C
p22
009XR
0081XR
058XR
0091XR
1_DNAB_FRW
TP03_RF(C102,C103)
TP03_RF(C102,C103)
4.16.3 Step 3
3.7V OK?
Step 3Check VBAT (C201, C202)in WCDMA PAM Block Yes
No
See the Next Page
3.7V OK?
No
Yes
Check the PowerSupply
Short ?
No
Yes
Soldering Check Component(CN500)
In Power Source Block
Check Point (C517)
in Power Source BlockTo Check Power source
Change Board
Check (C517 & C201, C202)in Block ,to check inner line connectionFrom C517 to C201, C202
WCDMA PAM
DC/DCConverter
C201C202
802CIND
u10.0202C
TABV
102Cu01
LT8023ML102U
NE1C
BF3C
3ADNGP
NIVP1A
3BDNGS
WS2A
2CNOCV
DDV1B
NE_CDCDW
CCV_APW
- 143 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 4-7. Step 3 :WCDMA PAM Block
(C202,C201)TP04_RF
TP04_RF(C202, C201)
- 144 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.16.4 Step 4: Checking VCC
2.8V OK?No
Yes
1.8V OK?
Yes
No
Check the AB3000
Check the AB3000Check Point
VDD_E (C503)
Common Input Power is OKSee The Next Part
Check Point VDD_A (C501)
(Bottom)
AB3000
C501 (VDD_A)
C503 (VDD_E)
Figure 4-5-1. Power for Radio ASIC
Figure 4-5-2. Schematic (Power)
205Cu1
0
405R
u1105C
u2.2305C
21FD_DDVE_DDV
21D
21CA_DDVODLTXE
11BAB3000
VRADA_2V8 (RF3000 analog)
VDIGRAD_1V8 (RF3000 digital)
TP05_RFC501 (VDD_A)
TP05_RFC501 (VDD_A)
TP06_RFC503 (VDD_E)
TP06_RFC503 (VDD_E)
- 145 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.17 Checking VCXO Block
The reference frequency (26MHz) from U102 (GSM Transceiver RF3000) is also used in WCDMA TXpart and BB part. Therefore, 3 test points in the following figure should be checked.
Phone
Oscilloscope
Notebook to send TP command
U102X100Crystal
GSM Transceiver
(RF3000)
WCDMA Transceiver
(RF3100)
U203
Figure 4-6. VCXO block
Figure 4-7. Connection for Checking VCXO Block
- 146 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check 1. Crystal and RF3000(GSM Transceiver) part
If you already check this crystal part, you can skip check 1
R113GSM Transceiver
(RF3000)
X100Crystal
Figure 4-8-1. Test Point (Crystal Part)
Figure 4-9. 26MHz at R113
R10
9
100K
R0AQ-AFK00062-32-XSK
001X
zHM62
2134
311RK001
TUOTSET9
WB
CLK
11 13X
ON
XO
P14 17
01QERKICM
16M
CLK
8KLC
GN
DA
1112
GN
DA
1215
211RK001
001PT
K001
411R
KLCW
KLC_LRTC_FR
QERKLCM
KLCM
TUOTSET
Figure 4-8-2. Schematic (Crystal Part)
TP07_RFR113
TP07_RFR113
- 147 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check 2. 26MHz at WCDMA TX part
C229
GSM Transceiver
(RF3000)
WCDMA Transceiver
(RF3100)
X100Crystal
Figure 4-10-1. Test point (26MHz at TX part)
Figure 4-11. 26MHz at C229
p2.8922C
VG
AC
TL
11 16N
C4
RE
FIN
1513C
LKD
ATA
12
EN
14
402PT
KLC_LRTC_FR
ATAD_LRTC_FR
BRTS_LRTC_FR
KLCW
Figure 4-10-2. Schematic (26MHz at TX part)
TP08_RFC229
TP08_RFC229
- 148 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check 3. 26MHz at BB part
R114
GSM Transceiver
(RF3000)
Figure 4-12-1. Test point (26MHz at BB part)
Figure 4-13. 26MHz at R114
R10
9
100K
R0AQ-AFK00062-32-XSK
001X
zHM62
2134
311RK001
TUOTSET9
WB
CLK
11 13X
ON
XO
P14 17
01QERKICM
16M
CLK
8KLC
GN
DA
1112
GN
DA
1215
211RK001
001PT
K001
411R
KLCW
KLC_LRTC_FR
QERKLCM
KLCM
TUOTSET
61Y0KLCSYS
41WKLCM
100K
R30
5
TP
301
8V1_EDDV
0KLCSYSKLCM
Figure 4-12-2. Schematic (26MHz at BB Part)
MCLK
Baseband(DB3150)
MCLK
TP09_RFR114
TP09_RFR114
- 149 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check R113 No
Refer to Figure 4-8
Yes
Check R114 NoRefer to Figure 4-10
Yes
VCXO part has a problem.Changing XTAL or U102
Checking 126MHz at VCXO
Checking 226MHz at MCLK
VCXO part is O.K.Check next stage
VCXO part has a problem.Changing XTAL or U102
- 150 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.18 Checking Front End Module Block
Antenna
Switch Module
(+ GSM/EDGE PA)
Antsw0
Antsw1
Antsw2
Figure 4-12. Front End Module Block (Bottom and Top)
1C
401Cp22
C10
9D
NI
501Cp22
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
001Cp22
p22601C
0WSTNA
SCPSCD_XT
MSGE_XT
1WSTNA
CPAV
2WSTNA
Antenna Switch Module (+ GSM/EDGE PA)
TP10_RF
TP10_RF
- 151 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.19 Checking Front End Module Block input logic
4.19.1 Mode Logic by TP Command
- 152 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LHLWCDMA
HHHPCS Rx
LHHDCS Rx
HLHEGSM Rx
HHLPCS Tx
HHLDCS Tx
HLLEGSM Tx
Antsw2Antsw1Antsw0Mode
Table 4-1. Front End module Logic
- 153 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.19.2 Checking Switch Block power source
Before Checking this part, must check common power source(through Veronica) part
TP Command
MODE=0SWRX=64,2
Open?
High? OK? Resoldering
Check each modeBy TP command Change the Board
No
No No
Yes
Yes Yes
Check soldering(C104)
Check SolderingIt is necessary to check short condition.Using Tester, Check 3 capacitorsANTSW0(C104),ANTSW1(C106)ANTSW2(C105)
Check ANTSW0(C104)To check Switch input power source
4.20 Checking WCDMA Block
- 154 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
start
1. CheckVCXO Block
4. CheckRF TX Level
3. CheckControl Signal
Re-download SW, Cal
2. CheckFront End Module
6. CheckRF RX Level
5. CheckPAM Block
(Top)
(Bottom)
SW100RF switch
U203WCDMA TransceiverRF3100
U200WCDMAPAM
Duplexer / Isolator / DCDC
Figure 4-27. WCDMA Block
- 155 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.20.1 Checking VCXO Block
Refer to 4.16
4.20.2 Checking Ant. SW module
Refer to 4.17
4.20.3 Checking Control Signal
First of all, control signal should be checked. (data, clk, strobe)
Figure 4-28-1. Test points (Control Signal)
PIN14 (STROBE) PIN13 (CLK)PIN12 (DATA)
U203WCDMA
Transceiver(RF3100)
- 156 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
p2.8922C
VG
AC
TL
11 16N
C4
RE
FIN
1513C
LKD
ATA
12
EN
14
402PT
KLC_LRTC_FR
ATAD_LRTC_FR
BRTS_LRTC_FR
KLCW
Figure 4-28-2. Schematic (Control Signal)
Phone
Oscilloscope
Notebook to send TP command
Figure 4-29. Connection for Checking Control Signal
RF3100
- 157 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
PIN14 (STROBE)
PIN13 (CLK)
PIN12 (DATA)
Similar ?
Control Signal is O.K.Check next stage
Download the SW
Check PIN12,PIN13, andPIN14. Check shape and pk-pk level Refer to Figure 4-30
Yes
No
If signal is not OK even after downloading, Change the U203
TP CommandMODE=4WTXC=10700, 1,890,903,542,557
PIN14 (STROBE)
PIN13 (CLK)
PIN12 (DATA)
Figure 4-30. Control Signal
- 158 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.20.4 Checking RF TX Level
Check 1SW100RF test connector
Check 3C226Duplexer Output
Check 6C207PAM Input
Check 4IS200Isolator Output
Check 5IS200Isolator Input
Check 2C107FEM Output
(Bottom)(Top)
Figure 4-31. Test point (RF TX Level)
Phone
Spectrum Analyzer
Notebook to send TP command
Fig. 4-32 Connection for Checking RF TX Level
TP17_RF
TP16_RF
TP13_RF
TP12_RF
TP15_RF
TP14_RF
- 159 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
p22701C
801CIND
815-SMK001WS
AC
G1
G2
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
009XR
0081XR
058XR
0091XR
1_DNAB_FRW
11DNG
42DNG3DNG
984DNG
65DNG
36DNG
7XR
XT5
00B0BE59G1YZYAS202LF2
TNA
502LAN
p22622C
1_DNAB_FRW
1_DNAB_XRW
1_DNAB_XTW
723-B9159G181CDL
TUO_C3
1DNG52
2DNG
NI1
TUO_M6
4ETANIMRET
002N
p22p01602C
402C
312CIND
p65
702C
302Cp0001
Hn2.8202L
AP_CCV
112CIND
502Cp0001
2DNG1DNG
4DNG3DNGTUONI
000BCD59G102SEC002SI
47177YKS002U
ELBANE2
61DNG
2DNG7
3DNG9
DNGP11
4TUO_FRNI_FR
8
5SAIBV
11CCV
012CCV
3LORTNOCV
R20
0
47
TABV
002LHn1
IND902C
IND012C
u10.0002C
ESNES_WOPW
SAIB_APW
NE_1_DNAB_XTW
I_DNAB_DOMXTW 1_DNAB_XTW
TP13_RFC107FEM Output
TP14_RFC226Duplexer Output
TP17_RFC207PAM Input
TP16_RFIS200Isolator Input
TP15_RFIS200Isolator Output
TP12_RFSW100RF test connector
- 160 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Fig. 4-33-1 Output Level at RF testconnector (SW100)
Fig. 4-33-2 Output Level at FEM Output(C107)
Fig. 4-33-3 Output Level at Duplexer(C226)
Fig. 4-33-1 Output Level at RF testconnector (SW100)
Fig. 4-33-2 Output Level at FEM Output(C107)
Fig. 4-33-3 Output Level at Duplexer(C226)
Fig. 4-33-4 Output Level at IsolatorOutput (IS200.2.Out )
- 161 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Fig. 4-33-5 Output Level at Isolator Input(IS200.3. In)
Fig. 4-33-6 Output Level at PAM Input(C207)
Fig. 4-33-7 Output Level at RF3100(Ylva)Output (C218)
- 162 -
4. TROUBLE SHOOTING
To verify that the phone fulfils requirments on maximum output power.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check 1About 22~23dBm?
RF TX Level is OKCheck next stage
Check output power at the SW100 with antenna Cable. Refer to Figure 4-33-1
No
Yes
Set the FDD Test of the Agillent 8960Set the Maximum Power
YesThe SW100 has any problem.Change the SW100
Check 2About 15dBm?
Check the power at the C107 with probe. Refer to Figure 4-33-2
No
YesThe U100 has any problem.Change the U100
Check 3About 19dBm?
Check the power at the C226 with probe. Refer to Figure 4-33-3
No
YesThe FL202 has any problem.Change the FL202
Check 4About 19dBm?
Check the power at the IS200 Out with probe. Refer to Figure 4-33-4
No
YesThe IS200 has any problem.Change the IS200
Check 5About 17dBm?
Check the power at the IS200 In with probe. Refer to Figure 4-33-5
No
YesThe U200 has any problem.You have to check PAM block.
Check 6About -6dBm?
Check the power at the C207 with probe. Refer to Figure 4-33-6
The U203 will be not operated.Change the board
No
TP CommandMODE=4WTXC=10700, 1,890,903,542,557TFTI=10700
- 163 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.20.5 Checking PAM Block
DC/DC converter
Duplexer Output(C226)
WCDMAPAM
PAM Input(C207)
VCC_PA(C212)
WPA_BIAS(C206)
Figure 4-34. Test points of WCDMA TX PAM block
TP18_RFDuplexer Output
(C226)
TP19_RFPAM Input(C207)
TP20_RFWPA_BIAS(C206)
TP21_RFVCC_PA(C212)
- 164 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
11DNG
42DNG3DNG
984DNG
65DNG
36DNG
7XR
XT5
00B0BE59G1YZYAS202LF2
TNA
502LAN
p22622C
1_DNAB_FRW
1_DNAB_XRW
1_DNAB_XTW
AP_CCV
802CIND
u10.0202C
TABV
102Cu01
L201
3.3u
H
212Cu7.4
LT8023ML102U
NE1C
BF3C
3ADNGP
NIVP1A
3BDNGS
WS2A
2CNOCV
DDV1B
NE_CDCDW
CCV_APW
p22p01602C
402C
312CIND
p65
702C
302Cp0001
Hn2.8202L
AP_CCV
112CIND
502Cp0001
47177YKS002U
ELBANE2
61DNG
2DNG7
3DNG9
DNGP11
4TUO_FRNI_FR
8
5SAIBV
11CCV
012CCV
3LORTNOCV
TABV
002LHn1
IND902C
IND012C
u10.0002C
SAIB_APW
NE_1_DNAB_XTW
I_DNAB_DOMXTW
TP18_RFDuplexer Output(C226)
TP20_RFWPA_BIAS(C206)
TP19_RFPAM Input(C207)
TP21_RFVCC_PA(C212)
- 165 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Yes
No
TP Command-mode =4
- WTXC=10700, 1,890,903,542,557
23dBm ?Check Duplex output
(C226)To Check PAM
output
WCDMA PAM is OKSee the Next page
Level< -
10dBm?
NoDownload the SW
& Calibrate
Level>2dBm
Check C207To Check PAM Input level
Check the WCDMA RF Tx Chip (Ylva)
Yes
Yes
1.3V ?
Check C206 To Check PAM control signal from RF3100 (Ylva)(WPA_BIAS)
Check the RF3100to WCDMA PAM Signal line
3.2V ?Check C212To Check PAM VCC BIASfrom DC/DC converter(VCC_PA)
No
No
No
Change the DC/DC
Yes
Yes
Change The PAM
- 166 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.20.6 Checking RX I,Q
To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q.
WRX_I_P (R208)
WRX_I_N (R207)
WRX_Q_P(R206)
WRX_Q_N(R205)
WCDMA Transceiver
(RF3100)
p2.8922C
022
502R
8BIXTAQXT
901
BQXT
41_XT
XROLCCV42
6XTOLCCV
22DDV
VG
AC
TL
11 16N
C4
5CN32
526CN7CN
62
8CN82
RE
FIN
15 17R
XIA
18R
XIB
19R
XQ
AR
XQ
B20
12TST
AIXT7
13C
LKD
ATA
12
EN
14
72NI_1ANL
2CN3
3CN5
NH5916MO_0013FR
302U
022
702R
IND722C
402PT
022
802R
022
602R
N_Q_XRW
P_Q_XRW
N_I_XRW
P_I_XRW
KLC_LRTC_FR
ATAD_LRTC_FR
BRTS_LRTC_FR
KLCW
Figure 4-35. RF3100, WCDMA Transceiver
TP22_RF
- 167 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 4-36-1. RX I,Q signal (CW:2142MHz)
Figure 4-36-2. RX I, Q signal
- 168 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
About 130mVp-p? Change RF3100 (U203)
Check the pk-pk level at R205,R206, R207 and R208 With Oscilloscope.Refer to Figure 4-36-1
Yes
No
Set the CW Mode of the Agillent8960Feed a CW signal at 2142MHzSet the RX Continuous mode
Check the Mean level at R205,R206, R207 and R208 With Oscilloscope.Refer to Figure 4-36-1
Yes
No
Check the frequency at R205,R206, R207 and R208 With Oscilloscope.Refer to Figure 4-36-2
Yes
No
Verify whether the signal was similar as Figure4-36-2 with Oscilloscope.
Yes
No
About 160mV?
About 2MHz?
Similar?
Check Next Stage
Change RF3100 (U203)
Change RF3100 (U203)
Change RF3100 (U203)
TP CommandMODE=4WRXC=10700
- 169 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.21 Checking GSM Block
start
2. CheckVCXO Block
5. CheckRF TX Path
4. CheckControl Signal
Re-download SW, Cal
3. CheckFEM Module
6. CheckRF RX Path
1. CheckVRADA_2V8
VDIGRAD_1V8
(Top)
(Bottom)
U100GSM/EDGE PAM (+Ant. SW)
U102GSM/EDGETransceiverRF3000
SW100RF switch
Figure 4-13. GSM Block
- 170 -
4. TROUBLE SHOOTING
4.21.1 Checking Regulator Circuit
Refer to 4.15 Checking Power Source block
IF you already check this point while checking power source block (4.15), You can skip this test.
4.21.2 Checking VCXO Block
Refer to 4.16 Checking VCXO block
IF you already check this point while checking VCXO block (4.16), You can skip this test.
4.21.3 Checking Front End Module
Refer to 4.18 Checking Ant. SW Module
IF you already check this point while checking Ant. SW module (4.18), You can skip this test.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 171 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.21.4 Checking Control Signal
Test Program Script
MODE=0
SWTX=1,64,7
RF_CTRL_STRB (PIN6)
RF_CTRL_CLK (PIN8)
RF_CTRL_DATA(PIN7)
RF3000
Figure 4-14. Test points of RF control signals
32R
X19
00P
52N008XRP008XR
62
92N009XR
82P009XR
6RTS
TUOTSET9
4BHXT
TX
LB39
42ACCV
18V
CC
D
WB
CLK
11 13X
ON
XO
P14
38G
ND
A2
GN
DA
336
GN
DA
433
5ADNG1
6ADNG03
7ADNG3
728ADNG
9ADNG5
17G
ND
D
01QERKICM
16M
CLK
37N
C
PG
ND
41 35R
X18
00N
RX
1800
P34 31
RX
1900
N
201UNH1916MO_0003FR
2DOMMA
8KLC
ATAD7
DA
TAA
20D
ATA
B19
22CATAD
12RTSATAD
40G
ND
A1
01ADNG32
GN
DA
1112
GN
DA
1215
001PT
TP22_RF
- 172 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Similar?
Check PIN6,PIN7,PIN8 of RF3000.Check if there is any Major difference.Refer to Figure 4-15
Yes
NoRe-download SWShort?
Yes
No
Change the board
Control signal is OK.See next page to check
Figure 4-15. GSM RF Control signal
- 173 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.21.5 Checking RF Tx Path
A. GSM Tx path Level
Figure 4-16. GSM/DCS/PCS Tx Path Level
- 174 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(Top) (Bottom)
U100GSM/EDGE
PAM (+Ant. SW)
U102RF3000
Figure 4-17. Test Points of GSM/DCS/PCS Tx Path
- 175 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
B. GSM Tx Output Level Check
(Bottom)
p22701C
801CIND
815-SMK001WS
AC
G1
G2
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
009XR
0081XR
058XR
0091XR
1_DNAB_FRW
TP23_RFSW100RF test connector
TP23_RFSW100RF test connector
- 176 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check GSM/DCS/PCS output power at .Check if there is any Major difference.Refer to Figure 4-42.GSM900>32dBmDCS>29dBmPCS>29dBm
NoSee Next page to check Tx pathSimilar?
Yes
GSM900/DCS/PCS Tx path OK. See Chapter 4.8.6 to check Rx path
v Agilent 8960 Setting: GSM BCH+TCH Mode
v Oscilloscope Setting
2. DCS TxMODE=2SWTX=1,699,0
Test Program Script
1. GSM900 TxMODE=0SWTX=1,64,5
3. PCS TxMODE=1SWTX=1,661,0
Figure 4-18. GSM900/DCS/PCS Tx Level at
- 177 - LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
C. GSM RF Transceiver Check
GSM900/DCS/PCS>5dBm
See Next page to check Tx path
Check GSM RF Transceiver Output power at .
No
Yes
Redownload SW
DCS/PCS Tx(R106)
GSM900 Tx(R101)
`
(U102)
RF3000
Figure 4-19. GSM900/DCS/PCS Transceiver (RF3000)
R10
9
100K
220
R10
8
Hn6.5201L
p6.5521C
R10
4
300
R10
7
220
F69G1BEFAS101LF
G1 2
G25 IN
1O
1 3
O24
32R
X19
00P
52N008XRP008XR
62
92N009XR
82P009XR
6RTS
TUOTSET9
4BHXT
TX
LB39
42ACCV
18V
CC
D
WB
CLK
11 13X
ON
XO
P14
38G
ND
A2
GN
DA
336
GN
DA
433
5ADNG1
6ADNG03
7ADNG3
728ADNG
9ADNG5
17G
ND
D
01QERKICM
16M
CLK
37N
C
PG
ND
41 35R
X18
00N
RX
1800
P34 31
RX
1900
N
201UNH1916MO_0003FR
2DOMMA
8KLC
ATAD7
DA
TAA
20D
ATA
B19
22CATAD
12RTSATAD
40G
ND
A1
01ADNG32
GN
DA
1112
GN
DA
1215
G1 2
G25 IN
1O
1 3
O24
Hn7.2
601L
00F0AF48G1BEFAS001LF
001PT
p6.5321C221C
p6.5
300
R10
3
131Cp7.2p3.3
031C
p6.5621C
Hn6.5501L
81
101R
601R
42
MSGE_XT
SCPSCD_XT
CPAV
ATAD_LRTC_FR
QERKLCM
BRTS_LRTC_FR
TUOTSET
GSM900 Tx(R101)
DCS/PCS Tx(R106)
TP24_RF
TP24_RF
- 178 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
D. GSM PAM Check
GSM/EDGE PAM
(+Ant. SW)
(Top) (Bottom)
GSM900/DCFS/PCSPAM Output (C107)
Vapc(U100 pin 25)
Figure 4-20. Test points of GSM900/DCS/PCS Tx
p22701C
1CD
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS GSM900/DCFS/PCSPAM Output (C107)
Vapc (U100 pin 25)
TP25_RF TP26_RF
TP25_RF
TP26_RF
- 179 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
GSM900:33.0dBmDCS: 31.0dBm
Yes
Changing GSM PAM(U100)
Check GSM900/DCS/PCS PAM output power at .
GSM Tx path OK. See Next page to check
Check Vapc level at .Check if there is any Major difference.Refer to Figure 4-20.
Yes
NoRedownload SW, CalGSM900>1.5 V?
DCS/PCS>1.3 V?
No
- 180 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.21.6 Checking RF Rx Path
A. GSM Rx path Level
GSM900 : -50dBm
DCS : -50dBm
PCS : -50dBM
GSM900 : -51.5dBm
DCS/PCS : -51.7dBm
`
Figure 4-21. GSM/DCS/PCS Rx Path Level
- 181 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. DCS/PCS RxMODE=2(DCS),1(PCS)SWRX=699,2
Test Program Script
1. GSM900 RxMODE=0SWRX=64,2
v Agilent 8960 SettingCW ModeGSM900 : -50dBm@Ch65(948MHz)DCS : -50dBm@Ch700(1842.8MHz)PCS : -50dBm@Ch700(1967.8MHz)
v Oscilloscope Setting
(Top) (Bottom)
GSM/EDGE PA
U100
GSM Transceiver
U102
DCS Rx
PCS Rx
GSM Rx
Figure 4-22. GSM900/DCS/PCS Rx path
TP28_RF
TP27_RF
- 182 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
B. GSM RF Level Check
GSM/EDGE PAU100
GSM Transceiver
U102
DCS Rx(C112)
PCS Rx(C114)
GSM Rx(C120)
Figure 4-23. Test Points of GSM900/DCS/PCS Rx
p65721C
1LAN
p22021C
p21121C
Hn81301L
p21421C
Hn6.5201L
p6.5521C
401LHn01
00F0AF69G1BEFAS101LF
G1 2
G25 IN
1O
1 3
O24
32R
X19
00P
52N008XRP008XR
62
92N009XR
82P009XR
6RTS
4BHXT
TX
LB39
42ACCV
38G
ND
A2
GN
DA
336
GN
DA
433
5ADNG1
6ADNG03
7ADNG3
728ADNG
9ADNG5
37N
C
PG
ND
41 35R
X18
00N
RX
1800
P34 31
RX
1900
N
201UNH1916MO_0003FR
2DOMMA
8ATAD
7
40G
ND
A1
32
001LHn01
21G
2G
5
NI11O
3
2O
4
921C
201LF
00F0LFM249BEFAS
p01231C
p01
21G
2G
5
NI1
1O
3
2O
4
301LF
00F0MFM188BEFAS
G1 2
G25 IN
1O
1 3
O24
00F0AF48G1BEFAS001LF
p22411Cp22311C
p6.5321C221C
p6.5
p22911C
Hn01101L
701LHn81
p6.5621C
p22211C
Hn6.5501L
p22511C
0081XR
0091XR
009XR
CPAV
DCS Rx(C112) PCS Rx
(C114)
GSM Rx(C120)
TP28_RF
- 183 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
v Agilent 8960 SettingCW ModeGSM900 : -50dBm@Ch65(948MHz)DCS : -50dBm@Ch700(1842.8MHz)PCS : -50dBm@ch700(1967.8MHz)
GSM Rx path OK.
Check GSM900/DCS/PCS Rx signal level at .
Yes
GSM900:-51.5dBmDCS/PCS:-51.7dBm
Change Ant. SW module(U100)
No
- 184 -
5. DOWNLOAD
5. DOWNLOAD
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.1 LGDP2
5.1.1 File map
C:\DOWNLOAD- LGDP2_V34_UMTS_KF750.exe (Execution File)- meflash.dll (EMP DLL File)- LDR Files (Loader Files)
CXC1721606_A2_P6C_ACC_Pre.ldr,CXC1721607_A2_P6C_APP_Pre.ldr,CXC1721610_A2_P6C_ACC_Production.ldr,CXC1724028_1A2_P6C_APP_Large_Production.ldr
C:\DOWNLOAD\Model\EMP\KF750- KF750_080501_MP.dll (Model DLL)- SSW File (Model Binary)- MAP File (GDFS Files)
5.2.1 Frame Preference Dialog
• Port Selection
Select download ports.
• DLL Selection
Select Model DLL.
• Download Configuration
Setup DLL configuration.
• DLL Information
Show DLL configuration information what is selected.
- 185 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.1.3 DLL Preference Dialog
This page is depend on model DLL.To run, press “Download Configuration” at Frame Preference Dialog.
• Use USB Address
If this check is unchecked, Connected phone use from Port 1 dialog.
Unchcked, use fixed USB port. You should assign port number with USB Address.
• Image Files
Select Image binary files.
• GDFS File
Select GDFS files.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 186 -
5.2 Download• On Frame Preference Dialog, select download port and select model DLL.
• Add Binary images and GDFS files.
• Close all preference dialog and select Start Button on main page.
• Connect phone and wait until download finished.
* Usage fixed USB port
- 187 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.2.1 How to run
Not Qualcomm USB Driver but EMP USB Driver assign port ID in order phone connected from ID 1.For use fixed port ID, assign port ID before download job.
5.2.2 Setting
• Phone should connect just one before detect USB address.
• Connect phone first curl-cord.
• Press Set Button.
• Check USB Address which is loaded.
• Do 2 again.
• After assign all ports, press save dialog.
- 188 -
6. BLOCK DIAGRAM
GSM & WCDMA RF Block
6. BLOCK DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
DCDCU201
GSM TRxU102(Gimly)
UMTS TRxU203(Ylva)
Antenna
Test Conn.SW100
GSM PAM with FEMU100
DuplexerFL202
IsolatorIS200
UMTS PAMU200
UMTS TX FilterFL201
UMTS RF FilterFL200
Crystal -26MX100
BluetoothAntenna
BluetoothU801
STLC2593C
Figure 5-1. RF Block Diagram
- 189 -
6. BLOCK DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
TXPower Detec tingLMV221U202
TXDirectional Couple r
LDC181G9519B-327N200
RXFilterSAFEB942MFL0F00FL102
RXFilterSAFEB1G96FA0F00FL101
TRXModemDB3150U301
GSM
RXFilterSAFEB1G84FA0F00FL100
Calibration, etcTest Conn ectorKMS-518SW100
TRXBlu etoothSTLC2593U801
GSM/DCS/PCS Tri w ith FEM
PAMSKY77519U100
TRXTRxRF3000 (Giml y)U102
Bluetooth
TRXModemDB3150U301
TXIsol atorCES201G95DCB000IS200
TXPAMSKY77174U200
TXDC/DC LM3208DSU201
TXTx RF FilterSAFEB1G95KA0F00FL201
RXRX RF FilterSAFEB2G14FA0F00FL200
TRXTRxRF3100 (Ylva)U203
TRXDuplexerSAYZY1G95EA0B00FL202WCDMA
Reference -13MCrystalKSX-23-26000KFA-QA0RX100
Band S electFEMSKY77519U100Common
CommentFunctionPart NameRef. NameBlo ck
Table 5-1. RF Block Component
- 190 -
6. BLOCK DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Whole Block Diagram
- 191 -
C
1
6
G
01
NAC DLEIHS
21
7
C
9
HH
9
E
3 21
3 6
1
21
E
H
D
4
B
E
F
5
5
11
G
D D
B
C
A
9
762
11
A
86 01
8
9
A
B
D
844 7 11
G
2
01
1
F F
5
11
B
0173
A
H
C
1
E
54
2
2 83 21
F
G
p65721C
p22701C
801LAN
IND111C
801CIND
p22021C
p21121C
101WSE100-96302
TNA
1G2G3G
815-SMK001WS
AC
G1
G2
Hn81
201Cu01
301L
p21421C
R10
9
100K
220
R10
8
R0AQ-AFK00062-32-XSK
001X
zHM62
2134
Hn6.5201L
p72331C
p6.5521C
401LHn01
311RK001
R10
4
300
R10
7
220
811Cu7.4
R10
5
100K
101PT
00F0AF69G1BEFAS101LF
G1 2
G25 IN
1O
1 3
O24
32R
X19
00P
52N008XRP008XR
62
92N009XR
82P009XR
6RTS
TUOTSET9
4BHXT
TX
LB39
42ACCV
18V
CC
D
WB
CLK
11 13X
ON
XO
P14
38G
ND
A2
GN
DA
336
GN
DA
433
5ADNG1
6ADNG03
7ADNG3
728ADNG
9ADNG5
17G
ND
D
01QERKICM
16M
CLK
37N
C
PG
ND
41 35R
X18
00N
RX
1800
P34 31
RX
1900
N
201UNH1916MO_0003FR
2DOMMA
8KLC
ATAD7
DA
TAA
20D
ATA
B19
22CATAD
12RTSATAD
40G
ND
A1
01ADNG32
GN
DA
1112
GN
DA
1215
211RK001
n01
001LHn01
101C
p72
21G
2G
5
NI11O
3
2O
4
531C
921C
201LF
00F0LFM249BEFAS
p01231C
p01
21G
2G
5
NI1
1O
3
2O
4
301LF
00F0MFM188BEFAS
G1 2
G25 IN
1O
1 3
O24
Hn7.2
601L
3456
789
00F0AF48G1BEFAS001LF
001CS
1
011121
2
p22411Cp22311C
4.7K
R11
1
001PT
p6.5321C
401Cp22
221Cp6.5
p22911C
TABV
R10
0
0
C10
9D
NI
300
R10
3
711Cu1.0
501Cp22
33
201RHn01101L
431Cu01
5161
7DNG8DNG
7181
9DNG
32NI_MSG
2EDOM
DNGP92
DVSR3
1XR76
2XR3XR
54
4XR
NEXT1
52CPAV
TTABV62
1AMDCW01
8TNA1SB
8272
2SB
12NI_SCP_SCD
91DNG
01DNG9102
11DNG21DNG
2231DNG
42
2DNG1121
3DNG4DNG
3141
5DNG
6DNG
001U91577YKS
131Cp7.2
201PT
u01301C
2 ADNG3
CCV5
4Y
EO_1
8V1_DARGIDV
RLRD521G1CVL47NS101U
701LHn81
p3.3031C
001Cp22
p6.5
57V2_KDDV
621C
R11
0
4.7K
Hn1208L
p22211C
p22601C
K001
411R
Hn6.5501L
p72821C
81
101R
601R
42
p22511C
0WSTNA
SCPSCD_XT
MSGE_XT
009XR
0081XR
058XR
058XR
0081XR
0091XR
009XR
8V2_ADARV
1WSTNA
CPAV
0091XR2WSTNA
1_DNAB_FRW
KLCW
PMETR
TUODA
MSGE_XT
SCPSCD_XT
n_QERKLC_TB
KLC_TB
KLCM
CPAV
KLC_LRTC_FR
ATAD_LRTC_FR
BSM_PMA_ATADQ
BSM_QERF_ATADI
BSL_QERF_BSL_PMA
RTSTAD_KLCDQERKLCM
KLCM
BRTS_LRTC_FR
TUOTSET
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 192 -
IND222C
723-B9159G181CDL
TUO_C3
1DNG52
2DNG
NI1
TUO_M6
4ETANIMRET
Hn7.4402L
002N
p22p01602C
402C
IND022C
IND
11DNG
42DNG3DNG
984DNG
65DNG
36DNG
7XR
XT5
122C
00B0BE59G1YZYAS202LF2
TNA
522C
p65
312CIND
102LF00F0AK59G1BEFAS
21G
52G
33G
NI1
TUO4
AP_CCV
p2.8
322C
922C
712C
IND
IND
8V2_ADARV
p65
702C
022
502R
302Cp0001
Hn2.8202L
8BIXTAQXT
901
BQXT
41_XT
XROLCCV42
6XTOLCCV
31V
CC
RX
40V
CC
TX
22DDV
VG
AC
TL
11 16N
C4
5CN32
526CN7CN
62
8CN82
9CN03
PG
ND
41
RE
FIN
15
38R
F_D
AC
1R
F_D
AC
239
17R
XIA
18R
XIB
19R
XQ
AR
XQ
B20
12TST
AIXT7
13C
LKD
ATA
12
EN
14
1XTDNG
72NI_1ANL
92TUO_1ANL
35M
IX1_
AM
IX1_
B36
21CN
32N
C10
NC
113334
NC
12
37N
C13
2CN3
3CN5
NH5916MO_0013FR
302U
AP_CCV
u1.0412C
022
702R
p6.5422C
112CIND
502C
8V2_ADARV
802C
p0001
822C
IND
IND
2DNG1DNG
4DNG3DNGTUONI
002PT
000BCD59G102SEC002SI
47177YKS002U
ELBANE2
61DNG
2DNG7
3DNG9
DNGP11
4TUO_FRNI_FR
8
5SAIBV
11CCV
012CCV
3LORTNOCV
R20
0
47
502LAN
612C
p65
202PT
u10.0202C
812C
p65
5.6n
HL2
03
TABV
TABV
p22622C
002LHn1
62
R20
3
8V1_DARGIDV
8V2_ADARV
IND722C
402PT
102Cu01
912CFn33
3O
14O
2
L201
3.3u
H
00F0AF41G2BEFAS002LF
2G
15G
2
1IN
022
802R
102PT
022
602R
512C
R20
4
62
p01
IND902C
8V2_ADARV
302PT
212Cu7.4IND
012C
8V2_ADARV
LT8023ML102U
NE1C
BF3C
3ADNGP
NIVP1A
3BDNGS
WS2A
2CNOCV
DDV1B
DA
P7
4NEDNG
3
TUO6
5FER
2NI_FR
1DDV
022
202R
122VML202U
u10.0002C
K1
102R
I_DNAB_DOMXTW
N_Q_XRW
P_Q_XRW
N_I_XRW
P_I_XRW
1_DNAB_XRW
KLC_LRTC_FR
ATAD_LRTC_FR
BRTS_LRTC_FR
KLCW
SAIB_APWCCV_APW
P_I_XTWN_I_XTWP_Q_XTWN_Q_XTW
NE_TED_WOPW
ESNES_WOPW
SAIB_APW
NE_1_DNAB_XTW
I_DNAB_DOMXTW 1_DNAB_XTW
1_DNAB_FRW
1_DNAB_XRW
1_DNAB_XTW
NE_CDCDW
CCV_APW
ESNES_WOPW
TED_WOPW
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 193 -
DNG
NI
TUO
D
C
5 7
9 21
10.01.7002 degnahC egatloV C2I_PPA
G
A
3
52.90.7002 NAROZ htiw detcennoc DSORCIM
01
6
)PCM(MARDS 61x 8.1v G1 + DNAN 8x 8.1v G2
E
10.01.7002 0513BD htiw detcennoc DSORCIM
A
01
3
H
4
B
11
ROTCENNOC MTE
011
01
1#NIP ELBANE RZ
H
4
D
54 21
A
F
8
3 92
E
H
C
E
ROTCENNOC GATJ
B
F
8
G
A
1 21
8
D
9
5
G
3
E
21
2 7
11
2
2
B
6 11
SC DNAN
C
6
4
G
B
7
C
SC dn2 MARDS stibG1
1
H
D
F
D_veR
1 7
9
F
sOIPG
)1S2I(NAROZ OT
5
8
SC NAROZ
116
0.1u
C31
5
0.1u
C31
8
8V1_EDDV
u1.0333C
u1
C31
20.
1u
203C
u1.0
C31
70.
1u
033C
5N8N
7SSV
1QSSV2E
2QSSV2J
3QSSV2L
7FSAC_
EC_6C
1SC_9E8E
2SC_
SAR_7E
5EER_
EW_6D
DEW_8F
5FPW_
MQDU
6B1CCV2CCV
7N
6NQCCV
4B1DDV
9G2DDV3DDV
2H
4DDV2M
2D1QDDV2QDDV
2F
3QDDV2K
1SSV2C9F
2SSV3SSV
2G4N
4SSV
5SSV5B
6SSV
K8
M5
NC
15N
C16
M6
M7
NC
17N
C18
M8
N2
NC
19
NC
2B
7
NC
20N
9
B9
NC
3N
C4
F3
J3N
C5
NC
6G
4
NC
7G
5G
6N
C8
NC
9H
5
B__R6E
3H
4J3K
9QD
5J0OI
5L1OI2OI
6J
3OI6L7J
4OI7L
5OI6OI
8J
7OI8L
MQDL3G
B2
NC
1
H6
NC
10N
C11
K5
K6
NC
12K
7N
C13
NC
14
P1
P2
DN
U9
0QD3B
1QD4C
01QD4K3L
11QD21QD
4L3M
31QD41QD
4M
51QD3N
2QD3C
3QD4D3D
4QD5QD
4E3E
6QD7QD
4F
8QD
ELA
7D0AB1AB
8D
8G1EKC
6F2EKC
5CELC
KLC4H
A2
DN
U1
DN
U10
P9
P10
DN
U11
A9
DN
U2
A10
DN
U3
DN
U4
B1
B10
DN
U5
DN
U6
N1
N10
DN
U7
DN
U8
7C0A1A
8C
9D01A
9H11A
7G21A
9C2A3A
8B9M
4A9L
5A9K
6A9J
7A7H
8A9A
8H
5D
003U55JD-MB00900LAK
C30
50.
1u
C30
40.
1u
0033313R
8V1_EDDV
503PT
5V2_FDDV
TP
300
433C
R31
10
533Cu1.0 u1.0
C32
30.
1u
C31
60.
1u
8V1_EDDV
0.1u
C32
4
TP
306
R30
40
Y13
VS
SA
DA
B9
VS
SC
OM
MO
NA
A8
VS
SC
O_P
LL_1
AA
13 Y12
VS
SC
O_P
LL_2
VS
SD
AA
A7 Y6
VS
SG
PA
D
VD
DC
O_1
V2_
20A
A14
VD
DC
O_1
V2_
21
L2V
DD
CO
_AF
AA
12V
DD
CO
_PLL
_1V
DD
CO
_PLL
_2A
B13
VD
DIO
_1V
8_00
A11
AB
17V
DD
IO_1
V8_
01V
DD
IO_1
V8_
02A
18E
22V
DD
IO_1
V8_
03V
DD
IO_1
V8_
04B
2L1
VD
DIO
_1V
8_05
VD
DIO
_1V
8_06
K1
M22
VD
DIO
_1V
8_07
VD
DIO
_1V
8_08
T22
W1
VD
DIO
_1V
8_09
VD
DIO
_2V
5_1
W6
VD
DIO
_2V
5_2
VD
DC
O_1
V2_
04A
A1
VD
DC
O_1
V2_
05V
DD
CO
_1V
2_06
AA
11A
A22
VD
DC
O_1
V2_
07V
DD
CO
_1V
2_08
AB
1A
B2
VD
DC
O_1
V2_
09V
DD
CO
_1V
2_10
AB
21A
B22
VD
DC
O_1
V2_
11V
DD
CO
_1V
2_12
B1
B22
VD
DC
O_1
V2_
13V
DD
CO
_1V
2_14
A16
B21
VD
DC
O_1
V2_
15V
DD
CO
_1V
2_16
K22
N1
VD
DC
O_1
V2_
17V
DD
CO
_1V
2_18
R22
T1
VD
DC
O_1
V2_
19Y
11
1A
SMT1M
1PN_TSRT
TX
_AD
C_S
TR
BW
2
TX
_PO
WA
B7
US
B_D
AT
_VP
L4
US
B_O
EM
4L3
US
B_S
E0_
VM
AA
10V
CC
AD
AA
6V
CC
DA
VC
CG
PA
DA
A9
VD
DA
DW
11
VD
DC
O_1
V2_
00A
10A
2V
DD
CO
_1V
2_01
VD
DC
O_1
V2_
02A
22E
1V
DD
CO
_1V
2_03
A7
V7
RF
_WC
DM
A_P
WR
DE
T_E
NA
B6
NIKLCCTR51W
KCTR3N
5UKLCSTADS
9P
71AAN_ECIVRES
N_TSRS01P
61Y0KLCSYS
51Y1KLCSYS2KLCSYS
61W
61VN_QERKLCSYS
2NKCT
2MIDTODT
3M
12AN_0UMETN_1UMET
AB
15A
B14
PLL
_PG
_416
_VC
ON
T
11PN_TSRRWPN_0TUOSER
81V61BA
N_1TUOSERN_2TUOSER
61AA
RF
_CT
RL_
CLK
AB
4
RF
_CT
RL_
DA
TAA
A4
AA
3R
F_C
TR
L_R
ES
ER
VE
D
AB
3R
F_C
TR
L_S
TR
B
Y4
RF
_DA
TA_A
RF
_DA
TA_B
AA
2Y
3R
F_D
ATA
_CY
2R
F_D
ATA
_ST
RB
AB
5R
F_W
CD
MA
_DC
DC
_EN
AB
8R
F_W
CD
MA
_PA
_0_E
NR
F_W
CD
MA
_PA
_1_E
N
M19
L21
PD
I_C
2P
DI_
C3
L20
L19
PD
I_C
4P
DI_
C5
K19
K20
PD
I_D
0P
DI_
D1
J19
K21
PD
I_D
2P
DI_
D3
J20
J21
PD
I_D
4P
DI_
D5
J22
H19
PD
I_D
6P
DI_
D7
H20
PD
I_R
ES
_NL1
4
PLL
_26_
FIL
TV
DD
AB
12A
B11
PLL
_26_
VC
ON
TP
LL_P
G_4
16_F
ILT
VD
D
Y17
AB
19M
CD
AT
1M
CD
AT
2A
B18
AA
18M
CD
AT
3M
CD
ATA
DIR
W17
41WKLCM
QERKLCM41Y
N_QRICCASM02BA
N_QRIPPASM02AA
G18
NA
1N
A2
V6
PC
MC
LKV
4
Y1
PC
MD
LD
W3
PC
MS
YN
PC
MU
LDV
5
M20
PD
I_C
0P
DI_
C1
02U22U
SW1S2I
KE
YIN
0V
19W
21K
EY
IN1
KE
YIN
2V
21U
18K
EY
IN3
KE
YIN
4U
19T
18K
EY
IN5
Y22
KE
YO
UT
0K
EY
OU
T1
W19
V22
KE
YO
UT
2K
EY
OU
T3
V20
W22
KE
YO
UT
4
Y19
MC
CLK
MC
CM
DA
A19 Y18
MC
CM
DD
IRM
CD
AT
0
GN
D_1
4G
ND
_15
N13 J11
GN
D_1
6G
ND
_17
J12
J13
GN
D_1
8G
ND
_19
J14
I2C
SC
LA
A21
I2C
SC
L2W
20Y
20I2
CS
DA
I2C
SD
A2
Y21
KLC0S2I02R
91TDLD0S2IDLU0S2I
12T91R
SW0S2I
KLC1S2I02T
12UDLD1S2IDLU1S2I
GN
D1_
3
AB
10G
ND
AD
K10
GN
D_0
0G
ND
_01
K11
K12
GN
D_0
2G
ND
_03
K13
K14
GN
D_0
4G
ND
_05
L10
L11
GN
D_0
6L1
2G
ND
_07
L13
GN
D_0
8G
ND
_09
M10
M11
GN
D_1
0G
ND
_11
M12
M13
GN
D_1
2G
ND
_13
N11
N12
9D
6D0TATSP_MTE1TATSP_MTE
5A6C
2TATSP_MTE
6BKLCT_MTE
0TKPT_MTE8A8D
1TKPT_MTE2TKPT_MTE
8C7D
3TKPT_MTE4TKPT_MTE
8B7C
5TKPT_MTE6TKPT_MTE
7B6A
7TKPT_MTE
CNYST_MTE5D
N10
GN
D1_
1G
ND
1_2
W12
W13
01D_2FIME11D_2FIME
71D71E
21D_2FIME81D
31D_2FIME81E
41D_2FIME51D_2FIME
91D
KLCBF_2FIME01B
YDAER_FIFN_2FIME9B
41A_10SBDS_2FIME02A81B
31A_0SBDS_2FIME
91A51A_1SBDS_2FIME
N_EO_ER_SACDS_2FIME9A
01CKLCDS_2FIME
NEKLCDS_2FIME01D11C
N_VDA_SARDS_2FIME
9CN_TIAW_2FIME
N_EW_2FIME
21B
11BKLC_2FIME
62A_ERC_2FIME22F
N_0SC_2FIME6E7E
N_1SC_2FIME01J
N_2SC_2FIME
00D_2FIME21D
10D_2FIME21C31D
20D_2FIME30D_2FIME
31C41D
40D_2FIME50D_2FIME
41C51D
60D_2FIME70D_2FIME
51C61D
80D_2FIME90D_2FIME
61E71C
80A_2FIME90A_2FIME
61C71A
01A_2FIME11A_2FIME
71B
21A_2FIME81C
61A_2FIME91B02B
71A_2FIME81A_2FIME
02C91C
91A_2FIME02A_2FIME
12C12D
12A_2FIME22A_2FIME
22C02D
32A_2FIME42A_2FIME
22D12E
52A_2FIME
11DN_0EB_2FIMEN_1EB_2FIME
41A_10SBDS_1FIME
1J31A_0SBDS_1FIME
2K51A_1SBDS_1FIME
4BN_SACDS_1FIMENEKCDS_1FIME
4A4D
KLCDS_1FIMEN_SCDS_1FIME
5B
N_SARDS_1FIME4C5C
N_EW_1FIME
10A_2FIME31B21A
20A_2FIME30A_2FIME
31A41A
40A_2FIME50A_2FIME
41B51B
60A_2FIME70A_2FIME
51A61B
00D_1FIME3D
10D_1FIME20D_1FIME
5E4E
30D_1FIME40D_1FIME
5F4F
50D_1FIME60D_1FIME
3F3G
70D_1FIME80D_1FIME
4G5G
90D_1FIME01D_1FIME
3H4H
11D_1FIME21D_1FIME
4J3J
31D_1FIME41D_1FIME
4K3K
51D_1FIME
2J
81W
L9E
FU
SE
_HV
4
2C10A_1FIME20A_1FIME
1C2D
30A_1FIME40A_1FIME
1D3E
50A_1FIME60A_1FIME
2E2F
70A_1FIME80A_1FIME
2G1F
90A_1FIME01A_1FIME
1G1H
11A_1FIME21A_1FIME
2H
N_0EB_1FIME3B3A
N_1EB_1FIME
3C
F19
CI_
D1
G21
F21
CI_
D2
CI_
D3
G20
CI_
D4
H21
G19
CI_
D5
CI_
D6
G22
CI_
D7
H22
F18
CI_
HS
YN
C
CI_
PC
LKF
20E
20C
I_R
ES
_N
E19
CI_
VS
YN
C
Y8
DA
C_I
_NE
GD
AC
_I_P
OS
W8
W7
DA
C_Q
_NE
GD
AC
_Q_P
OS
Y7
NOCD
51AA
0_OIPG_PPA41M41N
1_OIPG_PPA
01_OIPG_PPA12P22P
11_OIPG_PPA21_OIPG_PPA
91P02P
31_OIPG_PPA41_OIPG_PPA
21P
2_OIPG_PPA31P41P
3_OIPG_PPA4_OIPG_PPA
22N12N
5_OIPG_PPA6_OIPG_PPA
12M22L
7_OIPG_PPA8_OIPG_PPA
02N91N
9_OIPG_PPA
CI_
D0
12R
3_OIPG_CCA9N9M
4_OIPG_CCA5_OIPG_CCA
4N
6_OIPG_CCA3P
7_OIPG_CCA4P4R
8_OIPG_CCA9_OIPG_CCA
3R
Y10
AD
C_I
_NE
GA
DC
_I_P
OS
W10
W9
AD
C_Q
_NE
GA
DC
_Q_P
OS
Y9
W4
AN
T_S
W0
W5
AN
T_S
W1
AN
T_S
W2
Y5
AA
5A
NT
_SW
3
PEELSPPA
0_OIPG_CCA1_OIPG_CCA
9K
2R01_OIPG_CCA11_OIPG_CCA
1R2T
21_OIPG_CCA31_OIPG_CCA
4T1U
41_OIPG_CCA51_OIPG_CCA
3T5T
61_OIPG_CCA71_OIPG_CCA
4U
81_OIPG_CCA3V
91_OIPG_CCA1V
2P2_OIPG_CCA
2U02_OIPG_CCA12_OIPG_CCA
3U2V
22_OIPG_CCA32_OIPG_CCA
103U
0513BD
71VPEELSCCA
9J
R30
8
10K
u1.0
p0001723C
C31
40.
1u
823C
100K
003Q
7011NRB
C
E
R30
5
0.1u
C31
3
923Cu1.0
R30
0
0
TP
303
R30
9
2.2K
u1.0
0.1u
233C
C30
7
0.1u
C30
9
C30
6
0033413R
0.1u
0033513R
C32
10.
1u
C32
533
n
8V1_EDDV
u1103C
EROCV
523PT
0.1u
C31
10.
1uC
310
C30
30.
1u
8V1_EDDV
0033213R
C32
633
n
8V1_EDDV
423PT
TP
302
TP
301
0
R30
1
u1.0133C
0.1u
403PT
C30
8
0.1u
8V1_EDDV
C32
0
603R
K001
R30
2
0
013R
IND
513PT
u1003C
8V1_EDDV
C31
90.
1u
0.1u
R30
7
100K
C32
2
ESNESFHP_71PG_CCA
DI_DCL_21PG_PPA
n_EC_FN
NE_ROTOMBTESER_MP_BUS
3TAD_DSORCIM
LCD
_AD
S_N
LCD
_CS
_N
LCD
_WE
_N
LCD
_RD
_N
LCS_NEERCS_HCUOT_50PG_PPA
AP
P_I
2C_S
CL
AP
P_I
2C_S
DA
3TAD_BSU_22PG_CCA
KLC_DS
KLCS
ESNESPILF_51PG_CCA
SD
_CS
2_n
SD
_CK
E2
MIC
RO
SD
_DA
T2
MIC
RO
SD
_DA
T3
MIC
RO
SD
_CM
D_D
IR
MIC
RO
SD
_DA
T_D
IR
LCD
_DA
TA[0
]LC
D_D
ATA
[1]
LCD
_DA
TA[2
]
LCD
_DA
TA[4
]
LCD
_DA
TA[6
]
LCD
_DA
TA[3
]
LCD
_DA
TA[5
]
LCD
_DA
TA[7
]
LCD
_RE
SE
T_N
n_SC_PMM
TERKLC_CM_31PG_PPA
NE_RWP_PMM_30PG_PPA
TNI_IPS_TB_41PG_CCA
1TAD_IPS_TB_52PG_CCAKLC_IPS_TB_62PG_CCA
0TAD_IPS_TB_42PG_CCA
KLC_BSU_40PG_CCA
2OIPG_MF_61PG_CCA
n_TNI_PMM_20PG_PPA
MIC
RO
SD
_CLK
MIC
RO
SD
_CM
D
MIC
RO
SD
_DA
T0
MIC
RO
SD
_DA
T1
)4(D_2FIME)3(D_2FIME)2(D_2FIME)1(D_2FIME
)51:00(D_2FIME
)0(D_2FIME
)2(D_2FIME
)4(D_2FIME
)6(D_2FIME
)70:00(D_2FIME
)11(A_2FIME
)41(A_2FIME
TNI_NEERCS_HCUOT_40PG_PPA
TNI_SIXA3_70PG_PPA
ADS_NEERCS_HCUOT_61PG_PPA
NE_ODL_HCUOT_21PG_CCA
N_TESER_PMM_01PG_PPA
FFO_OI_CV_12PG_CCA
LCD
_VS
YN
C
n_0TUOSER
5TAD_BSU_70PG_CCA4TAD_BSU_60PG_CCA
6TAD_BSU_01PG_CCA7TAD_BSU_11PG_CCA
n0SC_IPS_TB_32PG_CCA
NE_WS_PMA_72PG_CCA
n_1TUOSER
NE_PMA_KPS_31PG_CCA
2EKC_DS
XR_TRAU_00PG_PPAXT_TRAU_10PG_PPA
)7(D_2FIME)6(D_2FIME)5(D_2FIME
)7(ATAD_DS)8(ATAD_DS)9(ATAD_DS
)0(D_2FIME)1(D_2FIME
)3(D_2FIME
)5(D_2FIME
)7(D_2FIME
n_LMQD_DS
YDAER_FN
n_UMQD_DS
n_SAC_DS
n_EC_FN
n_SC_DS
n_SAR_DS
n_EO_ER_PMM_FN
n_EW_PMM_FN
n_EW_DS
1AB_DS
EKC_DS
ELC_FN
)0(ATAD_DS)1(ATAD_DS
)01(ATAD_DS)11(ATAD_DS)21(ATAD_DS)31(ATAD_DS)41(ATAD_DS)51(ATAD_DS
)2(ATAD_DS)3(ATAD_DS)4(ATAD_DS)5(ATAD_DS)6(ATAD_DS
KE
YIN
4
)1(RDDA_DS)2(RDDA_DS
)11(RDDA_DS)21(RDDA_DS)31(RDDA_DS
)3(RDDA_DS)4(RDDA_DS)5(RDDA_DS)6(RDDA_DS)7(RDDA_DS)8(RDDA_DS)9(RDDA_DS)01(RDDA_DS
ELA_FN
0AB_DS
CI_
D4
CI_
D5
CI_
D6
CI_
D7
CI_
PC
LKC
I_V
SY
NC
CI_
HS
YN
C
KE
YIN
0
KE
YO
UT
0K
EY
OU
T1
KE
YO
UT
2K
EY
OU
T3
KE
YO
UT
4
KE
YIN
1K
EY
IN2
KE
YIN
3
PEELS_CCAPEELS_PPA
0AB_DS1AB_DS
n_SC_DSKLC_DS
n_SAC_DS
n_EW_DS
EKC_DS
n_SAR_DS
n_LMQD_DSn_UMQD_DS
ELA_FN
n_EW_PMM_FN
YDAER_FN
SH
AR
ED
_I2C
_SC
LS
HA
RE
D_I
2C_S
DA
CI_
D0
CI_
RE
S_n
CI_
D1
CI_
D2
CI_
D3
TX
_AD
C_S
TR
B
WP
OW
_DE
T
US
B_D
AT
1
US
B_D
AT
2U
SB
_DA
T0
HSALFPPV
TADS
RF
_CT
RL_
DA
TAR
F_C
TR
L_S
TR
B
QD
ATA
_AM
P_M
SB
IDA
TA_F
RE
Q_M
SB
AM
P_L
SB
_FR
EQ
_LS
BD
CLK
_DA
TS
TR
WD
CD
C_E
N
WT
X_B
AN
D_1
_EN
WP
OW
_DE
T_E
N
KLCCTR
n_TSRS
0KLCSYS1KLCSYS1LATX_BSU
n_QERKLC_TB
TUOD_MCP_MCPHCNYS_MCP_MCPH
KE
YIN
5
KLCM
QERKLCM
n_QRI_CCAn_QRI_PPA
AC
C_P
CM
_CLK
AC
C_P
CM
_DLD
AC
C_P
CM
_SY
NC
AC
C_P
CM
_ULD
n_TSRRWPn_0TUOSER
n_2TUOSER
RF
_CT
RL_
CLK
WT
X_Q
_P
NOCD
)21(A_2FIME
ELC_FN
n_2SC_DS
)8(D_2FIME)9(D_2FIME)01(D_2FIME)11(D_2FIME)21(D_2FIME)31(D_2FIME)41(D_2FIME)51(D_2FIME
)31(A_2FIME
n_EO_ER_PMM_FN
KLC_0S2I
DLD_0S2IDLU_0S2ISW_0S2I
KLC_MCP_MCPH
NID_MCP_MCPH
PTS_BSU_00PG_CCARID_BSU_10PG_CCA
DP_SC_BSU_02PG_CCA
XR_0TRAU_20PG_CCAXT_0TRAU_30PG_CCA
TXN_BSU_50PG_CCA
WR
X_I
_NW
RX
_I_P
WR
X_Q
_NW
RX
_Q_P
AN
TS
W0
AN
TS
W1
AN
TS
W2
TNI_ETOMER_11PG_PPA
WT
X_I
_NW
TX
_I_P
WT
X_Q
_N
)31:1(RDDA_DS
)1(RDDA_DS)2(RDDA_DS)3(RDDA_DS)4(RDDA_DS)5(RDDA_DS)6(RDDA_DS)7(RDDA_DS)8(RDDA_DS)9(RDDA_DS)01(RDDA_DS)11(RDDA_DS)21(RDDA_DS)31(RDDA_DS
)51:0(ATAD_DS
)0(ATAD_DS)1(ATAD_DS)2(ATAD_DS)3(ATAD_DS)4(ATAD_DS)5(ATAD_DS)6(ATAD_DS)7(ATAD_DS)8(ATAD_DS)9(ATAD_DS)01(ATAD_DS)11(ATAD_DS)21(ATAD_DS)31(ATAD_DS)41(ATAD_DS)51(ATAD_DS
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 194 -
G
4
H
F
1
B
F
NAROZ ROF CD/CD
10.01.7002 DEVOMER 314C
7
C
21
884
9 21
C
9
10.01.7002 BCP NIAM NO DEVOM CD/CD
21
D
21
A
7
63
3
KCUBV morF
2 4
D
11
7
H
1
11
4
10.01.7002 ]7:0[D AGV = ]7:0[DCL
6
E
A
11
C
8
1
E
6
3
G
E
A
015
C
E
F
LATX zhM72
01
D
A
F
10.01.7002 0513BD NO DETCENNOC DCL
H
95
115
G
6
B
LE ROF CDCD
01
10.01.7002 ESU TíNTSEOD BSU NAROZ
21
10.01.7002 RZ HTIW DETCENNOCSID C2I MP BUS
KCUBV morF
7
H
B
2
015
B
82
9
D
3
G
u1.0204C
FB
400
214CIND
314C
VD
DE
_1V
8
21PKLCMVKLCPV
01P
21KSVV
XTA
LIN
H14 J14
XTA
LOU
T
u1.0
ADIV8P
BDIV8N
CDIV9P
01MDDIVEDIV
01N
FDIV9N11N
GDIV11P
HDIVIDIV
21N
JDIV7N8L
KDIVLDIV
31P
MDIV9L
31NNDIV
11MODIVPDIV
9M
F4
VD
DC
OR
E2
J11
VD
DC
OR
E3
L7V
DD
CO
RE
4
L6V
DD
Q1
D7
VD
DQ
2
M8
VD
D_C
IS
H4
VD
D_G
EN
ER
AL
VD
D_H
OS
TD
9
VD
D_L
CD
D6
VD
D_M
MC
G2
VD
D_N
AN
DK
10
VD
D_P
MU
D10
VD
D_S
ER
IAL
G4
VE
NB
YP
INE
13E
11V
EN
BY
PO
UT
FERHV21M
TD
OD
13
TE
ST
F14
TM
SE
14
TR
ST
ND
14
41GATADVT
31FFERVT
1LSTCTRAU
1MSTRTRAU
3NXRTRAU
4MXTTRAU
4PNDUPDU
3P
DIU6P7M
TESRU
SUBVU4J
D8
VD
DC
OR
E1
G13
RE
SE
TN
41NLCS
1GKLCSDMCS
2H
41PADS
1F0TADS
2F1TADS
5E2TADS3TADS
3F
2NKLCIPS
SCIPS3K
3JIDIPS
2LODIPS
PWS3G
TC
KD
11
TD
IE
12
NRWL4C
31MELANELCN
21L
31LNSCN
0DN41L
1DN01L
11K51DN
21J2DN3DN
21H41K
4DN5DN
21G
6DN31J
7DN31H
41MNBRN
11LNERN
31KNEWN
2C31DL41DL
5C6C
51DL61DL
3D1D
71DL
2DL6B4B
3DL4A
4DL5DL
3C
6DL3A2A
7DL8DL
1A2B
9DL
SHL4E
5DNDRL
SVL3E
3HKLCMCPH
1JIDMCPH
ODMCPH2J
SFMCPH1H
NDRH7B9B
NRWH
0AL4D
2ETCAL
1EKCL
N0SCL6A2D
N1SCL
5B0DL1DL
5A
1B01DL11DL
3B1C
21DL
01C1DH
01DH21B
11DH21A11B
21DH31DH
11A9C
41DH51DH
01B
21C2DH3DH
31C
4DH41C41B
5DH11C
6DH7DH
31B
8DH41A31A
9DH
7ANTNIGH
1OIPG3M7P
2OIPG3OIPG
1N1P
4OIPG5M
5OIPG6OIPG
6N6M
7OIPG8OIPG
5P
9OIPG5N
11AH01A9A
21AH31AH
8C
41AH7C
8BN0SCH
8AN1SCH
21D0DH
H7
GN
D10
H8
GN
D11
H9
GN
D12
J6G
ND
13G
ND
14J7
GN
D15
J8 J9G
ND
16
GN
D2
F7
GN
D3
F8
F9
GN
D4
G6
GN
D5
GN
D6
G7
G8
GN
D7
GN
D8
G9
GN
D9
H6
2P0OIPG
404U
2MKLCBA
3LIDA
ODA1K2K
SFA
AG
ND
_US
BC
L5A
GN
D_U
SB
TK
5
AG
ND
_VD
AC
F12
4NKLCMA
E10
AV
DD
_PLL
AV
DD
_US
BC
L4K4
AV
DD
_US
BT
AV
DD
_VD
AC
IH
11
AV
DD
_VD
AC
PG
11
F11
AV
SS
_PLL
GN
D1
F6
3543RZ
p8704C
204L
V1.6_GERV
R40
00
Hu7.4
p8C
419
804C8V1_EDDV0.
1u
Hu2.2
304L
R43
3
75
2.2u
CA
M_V
DD
_1.8
V
u1.0
C42
8
304C
5.1K
R40
6
R43
4
390
014Cu1.0
MM
P_V
DD
_CO
RE
_1.0
V
724C
V0.1_EROC_DDV_PMM
804PT
u2.2524C
p22
1uC
420
1uC
418
3NIVA
1NE11
2NE2
211BF2BF
1
6DNGP
01DOOGP
1WS8
2WS4
DNG_T31
NIV9
7MWPF_
V8.1_DDV_MAC
LMYAA_8322CIM304U
5DNGA
u7.4124C
270K
R42
9
TABV
604PT
130K
R42
7
V9.1_DDV_PMM
57V2_GDDV
614Cp01
0524R
0034R
DN
I
R41
5
404PT
304PT
p22924C
180K
R42
2
314PT
028C
0518R
IND
114Cp01
004PT
R43
2D
NI
VD
DG
_2V
75
114PT
004LHu01
134C
414C
p033
21
34
u1.0
0
FP9_zHM72_832-AF004X
zHM72
R41
3
104Cu1.0
0
R41
4
0R
401
NE4
DNG2
PG
ND
5
3NIV
1TUOV
TABV
004QTMY17049CIM
014PT
R41
71K
614R
K001
DN
IR
402
704PT
204PT
404Cu1.0 u01
504Cu1.0
004C
V0.1_EROC_DDV_PMM
u01904C
604Cp01
47K
R42
8
CA
M_V
DD
_1.8
V
20K
R40
4
u2.2224C DGNA
4
NE63
BFCN
5
TUO81
DNGP
WS7
9DNG_T
2NIV
1KR
418
004U
LMY0922CIM
624Cp22
424Cu1
0.1u
C41
7
MM
P_V
DD
_1.9
V
68K
R42
4
514Cu1.0
FB
401
034Cp033
V9.1_DDV_PMM
Hu7.4104L
324C
214PT
FF_TUOHTIW_CNYSH_ICFF_TUOHTIW_CNYSV_IC
KLCP_IC
)21(A_2FIME
u01
n_SC_PMM
n_TNI_PMM_20PG_PPA
NDWP_MAC_PMM
HCROT_DEL_HSALFNE_DEL_HSALF
NE_RWP_PMM_30PG_PPA
NE_RWP_MAC_PMM
FF_TUOHTIW_CNYSV_IC
CNYSV_IC
FF_TUOHTIW_CNYSH_ICCNYSH_IC
NE_CDCD_LE
TESER_HCUOT_50PG_PPA
NE_CDCD_LE
1D_IC2D_IC3D_IC4D_IC5D_IC6D_IC7D_IC
0D_IC
KLC_1S2I
HNI_DEL_HSALF
]8[ATAD_MAC_PMM
)0(D_2FIME
)51:00(D_2FIME
KLCP_MAC_PMM
MM
P_X
TAL_
OU
T
]6[ATAD_MAC_PMM
]4[ATAD_MAC_PMM
]2[ATAD_MAC_PMM
]11[ATAD_MAC_PMM]01[ATAD_MAC_PMM
N_TESER_MAC_PMM
CNYSH_MAC_PMMCNYSV_MAC_PMM
ADS_C2I_PMMLCS_C2I_PMM
NI_LATX_PMM
TUO_LATX_PMM
AP
P_G
P10
_MM
P_R
ES
ET
_N
KLC_MCP_MCPHCNYS_MCP_MCPH
NID_MCP_MCPHTUOD_MCP_MCPH
MM
P_X
TAL_
IN
TUO_VT
]9[ATAD_MAC_PMM
]7[ATAD_MAC_PMM
]5[ATAD_MAC_PMM
]3[ATAD_MAC_PMM
KLCM_MAC_PMM
DLD_1S2IDLU_1S2I
]0[ATAD_MAC_PMM]1[ATAD_MAC_PMM
n_EW_PMM_FNn_EO_ER_PMM_FN
)31(A_2FIME)41(A_2FIME
)11(A_2FIME
)51(D_2FIME)41(D_2FIME)31(D_2FIME)21(D_2FIME)11(D_2FIME)01(D_2FIME
)9(D_2FIME)8(D_2FIME)7(D_2FIME)6(D_2FIME)5(D_2FIME)4(D_2FIME)3(D_2FIME)2(D_2FIME)1(D_2FIME
SW_1S2I
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 195 -
21
A
W4/1
W4/1
saiV elpitluM esU
E
4
enalP dnuorG lacoL
.pmA rekaepS
7
E
H
7
DNG_TTAB
yromeM dna seilppuS O/I llA ot
A
latigid 0013FR dna 0003FR ot
2
65
DCL dna draC DS ot
G
01
BA ot esolC
%1
htooteulB ot
A
BA ot esolC
6
F
rotceteD rewoP AMDCW dna golana 0013FR ,0003FR ot
3
2102
LLP/CDA/sCEDOC 0003BA ot
D
A
21
8
C
3
11
D
G
21
4
%1
C
D
9
TSET_PTO
eludom CTR 0003BA ot
7 9
.pmA enohpdaeH dna RAEB 0003BA ,hctiwS llaH ot
5
dnuorg enohP
rotareleccA sixA 3
)zHM001@(mho021 8061
5
G
01
htap nruter
%1
8
F
1
riap laitnereffid a sa etuor
5
J1NS121GP81MLB
9
%1
3 niP ot esolC
B
C
6
H
31
C
E
1
9
Clo
se to
Pin
1
H
sODL .txE dna ,hctiwS TMR/BSU ,pmA rekaepS ,sthgilkcaB ,MAP MSG & AMDCW ot
F
B
2
D
21
01
EROC 0013BD ot
F
7
B
1
.nnoC yrettaB
4
2102
4
DNG LLP_SSV & GID_SSV etarapeS
V01
32
golana 0013BD ot
11
G
%1
%1
6 8
E
%1
82
riap laitnereffid a sa etuor
11
11
01
B
%1
%02 ?A7.0 0.1*6.2*8.2
H
57V2_BMS_HDDV
Hu7.4005L
205C
n74135C
u1
51915R
TABV
915Cp74
SSAPYB1C
DNG2B
2C+NI
3C-NI
3ADDV
+OV3B
-OV1A1B
NWODTUHS_
TABV
RVQZ1A5026APT005U
0805R3060
D50
0
RB
521S
-30
R50
0
100K
415Cu01
K74515R
1.0315R
3060u1.0815C
u7.4
005C
TABV
56V2_CDDV
8V1_DARGIDV
u1325C
405Cu7.4
1uC
537
505R
K2.2
u1
100K
R52
3
3060
505C
220n
C53
6
p42315C
u1.0515C
3060
0
705R
3060
005BF
K74415R
5V1_DDDV
3060
205PT
K01125R
0115R3060
K93715R
47K
R52
5
3060
8V2_ADARV
n74425C
105QJD119AIS
1D
2D
3D
4D
1G
2G
1S
2S
5V2_FDDV
G1
G2
1 2 3
C_TABV
CN
500
0215R
905R
p42215C
520.0
505PT
335CIND
3060
0
405R
57V2_KDDV
u1105C
2
3
1
905Cu1
005QUA2222NTK
405PT
u1015C705C
305PT
u1
u1
8V1_EDDV
225C
805PT
57V2_GDDV
905PT
u1.03060 22
p
625C
C53
0
5A2
20B2
31B2
DNG4
1S7
2S6
CCV9
300K
R50
6
XMUT8622ASF105U
A1801
0B1
11B1
615R
51
n01535C
3060
56V2_CDDV
025Cu1
33u
C51
7
u1
100
R50
1
605Cu1
21
805C
005X
zHK867.23
615Cu01
D50
1
KD
S22
1E_R
TK
3A1_
C2
2
A2
C1 1
TABV
u2.2305C
TABV
51815R22p
C52
7
Fn33
TABV
115C
R52
210
0K
3060
5V1_DDDV
C52
822
p
22p
C_TABV
5V1_DDDV
C52
9
TABV
8V1_EDDV
EROCV
u2.2525C
u1.0435C
3060
3060 K01025R
K93425R
n74235C
VS
S_C
L7V
SS
_CO
DE
C
VS
S_D
G3
D7
VS
S_D
IG
VS
S_P
LLL1L4
VS
S_S
PK
RN
L2V
SS
_SP
KR
P
TSOOB_V3B
1SW3D
2SW3C
21K1LATX2LATX
11K
TSOOBSSV
KCUBSSV1B
F7
VS
ST
H1
H6
VS
ST
H10
VS
ST
H11
G5
VS
ST
H12
F5
G7
VS
ST
H2
VS
ST
H3
G6
VS
ST
H5
E6
VS
ST
H6
E7
VS
ST
H7
F8
G8
VS
ST
H8
H7
VS
ST
H9
E10
VS
S_A
VS
S_B
K1
VS
S_B
EA
RM
5
C6
6L
RAEB_DDV5K
11AC_DDV
8MCEDOC_DDV
21FD_DDV
3EGID_DDV
E_DDV21D
9AF_DDVG_DDV
7A
21BH_DDV
9FOI_DDV
K_DDV21M
LLP_DDV1M
RKPS_DDV3L
B6
VIB
R
01DFERV
5E
1G
H11
TX
ON
A_TABV11D
21EB_TABV
5AC_TABV
D_TABV1H
E_TABV21A
8AF_TABV
11MG_TABV
KCUBV2B
SUBV1J
C8
VD
DA
DC
2AKCUBDDV
11JPLDDV
21CA_DDV
7J1CDA_DDV
32CDA_DDV
2ODS
KLCMIS5H
TADMIS2H
01GN_FFOMIS
N_TSRMIS2J
CCVMIS1F
J10
SLE
EP
AS
LEE
PB
L12
NRKPS3M2M
PRKPS
2KN_TSRS
C11
SU
BG
2S
UB
2
4ATSOOBWS
1AKCUBWS
8ETSET
ELKCIRT
RDIM
01C1DOM
ON
SW
A_N
C7
ON
SW
B_N
B8
ON
SW
CG
9
SAIBP1D
H9
PW
RR
ST
_N
1KCS4D
4E2KCS
H10
SC
L
KLCS3J
SD
AH
12
3KTADS
1IDS2C
2D2IDS
1ODS1C
4F
J9
IRQ
B_N
L11
LED
1A
6
LED
2D
6B
7LE
D3
01L1NIENIL
01K2NIENIL
K4
MC
LK
N1CIM8J8K
P1CIM
N2CIM9M
P2CIM8L
N3CIM8H
01MP3CIM
9LN4CIM
9KP4CIM
5L
3F
3CED5J4J
4CED
ODLTXE11B
21G+ESNESGF
11G-ESNESGF
D8
GP
A0
A10
GP
A1
GP
A12
F10
GP
A2
B10
GP
A3
C9
D9
GP
A4
E9
GP
A5
GP
A6
F11
E11
GP
A7
FERI3H
IRQ
A_N
6K
2OXUA6M
ATADB4H
6JNRAEBPRAEB
4M
5D+BF_TSOOB
5B+ESNESI_TSOOB
5C-ESNESI_TSOOB
4C1WS_TSOOB
4B2WS_TSOOB
3A3WS_TSOOB
7M1OCC2OCC
7K
GERHC2E
1E+ESNESHC
2F-ESNESHC
OICD
B2R-0003BA
205U
21JZHK23
B9
AD
OU
T
G4
AD
ST
R
1OXUA
105PT
TABV
D50
2
RB
521S
-30
R_RAEL_RAE
ELKCIRT
P1CIMN1CIM
EROCV
A_NICD
SU
B_L
ED
CCVMIS
KE
Y_L
ED
1K
EY
_LE
D2
ELKCIRT
NICD
MO
TO
R_P
WM
SH
AR
ED
_I2C
_SD
A
N2CIMP2CIM
NRAEB
NE_WS_PMA_72PG_CCA
NE_PMA_KPS_31PG_CCA
PRKPS
NRKPS
RDIM
SW_0S2I
SW_1S2I
PUKCABV
TABV
+VCR_KPS
-VCR_KPS
PRAEB
8V2_ADARV
56V2_CDDV
8V1_DARGIDV
5V1_DDDV
8V1_EDDV
5V2_FDDV
57V2_GDDV
57V2_BMS_HDDV
57V2_KDDV
DLU_1S2I
DLD_0S2I
DLD_1S2I
KLCMIS
TADMIS
n_TSRMIS
AC
C_S
LEE
PA
PP
_SLE
EP
NRKPSPRKPS
n_TSRS
TX
_AD
C_S
TR
B
SUBV
SY
SC
LK1
PR_MF
PL_MF
ON
SW
A_n
ON
SW
B_n
DC
ON
PW
RR
ST
_n
KLC_0S2I
KLC_1S2I
SH
AR
ED
_I2C
_SC
L
KLCSTADS
DLU_0S2I
KLCCTR
AD
OU
T
HO
OK
RE
MO
TE
_AD
C
NRAEBPRAEB
1OCC2OCC
TE
ST
OU
TR
TE
MP
VB
AC
KU
P
AC
C_I
RQ
_nA
PP
_IR
Q_n
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 196 -
F
A
7
CDA_TMR/MD_BSU
11
G
A
E
V2.4+_TABV
YRETTAB PU_KCAB
6
9
B
42
8
L_RAE
D
1
3
A
1
B
21
21
9
CIM_SH
E
%1
XR_TRAU
HSALFPPV
C
3
H
7
TNI_TMR/PD_BSU
9
V5+_GHCV
)81.90.7002(TUO_VT
n_BWSNO
V01
8
F
3
F
2
H
1
%1
54
7
E
21
D
116
R_RAE
3
G
21
A
1%
DNG
5
G
NICD dna TRAU rof retliF DSE/IME
CDA_TMR/MD_BSU
C
F
015
2
G
n_TCETED_RAE
7
PU
LL-U
P R
EM
OV
ED
200
7.10
.01
2
detnuom eb dluohs CCA
V2.4+_TABV
H
6
01
deepS hgiH rof reviecsnarT BSU
rotcennoc ot raen
114
H
11
4
6
01
5 81
TNI_TMR/PD_BSU
01
E
8
TNA_MF
XT_TRAU
V5+_GHCV
REWOP_BSU
9
8V1_EDDV
0
616R
306BF
3060
K022026R
IND
888R
u1.0016C
8V1_EDDV
3060
R62
1
0
206BF
VA
603
ULC
E05
05C
015F
R
0.1u
C60
4
516C
IND
3060
006BF
006AVRF510C5050ECLU
K2.2
818R
u1u2.2918C
818CEC6
21DNG
52DNG
4CN
DDV31
TUOV
u1.0
D181D4111R308U
56789
TABV
3060
906C
1
011121314151617181
91
2
02
34
CP52-40S81-JESH
006NC
u7.4106C
ULC
E05
05C
015F
R
VA
602
C62
022
p
u10.0426C
106BF
74618R
506BF
C62
222
p
074016R
816C
IND
326Cu1
E_OICD5B5C
I_OICD
E_SMFD2A
I_SMFD3D
1AE_SMTD
2DI_SMTD
B2
GN
D1
GN
D2
B3
B4
GN
D3
C1
GN
D4
GN
D5
C2
VC
CC
4
5AE_SLFPPVI_SLFPPV
5D
006U2C-2ETTANK
E_SMFC4A4D
I_SMFC
3AE_SMTC
3CI_SMTC
E_NO_STC1B
I_NO_STC1D
R60
351
K
406BF
RS
B6.
8CS
T2R
ZD
600
0206R
R60
6
TABV
3060
12K
+1DSH
7-1DSH
2+2DSH
-2DSH6
LES01
9CCV
8EO_
R62
2
DN
I
206UXMU03BSUSF
+D3
-D5
DNG4
1
0.1u
C60
3
4.7u
3060
C60
2
106PT
006TAB
716C
526R
0
u1616C
u1.0
0
916R
074216R
74718R
IND006R
IND406R
3060
5.6K
R61
7
3060
VA
601
ULC
E05
05C
015F
R
R61
3D
NI
8V1_EDDV
22p
C62
1
u001416C
3060
R61
4D
NI
3060u1.0006C
916Cu2.2
K74
706R
006PT
8ETAG
TUO_ETAG9
2DNG
1NI1
2NI4
53NI
1CN1121
2CN
61TUO
2TUO7
01NE_
GALF_3
306UG2RTM843PCN
806C
K1816R
3060n01
Hn072006L
4.7u
C60
6
K1506R
DN
I
R62
3
L31BFSU006D
0.1u
3060
C60
5
TABV
R62
4
0
K3.3
516R
0106R
6D
TSET4C
4FSUBV
VC
CF
3
5B1OI_CCV2OI_CCV
2B
5F1LATX2LATX
6F
3060
7ATAD
5ERID
MD1C1D
PDTLUAF
2E
GN
D1
C5
D2
GN
D2
GN
D3
E4
3DDI
NC
1F
1F
2N
C2
5DN_WSPTXN
4D
6E8V1FER
3E3V3GER
2CFERR
PTS
0GFC1E
4B1GFC2GFC
3B
LES_PIHC3C4A
KCOLC0ATAD
1B1A
1ATAD2ATAD
2A3A
3ATAD4ATAD
5A6A
5ATAD6ATAD
6B6C
21CN
33CN2CN
67
4CN1TUO
8
52TUO
PG
ND
9
TEA8051PSI106U
NM4112FUN106LF
1NI1
2NI4
p22116C
2.2u
C60
7
u001316C
CDA_ETOMER
AP
P_A
CC
_UA
RT
_RX
AP
P_A
CC
_UA
RT
_TX
TNI_ETOMER_11PG_PPA
2OCC
P2CIM
KOOH
RDIM
PUKCABV
XR_TRAU_CCA_PPA
XT_TRAU_CCA_PPA
TUO_VT
XRT_BSU_SUBV
A_NICD
ESNESFHP_71PG_CCA
PD_BSU
MD_BSU
L_RAE
R_RAE
N2CIM
XT_TRAU_10PG_PPA
XR_TRAU_00PG_PPA
HSALFPPV E_HSALFPPV
n_BWSNO
NICD A_NICD
SUBV
TNA_MF
XR_TRAU_CCA_PPAXT_TRAU_CCA_PPA
E_HSALFPPV
NO_STC
TXN_BSU_50PG_CCAPTS_BSU_00PG_CCA
1LATX_BSU
XT_0TRAU_30PG_CCA
XR_0TRAU_20PG_CCA
NO_STC
MD_BSU
XRT_BSU_SUBV
PD_BSU
DP_SC_BSU_02PG_CCAKLC_BSU_40PG_CCA
0TAD_BSU1TAD_BSU2TAD_BSU3TAD_BSU_22PG_CCA4TAD_BSU_60PG_CCA5TAD_BSU_70PG_CCA6TAD_BSU_01PG_CCA7TAD_BSU_11PG_CCA
RID_BSU_10PG_CCA
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 197 -
RWPDXRUDXTU
G3G5.2
DNGXRXTRAHCVWS_NOTABV
2#OIPG htiw C2I LES-P
E
F
7 11
F
H
6001NC BCPF edilS oT
3
C
2
9
A
1101
elameF_ROTCENNOC nip 02
D
3
4
H
2 8
G
8
4
H
YEK_EDIS
1#OIPG htiw C2I neercS hcuoT
ODL_HCUOT
1
E
F
219
1 4
3 8
D
6
11
C
D
6
B
G
2
2#OIPG htiw C2I nottuB hcuoT
B
elameF_NOC_EDILS
REWOP AREMAC M5
01
G
1
C
98
E
D
C
75
H
21
4 7
01
219
G
7
ECAFRETNI AREMAC M5
21
11
V6.2_ODL DCL
6
3
E
012
TNIOP DAOLNWOD
5
PT tset noitcennoc FCA roF
5
BCP YEK_NIAM ot
F
hgiH evitcA
ROTCENNOC NIAM OT DRAOB_ECILS
1
GATJ
109NC BCP tekcoS oT
5
6
A
1uC
724
D113D4111R007U
EC6
1DNG2
2DNG5
4CN
1DDV
3TUOV
01507R
VG
A_V
DD
_1.8
V
3060
8797
8
08
9
TABV
8V1_EDDV
2636465666768696
7
0717273747576777
94
5
05152535455565758595
6
0616
33435363738393
4
140424344454647484
2
02122232425262728292
3
031323
207NC
1
01112131415161718191
TO
UC
H_3
.1V
IND
0007R
517C
NIV1
1TUOV87
2TUOV
VA
704
EV
LC14
S02
050
WQPGM-1109TR
21NE2NE
35
DNG1CN4
2CN6
PG
ND
9
307JO
307U
VA
703
EV
LC14
S02
050
IND317R
C71
1
3060p01
C71
81u
2G1G
4G3G
117PT
31
41
51
61
71
81
912
02
3
4
5
6
7
8
9
V1.3_HCUOT
007NC
1
1101
21
FB
700
TABV
1B_TUONI9
82B_TUONI
3B_TUONI7
64B_TUONI
527PT
RF001R070E48101EVCI
5G
110
G2
11A_TUONI
2A_TUONI2
33A_TUONI
44A_TUONI
6EC
1DNG2
2DNG5
CN4
1TUOVDDV
3
CA
M_V
DD
_1.8
V
007LF
TABV
F-RT-D182D4111R207U
VA
705
SIM
VC
C
EV
LC14
S02
050
607CIND
TABV
F-RT-D162D4111R107U
6EC
1DNG2
2DNG5
CN4
1TUOVDDV
3
VA
700
ICV
L051
8100
Y50
0FR
IND417R
207JO
p01
C70
8
VD
D_L
CD
_2.6
V
VB
AT
3060
IND417C
C72
2
427PT
788 9
TABV
1u
63 64 65 66 67 68 697 70 71 72 73 74 75 76 77495 50 51 52 53 54 55 56 57 58 596 60 61 6234 35 36 37 38 394 40 41 42 43 44 45 46 47 482 20 21 22 23 24 25 26 27 28 293 30 31 32 33CN
704
1 10 11 12 13 14 15 16 17 18 19
0107R
VG
A_V
DD
_2.8
V
007JO
VA
701
306001707R
ICV
L051
8100
Y50
0FR
VD
DG
_2V
75
127PT
01607R3060
3060
01407R
VD
DE
_1V
8
307NC1234
V8.1_DDV_MACV8.2_FA_DDV_MAC
u1717C
3060
C70
9
p01
G1
5
G2
10
1A_TUONI1
22A_TUONI
33A_TUONI
4A_TUONI4
91B_TUONI
2B_TUONI8
73B_TUONI
4B_TUONI6
TO
UC
H_3
.1V
u1.0207C
207LFRF001R070E48101EVCI
V8.2_FA_DDV_MAC
3060
33207R
IND507C
R71
00
V1.3_HCUOT
V8.2_DDVA_MAC
017PT
V1.6_GERV
227PT
VA
702
ICV
L051
8100
Y50
0FR
407C
3
0313233343
456789
3060u1.0
5161
817191
2
02122232425262728292
107NC1
0111213141
907PT
1uC
723
57V2_BMS_HDDV
u1307C 007C
V6.2_DCL_DDV
VR
EG
_6.1
V
u01
IND217C
617C
107JO
u1
1CN4
72CN
3CN89
4CN
5WS_NO
11STR
XR23
XT
TABV6
57V2_GDDV
007TRU
STC21
RSD01
1DNG
VD
DH
_SM
B_2
V75
TABV
707Cu1.0
807PT
CA
M_A
VD
D_2
.8V
3060
1uC
719
V8.2_DDV_AGV
R70
9D
NI
VG
A_V
DD
_1.8
V
317CIND
01
VG
A_V
DD
_2.8
V
307R
3A_TUONI
4A_TUONI4
91B_TUONI
82B_TUONI
3B_TUONI7
64B_TUONI
8V1_EDDV
RF001R070E48101EVCI107LF
G1
510G
2
11A_TUONI
2A_TUONI2
3
u1.03060
107C
327PT
627PT
p01
C72
1
3060
C71
0
1u 1u
NE_RWP_MAC_PMM
C72
0
N1CIM
1OCC
4TUOYEK
0NIYEK
1NIYEK
2NIYEK
3NIYEK3TUOYEK
ESNESPILF_51PG_CCA
MD_BSUPD_BSU
DI_DCL_21PG_PPA
0TUOYEK0NIYEK1NIYEK
0TUOYEK
1NIYEK0NIYEK
P1CIM
2TUOYEK
1TUOYEK
2DEL_YEK
1DEL_YEK
WLE
D4
WLE
D3
WLE
D2
WLE
D1
WLE
D5
GA
IN1
GA
IN2
SB
IAS
SE
NS
FLA
SH
_LE
D_T
OR
CH
FLA
SH
_LE
D_E
NF
LAS
H_L
ED
_IN
H
MIC
RO
SD
_CLK
AP
P_G
P13
_MC
_CLK
RE
T
SU
B_L
ED
MIC
RO
SD
_DA
T_D
IR
MIC
RO
SD
_CM
D_D
IR
CT
S_O
N
AP
P_A
CC
_UA
RT
_RX
AP
P_A
CC
_UA
RT
_TX
MO
TO
R_E
N
MO
TO
R_P
WM
SU
B_P
M_R
ES
ET
B
LCD
_PW
M
WLE
D_P
WR
MO
TO
R_P
WR
+
AP
P_I
2C_S
DA
AP
P_I
2C_S
CL
AP
P_G
P07
_3A
XIS
_IN
T
SIM
DA
TS
IMR
ST
_n
SIM
CLK MIC
RO
SD
_DA
T0
MIC
RO
SD
_DA
T1
MIC
RO
SD
_DA
T3
MIC
RO
SD
_DA
T2
MIC
RO
SD
_CM
D
N_TESER_DCL
N_SDA_DCLN_SC_DCLN_EW_DCL
MWP_DCL
RWP_DELW
4DELW3DELW2DELW1DELW
5DELW
MO
TO
R_P
WR
-
CNYSH_MAC_PMMCNYSV_MAC_PMM
ADS_C2I_PMM
KLCM_MAC_PMM
]0[ATAD_MAC_M5]1[ATAD_MAC_M5]2[ATAD_MAC_M5]3[ATAD_MAC_M5
]4[ATAD_MAC_M5]5[ATAD_MAC_M5]6[ATAD_MAC_M5]7[ATAD_MAC_M5
]9[ATAD_MAC_PMM]8[ATAD_MAC_PMM
]0[ATAD_MAC_PMM]1[ATAD_MAC_PMM]2[ATAD_MAC_PMM]3[ATAD_MAC_PMM
]4[ATAD_MAC_PMM]5[ATAD_MAC_PMM]6[ATAD_MAC_PMM]7[ATAD_MAC_PMM
KLCP_MAC_PMM
]8[ATAD_MAC_M5
]1[ATAD_MAC_M5
]3[ATAD_MAC_M5
]5[ATAD_MAC_M5
]7[ATAD_MAC_M5
]0[ATAD_MAC_M5
]2[ATAD_MAC_M5
]4[ATAD_MAC_M5
]6[ATAD_MAC_M5
]11[ATAD_MAC_PMM]01[ATAD_MAC_PMM
]11[ATAD_MAC_M5]01[ATAD_MAC_M5
LCS_C2I_PMM
]9[ATAD_MAC_M5]8[ATAD_MAC_M5
LCS_NOTTUB_HCUOT
TSR_HCUOTADS_NOTTUB_HCUOT
N_DR_DCLCNYSV_DCL
NDWP_MAC_PMM
N_TESER_MAC_PMM
]11[ATAD_MAC_M5]01[ATAD_MAC_M5]9[ATAD_MAC_M5
n_AWSNO
]0[ATAD_DCL]1[ATAD_DCL]2[ATAD_DCL
]4[ATAD_DCL
]6[ATAD_DCL
]3[ATAD_DCL
]5[ATAD_DCL
]7[ATAD_DCL
LCS_NEERCS_HCUOTADS_NEERCS_HCUOT
TNI_NEERCS_HCUOT
KLCP_IC
CNYSV_ICCNYSH_IC
n_SER_IC
LCS_C2I_PPAADS_C2I_PPA
FFO_OI_CV_12PG_CCA
1TUOYEK2TUOYEK4NIYEK5NIYEK
2D_IC3D_IC4D_IC5D_IC
7D_IC6D_IC
+VCR_KPS-VCR_KPS
+RWP_ROTOM-RWP_ROTOM
0KLCSYS
SAIBS
RWP_DELW
0TAD_DSORCIM
TADMIS
SNES
1NIAG
+RWP_ROTOM
1NIAG2NIAG
SAIBSSNES
0D_IC1D_IC
A_NICD
SUBV
NO_STC
XR_TRAU_CCA_PPAXT_TRAU_CCA_PPA
E_HSALFPPV
NE_RWP_MAC_PMM
NE_ODL_HCUOT_21PG_CCA
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 198 -
01
4 8
E
43 5
G
8
A
11
G
A
7
21
1 11
F
6
D
C
01 2195
H
65
H
E
4 9
D
7
C
2
C
01
7
)oidaR MF+( htooteulB
D
2
11016
6 117
3
F
5 21
D
C
E
21
B
NOITPO PSSI
1
2
EGNAHC TON OD
B
F
G
21
E
1
H
9
3 8
G
F
43
8
9
retfihS leveL NEERCSHCUOT
H
608PT
8V1_EDDV
108PT
FR_TB_SSV
IND108C
408C
118PT
u1.0
FR_TB_SSV
IND118R
C81
0
1C3407-TB054212AED008LF5
1PB
4CD_PB2PB
2
3G
16
G2
1PB_U
0.1u
808C
C80
31n
H
u1.0
R80
22.
2K
908PT
208CHn9.3
IND218R
208TUO
8V1_EDDV
FR_TB_SSV
008CIND
R80
4
0
9EKLCS_MF
OIDS_MF8D
BNES_MF9D
4AAV_MFDV_MF
3B
OIV_MF6D
4D1CN2CN
7F8F
3CN4CN
4L
5CN5L6L
6CN
1DNG_MF3A4B
2DNG_MF3DNG_MF
6B7B
4DNG_MF4C
5DNG_MF6C
6DNG_MF7C
7DNG_MF8DNG_MF
5D
1OIPG_MF7A6A
2OIPG_MF3OIPG_MF
5A
TUOL_MF5B
KLCR_MF7D
8CDNGFR_MF
5CTUOR_MF
9CBTSR_MF
2F5ANASSV_TB6ANASSV_TB
3F4F
7ANASSV_TB8ANASSV_TB
1G3G
9ANASSV_TB
6H1GIDSSV_TB
7H2GIDSSV_TB3GIDSSV_TB
8H8K
4GIDSSV_TB8L
5GIDSSV_TB
1FRSSV_TB1H1L
2FRSSV_TB3FRSSV_TB
2J2K
4FRSSV_TB
PUEKAW_TB9L
8BPIMF_MF
6JSTR_TRAU_TB
DXR_TRAU_TB9H
7GDXT_TRAU_TB
DLC_DDV_TB6E
6MA_OIV_TBB_OIV_TB
9J
C_OIV_TB3N5N
D_OIV_TBE_OIV_TB
8G
1ANASSV_TB1D
01ANASSV_TB4G3H
11ANASSV_TB4H
21ANASSV_TB
2D2ANASSV_TB3ANASSV_TB
3E
4ANASSV_TB1F
4MKLC_MCP_TB
4NCNYS_MCP_TB
NI_KLC_FER_TB6F
LRTC_GER_TB4J
7KNTESER_TB
1JNFR_TBPFR_TB
1K
1LC_RVSR_TB2B3C
2LC_RVSR_TB8M
D_RVSR_TBMSD_RVSR_TB
1C2C
N_RVSR_TBFR_RVSR_TB
2M
1TSET_TB2H2G
2TSET_TB
STC_TRAU_TB6K
9G0_OIPG_TB
4K01_OIPG_TB
3K11_OIPG_TB
61_OIPG_TB3J3L
8_OIPG_TB
9_OIPG_TB3M
PUEKAW_TSOH_TB8E
1AVH_TB2L3D
2AVH_TB3AVH_TB
1E2E
4AVH_TB4E
5AVH_TBDVH_TB
7N
KLC_PL_TB9K
A_MCP_TB5K5M
B_MCP_TB
108U
GRP_FA_TB6G
1_NI_QER_KLC_TB7E9F
2_NI_QER_KLC_TB
7J1_TUO_QER_KLC_TB
8J2_TUO_QER_KLC_TB
1_GIFNOC_TB7L
2_GIFNOC_TB7M6N
3_GIFNOC_TB
C81
422
n
3952CLTS
u1
018PT
R80
8
100K
8V1_EDDV
218C
218PT
8V1_EDDV
57V2_KDDV
TABV
008LHn3.3
318PT
R80
70
C81
712
0p
408PT
57V2_KDDV
10p
108L
C81
6
p2.1
8V1_EDDV
8V1_EDDV
22n
C81
5
C80
90.
1u
008BF06
708PT
C80
60.
1u
R80
02K
01318R
01418R
2.2K
R80
1
u1.0318C
FR_TB_SSV
ANA_TB_SSV
TO
UC
H_3
.1V
u1118C
1A1A
2A2A
3A3A
A4
A4
1C1B
C2
B2
B3
C3
B4
C4
4BDNG
3BEO
VC
CA
B2
B1
VC
CB
ANA_TB_SSV
008URUXZE4010SXT
0.1u
C80
5
508R
0
1u
418PT
C80
7
308R
0
308TUO
108TUO
ADS_NEERCS_HCUOT_NI
TSR_HCUOT
NE_ODL_HCUOT_21PG_CCA
LCS_NEERCS_HCUOT
ADS_NEERCS_HCUOT
LCS_NEERCS_HCUOT_NI
PL_MFPR_MF
TESER_HCUOT_50PG_PPA
LCS_NEERCS_HCUOT_50PG_PPA
ADS_NEERCS_HCUOT_61PG_PPA
TNI_NEERCS_HCUOT
LCS_NEERCS_HCUOT_NI
ADS_NEERCS_HCUOT_NI
2OIPG_MF_61PG_CCA
1TAD_IPS_TB_52PG_CCA
KLC_IPS_TB_62PG_CCA
n0SC_IPS_TB_32PG_CCA0TAD_IPS_TB_42PG_CCA
LCS_NOTTUB_HCUOT
ADS_NOTTUB_HCUOT
n_1TUOSER
LCS_C2I_PPA
ADS_C2I_PPA
KLC_TB
TNA_MF
TNI_NEERCS_HCUOT_40PG_PPA
n_QERKLC_TB
TNI_IPS_TB_41PG_CCA
KLCCTR
DLD_MCP_CCADLU_MCP_CCA
KLC_MCP_CCACNYS_MCP_CCA
n_2TUOSER
KLCCTR
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 199 -
DNG
NI
TUO
H
EE
ROTCENNOC NIAM OT DRAOB_ECILS
8
6
DEL HSALF AREMAC
1
G
3
2
F
20.01.7002 DSORCIM ROF RETFIHS LEVEL
5
C
21
DEL BUS
2 7
G
H
4
F
9
2 7
D
BCP_TEKCOS
THGILKCAB DCL
E
B
6
E
DS ORCIM
C
93
F
21
3
1
G
4
54
9
C
8
B
01 21
F
5
3 01
8
PT noitcepsni tcudorP roF
G
MISU
7
H
11
8 9 01
A
1
C
2
retemorelecca-sixa-eerhT
11
6
6
TIUCRIC ROTOM
PT tset noitcennoc FCA roF
DD
307NC NIAM morF
D
H
114
017 115 21
A
rotalugeR tnerruC pU-petS
1
719PT
2DZ
R2TSC8.6BSRR2TSC8.6BSR
1DZ
R91
2
390
DNG34
TNI
1CN011
2CN
11N
OT
1N
OT
212
KCS6
8IDS
7ODS
2OIDDVDDV
9
051AMB109U
BSC5
57V2_BMS_HDDV
TABV
VD
DG
_2V
75
R93
0
0
VA
908
EV
LC18
S02
015
n22509C
03-SC125BR 539R0
VB
AT
129C
u1
CCVMIS
u1029C
R91
310
K
239R0
VD
DH
_SM
B_2
V75
1
VD
DE
_1V
8
R91
610
0K
009QU201XRK
2
54
3
319C
V8.2_DDV_AGV
57V2_GDDV
u10.0
709C
u1
0439R03-SC125BR
VA
910
EV
LC18
S02
015
V8.2_DDV_AGV
829R0
u2.2
CCVMIS
8V1_EDDV
519C
709PT
819C
DN
I
R94
2
u1
u1
309C
719C
TABV
u1.0
229C
019PT
u1
609PT
319PT
K15429R
100K
R93
8
009AV05020S41CLVE
u2.2429C
0
R91
1
34
5
6
V8.1_DDV_AGV
009D
F4050RLP
1
2
R?
DN
I
CCVMIS
TABV
609C
1KR92
3
p22
K001919R
519PT
909C
p33
DN
I
R91
0
529Cn74
EV
LC18
S02
015
VA
909
339R0
1uC91
1
919C
TABV
57V2_GDDV
R90
9D
NI
u1.0
139R0
VG
A_V
DD
_1.8
VV
GA
_VD
D_2
.8V
V1.3_HCUOT
5.1K
R92
0
R90
7
470K
909PT
8V1_EDDV
V1.3_HCUOT
KLC5
DMC3
0TAD78
1TAD1
2TAD2
3TAD
91DNG
012DNG
113DNG4DNG
21
DDV4
SSV6
009J
910
R92
7
509PT
K15529R
R? 0
KLC3
4DNG
1DNG78
2DNGO_I
62
TSR
1CCV
PPV5
05020S41CLVE109AV
109J
2 4 6 8
1 3 5 7
DN
I
R94
1
RA
1
100K
409Cu1.0
VA
907
EV
LC18
S02
015
009DL
109LHu1
109PT
209PT
009R
mho001
SIM
VC
C
TO
UC
H_3
.1V
929R0
C91
610
u
329Cu2.2
809PT
639R
0
110K
R92
6
EV
LC18
S02
015
VA
911
SAIBS5F
5DLCS
4DADS
5EDNGS
SNESS3F
A1
T1
A6
T2
T3
F6
F1
T4
4F1TABV
PCTABV5B
ODLTABV1E
6EOIV
4BTUOV
NIMWPW1D
57V2_BMS_HDDV
N3C4A
P3C5A
3ADNGPC
TNCHSALF3D
1CG4E3E
2CG
O1ODL2F
O2ODL2E
2D1DEL
2C2DEL3DEL
1C
4DEL1B
5DEL2B2A
LFDEL
3BDNGDEL
BTESER4C
LUG5906DB
309U
N1C6D5C
P1C
6CN2CP2C
6B
809C
p33
11
DNG9
15G
_SLU
G5NIXL
6
TUO87
DNGP
41TESR
V1.3_HCUOT
1T-OFI0721TAA
DNGA4
1TC
2TES_NE
NELF213
DNGLF
HNILF01
ATUOLF31
BTUOLF
119PT
409U
109DL
419PT
5 7
IND419C
2 4 6 8
1 3
1CSSAPYB
2BDNG
+NI2C
3CDDV-NI
3A
3B+OV
1A-OVNWODTUHS_
1B
RA
2
100K
RVQZ1A5026APT209U219Cu10.0
R94
0
100K
8V1_EDDV
200K
R93
7
009L
0
2CBDMC
RID_DMC5B
2BB0TADA0TAD
2DRID_0TAD
5C
RID_321TAD1C
A1TAD1D2A
B1TAD4B
B2TADA2TAD4C
4AA3TAD
4DB3TAD
1DNG3B
2DNG3C
5AACCV
5DBCCV
219PT
RYXZE604ACVA47NS009U
3AAKLC
3DBKLC
F_KLC1A
ADMC1B
109C
73 74 75 76 77 788 9
u1.0
6 60 61 62 63 64 65 66 67 68 697 70 71 7244 45 46 47 48 495 50 51 52 53 54 55 56 57 58 593 30 31 32 33 34 35 36 37 38 394 40 41 42 4315 16 17 18 192 20 21 22 23 24 25 26 27 28 29
CN
11 10 11 12 13 14
C
E
VA
905
EV
LC18
S02
015
E204CRK
109Q
B
3TAD_DSORCIM_LAERDMC_DSORCIM_LAER
0TAD_DSORCIM_LAER
ADS_BMS
KLC_DSORCIM_LAER
BTESER_MP_BUS
DMC_DSORCIM
0TAD_DSORCIM
1TAD_DSORCIM2TAD_DSORCIM
0TAD_DSORCIM_LAER
1TAD_DSORCIM_LAER2TAD_DSORCIM_LAER
DMC_DSORCIM_LAER
3TAD_DSORCIM_LAER
1TAD_DSORCIM_LAER2TAD_DSORCIM_LAER
HNI_DEL_HSALF
DEL_BUS
-RWP_ROTOM
+RWP_ROTOM
WLE
D3
WLE
D2
WLE
D1
WLE
D5
GA
IN1
GA
IN2
SB
IAS
SE
NS
FLA
SH
_LE
D_T
OR
CH
FLA
SH
_LE
D_E
NF
LAS
H_L
ED
_IN
H
MIC
RO
SD
_DA
T_D
IR
MIC
RO
SD
_CM
D_D
IR
CT
S_O
N
AP
P_A
CC
_UA
RT
_RX
AP
P_A
CC
_UA
RT
_TX
MO
TO
R_P
WR
+M
OT
OR
_PW
R-
MO
TO
R_E
N
MO
TO
R_P
WM
SU
B_P
M_R
ES
ET
B
LCD
_PW
M
WLE
D_P
WR
WLE
D4
SIM
DA
TS
IMR
ST
_n
SIM
CLK MIC
RO
SD
_DA
T0
MIC
RO
SD
_DA
T1
MIC
RO
SD
_DA
T3
MIC
RO
SD
_DA
T2
MIC
RO
SD
_CM
D
MIC
RO
SD
_CLK
AP
P_G
P13
_MC
_CLK
RE
T
SU
B_L
ED
0TAD_DSORCIM
TADMIS
SNES
1NIAG
ADS_C2I_PPAADS_BMSLCS_C2I_PPALCS_BMS
MWP_ROTOM
HCROT_DEL_HSALFNE_DEL_HSALF
AP
P_I
2C_S
DA
AP
P_I
2C_S
CL
AP
P_G
P07
_3A
XIS
_IN
T
KLC_DSORCIM
3TAD_DSORCIM
NO_STC
XR_TRAU_CCA_PPA
XT_TRAU_CCA_PPA
ADS_MP_BUSLCS_MP_BUS
SAIBS
+RWP_ROTOM
RWP_DELW2DELW3DELW4DELW5DELW
SNES
n_TSRMISTADMIS
KLC_DSORCIM_LAER
TERKLC_CM_31PG_PPA
RID_DMC_DSORCIM
RID_TAD_DSORCIM
MWP_DCL
LCS_MP_BUSADS_MP_BUS
1NIAG
SAIBS
NE_ROTOM
1DELW
n_TSRMIS
KLCMISTADMIS
KLCMIS
TNI_SIXA3_70PG_PPALCS_BMS
2NIAG
RWP_DELW
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 200 -
44PIN_CONNECTOR_Female_1T
ON_SW KEY
From Slide FPCB CN1005
5
6
1
7 11
8
MULTI_KEY
8 9 11 12
MULTI EL
ISSP
G
B
C C
53 10
4 10
C
12
E
F
HV_OUT_PAD& BP_PAD SIZE
H
D
1.7X1.4mm
1
2
LCD INTERFACELCD LDO
TOUCH_CONNECTOR
9
3 6
D
G
6
10 11
H
5
F
A
E
F
7
83
11
2 4
1
C
12
D
H
EL DWONLOAD& TEST POINT
3
A
4
92
B
D
H
5 12
GG
E E
F
8
10
I2C
1
D5
G
S1 S2
R91
556
K
Q900SIA450DJ
D1 D2 D3 D4
OU
T90
5
EV
LC14
S02
050
VA
901
R90
9
0
C9010.1u
OU
T90
7
TOUCH_3.1V
OU
T91
3
VA
904
EV
LC14
S02
050
EL_
G2
OU
T91
2
R90
6
4.7K
ICV
N05
05X
150F
RV
A90
5
TP902
TP905
TP111TP108
R904 51K
HVOUT7
5HVOUT8
4HVOUT9
NC113
NC216
NC31823
NC4
25NC5
33SLUG
VBIAS26
VDD20
14VPP
22_LE
21_POL
24
GND15
HVGND27
HVOUT112
3HVOUT10HVOUT11
2HVOUT12
132
HVOUT13
31HVOUT14
30HVOUT15
29HVOUT16
HVOUT21110
HVOUT3
9HVOUT4HVOUT5
8HVOUT6
76
HV509U900
BP28
19CLK
DIN17
DOUT
EV
LC14
S02
050
VA
903
2.2uC902
EV
LC14
S02
050
VDDE_1V8
VA
902
OU
T90
1
470pFC903
CLR
VREG_6.1V
4.7K
R90
2
0.1u
C90
8
TP908
TP906
EL_
G3
R90010K
10K R901
C9000.1u
3
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
TP907
FL901ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A3
4.7K
R90
7
OU
T90
4
TOUCH_3.1V
6789
TP106
313233343536373839
44041424344
5
171819
2
202122 23
242526272829
3
30
CN9021
10111213141516
OU
T90
0
6
7 8
9
15 16
17 18
OU
T90
9
1
10
11
12
13
14
2
3
4
5
VREG_6.1V
CN901
R91
3
100K
10M
R91
0
P2_422
P2_53
23P2_6
2P2_7
P3_018
P3_17
19P3_2
6P3_3
28V
DD
32V
SS
1
12V
SS
2
17XREX
26P
0_4
30P
0_5
P0_
627
P0_
729
P1_
013
P1_
111 14
P1_
2
10P
1_3
P1_
415
P1_
59 16
P1_
6
8P1_7
P2_020
P2_15
21P2_2
4P2_3
VDDE_1V8
U901CY8C21434
33G
ND
P0_024
P0_11
P0_
225
P0_
331
TP112
3637
45
67
89
TP107
2122
2324
2526
2728
29
3
3031
3233
3435
1
1011
1213
1415
1617
1819
2
20
OU
T90
2
CN900
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
OU
T91
4
ICVE10184E150R500FR FL900
5G
110
G2
1INOUT_A1
INOUT_A22
OU
T91
0
END
VA900
ICVS0514X350FR
DN
I
R90
5
EL_
G1
8
7INOUT_B3
INOUT_B46
OU
T91
1
FL902ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B2
OU
T90
3
OU
T90
8
0.1u
TP903
TOUCH_3.1V
C906
TP105
VD
D_L
CD
_2.6
V
TOUCH_3.1V
TP109
0.1uC907
D900
RB521S-30
VA
906
ICV
N05
05X
150F
R
VDDE_1V8
VDD_LCD_2.6V
RF051VA2S
D901
0.1u
C90
4
100K
R912150pC905
OK
VREG_6.1V
TP103
100uHL900
OU
T90
6
TOUCH_3.1V
SEND
TO
UC
H_R
ST
TO
UC
H_B
UT
TO
N_S
DA
TO
UC
H_B
UT
TO
N_S
CL
TO
UC
H_S
CR
EE
N_S
DA
TO
UC
H_S
CR
EE
N_S
CL
HV_OUT_5HV_OUT_6HV_OUT_7HV_OUT_8HV_OUT_9
HV_OUT_13HV_OUT_14
BP
HV_OUT_2HV_OUT_3HV_OUT_4
TOUCH_SCREEN_SCL TOUCH_RST
TOUCH_SCREEN_SDATOUCH_SCREEN_SCL
APP_GP12_LCD_ID
APP_GP12_LCD_ID
HV_OUT_10HV_OUT_11HV_OUT_12
TOUCH_RST
TOUCH_SCREEN_INT
TOUCH_SCREEN_SCL
TOUCH_SCREEN_SDA
LCD_RESET_N_OUT
TOUCH_BUTTON_SCLTOUCH_BUTTON_SDA
TOUCH_SCREEN_INTTOUCH_SCREEN_SDA
WLED1
LCD_RESET_N
LCD_ADS_NLCD_CS_NLCD_WE_N
LCD_PWM
TOUCH_BUTTON_SDATOUCH_BUTTON_SCL
WLED3WLED4WLED5
WLED_PWR
KEYIN4KEYIN5
ONSWA_n
KEYOUT1KEYOUT2
LCD_VSYNCLCD_RD_N
WLED2
LCD_DATA[1]LCD_DATA[2]LCD_DATA[3]
LCD_DATA[0]LCD_DATA[1]LCD_DATA[2]
LCD_DATA[4]
LCD_DATA[6]
LCD_DATA[3]
LCD_DATA[5]
LCD_DATA[7]
HV
_OU
T_4
HV
_OU
T_3
HV
_OU
T_2
ONSWA_n
LCD_RESET_NLCD_WE_N
LCD_ADS_NLCD_CS_N
LCD_RESET_N_OUT
LCD_ADS_N_OUTLCD_CS_N_OUT
LCD_WE_N_OUT
LCD_DATA[4]LCD_DATA[5]LCD_DATA[6]LCD_DATA[7]
LCD_DATA[0]
LCD_DATA[4]_OUTLCD_DATA[5]_OUTLCD_DATA[6]_OUTLCD_DATA[7]_OUT
BPHV
_OU
T_1
4H
V_O
UT
_13
HV
_OU
T_1
2H
V_O
UT
_11
HV
_OU
T_1
0H
V_O
UT
_9H
V_O
UT
_8H
V_O
UT
_7H
V_O
UT
_6H
V_O
UT
_5
LCD_DATA[1]_OUTLCD_DATA[0]_OUT
WLED5WLED4WLED3WLED2WLED1
WLED_PWR
LCD_VSYNCLCD_RD_N
LCD_WE_N_OUTLCD_ADS_N_OUT
LCD_DATA[0]_OUTLCD_DATA[1]_OUTLCD_DATA[2]_OUTLCD_DATA[3]_OUT
ONSWA_n
KEYIN5
KEYIN4
KEYOUT2
KEYOUT1
KEYOUT2KEYOUT1
KEYIN4KEYIN5
LCD_CS_N_OUT
LCD_DATA[7]_OUT
LCD_PWM
LCD_DATA[6]_OUTLCD_DATA[5]_OUTLCD_DATA[4]_OUTLCD_DATA[3]_OUTLCD_DATA[2]_OUT
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 201 -
8
21
A
YEK_NIAM
2
G
E
5TOH
4
11
8
21
G
4
D
6
A
BB
F
H
61
11
5
7
73
D
21
11
F
YEK_REBMUN
E
72
TCETED EDILS
6
8
85 7
G
gnideeF annetnA
elameF_ROTCENNOC YEK_NIAM
1
21
54
01
3
8
C
6
9
0
C
H
2
01
1 01
E
009NC BCP tekcoS morF
7 9
4TOH
9
E
C
D
3
HH
C
D
1 6
eniL mm51.0 : DNGD etarepeS
CIM
32
32
4
9
DEL YEK_NIAM
11
9
G
5
1
F
5
F
4
01
VA
104
EV
LC14
S02
050
EV
LC14
S02
050
VA
106
n74601C
401
VA
108
EV
LC14
S02
050
8V1_EDDV
501C
u01 p74
501
401C
VA
103
4TUO
DDV1
011
EV
LC14
S02
050
5MB21006KT101U
21DNG
52DNG
6DDV_OI
CN3
201R
mho001
1L
Hn4.2
311C
p57.0
4
101TUO
101CIM
3-BP-5EH4020MPS
1G2
2G3
O1
P
4G3G
VA
107
EV
LC14
S02
050
5161718191202
3456789
2G1G1NC
1
1101213141
211C
8V1_EDDV
601
u1.0
EV
LC14
S02
050
VA
101
u1.0
VB
AT
mho001
101R
23
4
901C
1011WS
1
p5.0411C
201TUO
301201
701
n74801C
VA
105
EV
LC14
S02
050
201TOH101TOH
TNA1G2G
2 4 6 8
1 3 5 7
101WS10-E100-97202
K01
101AR
RS
B6.
8CS
T2R
ZD
101
ZD
102
RS
B6.
8CS
T2R
EV
LC14
S02
050
VA
102
57V2_GDDV
101
57V2_GDDV
1
A
2
C
101DL
7001STWS-CSS
1
A
2
C
0081301R
7001STWS-CSS
201DL
0081401R
EMOH
801
ITLUM
901
VB
AT
511CIND
P1CIM
N1CIM
1OCC
3NIYEK2NIYEK1NIYEK0NIYEK
N1CIMP1CIM
4TUOYEK
8V1_EDDV
2DEL_YEK
1TUOYEK2TUOYEK
3NIYEK
2TUOYEK
3TUOYEK
3NIYEK
1TUOYEK
4TUOYEK
2DEL_YEK
1DEL_YEK
1OCC
3NIYEK2NIYEK1NIYEK0NIYEK
1TUOYEK2TUOYEK4TUOYEK3TUOYEK
2NIYEK
0NIYEK
1NIYEK
ESNESPILF_51PG_CCA
1TUOYEK
3TUOYEK
2TUOYEK
4TUOYEK
3NIYEK
3TUOYEK
ESNESPILF_51PG_CCA
1DEL_YEK
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 202 -
1 21
1
B
ECAFRETNI AREMAC AGV
1059100YBNE
G741027KXA
72
A
BB
2
C
D
E
D
E
B
C
E
8
F
3
G
H
21
C
11
H
3
DAP_rekaepS
elaM_ROTCENNOC EDILS
T1_ELAM_ROTCENNOC_NIP 44
D
E
F
G
D
A
51
4
92
8 2111
A
6 87 1101
F
G
7 9
4
H
3
rosneS thgiL tneibmA
21
BCPF_edilS_NIAM
6554
01
1
9876
11019
54
C
32
F
G
H
A
6 01
8V1_EDDV
40414243444
56789
201RK11
62728292
3
03132333435363738393
01112131415161718191
2
0212
32224252
801NC1
VD
D_L
CD
_2.6
V
V1.3_HCUOT
37475767778797
8
08
9
101PT
95
6
06162636465666768696
7
071727
445464748494
5
051525354555657585
3
03132333435363738393
4
14042434
5161718191
2
02122232425262728292
601NC1
0111213141
301PT
VR
EG
_6.1
V
6001C
u1.0
73
CCV
101C
u1
101UCVF0061HB
1CG56
2CG2
DNGTUOI
1
41CN2CN
u1.0
201C
001PT
1
2
V1.6_GERV
101NC
701NC12
4G3G
V8.2_DDV_AGV
5161718191202
3456789
2G1G 401NC1
1101213141
301Cu1.0
TO
UC
H_3
.1V
VG
A_V
DD
_2.8
V
VG
A_V
DD
_1.8
V
201PT
2D_IC
5D_IC
V8.1_DDV_AGV
VD
D_L
CD
_2.6
V
8V1_EDDVDI_DCL_21PG_PPA
DI_DCL_21PG_PPA
CNYSH_IC
n_SER_IC
CNYSV_IC
6D_IC7D_IC
ADS_C2I_PPALCS_C2I_PPA
3D_IC
1D_IC
4D_IC
CNYSV_DCLN_DR_DCL
2DELW1DELW
N_TESER_DCL
N_SDA_DCLN_SC_DCLN_EW_DCL
MWP_DCL
N_SDA_DCLN_SC_DCLN_EW_DCL
MWP_DCL
RWP_DELW
4DELW3DELW2DELW1DELW
5DELW
TSR_HCUOT
3DELW4DELW5DELW
RWP_DELW
4NIYEK5NIYEK
n_AWSNO
1TUOYEK2TUOYEK
CNYSV_DCLN_DR_DCL
N_TESER_DCL
LCS_NEERCS_HCUOT
LCS_NOTTUB_HCUOTADS_NOTTUB_HCUOT
]0[ATAD_DCL]1[ATAD_DCL]2[ATAD_DCL
]4[ATAD_DCL
]6[ATAD_DCL
]3[ATAD_DCL
]5[ATAD_DCL
]7[ATAD_DCL
7D_IC6D_IC
+VCR_KPS-VCR_KPS
+RWP_ROTOM-RWP_ROTOM
TSR_HCUOT
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
CNYSV_IC
KLCP_IC0KLCSYS
1NIAG2NIAG
SAIBSSNES
0D_IC1D_IC2D_IC3D_IC4D_IC5D_IC
n_AWSNO
5NIYEK4NIYEK2TUOYEK1TUOYEK
FFO_OI_CV_12PG_CCA
ADS_C2I_PPALCS_C2I_PPA
n_SER_IC
CNYSH_IC
TNI_NEERCS_HCUOTADS_NEERCS_HCUOT
LCS_NEERCS_HCUOT
]7[ATAD_DCL
]5[ATAD_DCL
]3[ATAD_DCL
]6[ATAD_DCL
]4[ATAD_DCL
]2[ATAD_DCL]1[ATAD_DCL]0[ATAD_DCL
FFO_OI_CV_12PG_CCA0KLCSYS
KLCP_IC
+VCR_KPS
-VCR_KPS
-RWP_ROTOM
1NIAG2NIAG
SAIBSSNES
+RWP_ROTOM
0D_IC
ADS_NOTTUB_HCUOT
LCS_NOTTUB_HCUOT
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
8. BGM Pin Map
- 203 -
8. BGM Pin Map
DBB IC : DB3150 R3A (top view)
Use
Don't Use
- 204 -
8. BGM Pin Map
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
ABB IC : AB3000 R2A (top view)
Use
Don't Use
- 205 -
8. BGM Pin Map
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Memory IC : KAL00900BM-DJ55 (top view)
Use
Don't Use
- 206 -
8. BGM Pin Map
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
ZORAN IC : ZR3453X (top view)
Use
Don't Use
- 207 -
8. BGM Pin Map
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Bluetooth IC : STLC2593 (top view)
Use
Don't Use
- 208 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 209 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<FPCB Connector>LCD assembly status
Connector combination
<Touch Screen level shifter>Touch operation
<ACF connector>Socket PCB connection
<CAM LDO>Camera operation
<DC/DC for Zoran>Zoran operation
<X-tal>Check the freq. 27MHz
<ZORAN>Multi Media chipset
<DC/DC for PA>WCDMA Tx operation
<WCDMA PA>WCDMA Tx amplifier operation
<X-tal>Check the freq. 26MHz
<GSM Transceiver>Check Rx/Tx operation
<WCDMA Transceiver>Check Rx/Tx operation
<GSM Rx SAW filter>Check Rx operation
<GSM PA + ASM>Tx amplifier and antenna
switch operation
<OVP>Check VCHG output
- 210 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<5M CAM Connector>5M camera operation
<DC/DC for EL>EL operation
<Touch LDO>Touch operation
<LCD LEO>LCD operation
<USB Transceiver>USB operation
<Headset Mic LDO>Headset operation
<Headset filter>Headset operation
<EMI/ESD filter>UART/Charging operation
<MiainKey Connector>Numeric Key & SideKey
<Headset filter>Headset operation
<Speaker Amp>Speaker operation
<Backup Battery>RTC clock operation
<Bluetooth IC>B/T & FM radio operation
<X-tal>RTC clock (32.768kHz)
<SideKey>Volume up/down operation
<Battery Connector>Power supply
<PMIC & Audio IC>Check output of LDO
Check audio path
<Memory (2G/1G)>
<DBB (DB3150) >
- 211 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
<ACF connector>Main & Socket PCB connection
- 212 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<3 axis accelerometer>Motion sensor operation
<SIM socket>Socket soldering
<u-SD card socket>Socket soldering
<Level shifter>u-SD card level shifter
<Sub LED>CAM flash & trickling charge
<LDO for flash LED>Flash LED operation
<Flash LED>CAM flash operation
<LDO for LCD backlight>LCD operation
<Motor operating IC>Motor operation
- 213 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 214 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<FPCB connector>LCD assembly status
Connector combination
<EL driver IC>EL operation
<LCD connector>LCD operation
<Touch Connector>Touch operation<EL operating IC>
EL operation
- 215 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
<MainKey Connector>Number & sidekey operation
<MainKey LED>MainKey backlight
<Touch&Multi sidekey>
<CAM sidekey>Camera operation
<Mic>Voice input
<Hall IC>Slide detect
- 216 -
9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<Antenna Connector>Antenna connection
- 217 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
<FPCB connector>LCD assembly status
Connector combination
<FPCB Connector>LCD assembly status
Connector combination
<Ambient Light Sensor>ALC operation
<Spk/Receiver connector>Speaker operation
- 218 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
<VGA CAM connector>VGA operation <Motor pad>
Check soldering
- 219 -
10. Calibration
10. Calibration
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
10.1 General Description
This document describes the installation and software usage for the calibration of LG°Øs
GSM/GPRS/EDGE/WCDMA Multimedia Mobile Phone. The calibration menu and it°Øs result is
displayed in PC terminal by Mobile phone.
10.2 Environment
10.2.1 H/W Environment
- PC with RS-232 Interface & GPIB card installed
- GSM/GPRS/EDGE/WCDMA Multimedia Mobile Set
- Agilent 8960 Series 10 E5515C Instrument (E1987A ver A.05.28)
- Tektronix PS2521G Power Supply or Agilent A66311B
- ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)
10.2.2 S/W Environment
- National Instrument GPIB & VISA (ver 2.60 full) driver install
- Agilent 8960 VXI driver(E1960) install
- Hot Kimchi EXE files
- OS : Window98, Window2000, WindowXP
10.2.3 Configuration Diagram of Calibration Environment
KF750
Figure 10-1. Calibration Configuration Figure
- 220 -
10. Calibration
10.3 Calibration Environment
Ensure that the following conditions are maintained throughout the duration of the tests and
calibrations described within this document.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
A30Supply current
V3.83.73.6Vbatt
%754020Relative Humidity
°C302515Temperature
UnitMaxTypMinParameter
Table 10-1. Nominal Environmental Test Conditions
- 221 -
10. Calibration
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
10.4 Program Operation
10.4.1 Hot Kimchi Program Overview
When trying to calibrate the mobile phone, the service engineers make a configuration of calibration
environment like Figure10-1. And if you finish making configuration, please execute the Hot Kimchi
program. See Figure10-2.
Hot Kimchi supports following functions.
- Calibration of EGSM 900, DCS 1800, PCS1900, and WCDMA
- Instrument (Agilent8960, Tektronix PS2521G) control
- UART communication with mobile phone
Figure 10-2. Hot Kimchi Window
- 222 -
10. Calibration
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
10.4.2 Setting
Select a ezlooks
Select Off-line in the EZLOOKS MODE.
- 223 -
10. Calibration
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Select a Line System
Select Manual in the RUN MODE.
Select your com port appropriately.
- 224 -
10. Calibration
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Select a Logic Operation
Select Logic Mode you want.
1. CAL only
2. AUTO only
3. CAL + AUTO
Select your com port appropriately.
MONitor Port is to communicate with 2.5G mobile phone
- 225 -
10. Calibration
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
10.4.3 Calibration Procedure
Select a model name - KF750.
Click the START button.
- 226 -
11. Stand-alone Test
11.1 General Description
1) General Description
This document describes the installation and software usage for the stand-alone test of LG’s
GSM/GPRS/EDGE/WCDMA Mobile Phone. The test menu and it’s result is displayed in PC terminal
by Mobile phone.
This test software was called “XCALMON(eXtended CALibration and MONitor program)”. XCALMON
can support both calibration and test.
This test software includes GSM, DCS, PCS, EDGE, and WCDMA Band test.
2) XCALMON Environment
H/W Environment
- PC with RS-232 Interface & GPIB card installed
- GSM/GPRS/EDGE/WCDMA Mobile Set
- Agilent 8960 Series 10 E5515C Instrument (E1987A ver A.05.28)
- Tektronix PS2521G Power Supply or Agilent A66311B
- ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)
S/W Environment
- National Instrument GPIB & VISA (ver 2.60 runtime) driver install
- Agilent 8960 VXI driver(E1960) install
- XCALMON EXE files
- OS : Window98, Window2000, WindowXP
- Serial port configuration
Baud rate: 115200 / Char length: 8bit / No Parity/ No Flow control / Stop bits: 1 bit
3) Configuration Diagram of Test Environment
11. Stand-alone Test
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
KF750
- 227 -
11. Stand-alone Test
11.2 Program Operation
1) XCALMON Program Overview
When trying to test the mobile phone, the service engineers make a configuration of calibration
environment like previous figure. And if you finish making configuration, please execute the XCALMON
program. Running the XCALMON program, you will see XCALMON program window like below.
If XCALMON program would be executed, it checks the connection of instruments and initializes them
automatically.
XCALMON supports following functions.
- Test of EGSM 900, DCS 1800, PCS1900, GSM850 and WCDMA
- Instrument (Agilent8960, Tektronix PS2521G) control
- UART communication with mobile phone
XCALMON has three windows and each window support different function.
- Command window which supports interactive ITP commands like Hyper terminal
- Calibration tree window
- Quick Command mode window
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 228 -
11. Stand-alone Test
2) XCALMON Icon Description
A. DOS Window IconWhen you click the DOS window icon, then you should see the ITP command window like DOS
window of DOS-operating system. In ITP command window, you can communicate with a mobile
phone which is running in ITP mode.
For example, if you will enter command “VERS” and enter the return key, you should get the response
of the present running ITP version information from a mobile phone.
B. Calibration Tree Window IconWhen you click the calibration window icon “C”, then you see the calibration tree window. That will be
shown all calibration items. If you want to calibrate a mobile phone for all calibration items, you should
select ‘Calibration” and push “F4” button in your keyboard.
Also there are four tap view in calibration window.
- OUTPUT : All results of calibration. See figure 9-4
- STATUS : Summary of Test result
- INSTRUMENT : Control and view instrument connection status. See figure 9-5
- PC SETTING : Control and view UART connection status. See figure 9-6
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
XCALMON ITP Command Window
- 229 -
11. Stand-alone Test
C. Quick Command mode window IconWhen clicking the Quick command mode window icon “Q”, then you find out the Quick Command
mode window. That window is for test of the mobile phone.
D. ITP Starting Window Using Production LoaderWhen clicking the ITP starting window icon “L”, then you find out the ITP starting window. That dialog
window just waits for power-on of the mobile phone. When it will occur power-on, it automatically start
ITP running.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
XCALMON Quick Command mode Window
XCALMON ITP Starting Window (Using Production Loader)
- 230 -
11. Stand-alone Test
11.3 Stand-alone Test
1) Test Procedure
Test procedure of XCALMON is the same as below procedure.
- Configuration of test environment
- Running ITP using preloader and production loaders
- Verification of stand-alone test by Quick Command mode
A. Configuration of test environment
Configure to test the mobile phone like 12.1. If configuration will be accomplished, XCALMON program
will be started.
B. Running ITP Using Preloader and Production Loaders
If XCALMON will be executed, you should run ITP using “L” ITP starting icon at first.
Click the “L” icon, then you will see the ITP start window like 12-2 D.
When you will turn on the mobile phone, the loaders will be downloaded automatically like below figure
and then it will execute the ITP at once.
4 loaders are needed and exists in the folder “loader”. And all you have to do is select the profile
“KF750_KT520_20080412.prfl” If the ITP will operate normally, you should see the characters “TP,
OK” in ITP command window like 12-2 A.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Loader downloading
- 231 -
11. Stand-alone Test
2) Test
If you want to test a mobile phone, click the Quick command mode icon “Q”.
A. Select System
You can select the GSM or WCDMA system.
B. Select Band
You can select the GSM quad band or WCDMA band.
C. Testing Channel
You can select only one channel.
D. RF operation
You can select Rx or Tx.
If you select all item and click test, you can find out result “pass or fail”.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 232 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 233 -
6
54
3 2
1
7
8
9
10
11
15
1617
1875
76
19
31
32
36
37
35
3433
30
20
26
27
51
5657 58 59 60 61
70
71
73
72
5553
5452
62
63
64
65
66
67
45
4468
4847
46
50
49
6944
74
42
43
41
403938
2122
2425
23
29
28
12
13
14
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 234 -
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 235 -
12.2 Replacement Parts<Mechanic component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LevelLocation
NoDesciption Part Number Spec Color Remark
2 AAAY00 ADDITION AAAY0304201 Without Color
3 ACGA00 COVER ASSY,BATTERY ACGA0021501 Black 69, 70
4 MCJA00 COVER,BATTERY MCJA0064801 PRESS, STS, , , , , Without Color
4 MLEA00 LOCKER,BATTERY MLEA0045801 MOLD, POM TX-31, , , , , Black
2 APEY00 PHONE APEY0553901 Black
3 ACGM COVER ASSY,REAR ACGM0107001 Black
4 ADBY00 DECO ASSY ADBY0011901 Black
5 MDAD00 DECO,CAMERA MDAD0035301 ELECTROFORMING, Cu, 0.2, , , , Silver 65
5 MDAK00 DECO,REAR MDAK0014501 MOLD, PC LUPOY SC-1004A, , , , , Black
5 MLCE00 LENS,FLASH MLCE0008901 MOLD, PC LEXAN 141R, , , , , Without Color 73
5 MPBT00 PAD,CAMERA MPBT0053401 COMPLEX, (empty), 0.7, , , , Without Color 76
5 MTAA00 TAPE,DECO MTAA0152901 COMPLEX, (empty), , , , , Without Color 64
5 MTAD00 TAPE,WINDOW MTAD0081101 COMPLEX, (empty), , , , , Without Color 66
5 MWAE00 WINDOW,CAMERA MWAE0032401 MOLD, Tempered Glass, 0.5, , , , Black 67
4 MBJL00 BUTTON,SIDE MBJL0052201 COMPLEX, (empty), , , , , Silver
4 MBJL01 BUTTON,SIDE MBJL0052001 COMPLEX, (empty), , , , , Black 58, 59
4 MBJL02 BUTTON,SIDE MBJL0052101 COMPLEX, (empty), , , , , Black 57
4 MCCC00 CAP,EARPHONE JACK MCCC0052301 MOLD, Urethane Rubber S190A, , , , , Black 54
4 MCCF00 CAP,MOBILE SWITCH MCCF0052201 COMPLEX, (empty), , , , , Black
4 MCJN00 COVER,REAR MCJN0080501 MOLD, PC LUPOY SC-1004A, , , , , Black 55
4 MGAD00 GASKET,SHIELD FORM MGAD0168201 COMPLEX, (empty), , , , , Gold
4 MLEA00 LOCKER,BATTERY MLEA0045701 MOLD, PC LUPOY SC-1004A, , , , , Without Color
4 MPBH00 PAD,MIKE MPBH0037901 COMPLEX, (empty), , , , , Without Color 44
4 MPBU00 PAD,CONNECTOR MPBU0032501 COMPLEX, (empty), , , , , Black
4 MPBU01 PAD,CONNECTOR MPBU0032901 COMPLEX, (empty), , , , , Black
4 MPBZ00 PAD MPBZ0200401 COMPLEX, (empty), , , , , Without Color
4 MPBZ01 PAD MPBZ0200501 COMPLEX, (empty), , , , , Without Color 75
4 MSDB00 SPRING,COIL MSDB0005501 COMPLEX, (empty), , , , , Black
4 MSDD00 SPRING,PLATE MSDD0006801 PRESS, BeCu, , , , , Gold
4 MTAA00 TAPE,DECO MTAA0152601 COMPLEX, (empty), 0.1, , , , Without Color 63
4 MTAB00 TAPE,PROTECTION MTAB0218501 COMPLEX, (empty), , , , , Without Color 77
4 MTAC00 TAPE,SHIELD MTAC0071601 COMPLEX, (empty), , , , , Gold
3 ACGQ00 COVER ASSY,SLIDE ACGQ0023401 Black
- 236 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
4 ACGK00 COVER ASSY,FRONT ACGK0105601 Black
5 MCJK00 COVER,FRONT MCJK0083501 MOLD, PC LUPOY SC-1004A, , , , , Black 38
5 MFBD00 FILTER,MIKE MFBD0028301 COMPLEX, (empty), , , , , Without Color 43
4 ACGS00COVERASSY,SLIDE(UPPER)
ACGS0020201 Silver
5 ABGG00 BUTTON ASSY,SUB ABGG0001801 SEND/END Silver 2
5 ACGS00COVERASSY,SLIDE(UPPER)
ACGS0016501 Silver
6 ADBY00 DECO ASSY ADBY0011801 UPPER Black
7 MDAP00 DECO,SLIDE(UPPER) MDAP0001801 MOLD, PC LUPOY SC-1004A, , , , , Black 4
7 MTAK00 TAPE,CAMERA MTAK0007301 COMPLEX, (empty), 0.1, , , , Without Color 15
7 MWAE00 WINDOW,CAMERA MWAE0032301 CUTTING, PMMA MR 200, 0.8, , , , Without Color 17
6 MCJW00 COVER,SLIDE(UPPER) MCJW0016801 CASTING, Al Alloy, , , , , Black 9
6 MDAN00 DECO,SPEAKER MDAN0013901 ELECTROFORMING, Cu, , , , , Silver 6
6 MFBC00 FILTER,SPEAKER MFBC0036901 COMPLEX, (empty), , , , , Without Color 14
6 MTAA00 TAPE,DECO MTAA0152501 COMPLEX, (empty), 0.1, , , , Without Color 7
5 MTAB00 TAPE,PROTECTION MTAB0212201 COMPLEX, (empty), , , , , Without Color
5 MTAB01 TAPE,PROTECTION MTAB0232201 COMPLEX, (empty), , , , , Without Color
5 MTAZ00 TAPE MTAZ0168901 COMPLEX, (empty), , , , , Without Color
5 MWAC00 WINDOW,LCD MWAC0093502 MOLD, Tempered Glass, , , , , Black
4 ADBY01 DECO ASSY ADBY0012301 Lower Deco Assy Black
5 MDAP00 DECO,SLIDE(UPPER) MDAP0002301 MOLD, POM TX-31, , , , , Black
5 MMAA00 MAGNET,SWITCH MMAA0009601 COMPLEX, (empty), 1, , , , Without Color 29
4 ARDY00 RAIL ASSY,SLIDE ARDY0004601 Without Color 41, 42
5 MPBT00 PAD,CAMERA MPBT0057601 COMPLEX, (empty), , , , , Without Color 45
5 MPBU00 PAD,CONNECTOR MPBU0026201 COMPLEX, (empty), 0.3T, , , , Black 31
5 MTAC00 TAPE,SHIELD MTAC0067301 COMPLEX, (empty), , , , , Without Color
4 GMEY00 SCREW MACHINE,BIND GMEY00170011.4 mm,2.3 mm,SWCH18A ,N ,SQR , ,; ,BH ,[empty],2.7mm ,2.3mm +0.0mm,-0.2mm ,SWRCH ,WHITE,[empty] ,[empty]
28
4 MBJC00 BUTTON,FUNCTION MBJC0024801 COMPLEX, (empty), , , , , Silver 3
4 MCCH00 CAP,SCREW MCCH0123101 COMPLEX, (empty), , , , , Black 27
4 MCCH01 CAP,SCREW MCCH0123001 COMPLEX, (empty), , , , , Black 26
4 MIDZ00 INSULATOR MIDZ0166101 COMPLEX, (empty), , , , , Without Color
4 MIDZ01 INSULATOR MIDZ0166701 COMPLEX, (empty), , , , , Without Color
4 MIDZ02 INSULATOR MIDZ0167801 COMPLEX, (empty), , , , , Without Color
4 MIDZ03 INSULATOR MIDZ0167901 COMPLEX, (empty), , , , , Without Color
4 MKAG00 KEYPAD,MAIN MKAG0006201 COMPLEX, (empty), , , , , Black 39
4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White
- 237 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
4 MPBG00 PAD,LCD MPBG0072301 COMPLEX, (empty), , , , , Without Color 1
4 MPBJ00 PAD,MOTOR MPBJ0051501 COMPLEX, (empty), , , , , Without Color 12
4 MTAB00 TAPE,PROTECTION MTAB0228401 COMPLEX, (empty), , , , , Without Color
4 MTAB01 TAPE,PROTECTION MTAB0212201 COMPLEX, (empty), , , , , Without Color
4 MTAC00 TAPE,SHIELD MTAC0067601 COMPLEX, (empty), , , , , Without Color
4 MTAF00 TAPE,MOTOR MTAF0019601 COMPLEX, (empty), , , , , Without Color
4 MTAJ00 TAPE,FLEXIBLE PCB MTAJ0004801 COMPLEX, (empty), , , , , Without Color
4 MTAK00 TAPE,CAMERA MTAK0007401 CUTTING, BeCu, 0.05, , , , Without Color
6 ADCA00 DOME ASSY,METAL ADCA0076201 Without Color 40
6 ADCA00 DOME ASSY,METAL ADCA0076101 SUB Without Color 16
6 MIDZ00 INSULATOR MIDZ0175201 COMPLEX, (empty), , , , , Without Color
3 GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black 23
3 MLAK00 LABEL,MODEL MLAK0018616 KG110 MADE IN KOREA Without Color
4 ACKA00 CAN ASSY,SHIELD ACKA0006801 Without Color
5 MCBA00 CAN,SHIELD MCBA0027701 PRESS, STS, , , , , Without Color 51
5 MIDZ00 INSULATOR MIDZ0168901 CUTTING, BeCu, , , , , Without Color 50
5 MIDZ01 INSULATOR MIDZ0169001 CUTTING, Bs, , , , , Color Unfixed 49
5 MCBA00 CAN,SHIELD MCBA0027801 PRESS, STS, , , , , Without Color 46
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 238 -
LevelLocation
NoDesciption Part Number Spec Color Remark
1 IMT-2000(SLIDE) TISL0003201 Black
4 SNGF00 ANTENNA,GSM,FIXED SNGF00335023.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL,; ,QUAD ,-2.0 ,50 ,3.0
52
4 SNGF01 ANTENNA,GSM,FIXED SNGF00341013.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0,50 ,3.0
53
4 SACY00 PCB ASSY,FLEXIBLE SACY0073001
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0067701
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM
SACC0044801
7 C1006 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C101 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C102 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C103 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 CN104CONNECTOR,BOARD TOBOARD
ENBY0016601 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING HEIGHT
7 R102 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP
SACD0057301
7 CN106CONNECTOR,BOARD TOBOARD
ENBY0019801 80 PIN,0.4 mm,ETC , ,H=1.5, Header
7 CN108CONNECTOR,BOARD TOBOARD
ENBY0036101 44 PIN,0.4 mm,ETC , ,H=1.0, Plug
7 U101 IC EUSY0343701WSOF6 ,6 PIN,R/TP ,Luminance sensor ,; ,IC,A/DConverter
6 SPCY00 PCB,FLEXIBLE SPCY0110201 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
4 SACY01 PCB ASSY,FLEXIBLE SACY0073101
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0067801
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM
SACC0044901
7 C113 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C114 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 L1 INDUCTOR,CHIP ELCH0003828 2.4 nH,J ,1005 ,R/TP ,MLCI
7 SW101 CONN,RF SWITCH ENWY0005501,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD,[empty] ,[empty] , ,
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP
SACD0057401
7 C104 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
7 C105 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
7 C106 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
12.2 Replacement Parts<Main component>
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 239 -
LevelLocation
NoDesciption Part Number Spec Color Remark
7 C108 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
7 C109 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C112 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 CN1CONNECTOR,BOARD TOBOARD
ENBY004360120 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,MALE ,SMD ,[empty] , ,
7 LD101 DIODE,LED,CHIP EDLH0013401WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,,[empty] ,[empty] ,2P
7 LD102 DIODE,LED,CHIP EDLH0013401WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,,[empty] ,[empty] ,2P
7 MIC101 MICROPHONE SUMY0010603PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI,1.5TO5V , ,SMD
7 R101 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R102 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R103 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
7 R104 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
7 RA101 RES,ARRAY,R ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP
7 SW1101 SWITCH,TACT ESCY00053011 V,1 A,HORIZONTAL ,1 G, ,; ,10C2P ,[empty] ,[empty],[empty] , ,[empty]
7 U101 IC EUSY0268101 SON2017-6 ,6 PIN,R/TP ,HALL SWITCH, Pb Free
7 VA101 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA102 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA103 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA104 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA105 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA106 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA107 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA108 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 ZD101 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
7 ZD102 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 SPCY00 PCB,FLEXIBLE SPCY0110101 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
5 SAFB00 PCB ASSY,MAIN,INSERT SAFB0085701
4 SAJY00 PCB ASSY,SUB SAJY0032201 Multi key PCB Color Unfixed 18
5 SAJB00 PCB ASSY,SUB,INSERT SAJB0016001
5 SAJE00 PCB ASSY,SUB,SMT SAJE0025701 Multi Key Color Unfixed
6 SAJC00PCB ASSY,SUB,SMTBOTTOM
SAJC0024701
7 C900 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C901 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C902 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 240 -
LevelLocation
NoDesciption Part Number Spec Color Remark
7 C903 CAP,CERAMIC,CHIP ECCH0011201470 pF,250V ,K ,X7R ,HD ,1608 ,R/TP ,; , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty]
7 C904 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C905 CAP,CERAMIC,CHIP ECCH0009515 150 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
7 C906 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C907 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 CN900 CONNECTOR,FFC/FPC ENQY001430137 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC,STRAIGHT ,BOTH ,SMD ,[empty] ,[empty] ,
7 CN901CONNECTOR,BOARD TOBOARD
ENBY004580114 PIN, mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,FEMALE ,SMD ,[empty] , ,
7 CN902CONNECTOR,BOARD TOBOARD
ENBY0036201 44 PIN,0.4 mm,ETC , ,H=1.0, Socket
7 D900 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
7 D901 DIODE,SWITCHING EDSY0017901TUMD2 ,200 V,0.5 A,R/TP , ,; , , , , , , ,[empty] ,[empty],[empty] ,[empty]
7 FL900 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
7 FL901 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
7 FL902 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
7 L900 INDUCTOR,CHIP ELCH0002610 100 uH,M ,ETC ,R/TP ,power inductor 2.9x2.9
7 Q900 TR,FET,N-CHANNEL EQFN0008301SC70-6L ,15 W,240 V,1.52 A,R/TP ,Nch MOSFET ,; ,N-CHANNEL ,MOSFET ,240 ,+-20 ,; ,2.46 ,15 ,SC706L,R/TP ,6P
7 R900 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R901 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R902 RES,CHIP ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R904 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
7 R906 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
7 R907 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
7 R908 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 R909PCB ASSY,MAIN,PADSHORT
SAFP0000501
7 R910 RES,CHIP ERHY001820110000000 ohm,1/10W ,F ,1608 ,R/TP ,; ,10000000 ,1%,1/10W ,1608 ,R/TP
7 R911PCB ASSY,MAIN,PADSHORT
SAFP0000401
7 R912 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R913 RES,CHIP ERHY0009558 68 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
7 R915 RES,CHIP ERHY001910156000 ohm,1/10W ,J ,1608 ,R/TP ,; ,56000 ,5% ,1/10W,1608 ,R/TP
7 U900 IC EUSY0309902 QFN ,32 ,R/TP ,S/W ic for EL, 5x5x1T ,; ,IC,BiCMOS
7 U901 IC EUSY0277001Cap sense Inputs device ,32 PIN,R/TP ,5*5 CapsenseTrackPad
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 241 -
LevelLocation
NoDesciption Part Number Spec Color Remark
7 VA900 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
7 VA901 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA902 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA903 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA904 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA905 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
7 VA906 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 SPJY00 PCB,SUB SPJY0046501FR-4 ,0.5 mm,BUILD-UP 6 ,KF750 MULTIKEY PCB ,; , , ,, , , , , ,
4 SJMY00 VIBRATOR,MOTOR SJMY0006508 3 V,.08 A,10*3.45 ,17mm , ,3V , , ,12500 , , , ,38 11
4 SUSY00 SPEAKER SUSY0027201 PIN ,8 ohm,90 dB, mm, ,; , , , , , ,18*12*3.4T ,PIN 13
4 SVCY01 CAMERA SVCY0015301CMOS ,VGA ,MAGNACHIP(1/7.4"), 5.5x5.1x3.2t, FPCB90
5
4 SVLM00 LCD MODULE SVLM0027801MAIN ,240*320 ,42.2*60*1.5t ,262k ,TFT ,TM,uPD161707 ,
4 SWCC00 CABLE,COAXIAL SWCC000530162 mm, LINE, ,; ,[empty] ,[empty] ,[empty] , ,[empty] ,,[empty]
3 SAFY00 PCB ASSY,MAIN SAFY0255701 48
4 SACY00 PCB ASSY,FLEXIBLE SACY0073201
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0067901
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM
SACC0045001
7 C901 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
7 C903 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
7 C904 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C905 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
7 C906 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
7 C907 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C908 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C909 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C911 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C912 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
7 C913 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
7 C915 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C916 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
7 C917 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C918 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C919 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C920 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 242 -
LevelLocation
NoDesciption Part Number Spec Color Remark
7 C921 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C922 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C923 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C924 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C925 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
7 D900 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE
7 J900 CONN,SOCKET ENSY0021401 8 PIN,ETC , , mm,
7 J901 CONN,SOCKET ENSY0018101 6 PIN,ETC , ,2.54 mm,H=1.5
7 L900 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 L901 INDUCTOR,CHIP ELCH0003811 1000 nH,K ,1608 ,R/TP ,COIL TYPE
7 LD900 DIODE,LED,ARRAY EDLA0000902 ORANGE ,1 COLOR,3.2X2.4X2.4mm ,R/TP ,
7 LD901 DIODE,LED,MODULE EDLM0009401 WHITE ,1 LED,3.5X2.8X0.6T ,R/TP ,
7 Q900 TR,BJT,ARRAY EQBA0000601 UMT5 ,.2 W,R/TP ,
7 Q901 TR,BJT,NPN EQBN0012401 ESM ,100 mW,R/TP ,NPN TRANSISTOR
7 R900 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R907 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP
7 R911 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R912 RES,CHIP,MAKER ERHZ0000474 390 ohm,1/16W ,J ,1005 ,R/TP
7 R913 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
7 R916 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 R919 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 R920 RES,CHIP,MAKER ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP
7 R923 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
7 R924 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
7 R925 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
7 R926 RES,CHIP,MAKER ERHZ0000331 110 Kohm,1/16W ,F ,1005 ,R/TP
7 R927 RES,CHIP,MAKER ERHZ0000518 910 ohm,1/16W ,J ,1005 ,R/TP
7 R928 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R929 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R930 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R931 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R932 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
7 R933 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
7 R934 DIODE,SWITCHING EDSY0018101VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty],[empty] ,2P ,1
7 R935 DIODE,SWITCHING EDSY0018101VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty],[empty] ,2P ,1
7 R936 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 243 -
LevelLocation
NoDesciption Part Number Spec Color Remark
7 R937 RES,CHIP,MAKER ERHZ0000439 200 Kohm,1/16W ,J ,1005 ,R/TP
7 R938 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 R940 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R943 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 RA1 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
7 RA2 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
7 U900 IC EUSY0334202BGA ,20 PIN,R/TP ,Levelshifter,sdcard,6ch ,; ,IC,BusController
7 U901 IC EUSY03452013*3 QFN ,10 PIN,R/TP ,3xis Accelerometer ,; ,IC,A/DConverter
7 U902 IC EUSY0349001BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,AudioAmplifier
7 U903 IC EUSY0230104CSP ,36 PIN,R/TP ,SUB PMIC,ALC,2LDO_150mA,1.33X,; ,IC,Sub PMIC
7 U904 IC EUSY0264502DFN ,14 PIN,R/TP ,700mA Boost converter ,; ,IC,DC,DCConverter
7 VA900 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA901 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
7 VA905 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA907 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA908 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA909 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA910 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA911 VARISTOR SEVY0003801 18 V, ,SMD ,
7 ZD1 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
7 ZD2 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 SPCY00 PCB,FLEXIBLE SPCY0109601 POLYI ,0.25 mm,3-1-3 RF , ,; , , , , , , , , ,
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0172201
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM
SAFC0107001
6 BAT600 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi4.8, Pb-Free
6 C107 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C117 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C118 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
6 C300 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C301 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C302 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C303 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 244 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C304 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C306 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C308 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C309 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C310 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C311 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C313 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C314 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C315 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C316 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C317 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C318 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C319 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C320 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C321 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C322 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C323 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C324 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C325 CAP,CERAMIC,CHIP ECCH0009203 33 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C326 CAP,CERAMIC,CHIP ECCH0009203 33 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C327 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C328 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C329 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C330 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C331 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C332 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C333 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C334 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C335 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C421 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
6 C422 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C500 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C501 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C502 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 245 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C503 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C504 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C505 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C506 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C507 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C508 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C509 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C510 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C511 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C512 CAP,CHIP,MAKER ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C513 CAP,CHIP,MAKER ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C514 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C515 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C516 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C517 CAP,TANTAL,CHIP ECTH000200233 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty],[empty]
6 C518 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C519 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C520 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C522 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C523 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C524 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C525 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C526 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C527 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C528 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C529 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C530 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C531 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C532 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C534 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C535 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
6 C536 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C537 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C600 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C601 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
6 C602 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 246 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C603 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C604 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C605 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C606 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C607 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
6 C609 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C610 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C611 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C613 CAP,TANTAL,CHIP ECTH0005202100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C614 CAP,TANTAL,CHIP ECTH0005202100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C616 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C619 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
6 C620 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C621 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C622 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C700 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C701 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C702 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C703 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C704 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C707 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C708 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C709 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C710 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C711 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C716 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C717 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C718 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C719 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C722 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C724 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C802 INDUCTOR,CHIP ELCH0001040 3.9 nH,S ,1005 ,R/TP ,PBFREE
6 C803 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 C804 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C808 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 247 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C809 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C810 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C811 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C812 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C813 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C814 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
6 C815 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
6 C816 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C817 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
6 C818 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C819 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 CN500 CONNECTOR,ETC ENZY0016301 3 PIN,3.0 mm,ETC , ,H-2.0
6 CN600 CONNECTOR,I/O ENRY0006501 18 PIN,0.4 mm,ETC , ,1.2 Offset
6 CN700CONNECTOR,BOARD TOBOARD
ENBY004370120 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,FEMALE ,SMD ,[empty] , ,
6 CN701CONNECTOR,BOARD TOBOARD
ENBY0040301 34 PIN,0.4 mm,ETC , ,H=1.0, Socket
6 D500 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 D501 DIODE,SWITCHING EDSY0014001 SMT ,20 V,200 A,R/TP ,
6 D502 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 D600 DIODE,SWITCHING EDSY0017601USF ,30 V,1 A,R/TP , ,; , , ,22A , , ,667mW ,[empty],[empty] ,[empty] ,1
6 FB500 FILTER,BEAD,CHIP SFBH0001501 120 ohm,1608 ,
6 FB600 FILTER,BEAD,CHIP SFBH00081031000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , ,,SMD ,R/TP
6 FB601 FILTER,BEAD,CHIP SFBH00081031000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , ,,SMD ,R/TP
6 FB603 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB604 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB605 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB700 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 ,
6 FB800 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 ,
6 FL601 FILTER,EMI/POWER SFEY0014001 SMD ,2ch Audio EMI/ESD Filter (8.4ohm, 60pF)
6 FL700 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL701 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL702 FILTER,EMI/POWER SFEY0011701 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
6 FL800 FILTER,SAW SFSY0027301 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW
6 L400 INDUCTOR,SMD,POWER ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 248 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 L500 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP ,
6 L600 INDUCTOR,CHIP ELCH0001556 270 nH,J ,1608 ,R/TP ,
6 L800 INDUCTOR,CHIP ELCH0001034 3.3 nH,S ,1005 ,R/TP ,PBFREE
6 L801 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 L802 INDUCTOR,CHIP ELCH0004703 1 nH,S ,1005 ,R/TP ,
6 Q300 TR,BJT,NPN EQBN0013301 2-2H1A ,.1 W,R/TP ,VEBO=6V, Pb free
6 Q400 TR,FET,P-CHANNEL EQFP0009301MLF-4 ,0 W,0 V,1.2 A,R/TP ,Load Switch ,; ,P-CHANNEL,MOSFET ,; ,; ,; ,; ,; ,MELF ,R/TP ,4P
6 Q500 TR,BJT,NPN EQBN0014301USM ,600 mW,R/TP ,EPITAXIAL PLANAR NPNTRANSISTOR
6 Q501 TR,FET,P-CHANNEL EQFP0009101SC70-6 ,6.5 W,-20 V,-4.5 A,R/TP ,P channel FET ,; ,P-CHANNEL ,MOSFET ,-20 ,8 ,-4.5 ,0.153 ,6.5 ,SC70,R/TP ,6P
6 R100PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R102 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
6 R105 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R300PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R301PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R302PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R304PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R305 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R306 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R307 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R308 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R309 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R310PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R311PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R312 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R313 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R314 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R315 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R404 RES,CHIP,MAKER ERHZ0000237 20 Kohm,1/16W ,F ,1005 ,R/TP
6 R406 RES,CHIP,MAKER ERHZ0000294 5100 ohm,1/16W ,F ,1005 ,R/TP
6 R500 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R501 RES,CHIP ERHY0009503 100 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 249 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 R504PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R505 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R506 RES,CHIP,MAKER ERHZ0000265 300 Kohm,1/16W ,F ,1005 ,R/TP
6 R507PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R508PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R509 RES,CHIP ERHY0017201 0.025 ohm,1/4W ,F ,2012 ,R/TP
6 R511PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R512PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R513 RES,CHIP,MAKER ERHZ00039010.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012,R/TP
6 R514 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R515 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R516 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP
6 R517 RES,CHIP,MAKER ERHZ0000279 39 Kohm,1/16W ,F ,1005 ,R/TP
6 R518 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP
6 R519 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP
6 R520 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R521 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R522 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R523 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R524 RES,CHIP,MAKER ERHZ0000279 39 Kohm,1/16W ,F ,1005 ,R/TP
6 R525 RES,CHIP ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R600PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R601PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R602PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R603 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R604PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R605 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R606 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
6 R607 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R610 RES,CHIP ERHY0009541 470 ohm,1/20W(0.05W) ,F ,0603 ,R/TP
6 R612 RES,CHIP ERHY0009541 470 ohm,1/20W(0.05W) ,F ,0603 ,R/TP
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 250 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 R613PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R614PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R615 RES,CHIP ERHY0009522 3.3 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R616PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R617 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP
6 R618 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R619PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R620 RES,CHIP,MAKER ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP
6 R621PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R622PCB ASSY,MAIN,PADOPEN
SAFO0000501 0OHM_1005_DNI
6 R623PCB ASSY,MAIN,PADOPEN
SAFO0000501 0OHM_1005_DNI
6 R624PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R702 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
6 R703 RES,CHIP,MAKER ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP
6 R704 RES,CHIP ERHY0009502 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R705 RES,CHIP ERHY0009502 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R706 RES,CHIP ERHY0009502 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R707 RES,CHIP ERHY0009502 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R710PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R713PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R714PCB ASSY,MAIN,PADOPEN
SAFO0000401 0OHM DNI
6 R803PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R807PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R808 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R813 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R814 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R816 RES,CHIP ERHY0009531 62 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R817 RES,CHIP ERHY0009531 62 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R818 RES,CHIP ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 SW100 CONN,RF SWITCH ENWY0005301,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER,SMD ,R/TP ,AU , ,
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 251 -
LevelLocation
NoDesciption Part Number Spec Color Remark
6 SW101 CONN,RF SWITCH ENWY0005601,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD,[empty] ,[empty] , ,
6 U101 IC EUSY0245902 DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7
6 U300 IC EUSY0316504FBGA ,107 PIN,ETC ,FULLY 1.8V 2G(LB/256Mx8)NAND+1G(2CS/16Mx4x16) SDRAM ,; ,IC,MCP
6 U301 IC EUSY0327501 BGA ,344 PIN,R/TP ,3.6Mbps HSDPA Digital Baseband
6 U400 IC EUSY0154415
6 U500 IC EUSY0349001BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,AudioAmplifier
6 U501 IC EUSY0340301uMLP ,10 PIN,R/TP ,typ Rdson 0.4ohm, 1.4X1.8 ,;,IC,Analog Switch
6 U502 IC EUSY0297502BGA ,143 PIN,R/TP ,HSDPA Analog baseband ,;,IC,Digital Baseband Processor
6 U600 IC EUSY0269001CSP ,20 PIN,R/TP ,ESD protection & Filtering for analogsignals, Pb-free
6 U601 IC EUSY0320201 TFBGA ,36 PIN,R/TP ,USB2.0 Transceiver, 3.5X3.5X0.8
6 U602 IC EUSY0338301uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF6.5ohm 1.4X1.8
6 U700 IC EUSY0294801 SON1612-6 ,6 PIN,R/TP ,3.1V 150mA LDO Pb-Free
6 U701 IC EUSY0294901 SON1612-6 ,6 PIN,R/TP ,2.6V 150mA LDO Pb-Free
6 U702 IC EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO
6 U801 IC EUSY0358701WFBGA ,100 PIN,R/TP ,Bluetooth+FM 5*7.5*0.8 ,;,IC,Bluetooth
6 U803 IC EUSY0294701 SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free
6 VA600 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA601 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA602 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA603 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA700 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA701 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA702 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005
6 VA703 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA704 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA705 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 X500 X-TAL EXXY002430132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,-40'C ~ +85'C, C0 1.05pF, C1 fF ,; ,32.768 ,20PPM ,12.5, , ,SMD ,R/TP
6 ZD600 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0105601
6 C100 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C101 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
- 252 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C102 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C103 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C104 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C105 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C106 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C112 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C113 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C114 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C115 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C119 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C120 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C121 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C122 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C123 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C124 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C125 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C126 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C130 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C131 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C133 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C134 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C135 CAP,CERAMIC,CHIP ECCH0009506 27 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
6 C200 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C201 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C202 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C203 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C204 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C205 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C206 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C207 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C212 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C214 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C215 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C216 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C218 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C219 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C224 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
- 253 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C225 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C226 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C229 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C400 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C401 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C402 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C403 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C404 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C405 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C406 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
6 C408 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
6 C409 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6 C410 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C411 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C413 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C414 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C415 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C416 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C417 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C418 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C419 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C420 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C423 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C424 CAP,CHIP,MAKER ECZH0001420 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP
6 C425 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
6 C426 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C427 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C428 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6 C429 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C430 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C431 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C623 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C624 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C720 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C721 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C723 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 254 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
6 C805 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C806 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C807 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 CN702CONNECTOR,BOARD TOBOARD
ENBY0019901 80 PIN,0.4 mm,ETC , ,H=1.5, Socket
6 FB400 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FB401 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
6 FB602 FILTER,BEAD,CHIP SFBH0002302 120 ohm,1608 ,CHIP BEAD, 2000mA
6 FL100 FILTER,SAW SFSY0024302 1842.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150
6 FL101 FILTER,SAW SFSY0024303 1960 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150
6 FL102 FILTER,SAW SFSY0024301 942.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150
6 FL200 FILTER,SAW SFSY00292012140 MHz,1.35*1.05*0.6 ,SMD ,Pb-free_WCDMA_Rx_200ohm
6 FL201 FILTER,SAW SFSY0028101 1950 MHz,1.4*1.4 ,SMD ,Pb-free_DCS1900_Rx
6 FL202 DUPLEXER,IMT SDMY00012021950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP
6 IS200 ISOLATOR,GSM SQGY0000101 1950 MHz,3.2x2.5x1.2 ,SMD ,IL 0.5dB, Isolation 14.5dB
6 L100 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6 L101 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6 L102 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 L103 INDUCTOR,CHIP ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE
6 L104 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6 L105 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 L106 INDUCTOR,CHIP ELCH0001039 2.7 nH,S ,1005 ,R/TP ,PBFREE
6 L200 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP ,
6 L201 INDUCTOR,SMD,POWER ELCP0008003 3.3 uH,M ,2.5*2.0*1.0 ,R/TP ,Chip power
6 L202 INDUCTOR,CHIP ELCH0005016 8.2 nH,J ,1005 ,R/TP ,
6 L203 INDUCTOR,CHIP ELCH0001036 5.6 nH,S ,1005 ,R/TP ,PBFREE
6 L204 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE
6 L401 INDUCTOR,SMD,POWER ELCP00080044.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD,2.5X2X1MM ,11MM ,R/TP
6 L402 INDUCTOR,SMD,POWER ELCP00080044.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD,2.5X2X1MM ,11MM ,R/TP
6 L403 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
6 N200COUPLER,RFDIRECTIONAL
SCDY000350119.3 dB,0.3 dB,25 dB,1.6*0.8*0.6 ,SMD ,1920M ~1980M, 6pin
6 R101 RES,CHIP,MAKER ERHZ0000428 18 ohm,1/16W ,J ,1005 ,R/TP
6 R103 RES,CHIP,MAKER ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP
6 R104 RES,CHIP,MAKER ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP
- 255 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
6 R106 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP
6 R107 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP
6 R108 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R110 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R111 THERMISTOR SETY0007101 NTC ,4700 ohm,SMD ,1005 J B:3500K
6 R112 RES,CHIP ERHY0009536 100 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
6 R113 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R114 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R200 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R201 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R202 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP
6 R203 RES,CHIP,MAKER ERHZ0000500 62 ohm,1/16W ,J ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000500 62 ohm,1/16W ,J ,1005 ,R/TP
6 R205 RES,CHIP ERHY0009515 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R206 RES,CHIP ERHY0009515 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R207 RES,CHIP ERHY0009515 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R208 RES,CHIP ERHY0009515 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R400PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R401PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R402PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R413PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R414PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R416 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R417 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R418 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R422 RES,CHIP,MAKER ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP
6 R424 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP
6 R425PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R427 RES,CHIP ERHY0000283 130K ohm,1/16W,J,1005,R/TP
6 R428 RES,CHIP ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R429 RES,CHIP ERHY0000289 270K ohm,1/16W,J,1005,R/TP
6 R430PCB ASSY,MAIN,PADSHORT
SAFP0000501
- 256 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
6 R432PCB ASSY,MAIN,PADOPEN
SAFO0000501 0OHM_1005_DNI
6 R433 RES,CHIP,MAKER ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP
6 R434 RES,CHIP ERHY0000170 390 ohm,1/16W ,F ,1005 ,R/TP
6 R625PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R700PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R701PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 R800 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP
6 R801 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R802 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R804PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R805PCB ASSY,MAIN,PADSHORT
SAFP0000401
6 R815PCB ASSY,MAIN,PADSHORT
SAFP0000501
6 SC100 FRAME,SHIELD MFEA0021501 PRESS, STS, , , , , Without Color 47
6 SPFY00 PCB,MAIN SPFY0174201FR-4 ,0.8 mm,LX-BUMP 10 ,KF750 AMP MAIN PCB ,; , ,, , , , , , ,
6 U100 RF MODULE,HANDSET SMRH0004201 MHz, MHz,QUAD EDGE 6x6 ,EMP U300 Tx Module
6 U102 IC EUSY0296201HVQFN40 ,40 PIN,R/TP ,RF3000 EDGE Transceiver, 6x6x1.0, 40 HVQFN
6 U200 PAM SMPY0013601 dBm,40 %,90 mA, dBc,29 dB,4x4x1 ,SMD ,HSDPA
6 U201 IC EUSY0222103 MicroSMD ,8 PIN,R/TP ,DCDC for PAM 650mA, ~3.4V
6 U202 IC EUSY0299401 ,6 PIN,R/TP ,0.3_2v
6 U203 IC EUSY0327901HVQFN40 ,40 PIN,R/TP ,WCDMA Transceiver, 6 * 6 *1.0, OM6195HN
6 U403 IC EUSY0154416MLF ,12 PIN,R/TP ,Dual DCDC,800mA, adj ,; ,IC,SubPMIC
6 U404 IC EUSY0330701FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audiocodec
6 U603 IC EUSY0319201 DFN ,10 PIN,R/TP ,OVP
6 U703 IC EUSY0319001WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V DualLDO
6 U800 IC EUSY0334201BGA ,12 PIN,R/TP ,4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR (ZXU type)
6 X100 X-TAL EXXY002280126 MHz,10 PPM,15 pF,40 ohm,SMD ,3.2*2.5*0.85,10ppm at -30'C ~ +85'C, C0 1.6pF, C1 5.7fF
6 X400 X-TAL EXXY002330127 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppmat -20'C ~ +70'C, Pb Free
5 SPKY00 PCB,SIDEKEY SPKY0056301POLYI ,0.2 mm,DOUBLE ,KF750 VOLUME SIDEKEY ,; ,, , , , , , , ,
- 257 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
NoDesciption Part Number Spec Color Remark
4 SVCY00 CAMERA SVCY0017001CMOS ,MEGA ,5M AF [Micron 1/3.2", MI5130, Parallel,FPCB]
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 258 -
12.3 Accessory Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LevelLocation
NoDesciption Part Number Spec Color Remark
3 MHBY00 HANDSTRAP MHBY0005603 Libra Hand Strap Without Color
3 SBPL00 BATTERY PACK,LI-ION SBPL0085703
3.7 V,800 mAh,1 CELL,PRISMATIC ,CMW PJT BATT,Innerpack, Europe Label, Pb-Free ,; ,3.7 ,800 ,0.2C,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack,CMW Slide & Folder
AIRY BLUE
BATTERY PACK,LI-ION SBPL00878033.7 V,800 mAh,1 CELL,PRISMATIC,463443,innerpack,EUROP ,; , , , ,PRISMATIC , , ,BLACK, ,
3 SGDY00 DATA CABLE SGDY0010908; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX BoxPackage ,BLACK , ,N
3 SGEY00EAR PHONE/EAR MIKESET
SGEY0005571
; ,RMS 10mW(0.4V,RM3 ,16 OHM ,93dB,1KHZ,1mW,65dB 10KHZ ,104dB 100KHZ ,[empty] ,BLACK ,18PMMI CONNECTOR ,Balance wire 250mm,Earphone,Stereo
3 SSAD00 ADAPTOR,AC-DC SSAD0025003100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug,Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC SSAD0025004100-240V ,5060 Hz,5.1 V,0.7 A,CE ,18pin, UK, Viewtypacking ,; , ,5.1V ,0.7A , , ,WALL 2P ,I/O CONNECTOR ,
Note
Note
Recommended