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Date: February, 2008 / Issue 1.0
Serv
ice M
an
ual
Mo
del : K
F300
Service ManualKF300
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1. INTRODUCTION ........................... 51.1 Purpose .................................................. 51.2 Regulatory Information............................ 51.3 Abbreviations .......................................... 7
2. SYSTEM SPECIFICATION............... 92.1 H/W Features.......................................... 92.2 Technical Specification ......................... 10
3. TECHNICAL BRIEF ....................... 153.1 Digital Main Processor(AD6900, U101). 153.2 Analog Main Processor(AD6855, U100) 183.3 Power Amplifier Module(SKY77318, U601)
.............................................................. 253.4 FEM (DGM1110M014, FL601) ............. 263.5 RTC(FC-135, X100).............................. 273.6 Crystal(26 MHz, X601).......................... 283.7 RF Tranceiver(AD6548, U602) ..............303.8 MEMORY(PF38F5060M0Y0BE, U202)..363.9 BT Module with integrated FM tuner
(EWFMLBAXX, U201) ...........................393.10 SIM Card Interface...............................413.11 Micro-SD Card Interface ......................423.12 LCD Interface.......................................433.13 Battery Charger Interface.....................463.14 Keypad Interface..................................473.15 Audio Interface.....................................493.16 Camera Interface
(2M Fixed Focus Camera) ...................563.17 KEY BACLKLIGHT LED Interface .......593.18 Vibrator Interface .................................60
4. TROUBLE SHOOTING ...................614.1 RF Component.......................................614.2 RX Trouble.............................................624.3 TX Trouble .............................................674.4 Power On Trouble..................................734.5 Charging Trouble ...................................754.6 Vibrator Trouble .....................................774.7 LCD Trouble...........................................794.8 Camera Trouble .....................................834.9 Speaker Trouble ....................................874.10 Earphone Trouble ................................894.11 Receiver Trouble..................................914.12 Microphone Trouble .............................934.13 SIM Card Interface Trouble..................95
4.14 KEY backlight Trouble .........................974.15 RTC Trouble ........................................994.16 Folder on/off Trouble..........................1014.17 Micro SD Trouble ...............................1034.18 Bluetooth Trouble...............................1054.19 FM Radio Trouble ..............................107
5. DOWNLOAD.....................................1095.1 Download .............................................109
6. BLOCK DIAGRAM ........................116
7. CIRCUIT DIAGRAM ......................117
8. BGA IC Pin Check ........................127
9. PCB LAYOUT................................133
10. ENGINEERING MODE................13910.1 BB Test [MENU 1]..............................14010.2 RF Test [MENU 2]..............................14210.3 MF mode [MENU 3] ...........................14210.4 Trace option [MENU 4] ......................14310.5 Call timer [MENU 5] ...........................14310.6 Fact. Reset [MENU 6] ........................14310.7 S/W version........................................143
11. STAND ALONE TEST .................14411.1 Introduction ........................................14411.2 Setting Method...................................14411.3 Means of Test ....................................145
12. AUTO CALIBRATION .................14712.1 Overview............................................14712.2 Equipment List ...................................14712.3 Test Jig Operation..............................14812.4 Procedure ..........................................14912.5 AGC ...................................................15112.6 APC....................................................15112.7 ADC ...................................................151
13. EXPLODED VIEW &REPLACEMENT PART LIST ..... 153
13.1 Exploded View .................................. 153
13.2 Replacement Parts ............................15513.3 Accessory ......................................... 168
Table Of Contents
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download thefeatures of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,persons other than your company’s employees, agents, subcontractors, or person working on yourcompany’s behalf) can result in substantial additional charges for your telecommunications services.System users are responsible for the security of own system. There are may be risks of toll fraudassociated with your telecommunications system. System users are responsible for programming andconfiguring the equipment to prevent unauthorized use. The manufacturer does not warrant that thisproduct is immune from the above case but will prevent unauthorized use of common-carriertelecommunication service of facilities accessed through or connected to it.The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as long asrepair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If thesechanges could reasonably be expected to affect the use of the this phone or compatibility with thenetwork, the telephone company is required to give advanced written notice to the user, allowing theuser to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorizedagent.The user may not make any changes and/or repairs expect as specifically noted in this manual.Therefore, note that unauthorized alternations or repair may affect the regulatory status of the systemand may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference fromunsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.Following information is ESD handling:• Service personnel should ground themselves by using a wrist strap when exchange system boards.• When repairs are made to a system board, they should spread the floor with anti-static matb which is
also grounded.• Use a suitable, grounded soldering iron.• Keep sensitive parts in these protective packages until these are used.• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION
1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
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1. INTRODUCTION
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. SYSTEM SPECIFICATION
2.1 H/W Features
2. SYSTEM SPECIFICATION
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion Polymer, 3.7V 800mAh
Stand by TIME Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM850/EGSM: -109dBm, DCS/PCS: -109dBm
TX output powerGSM850, EGSM: 32.4dBm(Level 5),DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
DisplayMAIN : TFT 240 × 320 pixel 262K Color
SUB : TFT 128 × 160 pixel 262K Color
Hard icons. Key Pad
Status Indicator0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation KeyMenu Key, Clear Key, Back Key, Confirm KeySend Key, Volume Key, PWR Key, Camera Key, Hot Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver 16Ø Speaker / 11x07 Receiver
Travel Adapter Yes
MIDI SW MIDI (Mono SPK)
Camera 2M
Bluetooth / FM Radio Bluetooth version 2.0 / 76~108MHz supported
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2. SYSTEM SPECIFICATION
2.2 Technical Specification
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM850TX: 824 ~ 849MHzRX: 869 ~ 894MHz
EGSMTX: 880 ~ 915MHzRX: 925 ~ 960MHz
DCS18001 Frequency Band TX: 1710 ~ 1785MHz
RX: 1805 ~ 1880MHzPCS1900
TX: 1850 ~ 1910MHzRX: 1930 ~ 1990MHz
2 Phase ErrorRMS < 5 degreesPeak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM850/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS/PCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. SYSTEM SPECIFICATION
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM850/EGSM
Offset from Carrier (kHz). Max. [dBc]
100 0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS/PCS
Offset from Carrier (kHz). Max. [dBc]
100 0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM850/EGSM
Offset from Carrier (kHz) Max. [dBm]
Output RF Spectrum 400 -196
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. SYSTEM SPECIFICATION
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
DCS/PCS
Offset from Carrier (kHz) Max. [dBm]
Output RF Spectrum 400 -226
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850/EGSM
8 Bit Error RatioBER (Class II) < 2.439% @-102 dBm
DCS/PCSBER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
13 Receiving Response1,000 0 -6
3,000 4 -6
3,400 4 -6
4,000 4 -9
*Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
- 13 -
2. SYSTEM SPECIFICATION
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Distortion-20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18System frequency
≤ 2.5 ppm(13 MHz) tolerance
19 32.768KHz tolerance ≤ 30 ppm
At least 65 dBspl under below conditions:20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : Typ. 430 mA21 Charge Current Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
Bar Number Power
7 -93~
7 → 5 -93 2
22 Antenna Display 5 → 4 -98 2
4 → 2 -101 2
2 → 1 -104 2
1 → 0 -106 2
0 → OFF ~-106
Battery Bar Number Voltage
3 ≤ 3.75 0.05 V
23 Battery Indicator 3 → 2 3.75 0.05 V
2 → 1 3.64 0.05 V
1 → 0 3.54 0.05 V
Item Description Specification
24Low Voltage Warning ≤ 3.54 0.05V (Call)
(Blinking Bar) ≤ 3.4 0.05V (Standby)
25Forced shut down
3.33 0.05VVoltage
26 Sustain RTCwithout battery Over 50 hours
Li-Ion Battery
27 Battery TypeStandard Voltage = 3.7 VBattery full charge voltage = 4.2 VCapacity: 800mAh
Switching-mode charger28 Travel Charger Input: 100 ~ 350V, 50/60 Hz
Output: 5.1 V, 700 mA
- 14 -
2. SYSTEM SPECIFICATION
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1 Digital Main Processor(AD6900, U101)
The AD6900 is an advanced, low-power baseband processing solution from Analog Devices, and ispart of the AD20msp500 SoftFone® chipset family. The AD6900 is intended for use in a wide variety offeature-rich phones with GSM/GPRS/EGPRS based system connectivity requirements. It is designedto interface easily to an application/OS processor, or to stand alone as a fully integrated and easy-to-use solution for mobile handset and wireless modem applications.
Figure. 3-1 AD6900 FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.1.1 Features of AD6900
Complete Single-Chip Programmable Digital Baseband Processor with four main subsystems
MCU Control Processor Subsystem:
32-bit ARM926EJ-S® MCU Control Processor260 MHz operation at 1.5Vdedicated caches, 16K bytes each, for instructions and data4kB Instruction Tightly Coupled Memory (TCM)2-Mbit On-chip System SRAMCiphering coprocessor for GPRS supporting GEA1 and GEA2 encryption algorithmsKasumi cipher coprocessor for GEA3 encryptionDedicated multichannel DMA controller
DSP Subsystem:
Blackfin 16-bit fixed-point DSP Processor260 MHz operation at 1.5VMemory:
→ L1 program space: 64 kB SRAM and 16 kB configurable as instruction cache or SRAM→ L1 data space: Two banks of 16K bytes, each with 8K bytes of dedicated SRAM and an
additional 8K bytes that can be configured as either cache or SRAM→ L2 space: 64KB SRAM
Ciphering coprocessor (GEA1 and GEA2)Kasumi cipher coprocessor for GEA3 encryptionDedicated multichannel DMA controller
Peripherals Subsystem:
Shared on-chip peripherals and off-chip interfaces:Support for Burst-mode, Page-mode, and NAND Flash memorySupport for SRAM, SDRAM, and PSRAM (cellular RAM)Full-Speed USB 2.0 Dual-Role Interface with OTG (On-The-Go) Host Mode or traditional Peripheral-only mode
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3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Applications Subsystem for Enhanced Multimedia:
Parallel Peripheral Interface (PPI) for 10-bit dedicated camerasensor or video input interface (including ITU-656 and ITU-601 digital video)Separate external bus interface for parallel LCD displays (or camera module inputs)- reduces noise and loading on themain EBUS interfaceDedicated multi-channel DMA controller
OTHER FEATURES
Real-Time Clock (RTC) with AlarmFour General-Purpose TimersBaseband Converter InterfaceCompatible with Othello® radio subsystemHighly configurable interrupt controller architectureProgrammable bus arbitration to optimize system performanceSupports 13 MHz and 26 MHz Input ClocksProgrammable Power Management and Clock Management
- Slow Clocking Scheme for Low Idle Mode Current- Power Down modes- Dynamic Core Voltage Scaling from 1.1 - 1.5V
Independent I/O Voltage DomainsOn-chip support for EGPRS Data Services up to Class 10Embedded Trace Macrocell for MCU DebugJTAG Interface for Test and In-Circuit Emulation of both the MCU and DSP Advanced features forsecurity
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
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3.2 Analog Main Processor(AD6855, U100)
The AD6855 is a complete mixed-signal baseband processor that combines all of the data convertersand power supply regulators required for a GSM 900 / GSM 850 / DCS 1800 / PCS 1900 mobile on asingle device, including HSCSD, GPRS and EGPRS.
Figure. 3-2-1 AD6855 FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.2.1 General DescriptionThe AD6855 baseband transmit section supports the following mobile station GMSK modulation powerclasses:
GSM 900/850 power classes 4 and 5,DCS 1800 power classes 1 and 2, andPCS 1900 power classes 1 and 2.
The AD6855 baseband transmit section supports the following mobile station 8-PSK modulation powerclasses:
GSM 900/850 power classes E2 and E3,DCS 1800 power classes E2 and E3, andPCS 1900 power classes E2 and E3.
The AD6855 baseband receive section supports GMSK and 8-PSK applications.The AD6855 auxiliary section provides a voltage reference, an automatic frequency control DAC, anauxiliary ADC, and light controllers. The auxiliary ADC provides two channels for measuringtemperature using discrete external devices placed in critical locations. The AD6855 audio sectionprovides 8 kHz and 16 kHz sampling rates for voiceband data input and output and provides ninestandard sample rates ranging from 8kHz to 48 kHz for personal audio output on two PCM Audio serialports. The two Audio serial ports allow support for concurrency. The AD6855 power managementsection provides voltage regulators for digital and analog components, a battery charger, batteryprotection circuitry, and power supply activation logic. The AD6855 digital processor interface providesserial ports for control data, baseband transmit and receive data, and two for audio data.
- 20 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.2.2 Power BlockCSPORT interface, power management control interface and the circuit that generates power upRESET pulses (RESET2P8 and RESET1P8) for use by the DBB chip.All regulators except the USB interface regulator are powered from the main battery.The USB regulator is powered from USB VBUS.And the user presses KEYON which puts the AD6855 power management system into ACTIVATIONstate (see definitions below) and signals DBB software that it’s time to wake up and operate using theKEYOUT signal.
Figure. 3-2-2 AD6855 POWER BLOCK DIAGRAM
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3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-2-3 AD6855 KEYON/KEYOUT BLOCK DIAGRAM
Figure. 3-2-4 AD6855 RESET GENERATION BLOCK DIAGRAM
- 22 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Power On Reset Generator
The power-on reset signals (RESET1P8 and RESET2P8) are asserted based on the VCORE (ifVAPPCFG = 0), VMEM, VEXT, and VPLL regulators. RESET1P8 and RESET2P8 are low when resetis enabled and high when reset is disabled.When the outputs of all four regulators reach their corresponding threshold voltages, reset will bedisabled after a nominal reset period of 130ms.The outputs of all four regulators must remain at or above their corresponding threshold voltages forthe duration of the reset period for reset to be disabled (pulled high).The nominal 130ms reset period is restarted whenever all four regulators reach their thresholdvoltages. The nominal reset period of 130ms can be extended by connecting an external capacitor toCRST. This capacitor is charged using a small current when reset is enabled. Once the capacitorreaches the threshold, reset is disabled.Reset will be enabled immediately if any one of the four regulators falls below their correspondingthreshold voltages. In addition, reset will be enabled if VBAT falls below VRTC. The PWREN signal isthe logical AND of all the state controls that enable or disable many of the regulators on the chip. If theregulators enabled by PWREN are disabled by PMT state controls described below then PWRENmust go low.When PWREN goes low reset will be immediately enabled causing RESET1P8 and RESET2P8 to bepulled low.When reset is enabled, both RESET1P8 and RESET2P8 are actively pulled low. CRST is also activelypulled low when reset is enabled.
VABB Regulator Enable/Disable Logic Operation
The VABB regulator powers many on-chip analog circuits on the ABB. The VCXOEN signal, theVABBEn bit in the LDOControl1 Bit Positions ( Addr 0x35) register, and the AFCDACMode andAFCDACOn bits in the AuxControl1 Bit Positions ( Addr 0x13) register all particpate in controlling theVABB enable/disable.When the ABB power management system transitions from Off state, DDLO state, UVLO state, orThermal Shutdown State to Power Key Activation, Charger Activation, USB Charger Activation, orActive State VABB will be enabled. During these state transitions ABBEn = 0 and AFCDACMode = 0,VRF is enabled.Once the ABB power management system is in Power Key Activation, Charger Activation, USBCharger Activation, Active-Standby or Active State the VABB regulator enable/disable is controlled bythe information written to the VABBEn and AFCDACMode register bits by system software.
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3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Digital Baseband Core (VCORE)
The Digital Baseband Core regulator supplies the digital baseband processor (DBB) core.The voltage on VCORE is selectable using the VCOREControl register.The VCOREActive code selects the voltage on VCORE in high power mode and the VCOREStandbycode selects the voltage on VCORE in low-power mode.
DBB Interface (VINT)
The DBB interface regulator supplies the DBB/ABB digital interfaces. The output voltage of the VINTregulator is nominal 1.8V.
Memory (VMEM)
The VMEM regulator supplies the external memory(s) and the interface to the external memory on thedigital baseband processor. The output voltage of the Memory Interface regulator can be selected as1.8V nominal or 2.8V nominal using the VMEMSEL terminal.
External Interface (VEXT)
The External Interface regulator supplies the Radio digital interface and the high voltage (>1.8V)interface between the digital baseband processor and various peripherals, such as the LED indicatorsand the LCD display.
SIM Interface (VSIM)
AD6855 is designed to support 3.0 V and 1.8 V SIMs exclusively (i.e. no 5 V SIMs).The SIM Interface regulator supplies the SIM interface circuitry on the digital processor and the SIMcard. By default the SIM Interface regulator output is 2.85 V, which can be decreased to 1.8 V if a 1.8V SIM is detected.
Real-Time Clock (VRTC)
The Real-Time Clock regulator supplies the Real-Time Clock module. The Real-Time Clock regulatoris optimized for low ground current.
Baseband Analog (VABB)
The Baseband Analog regulator supplies the analog portions of the AD6855. Operation of the VABBregulator is controlled by the VABBEn bit in the LDOControl1 register.If VABBEn = 0, the VABB regultor will be disabled unless the AFCDAC is enabled or VCXOEN = 1. IfVABBEn = 1 (the default state) VABB is enabled along with VCORE, VMEM, and VEXT. TheBaseband Analog regulator is optimized for high ripple rejection and low noise. The output of theBaseband Analog regulator should not be used as a supply for any external components.
- 24 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Microphone (VMIC)
The Microphone regulator supplies the microphone interface circuitry. The Microphone regulator isoptimized for extremely high ripple rejection up to 217 Hz and low noise.
VRF (VRF)
The VCXO regulator supplies the voltage controlled crystal oscillator (VCXO). The VCXO regulator isoptimized for high ripple rejection and low noise.
USB Interface (VUSB)
The VUSB regulator supplies the USB transceiver located in the DBB. Digital Baseband PLL (VPLL)The VPLL regulator supplies the phase locked loop on the digital baseband (DBB).
General Purpose Regulator (VGP)
The General Purpose regulator is intended primarily to serve as a supply rail for camera modules. Itsvoltage is programmable by setting VGPSel[3:0] in theLDOControl2 Register. VGP is enabled bysetting the VGPEn bit in LDOControl1 to 1.
Applications Regulator (VAPP)
The VAPP regulator is an adjustable regulator that uses an off chip pass device. It has two modes ofoperation selected by the state of the VAPPCFG terminal. If VAPPCFG is pulled low the VAPPregulator functions as a programmable voltage applications supply.In this mode, VAPP is enabled or disabled using the VAPPEn bit of LDOControl1.
3.3 Power Amplifier Module(SKY77318, U601)
3.3.1 Internal Block Diagram
3.3.2 General DescriptionThe SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact formfactor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matchingcircuitry for 50 ߟ input and output impedances and a Power Amplifier Control (PAC) block with aninternal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PACfunction and interface circuitry.Fabricated onto a single Gallium Arsenide (GaAs) die, one Hetero-junction Bipolar Transistor (HBT)PA block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. BothPA blocks share common power supply pins to distribute current.
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3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-3-1 SKY77318 FUNCTIONAL BLOCK DIAGRAM
3.4 FEM (DGM1110M014, FL601)
The FEM is integrated of quadband RX SAWs, internal diplexer and ESD protection at Ant port to 8kVacc.
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-4-2 FEM CIRCUIT DIAGRAM
Figure 3-4-1 Band SW Logic Table
100pC644
2V75_VCXO
15
GSM850_RX11
GSM850_RX223
GSM900_RX1GSM900_RX2
4
VC11413
VC2
12VDD
FL601DGM1110M014
AN
T17
GND19
11GND2
16GND3
18GND4GND5
1920
GND6GSM1800_1900_TX
10
5GSM1800_RX1GSM1800_RX2
67
GSM1900_RX1GSM1900_RX2
8
GSM850_900_TX
C63239p
C6280.1u
C643100p
10
R612
ANT_SW2ANT_SW1
ANT_SW1 ANT_SW2
GSM850/900 TX L H
DCS/PCS TX H H
GSM850/900 RX L L
DCS/PCS RX H L
3.5 RTC(FC-135, X100)
The AD6900 supports a Real Time Clock function. A total of 25pF+/-10% capacitance to graound isrequired (including board trace capacitance) on each OSCIN and OSCOUT.RTC functionality allows the application software to implement standard clock, calendar, or organizerfunctions.
A 32KHz clock is required in AD6900 based systems to take advantage of power saving “slowclocking” mode. A combination of an oscillator circuit within the AD6900 IC and an external 32KHzcrystal results in a stable 32kHz clock for use in the system. The purpose of this application note is todiscuss the system issues that affect operation of the 32kHz oscillator circuit.
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-5-1 32.768KHz Crystal Basic Connections
- 28 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.6 Crystal(26 MHz, X601)
The AD6548 requires only an external low cost as the frequency reference. The circuitry to oscillatethe crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementationrequiring the crystal to be connected across 2 pins. There is a programmable capacitor arrayincluded for coarse tuning of fixed offsets, and an integrated varactor for dynamic control. Theoscillator is designed for use with a 26MHz crystal. The crystal is connected as shown in figure 3-3.
Figure. 3-6-1 Crystal Oscillator External Connection
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Dedicated control software ensures excellent frequency stability under all circumstances. The AD6548reference oscillators provides a 26MHz 600mVpp (typical) output (REF_OP), for use as the basebandclock input.
The AD6548 integrates this frequency tuning range the tuning section comprises a switchablecapacitor array for discrete steps and varactor for fine tuning. Contol of the tuning process is driven bysoftware, whereby the frequency can be maintained accurately during reception gaps and initialfrequency upon startup can be accurately estimated without the need for temperature sensors.
Figure. 3-6-2 Crystal Circuit Block Diagram
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.7 RF Tranceiver(AD6548, U602)
3.7.1 GENERAL DESCRIPTIONThe AD6548 provides a highly integrated direct conversion radio solution that combines, on a singlechip, all radio and power management functions necessary to build the most compact GSM radiosolution possible. The only external components required for a complete radio design are the RxSAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radiosolution.The AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family.For Quad band applications the front end features four fully integrated programmable gain differentialLNAs. The RF is then downconverted by quadrature mixers and then fed to the basebandprogrammable-gain amplifiers and active filters for channel selection. The Receiver output pins can bedirectly connected to the baseband analog processor. The Receive path features automatic calibrationand tracking to remove DC offsets.
Figure. 3-7-1 CIRCUIT DIAGRAM of RF Tranceiver
- 31 -
3. TECHNICAL BRIEF
The transmitter features a translation-loop architecture for directly modulating baseband signals ontothe integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removingthe need for external SAW filters prior to the PA.The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. Thesynthesizer lock times are optimized for GPRS applications up to and including class 12.
3.7.2 FUNCTIONAL DESCRIPTION
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-7-2 RECEIVER CHAIN BLOCK DIAGRAM
- 32 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.7.2.1 RECEIVER CHAIN
The AD6548/9 receiver section fully integrates all the RF and baseband signal processing. Each majorblock is described in the following sections.
Low Noise Amplifiers
The AD6548 includes four fully integrated Low Noise Amplifiers (LNAs), to support quad bandapplications without further external active components. The LNAs have differential inputs whichminimize the effect of unwanted interferers. The inputs are easily matched to industry standardFront End Modules (FEMs) or discrete Rx SAW filters. The outputs of the LNAs are directly coupledto the down-converting mixers.The voltage gain of the LNAs are typically 24 dB. Each LNA can be switch to a low gain mode whenreceiving large input signals as part of the AGC system.Down-Converting Mixers Two quadrature mixers are used to mix down the signals from the LNAs,one for the high bands (1800 and 1900 MHz) and one for the low bands (850 and 900 MHz). Theoutputs of the mixers are connected to the baseband section through an integrated single pole filterwith nominal cut-off frequency of 800kHz. This acts as a “roofing filter” for the largest blockingsignals (i.e. those ≥ 3MHz) and prevents the baseband amplifiers from being overloaded.
Baseband Amplifiers / Low Pass Filters
The baseband amplifiers provide the majority of the analog receiver gain. The filtering is provided byan integrated 5th order Chebyshev filter giving the necessary adjacent channel and blocking filtering,it is also acting as an anti-alias filtering for Baseband IC’s converters. A final low pass pole ispossible Baseband Output D.C. Offset Correction In order to minimize D.C. offsets inherent in thereceiver and maximize dynamic range a D.C offset correction circuit is integrated. This correction istriggered over the serial bus and then an offset tracking loop is enabled to minimize residual offsetsunder all conditions. The tracking loop is fully hardware integrated, requiring no softwareintervention.
Receiver Local Oscillator (LO) Generator
The Rx LO generator is used to avoid DC offset problems associated with LO leakage into thereceiver RF path. By operating the VCO at a frequency other than the desired receive frequencies,any leakage of the VCO will fall out of band. The LO generator is used to convert the offsetsynthesized VCO output to the on-frequency quadrature LO required by the chipset. The LOgenerator is implemented as a regenerative frequency divider, performing a 2/3 multiplication of theVCO output for the high band (DCS1800/PCS1900) and a 1/3 multiplication for low band (E-GSM900/GSM850).
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 33 -
3.7.2.2 Transmit Path
Overview
The transmit section of the AD6548/9 radio implements a translation loop modulator.This consists of a quadrature modulator, high speed phase-frequency detector (PFD) with chargepump output, loop filter, TX VCO and a feedback down converting mixer. The VCO output (dividedby 2 for low band) is fed to the power amplifier with a portion internally fed back into the down-converting feedback mixer to close the feedback loop.
Quadrature Modulator
The Quadrature modulator takes the baseband I & Q signals and translates these into a GMSKsignal at the Transmit Intermediate Frequency (TX IF). After bandpass filtering and limiting the TX IFsignal is used as the reference input to the Phase Frequency Detector (PFD) of the transmit PLL.
Figure. 3-7-3 TRANSMIT PATH BLOCK DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3. TECHNICAL BRIEF
- 34 -
Phase Frequency Detector (PFD)
The PFD ensures that the transmitted signal contains the required modulation and is accuratelylocked to the desired GSM channel. The downconverted feedback signal from the TX VCO and theQuadrature Modulator output are phase compared by the PFD.The PFD charge pump generates a current pulse proportional to the difference in phase which isapplied to the loop filter.
Loop filter
To minimize complexity of the external PCB layout the TX loop filter is fully integrated into the IC. Atpower up the filter is automatically calibrated as part of the baseband filter cal, eliminating processtolerances. The calibration is fully integrated and requires no extra programming.
TX VCO
The Transmit Voltage Controlled Oscillator (TX VCO) and tank components are a fully integratedsubsystem. The subsystem includes PA drivers so the outputs are used to directly drive the externalPAs. The low noise oscillator design and internal filtering mean that external TX SAW filters are notrequired. In Low band operation the TX VCO output is divided by two and filtered. The TX VCO isautomatically calibrated to ensure optimum performance over its operating frequency of 1648 to1910 MHz.
Feedback Down-Converting Mixer
The feedback down converting mixer is used to translate the TX VCO output frequency to the TX IF.An integrated band pass filter exists between the mixer and the PFD to filter the mixers unwantedside band and higher order mixing products.
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.7.2.3 Main Frequency Synthesizer
The AD6548 has a single fast-locking fractional synthesizer used for VCO control in both receive andtransmit mode. The entire system including VCO, tank, fractional N dividers, sigma deltacompensation, charge pump and loop filters are fully integrated.The only external component is the frequency reference. The synthesizer is controlled via the serialinterface. The VCO is fed into the respective dividers to generate the appropriate LO frequencies forthe RX and TX bands.
Fractional N Dividers
The fractional N divider allows the PLL system to have a smaller step size than theb comparisonfrequency which is set by the external reference to 26 MHz. This feature allows all the GSMfrequency band rasters to be achieved, with fast lock times and good phase noise characteristics.The divider section consists of a dual modulus 8/9 prescaler, integer M & A dividers, and fractionalN system based on sigma-delta modulation to generate the required fractional divide ratio. TheDenominator of the fractional divider can be set to 3 different values, (1040, 1170, 1235), dependingon the mode of operation. For example a denominator of 1040 with an input fraction F maintains anaverage value of F/1040 allowing 25 kHz steps when operated at a reference of 26 MHz.The Overall count value is thus:
8*M + A + FractionWhere: M is 4 bits, but the MSB is set to 1. A is 3 Bits. Fraction is N/ Denominator.The Denominator is set to one of 3 values: 1040, 1170, 1235. N is a 11 bit value.Values for M, A and N are loaded from serial interface word, but the denominator is automaticallyset according to the mode.Refer to the Programming Procedures for more details.
Phase Frequency Detector/Charge Pump
A Phase Frequency Detector (PFD) is used for the PLL phase detector. The charge pump isdesigned such that good matching of up and down currents is achieved over a wide outputoperating range. The charge pump output is internally routed to the integrated synthesizer loop filter.
Synthesizer Loop filter
To minimize complexity of the external PCB layout the Main Synthesizer loop filter is also fullyintegrated into the IC. No external components or adjustments are required.
Voltage Controlled Oscillator
The integrated voltage controlled oscillator (VCO) is a complete self-calibrating subsystem. Thisemploys a fully automated digital self-calibration function to ensure optimum phase noiseperformance over the entire frequency range. The VCO generates frequencies between 2520MHzand 2985MHz as required to operate in the four GSM bands for RX and TX.
- 36 -
3. TECHNICAL BRIEF
3.8 MEMORY(PF38F5060M0Y0BE, U202)
The 512Mbit Ballaire Wireless Flash memory with LPSDRAM stacked device family offers multiplehigh-performance solutions. The Ballaire flash die is manufactured on 65 n m ETOX™IX ProcessTechnology. It delivers 108 MHz synchronous burst and pagemode read rates with supports multi-partitioning with Read-While-Write (RWW) or Read-While-Erase (RWE) dual operations. TheLPSDRAM is a high-performance volatile memory operating at speeds up to 133 MHz withconfigurable burst lengths.The Ballaire stacked device features programmable driver strength and low-power operation.This Stacked Chip Scale Package (SCSP) device is packaged in a standard Intel® x16D footprint andsignal ballout.This model uses 512Mbits Flash memory and 128Mbits LPSDRAM memory with stacked.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-8-1 MEMORY BLOCK DIAGRAM
- 37 -
3. TECHNICAL BRIEF
The DBB External Bus Interface provides a memory-mapped interface to external devices such asNOR Flash, NAND Flash, SRAM, SDRAM, PSRAM, and other custom devices.The External Memory Interface contains three distinct memory controllers: a NAND Flash Controller(NFC), an SDRAM Controller (SDC), and the External Bus Controller (EBC).These three controllers share the external pins. They also share an arbiter through which the DMAcontrollers (via DDBUS, ADBUS, and DMABUS) and the processor cores (via DSPBUS andMCUEBUS) access external devices. The following figure shows the external memory interface blockdiagram.
The following table shows the pin list for the external memory interface which supportedby Main Base Band chipset(AD6900).
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-8-2 DBB EBU SUBSYSTEM BLOCK DIAGRAM
- 38 -
3. TECHNICAL BRIEF
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
NFC Busy Request nNDBUSY
SDC Clock Output SDCLKOUT
SDC Clock Enable SDCKE
SDC address 10 SDA10
SDC Write Enable nSDWE
SDC Column Address Strobe nSDCAS
SDC Row Address Strobe nSDRAS
External Device Wait Input nWAIT
Burst Memory Clock BURSTCLK
Low Write / Byte Strobe / Data Mask / Address Latch Enable nLWR / nLBS / SDQM[0] / ALE
High Write / Byte Strobe / Data Mask/ Command Latch Enable nHWR / nUBS/ SDQM[1] / CLE
Auxiliary Chip Select nB1CS
Auxiliary Chip Select nB0CS
NAND Flash Chip Select nNDCS
SDRAM Chip Select nSDCS
General Purpose Chip Select nA5CS
General Purpose Chip Select nA4CS
General Purpose Chip Select nA3CS
General Purpose Chip Select nA2CS
General Purpose Chip Select nA1CS
General Purpose Chip Select nA0CS
Valid Address nADV
Read Enable nRD
Write Enable nWE
Address ADDR[25:0]
Data DATA[15:0]
Function Signal Name
- 39 -
3. TECHNICAL BRIEF
3.9 BT Module with integrated FM tuner (EWFMLBAXX, U201)
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure. 3-9-1 Bluetooth ModuleBLOCK DIAGRAM
Figure. 3-9-2 BCM2048 POWERBLOCK DIAGRAM
- 40 -
3. TECHNICAL BRIEF
3.9.1 Power Block
To reduce the external BOM, the BCM2048 features three internal voltage regulators for the Bluetoothand FM sections that eliminate the need for filtering between the digital and noise sensitive RF circuits.These regulators operate from either 2.3V to 5.5V input supplies that support direct connection toLithium batteries, or to a 1.7V to 3.6V input supply.The pre-regulator, PRE-REG, regulates battery power supply down to a level acceptable to the internalmain regulators, BT REG and FM REG. The PRE-REG and the BT REG are enabled by an externalinput VREG_CTL. If VREG_CTL is low, the BCM2048 is shut down. If preregulation is not requiredbecause the input power supply is in the range 1.7V to 3.6V, VDDR5V and VDDR3V should be tiedtogether to form the input power supply.For more on supplying power to the BCM2048, refer to the reference schematic document, availablefrom your Broadcom representative.
3.9.2 Operational Description
The BCM2048 Bluetooth radio transceiver provides enhanced radio performance to meet the moststringent industrial temperature applications and the tightest integration into mobile handsets andportable devices. It is fully compatible with all standard TCXO frequencies and provides full radiocompatibility to operate simultaneously with GPS and cellular radios. It also integrates a complete FMand RDS/RBDS solution. The integrated solution saves power and board space, minimizes the BOM,and maximizes interface flexibility over a separate Bluetooth and FM solution. The FM subsystem canoperate independently of Bluetooth and achieve full performance while Bluetooth is operating.It is designed to cover from 76 MHz, up to 108 MHz, bands (US, Europe, Japan) and to operate fromeither the Bluetooth reference clock or a 32-kHz LPO input. The FM subsystem supports aconventional I2C compatible interface and analog outputs for legacy systems, as well as digitalinterface options, such as I2S and PCM. The I2S and PCM interfaces supports 48-kHz operation andcan be either master or slave. The analog interface consists of high-quality, line-level stereo DACs.The BCM2048 FM subsystem includes advanced RDS/RBDS capability. The BCM2048 synchronizes,demodulates, and decodes RDS/RBDS signals including CRC processing, post data filter detection,signal quality estimation, and buffering thus making it easy for an external application to read andprocess the RDS/RBDS data. The FM radio provides excellent reception, with 1 •ÏV for 26 dB (S+N)/Ntypical sensitivity and greater than 60-dB SNDR capability, allowing easier system integration andantenna design. The FM subsystem includes many sought-after features, including signal-dependantmono/stereo blend, soft mute, and signal bandwidth control. The system has digital RSSI, signalquality, and IF frequency error indicators for system monitoring. The FM subsystem containsembedded automatic search and scan features, and large RDS data buffers to simplify the interfacewith an external host.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 41 -
3. TECHNICAL BRIEF
3.10 SIM Card Interface
The Main Base Band Processor(AD6900) provides SIM Interface Module.The AD6900 checks status Periodically During established call mode whether SIM card is inserted ornot, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signalsSIM_DATA, SIM_CLK, SIM_RST.And This model supports only 3V SIM Card.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(5000-6T-1.8SL)
(GPIO_100)
220n
C318
2V85_VSIM
C324
22p
2V85_VSIM
C3251000p
4C5C6
5
C76
GND178
GND2GND39
10GND4
J3001
C12
C2C3
3
C323
DNI
R316
15KSIM_RST
SIM_DATA SIM_CLK
Figure 3-10. SIM CARD Interface
Signals Description
SIM_RST This signal makes SIM card to HW default status.
SIM_CLK This signal is transferred to SIM card.
SIM_DATA This signal is interface datum.
- 42 -
3. TECHNICAL BRIEF
3.11 Micro-SD Card Interface
AD6900 provides an interface for Multi-Media Cards (MMC), Secure Digital Memory Cards (SD Card),and Secure Digital Input/Output Cards (SDIO). All of these cards use similar interface protocols. Themain difference between MMC and SD support is the initialization sequence. The main differencebetween SD card and SDIO support is the use of interrupt and read wait signals for SDIO.Features of the MMC/SD interface (MMCI) include:
Support for a single MMC, SD Memory or SDIO cardSupport for 1-bit and 4-bit SD modes (SPI mode is not supported)A six-pin external interface with clock, command, and up to 4 data linesCard detection using one of the data pinsCard interface clock generation from SYSCLKSDIO interrupt and read wait features
The following table lists the six pins in the MMCIThe MMCI consists of an MMC/SD controller along with a peripheral bus interface. The controller handles the multi-media and secure digital card functions. This includes clockgeneration, power management, command transfer, and data transfer. The bus interface contains 32-bit memory mapped registers, converts 16-bit PBUS accesses to 32-bit register accesses,
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(SCHB1A0202)
R325 0 9
GND210
GND31112
GND4
4VDD
6VSS
J301
5CLK
3CMD
7DAT0DAT1
8DAT2
1
DAT32
GND1
1M
R328
R319
100K 100K
R323
C329
2.2u
2V93_VEXT
100K
R320
2V93_VEXT
R321
100K
2V93_VEXT
MC_D3
MC_DET
MC_D0MC_D1MC_D2
MC_CMDMC_CLK
Figure 3-11. Micro-SD Interface
- 43 -
3. TECHNICAL BRIEF
3.12 LCD Interface
LCD Module provides 2 LCD, Primary LCD(240x320, 262K Color) and Secondary LCD(128x160, 262kColor).The controller handles the multi-media and secure digital card functions. This includes clockgeneration, power management, command transfer, and data transfer. The bus interface contains 32-bit memory mapped registers, converts 16-bit PBUS accesses to 32-bit register accesses,Two LCD shared Data bus, RD, WR and RS but CS (chip select signal).BLU (Back Light Unit) is shared primary and secondary LCD and include 5 white LEDs. White LCDdriver is AAT3169 and it is descripted at next page.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(SUB LCD VSYNC)
(0.15mm)
(0.15mm)
(0.15mm)
(0.2mm/ Shield)
(0.2mm/ Shield)(0.15mm)
(IF_MODE = LOW : 16BIT)
(LCD_RD : Internally Pulled Up)
(0.1
5mm
)
(0.15mm)
(0.15mm)(0.4mm)
789
G1 G2
G3 G4
313233343536373839
44041424344
56
171819
2
202122 23
242526272829
3
30
CN802
1
10111213141516
2V93
_VE
XT
RCV_PRCV_N
LCD_DATA02
LCD_DATA00
LCD_DATA06
LCD_DATA04LCD_DATA11LCD_DATA10
LCD_DATA08LCD_DATA09
LCD_DATA15LCD_DATA14
LCD_DATA12LCD_DATA13
LCD_DATA01
LCD_DATA03
LCD_DATA05
LCD_DATA07
MLED5
MLED3
MLED1
LCD_RS
LCD_SUB_CS
LCD_MAIN_CS
LCD_WR
LCD_VSYNC
LCD_RESET
MLED
MLED2
MLED4
LCD_IDVIBRATOR_P
Figure 3-12-1. LCD Interface
- 44 -
3. TECHNICAL BRIEF
The AAT3169 is a low noise, constant frequency charge pump DC/DC converter that uses a tri-modeload switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LEDapplications. The AAT3169 is capable of driving six LEDs for a total of 180mA from a 2.7V to 5.5Vinput. The current sinks may be operated individually or in parallel for driving higher current LEDs.A low external parts count (two 1µF flying capacitors and two small 1µF capacitors at IN and OUTCP)make this part ideally suited for small, battery-powered applications.AnalogicTech's AS2Cwire™ (Advanced Simple Serial Control™) serial digital input is used to enable,disable, and set current for each LED with a 16-level logarithmic scale plus four low-current settingsdown to 115µA. For optimized efficiency, low-current settings require only 65µA of housekeepingcurrent.Each output of the AAT3169 is equipped with builtin protection for output short-circuit and auto-disablefor load short-circuit conditions. Built-in softstart circuitry prevents excessive inrush current duringstart-up. A low-current shutdown feature disconnects the load from the input and reduces quiescentcurrent to less than 1µA.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LCD BACKLIGHT
D50
3R
SB
6.8C
ST2
R
C518
1u
R50
3
100K
1u C51
7
VBAT
C5191u
EN_SET3
10GND
9IN
OUTCP6
PGND15
C5201u
AAT3169IFO-T1U501
C1+4
5C1-
C2+7
C2-8
11D1D2
1213
D314
D41
D52
D6MLED5
MLED
LCD_BACKLIGHT_CTRT
MLED1MLED2MLED3MLED4
Figure 3-12-2. AAT3169 CIRCUIT DIAGRAM
- 45 -
3. TECHNICAL BRIEF
The AAT3169 can setup three group as Maximum current, 15mA, 20mA and 30mA Each group has 16steps of 2 stages as current level, so totally has 32 steps.One stage is about high current and the other stage is about low current.Refer to Detail feature below.
This model uses level 5 in maximum 20mA group and level 15 in low current mode. But it don’t uselow current stage.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-12-3 AAT3169 High Current Stage Figure 3-12-4 AAT3169 Low Current Stage
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3. TECHNICAL BRIEF
3.13 Battery Charger Interface
The ISL6299 is a fully integrated low-cost single-cell Li-ion or Li-polymer battery charger. The chargeraccepts two power inputs, normally one from a USB port and the Other from a desktop cradle. TheISL6299 is an ideal charger for smart handheld devices that need to communicate with a personalcomputer via USB.The ISL6299 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be usedsafely. When both inputs are powered, the cradle input is used to charge the battery.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(GPIO_037)(GPIO_059)
(1%)
R21610K
R21336K
R214100K R212
100K
CHG_ABB
R21010K
VUSBIN
BAT10
CRDL1
8GND
9ICDL
6IMIN
PGND11
2USB
USBON7
4_CHG
_EN5
_PPR3
ISL6299U203
C215
1u
VBAT
USB_DETCHG_EN
Figure 3-13 BATTERY CHARGER BLOCK
From External Source(Wall Adaptor or Computer)
- 47 -
3. TECHNICAL BRIEF
3.14 Keypad Interface
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
UP
4
DOWN
# SEND
OK
RIGHT
8
7
MENU
1
CLEAR
(VOLUME_DOWN)
0
END
LEFT
CONF
3
*
6
(VOLUME_UP)
5
9
SIDEKEY_PAD
2
F1
KB420
KB412
KB409
VA502EVLC18S02015
680
R614
KB418
VA
402
EV
LC18
S02
015
KB421
KB416
KB404KB402
KB413KB411
VBAT
KB410
KB408
CN
400
1234
KB422
680R402
R404 680
VA
404
EV
LC18
S02
015
KB403
KB405
KB400 KB401
VA
403
EV
LC18
S02
015
KB406 KB407
680R403
KB415
680
R405
KB419
VA503EVLC18S02015
KB414
10K
R40
6
KB417
KEY_COL1
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_COL0
KEY_ROW1
POWERKEY
KEY_COL3
KEY_COL4
KEY_ROW0
KEY_ROW5
KEY_COL2
Figure 3-14-1 MAIN KEY STRUCTURE
HOT 3 HOT 4
Match Two Column Lines
HOT 1 HOT 2to Outer Circle of Buttons
KB702KB701 KB703 KB704
KEY_ROW5
KEY_COL3
KEY_COL4
KEY_ROW4
Figure 3-14-2 HOT KEY STRUCTURE
- 48 -
3. TECHNICAL BRIEF
The keypad interface supports a row/column decoding of a keyboard matrix of up to 8 rows and 8columns. The interface generates an interrupt when any key is pressed, and the interrupt is routedthrough the system interrupt controller to the MCU. Software must scan the columns to determinewhich key was pressed. Debouncing must also be implemented in software. The keypad interfaceconsists of eight tristateable KEYPADCOL outputs and eight KEYPADROW inputs. Pressing a keypulls the corresponding KEYPADROW input low. When all KEYPADCOL outputs are driven low,pulling any KEYPADROW input low generates an interrupt.In the interrupt service routine, the keypad must be scanned by setting only one column output low ata time and reading the row inputs. A zero is read anywhere a key is pressed on that column. The scanshould be repeated at regular intervals until no key is being pressed. To implement debouncing, thesoftware must require the same scan result for several scans. The keypad interrupt should not becleared until no key has been pressed for several scans.The 8 by 8 matrix of rows and columns provides the possibility of up to 64 keys (with an additional 8 ifa ghost column is used). Full flexibility in enabling and disabling individual rows and columns isprovided. Any rows or columns not used should be disabled in the Keypad Control Register. Thefollowing figure shows the keypad interface and interrupt generation logic.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-14-3 keypad interface and interrupt generation logic
- 49 -
3. TECHNICAL BRIEF
3.15 Audio Interface
The AD6855 Audio Section supports communications and personal audio applications.The Audio Section provides an audio codec with two digital-to-analog converters and an analog-to-digital converter, a microphone interface, and analog input and output channels.
Audio and Music Serial Ports
The AD6855 Audio Serial Port is described in detail in the Audio Serial Port (ASPORT) section below.AD6855 Music serial port (MSPORT) is described in detail in the Music Serial Port (MSPORT) sectionbelow.
Audio Codec
The AD6855 audio codec supports communications applications with digital sample rates of 8 kHz or16kHz. DAC 1 is used for receiving speech. An ADC is used for sending speech. The AD6855 audiocodec supports personal audio applications with digital sample rates of 8 kHz, 11.025kHz, 12 kHz, 16kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz. DAC 1 and DAC 2 are used for monophonicaudio. The channels are common in the digital section. DAC 1 and DAC 2 are used together for stereoaudio, with DAC 1 decoding the left-channel digital input and DAC 2 decoding the right-channel digitalinput.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-15-1 ABB Internal Audio Block Diagram
- 50 -
3. TECHNICAL BRIEF
Audio codec operating modes can be controlled by writing 5 bit codes in the AudMode field of theAudControl1 register and in the AudMode_M field of the AudControl4 register.AudControl1 programs the sampling rate and stereo or monophonic operating mode for PCM audiosamples input via the ASPORT.AudControl4 programs the sampling rate and stereo or monophonic operating mode for PCM audiosamples input via the MSPORT.The AudControl1 and AudControl4 contain control bits that allow system software to turn on threeaudio loudness enhancement techniques meant for use when driving 8 ohm loudspeakers. These arehigh pass filter, dynamic range compressor, and x4 gain boost.These loudness enhancement techniques can be used with any AudMode or AudMode_M setting. Andare programmed seperately and independently for the ASPORT and MSPORT PCM audio decoderdata streams.
Analog Audio Output & Input Configurations
Output configurations are set by AudOS[4:0] bits in the AudControl2 register. Input configurations areset by AudIS[3:0] bits in the AudControl2 register.AudIn3LMute bit high in the AudMuteControl register (0x27). For configurations using “DAC2+AIN3R”,the AIN3R input may be muted by setting AudIn3RMute bit high in the AudMuteControl register. Forconfigurations using “AIN3(L)”, the AIN3L and AIN3R inputs may be used as a differential input or theAIN3L input may be used as a single-ended input.Single ended configuration is chosen by setting AudIn3Cfg bit high in the AudControl3 register (0x32).
Audio DACs and Analog Filters
The Audio DACs are over-sampled switched-capacitor DACs. The analog filters are switched-capacitor filters followed by active-RC filters.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 51 -
3. TECHNICAL BRIEF
Analog Audio Output Drivers
Audio Output 1
PGA gain for Audio Output 1 can be set by using bits AudOut1Gain[4:0] in the AudOut12Control(0x21 ) register. Output 1 is used for 32ߟ interface with differential output but can be used bysingle ended interface.And this model only uses passive filters between output port and Receiver.
Audio Output 2
PGA gain for Audio Output 2 can be set by using bits AudOut2Gain[4:0] in the AudOut12Control(0x21) register. Output 2 is used for 8ߟ. This port supports only a differential interface. And thismodel only uses passive filters and Class D audio amplifier between output port and speaker. Audioamplifier Gain is set by hardware component and gain is 6 times.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-15-2 ABB Audio OUTPUT1
Figure 3-15-3 ABB Audio OUTPUT2
- 52 -
3. TECHNICAL BRIEF
Audio Output 3
PGA gain for Audio Output 3 Stereo Configuration can be set by using bits AudOutLGain[4:0] andAudOutRGain[4:0] in the AudOutLRControl (0x22) register. When Audio Output 3 configured asmonophonic differential output PGA gain can be set by using bits AudOut3Gain[4:0] in theAudOut3Control register (0x23).This port is used for headset speaker in stereo. This port must use DC-coupling capacitor as outputDC. It uses two 100uF capacitor each other in left and right output.
Analog Audio Input
The AD6855 provides two analog input channels, AIN1 and AIN2, that may be used for bothmicrophone and line inputs. The AIN1 and AIN2 channels are identical. One of the two channels istypically used with microphone built into a handset. The other channel is typically used with an externalmicrophone or external line input.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-15-3 ABB Audio OUTPUT3
Figure 3-15-4 Audio Input Block Diagram
- 53 -
3. TECHNICAL BRIEF
Analog Input AIN1, AIN2 and VMIC configurations can be chosen by setting bits AudIS[3:0] in theAudControl2 register (0x1E ). Additional gain of 9dB can be inserted into Analog Audio Input signalchain by setting AudPreampGainSel bit high in the AudControl3 register (0x32 ).
Microphone Interface
The microphone pre-amplifier and associated integrated resistors support electret microphones. Aninternal (Configuration 11) or external (Configuration 01 or 10) load resistor converts the current inputof the microphone to a voltage signal which is amplified using a low-noise pre-amplifier. TheMicrophone signal path also includes an additional programmable gain of +9 dB gain directly after thepre-amplifier. Different microphones require different DC bias currents for optimum sensitivity.
Audio ADC and PGA
The Audio ADC is a high-order single-bit sigma-delta ADC that includes a switchedcapacitor PGA atthe input.
Digital Filters
The AD6855 Audio Section provides two digital filters. The voiceband filter is used for applications witha 8 kHz digital sample rate. The high-quality audio filter is used for applications with higher digitalsample rates.
Audio Accessory Detection
The AD6855 provides for detection of audio headset accessory insertion, extraction, and hookswitchevents. The detector circuit is designed to operate with minimum power in standby mode. There aretwo pins dedicated to the accessory detector. AccDet is intended to interface to the externalmicrophone and monitor its bias voltage. The ACCDET terminal is used to sense hookswitch eventswhile a headset accessory is inserted. The JackSense terminal is interfaced to the switch pin of theJack socket or a Jack Sense terminal on a handset system connector.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 54 -
3. TECHNICAL BRIEF
Use of the AccDet Terminal for Hookswitch Event Detection
The AccDet terminal may be connected directly to the Ain2P pin in the case of a DC coupling of theaccessory microphone. If the accessory microphone is connected via a capacitor then the AccDet pinmay be connected to the microphone side of the coupling capacitor. The AccDet terminal is used todetect hookswitch events. Hookswitch events cause the system to answer an incoming phone call orhang up on an active phone call.The detector circuit is in operation only if an accessory is inserted. It monitors the voltage at theAccDet terminal using a comparator as shown Figure below.Associated logic then provides the AudAccInt interrupt and updates the contents of the DetectorControl register as follows on each comparator transition.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-15-5 Audio Accessory Detection Block Diagram
- 55 -
3. TECHNICAL BRIEF
Use of the JackSense Terminal for Accessory Insertion and Removal Detection
Accessory insertion and removal is detected using the JackSense terminal.The JackSense terminal is connected to a signal produced by a mechanical connection that indicatesthe presence or absence of the headset accessory. The insertion/removal sense circuit fed byJackSense is flexible as far as the characteristics of the mechanical connection are concerned. Themechanical connection will often times be pulled down in one state and floating in the other. In suchcases a 1uA on chip current source is used to pull JsckSense to VBAT when the mechanicalconnection is floating.To avoid false interrupts the Accessory detect logic has a hardware polling loop which will preventInterrupt generation from comparator transitions with a duration of no less than 10 mSec.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-15-6 Accessory Insertion/Removal Detector Block Diagram
- 56 -
3. TECHNICAL BRIEF
3.16 Camera Interface(2M Fixed Focus Camera)
3.16.1 AD6900 Camera Interface (PPI Block)AD6900 provides a Parallel Peripheral Interface (PPI) that can connect directly to camera modules.The PPI is an input-only parallel external port that accommodates up to 10 bits of data, in a variety ofRGB and YUV color formats. In addition, ITU-656 (CCIR656) and ITU-601 (CCIR601) compatible datatransfers are supported.
The PPI feature set includes:Eight dedicated data pins and two data pins muxed with GPIOsParallel data transfer rates up to 32.5 MB/sTwo frame syncs (horizontal and vertical), with programmable polarityA bidirectional clock pin, with programmable output clock rate up to 65 MHzSynchronization by detection of embedded preamble codes or by using frame synchronization pinsITU standard and counter controlled data transfers8-bit data packing to reduce DMA bandwidth for image dataData re-ordering to reduce DMA bandwidth for YUV 4:2:2 dataA 32 word by 16 bit input FIFO
The PPI offers specific configurations to support still image and video data inputs.The PPI supports ITU-601 and ITU-656 standards. It also provides Active Video Only and Entire Fieldoperational modes. In all modes, data packing options optimize DMA transfer bandwidth for YUV 4:2:2and other data formats.The PPI pins are listed in the following table.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 57 -
3. TECHNICAL BRIEF
PPI Architecture
A simplified PPI block diagram is shown in the following figure. The PPI contains a 32 word by 16 bitFIFO, interrupt request (IRQ) generation logic, clock dividers, and memory mapped registers(MMRs).The PPI provides a parallel interface to camera modules.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Bi-Directional Input Clock PPI_CLK
Input Frame Sync PPI_VSYNC
Input Frame Sync PPI_HSYNC
Input Optional Data PPI_DATA_10B_LSB[0]
Input Optional Data PPI_DATA_10B_LSB[1]
Input Data PPI_DATA[0]
Input Data PPI_DATA[1]
Input Data PPI_DATA[2]
Input Data PPI_DATA[3]
Input Data PPI_DATA[4]
Input Data PPI_DATA[5]
Input Data PPI_DATA[6]
Input Data PPI_DATA[7]
Direction Default Function Signal Name
Figure 3-16-1 PPI Block Diagram
- 58 -
3. TECHNICAL BRIEF
FIFO Operation
The PPI FIFO is 32 words by 16 bits. Received data is stored in the FIFO either as 16- bit words or as8-bit words. The data is only stored a 8-bit words when the DLEN and PACK_EN bits in the PPIControl register are cleared. The data in the FIFO may be read whenever the FIFO is not empty. TheDMA controllers may burst read the FIFO data whenever at least four words are contained in theFIFO. These FIFO status conditions are reported in the PPI Status register and can be unmasked inthe PPI DMA Interrupt Mask register to generate interrupts.
Interrupt Request Generation
The PPI generates interrupt requests for the DMA controllers, MCU, and DSP.An interrupt can be generated for the following conditions:
Start of a frameFIFO overflowFIFO underflowIncorrect number of data words in a line or lines in a framePreamble code error (in ITU-656 mode)
PPI Clock Frequency
The PPI transfer clock may be provided either by an external source or internally by the PPI. BCLK isthe source for the PPI clock divider. The clock may be divided by 1, 2, 3, 4, 5, 6, 7,8, 16, 32 or 64 fromBCLK. However, the maximum frequency supported is 32.5 MHz for packed 8-bit transfers and 16.25MHz for 10-bit or unpacked 8-bit transfers. At higher clock frequencies, the APPDMA does not supportthe incoming data bandwidth. A PPI FIFO (32 words deep, 16-bits wide) is provided to compensate forarbitration latency encountered by APP DMA accessing system resources.
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- 59 -
3. TECHNICAL BRIEF
3.17 KEY BACLKLIGHT LED Interface
The AD6855 Auxiliary Section provides three independent PWM light controllers.The PWM output controllers regulate the average current through active lights.
The output frequencies of the LIGHTx PWM output controllers are set by the Light12Period (0x2F) andLight3Period (0x31) control registers.With fMCLK = 13 MHz, frequencies ranging from 50.781 kHz to 49.591 Hz may be specified.
fLIGHT1 = ( fMCLK / 256 ) / ( Light12Period[9:0] + 1)fLIGHT2 = ( fMCLK / 256 ) / ( Light12Period[9:0] + 1)fLIGHT3 = ( fMCLK / 256 ) / ( Light3Period[9:0] + 1)
he output duty cycles of the PWM output controllers are set by the LightxDutyCycle[7:0] controlregisters - Light1DutyCycle (0x2D), Light2DutyCycle (0x2E) and Light3DutyCycle (0x30).
This model use only Light3 port and 2 high luminance white LED with light guard film.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3-17 ABB Light Controller Block Diagram
- 60 -
3. TECHNICAL BRIEF
3.18 Vibrator Interface
Vibrator is drived by Dual BJT with bias resistor.VIBRATOR_P is connected with + terminal of vibrator and - terminal is connected with Ground. It iscontrolled by VIBRATOR signal of DBB with only ON/OFF function.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2.2
R408
2
Q1_B
6
Q1_C
1
Q1_E
Q2_B
5
Q2_C
3
Q2_E
4
Q400
VBAT
VIBRATOR_P
VIBRATOR
Figure 3-18 Vibrator Driver Block Diagram
4.1 RF Component
U601 Power Amp Module (SKY77318)
U602 (AD6548) RF Main Chip (Transceiver)
X601 Crystal, 26MHz Clock
FL601 FEM
- 61 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
TEST POINT
U601FL601
U602
X601
Figure 4-1
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- 62 -
4. TROUBLE SHOOTING
4.2 RX Trouble
START
Re-download SW or Do calibration again
HP8960 : Test mode62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)Spectrum analyzer setting
Oscilloscope setting
(1) CheckCrystal Circuit
(2) CheckMobile SW &FEM
(3) CheckRX I/Q Signal
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 63 -
(1) Checking Crystal Circuit
C120(b)
C619(a)
26 MHzO.K?
NoNo
Crystal Circuit is OKSee next Page to check Mobile SWSee next Page to check Mobile SW
Yes
Change 601
(GPIO_074)(GPIO_073)
(GPIO_072)
0.1uC634
C6250.1u
VLDO1
VLDO1
47pC618
82pC617
C62927p
C6270.1u
16
9VLDO3
3029
RX900B
SC
LK65
SD
ATA
7S
EN
11TXOP_HI
TXOP_LO10
18V
AFC
_NC
VBAT14
VC
C_B
BI
4
24V
CC
_BB
Q1
VC
C_F
E
VC
C_R
EF
17
12VCC_TXVCO
13VDD
15VLDO1VLDO2
GND33
I2 3
IB NC
8
Q23 22
QB
20R
EFI
NR
EFI
NB
19
RE
F_O
P21
RX18002827
RX1800BRX1900
26RX1900B
25
RX8503231
RX850BRX900
AD6548U602
2 34
C641100p
26M
Hz X60
1TS
X-3
225_
26M
HZ1
0.1u
2V75_VCXO
C626C6300.1u
C640100p
220n
C622
C63639p
0.1u
C62
0
82p
VBAT
C642
100pC639
2V93_VEXT VLDO1
10K
R611
1uC619
S_DATA
IP
QP
QN
IN
S_CLK
26M
S_EN
AFC
PPI_HSYNCAB21AA22
PPI_VSYNC
K19SIMCLK
L19SIMDATAIO
PPI_CLKY21L22
KEYPADROW_4AA12
F22MC_CLK
J19MC_CMD
J17MC_DAT_0
E21MC_DAT_1MC_DAT_2
F21K17
MC_DAT_3
GPIO_010P4
L21EB2_ADDR_07EB2_ADDR_08
P22
EB2_ADDR_09N22U19
EB2_ADDR_10T17
EB2_ADDR_11EB2_ADDR_12
W18
P19EB2_NRD
EB2_NWAITW17
EB2_NWEN17
EB2_ADDR_00P21P17
EB2_ADDR_01EB2_ADDR_02
R19T19
EB2_ADDR_03EB2_ADDR_04
U22R17
EB2_ADDR_05K21
EB2_ADDR_06
B14CLKIN
1000pC120
BT_LDO_EN
26M
CAM_PWDN
LOUD_SPK_EN
CAM_LDO_EN
BT_RESETCAM_RESETLCD_RESET
CAM_HSYNCCAM_VSYNC
CAM_PCLK
KEY_ROW4
MC_D1MC_D2MC_D3
SIM_CLKSIM_DATA
MC_CLKMC_CMDMC_D0
LCD_RSLCD_VSYNC
CAM_I2C_DATACAM_I2C_CLK
LCD_WR
FOLDER_DET
TEST POINT CHECKING FLOW
CIRCUIT
WAVEFORM
Graph 4-2-1(a) Graph 4-2-1(b)
Figure 4-2-1
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4. TROUBLE SHOOTING
- 64 -
(2) Checking Mobile SW & FEM
ANT_SW1ANT_SW2
2V75_VCXO
100pC644
2V75_VCXO
15
GSM850_RX11
GSM850_RX223
GSM900_RX1GSM900_RX2
4
VC11413
VC2
12VDD
FL601DGM1110M014
AN
T17
GND19
11GND2
16GND3
18GND4GND5
1920
GND6GSM1800_1900_TX
10
5GSM1800_RX1GSM1800_RX2
67
GSM1900_RX1GSM1900_RX2
8
GSM850_900_TX
C63239p
C6280.1u
C643100p
10
R612
ANT_SW2ANT_SW1
TEST POINT
CIRCUIT
Figure 4-2-2
WAVEFORM
EGSM RX
ANT_SW1
ANT_SW2
Low
Low
Graph 4-2-2 FEM Control Signal
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 65 -
Check C643,C644,C632
Check whether Ant SW
Set as RX mode
Refer to Table 4.2.2 Yes
Check SW601 Pin ANT,RF
with RF Cable connected. Open
Yes
Changing SW601
Check SW601 Pin ANT,RF
with No RF Cable ConnectedShort
Yes
Changing SW601
For these 2 test case,
No Call connection is needed
No
No
Changing the Board.
Check RF Level of
FL601.3(for EGSM) & FL601.5&7(for DCS&PCS)
Ant SW & Mobile SW is OK
See next Page to check
Rx I/Q Signal
Pin 16 : ~ -62dBmPin 14 & 12 : ~ -63dBm
No Changing FL601
Yes
No
For this RF Level test case,
RX Stand alone Mode is needed refer to chapter 10
Check Vctrl 1,2 & Vcxo
CHECKING FLOW
Table 4.2.1
Switch Mode Vc1 Vc2
GSM850/900 Tx 0 1
GSM1800/1900 Tx 1 1
GSM850/900 Rx 0 0
GSM1800/1900 Rx 1 0
(3) Checking RX I/Q
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 66 -
Redownload software and calibration again
Similar?
No
Replace U602
Yes
NoCheck C617, C642.
Check if there is any
Major difference
Refer to graph 4.2.3
U602 U617
C642
SW601
TEST POINT
WAVEFORM
CIRCUIT
Graph 4-2-3
Figure 4-2-3
(GPIO_074)(GPIO_073)
(GPIO_072)
0.1uC634
C6250.1u
VLDO1
VLDO1
47pC618
82pC617
C62927p
C6270.1u
16
9VLDO3
3029
RX900B
SC
LK65
SD
ATA
7S
EN
11TXOP_HI
TXOP_LO10
18V
AFC
_NC
VBAT14
VC
C_B
BI
4
24V
CC
_BB
Q1
VC
C_F
E
VC
C_R
EF
17
12VCC_TXVCO
13VDD
15VLDO1VLDO2
GND33
I2 3
IB NC
8
Q23 22
QB
20R
EFI
NR
EFI
NB
19
RE
F_O
P21
RX18002827
RX1800BRX1900
26RX1900B
25
RX8503231
RX850BRX900
AD6548U602
2 34
C641100p
26M
Hz X60
1TS
X-3
225_
26M
HZ1
0.1u
2V75_VCXO
C626C6300.1u
C640100p
220n
C622
C63639p
0.1u
C62
0
82p
VBAT
C642
100pC639
2V93_VEXT VLDO1
10K
R611
1uC619
S_DATA
IP
QP
QN
IN
S_CLK
26M
S_EN
AFC
CHECKING FLOW
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4. TROUBLE SHOOTING
- 67 -
START
Redownload SW or Do calibration again
HP8960 : Test mode62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)Spectrum analyzer setting
Oscilloscope setting
(1)CheckCrystal Circuit
(3)CheckPAM control
signal
(4)CheckTX I/Q Signal
(2)CheckMobile SW
& FEM
4.3 TX Trouble
CHECKING FLOW
(1) Checking Crystal Circuit
- 68 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
C120(b)
C619(a)
26 MHzO.K?
NoNo
Crystal Circuit is OKSee next Page to check Mobile SWSee next Page to check Mobile SW
Yes
Change 601
TEST POINT CHECKING FLOW
CIRCUIT
WAVEFORM
Graph 4-3-1(a) Graph 4-3-1(b)
Figure 4-3-1
(GPIO_074)(GPIO_073)
(GPIO_072)
0.1uC634
C6250.1u
VLDO1
VLDO1
47pC618
82pC617
C62927p
C6270.1u
16
9VLDO3
3029
RX900B
SC
LK65
SD
ATA
7S
EN
11TXOP_HI
TXOP_LO10
18V
AFC
_NC
VBAT14
VC
C_B
BI
4
24V
CC
_BB
Q1
VC
C_F
E
VC
C_R
EF
17
12VCC_TXVCO
13VDD
15VLDO1VLDO2
GND33
I2 3
IB NC
8
Q23 22
QB
20R
EFI
NR
EFI
NB
19
RE
F_O
P21
RX18002827
RX1800BRX1900
26RX1900B
25
RX8503231
RX850BRX900
AD6548U602
2 34
C641100p
26M
Hz X60
1TS
X-3
225_
26M
HZ1
0.1u
2V75_VCXO
C626C6300.1u
C640100p
220n
C622
C63639p
0.1u
C62
0
82p
VBAT
C642
100pC639
2V93_VEXT VLDO1
10K
R611
1uC619
S_DATA
IP
QP
QN
IN
S_CLK
26M
S_EN
AFC
PPI_HSYNCAB21AA22
PPI_VSYNC
K19SIMCLK
L19SIMDATAIO
PPI_CLKY21L22
KEYPADROW_4AA12
F22MC_CLK
J19MC_CMD
J17MC_DAT_0
E21MC_DAT_1MC_DAT_2
F21K17
MC_DAT_3
GPIO_010P4
L21EB2_ADDR_07EB2_ADDR_08
P22
EB2_ADDR_09N22U19
EB2_ADDR_10T17
EB2_ADDR_11EB2_ADDR_12
W18
P19EB2_NRD
EB2_NWAITW17
EB2_NWEN17
EB2_ADDR_00P21P17
EB2_ADDR_01EB2_ADDR_02
R19T19
EB2_ADDR_03EB2_ADDR_04
U22R17
EB2_ADDR_05K21
EB2_ADDR_06
B14CLKIN
1000pC120
BT_LDO_EN
26M
CAM_PWDN
LOUD_SPK_EN
CAM_LDO_EN
BT_RESETCAM_RESETLCD_RESET
CAM_HSYNCCAM_VSYNC
CAM_PCLK
KEY_ROW4
MC_D1MC_D2MC_D3
SIM_CLKSIM_DATA
MC_CLKMC_CMDMC_D0
LCD_RSLCD_VSYNC
CAM_I2C_DATACAM_I2C_CLK
LCD_WR
FOLDER_DET
- 69 - LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
(2) Checking Mobile SW & FEM
ANT_SW1ANT_SW2
2V75_VCXO
TEST POINT
CIRCUIT
Figure 4-3-2
WAVEFORM
Graph 4-3-2 FEM Control Signal100pC644
2V75_VCXO
15
GSM850_RX11
GSM850_RX223
GSM900_RX1GSM900_RX2
4
VC11413
VC2
12VDD
FL601DGM1110M014
AN
T17
GND19
11GND2
16GND3
18GND4GND5
1920
GND6GSM1800_1900_TX
10
5GSM1800_RX1GSM1800_RX2
67
GSM1900_RX1GSM1900_RX2
8
GSM850_900_TX
C63239p
C6280.1u
C643100p
10
R612
ANT_SW2ANT_SW1
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4. TROUBLE SHOOTING
- 70 -
Check SW601.ANT, RF with RF Cable connected. Open
Yes
Changing SW601
Check SW601.ANT,RF
with RF Cable disconnectedShort
Yes
Changing SW601No
No
Check C643,C644,C632
Check whether Ant SW
Set as TX mode
Refer to Graph 4.3.2
Refer to Table 4.3.2Yes
Check Vctrl 1,2 & Vcxo
Check RF Level of
FL601.15(for EGSM) & FL601.10(for DCS&PCS)
Pin15 : ~29.5dBm
Pin10 : ~26.5dBmNo
Yes
NoChanging board
Go to 4.3.4 Checking PAM control signal
END
For the test,
TX Stand alone Mode is needed. Refer to chapter 10 (PL=7 for EGSM, PL=2 for
DCS&PCS)
CHECKING FLOW
Table 4-3-1
Switch Mode Vc1 Vc2
GSM850/900 Tx 0 1
GSM1800/1900 Tx 1 1
GSM850/900 Rx 0 0
GSM1800/1900 Rx 1 0
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4. TROUBLE SHOOTING
- 71 -
(3) Checking PAM Control Signal
Similar?
Yes
No
Check TX_RAMP and PAM_EN
Any Major Difference or not
¨
Similar?
Yes
No
Go to Next Step
Similar?
Yes
No Re-download S/W
Check if there is
Any Major Difference or not
R̈efer to Graph 4.3.3
C614 PA_ENC613 PA_BAND
C604 Tx_Ramp(GPIO_060)
(GPIO_070)
0.01uC606
DNIC615
C60439p
27pC614
22uC601
0.01uC605
VBAT
DNIC610
C612 4.3nH
0R613
C60233p
27pC613
1K R603
R610
82
C603
C616
2.7p
0.01u
0.5pC609
51
R607
7G
ND
2G
ND
38
GN
D4
910G
ND
512
GN
D6
13G
ND
7G
ND
814
GN
D9
16
P_GND21
19RSVD_GND
VA
PC
20
VB
ATT
17 2V
CC
1A
6V
CC
1B
U601SKY77318
BS1
3DCS_PCS_INDCS_PCS_OUT
15
4EGSM_IN
11EGSM_OUT
ENABLE18
GN
D1
5
TX_RAMP
PA_EN
PA_BAND
TEST POINT
CHECKING FLOW
WAVEFORM
CIRCUIT
Graph 4-3-3
Figure 4-3-3
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 72 -
(4) Checking TX I/Q
Re-download the SoftwareAnd calibrate
Check if there isAny Major Difference
R̈efer to Graph4.3.4
Similar?
Yes
No Replace U602
U602 U617
C642
SW601
TEST POINT
WAVEFORM
CIRCUIT
Graph 4-3-4
Figure 4-3-4
(GPIO_074)(GPIO_073)
(GPIO_072)
0.1uC634
C6250.1u
VLDO1
VLDO1
47pC618
82pC617
C62927p
C6270.1u
16
9VLDO3
3029
RX900B
SC
LK65
SD
ATA
7S
EN
11TXOP_HI
TXOP_LO10
18V
AFC
_NC
VBAT14
VC
C_B
BI
4
24V
CC
_BB
Q1
VC
C_F
E
VC
C_R
EF
17
12VCC_TXVCO
13VDD
15VLDO1VLDO2
GND33
I2 3
IB NC
8
Q23 22
QB
20R
EFI
NR
EFI
NB
19
RE
F_O
P21
RX18002827
RX1800BRX1900
26RX1900B
25
RX8503231
RX850BRX900
AD6548U602
2 34
C641100p
26M
Hz X60
1TS
X-3
225_
26M
HZ1
0.1u
2V75_VCXO
C626C6300.1u
C640100p
220n
C622
C63639p
0.1u
C62
0
82p
VBAT
C642
100pC639
2V93_VEXT VLDO1
10K
R611
1uC619
S_DATA
IP
QP
QN
IN
S_CLK
26M
S_EN
AFC
CHECKING FLOW
4.4 Power On Trouble
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 73 -
1V88_VMEM
2V75_VCXO
2V85_VSIM
VCORE
2V93_VEXT
1V8_VRTC
1V8_VGP
2V5_VMIC2V5_VABB
1V82_VINT
U100
1V5_VPLL
D100R101
(2012)1u
C128C124
22u
VUSB
2V5_VABB
2V75_VCXO
1V5_VPLL
1V88_VMEM
1u
C127
22u
C125
VCORE
L100 4.7uH
1V82_VINT
2V85_VSIM
1V8_VGP
1u
C122C121
1u
C132
2.2u
VMEMOUT2
J12VMIC
F12VPLL
VRFC12
M6VSIM
VUSBC11
VCOREPWR1F1
VCOREPWR2F2
E1VCORESW1VCORESW2
E2
VEXT1A3B3
VEXT2
VGPM5
VINTK2
VINTOUTK1
L4VMEMOUT1
M4
G12VABB
D12VAPPGATE
A8PA
QNA11A12
QP
INA10A9
IP
FB100
1u
C126
VBAT
1u
C130C129
1u
C123
1u
C131
1u
2V5_VMIC
VBAT
2V93_VEXT
INIP
TX_RAMP
QNQP
TEST POINT
CIRCUIT
Figure 4-4
100K
R101
3
1
2
KDR331V
D100
EXT_PWRONRPWRON
PWRON
END
VBAT
KB42210K
R40
6
POWERKEY
M10KEYONKEYOUT
L10
POWERKEYKEY_ROW4
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 74 -
START
Check Battery Voltage> 3.35V
Push power-on keyAnd check the level change
into low of POWERKEY
Check the voltage ofThe LDO outputs at U100
Logic level at RPWRON(DBBON) of D100
= HIGH(above 1.2V)?
Is the phone power on?
The phone willProperly operating.
Charge or Change Battery
Check the contact of power keyOr dome-switch
Replace U100
VCORE=1.2V~1.5V 2V75_VCXO=2.75V1V88_VMEM=1.88V 2V85_VSIM= 2.85V 2V93_VEXT=2.93V 1V5_VPLL=1.5V 2V5_VMIC=2.5V 2V5_VABB=2.5V
Re-download software
Does it work properly?
Replace the main board
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
NO
Replace U100 and Re-download software
CHECKING FLOW
- 75 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.5 Charging Trouble
CN300
U204
U203
C310
R213
TEST POINT
(GPIO_037)(GPIO_059)
(1%)
R21610K
R21336K
R214100K R212
100K
CHG_ABB
R21010K
VUSBIN
BAT10
CRDL1
8GND
9ICDL
6IMIN
PGND11
2USB
USBON7
4_CHG
_EN5
_PPR3
ISL6299U203
C215
1u
VBAT
USB_DETCHG_EN
(GPIO_013)
30K
R217
IN35
11NC1NC2
12
OUT16
7OUT2
_EN10
3_FLAG
VCHARGE
NCP348MTR2GU204
GATE8
9GATE_OUT
GND2
1IN1
4IN2
CHG_ABB
R211
30KCHG_DET
CIRCUIT
Figure 4-5
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 76 -
START
Is I/O Connector(CN300)well-soldered ?
Check the voltage atC310 = 5.1V ?
Is the voltageat pin6 of U204 = 5.1V?
YES
YES
YES
Is Voltage across R213about 1.2V?
YES
Battery is charged?
YES
Charging isproperly operating
NO
NO
NO
NO
NO
Resolder the CN300(Pin 12,13 : VCHARGE)
The TA is out of orderChange the TA
Replace theU204
Replace theU203
Replace the main board
Battery is charged?
NO
Change the battery
Charging isproperly operating
YES
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 77 -
4.6 Vibrator Trouble
Q400
PIN 1
Vibrator PAD
TEST POINT
2.2
R408
2
Q1_B
6
Q1_C
1
Q1_E
Q2_B
5
Q2_C
3
Q2_E
4
Q400
VBAT
VIBRATOR_P
VIBRATOR
CIRCUIT
Figure 4-6
LCD ModuleVIBRATOR
- 78 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
Is the voltage at pin 2of Q400 high?
YES
NO
Is the voltage at pin 4of Q400 high (VBAT) ?
YES
Check the solderingof vibrator ?
YES
Replace vibrator
YES
VibratorWorking well !
Check the solderingQ400
NOCheck the soldering
of Q400
Resolder or Replace vibratorNO
CHECKING FLOW
- 79 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.7 LCD Trouble
TEST POINT
CN500
FL501
FL504
FL505
FL507
FL508
U501
C519
CN802
CN803
LCD Connector
R504
R503
Figure 4-7
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 80 -
FPCB CONNECTOR
0.1u0.1uC508 C509
D50
6R
SB
6.8C
ST2
R
C50456p
DNIC522
4.7K
R502
L500
INOUT_B46
18nH
FL506 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
INOUT_A22
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
2V8_IOVDD
RS
B6.
8CS
T2R
D50
1
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
39p
FL501 ICVE10054E250R201FR
C502
C500DNI
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
7INOUT_B3
6INOUT_B4
7
6INOUT_B4
ICVE10184E150R101FRFL508
5G
110
G2
1INOUT_A1
ICVE10054E250R201FRFL504
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B3
59
6
60
789
G1G2
G3G4
43444546474849
5
505152535455565758 3
30313233343536373839
4
404142
1516171819
2
20212223242526272829
CN500
1
1011121314
C5030.1u
RS
B6.
8CS
T2R
D50
2
100ohm R504
2
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL503
5G
110
G2
1INOUT_A1
INOUT_A2
D50
5R
SB
6.8C
ST2
R
2V93_VEXT
INOUT_B37
6INOUT_B4
DNI
C521
5G
110
G2
1INOUT_A1
2INOUT_A2
INOUT_A33
INOUT_A44
INOUT_B19
8INOUT_B2
ICVE10184E150R500FRFL500
C510
L50118nH
2V8_
AV
DD
0.1u
2V8_
IOV
DD
ZD501RSB6.8CST2R
VA
501
ICV
N05
05X
150F
R
ICVE10054E250R201FRFL507
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
C51127p
C50139p
RS
B6.
8CS
T2R
D50
4
DNI
R505
1V8_
DV
DD
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
INOUT_B46
R501
4.7K
ICVE10184E150R500FRFL502
5G
110
G2
1INOUT_A1
INOUT_A22
INOUT_A33
FL505 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
LCD_DATA01LCD_DATA00
MLED5MLED4MLED3
MLED1MLED2
CAM_RESET
CAM_VSYNCCAM_HSYNC
RCV_N
RCV_P
KEY_COL3
MLED
CAM_DATA3CAM_DATA2CAM_DATA1CAM_DATA0
LCD_VSYNC
LCD_MAIN_CS
CAM_PCLKCAM_MCLK
CAM_I2C_DATACAM_I2C_CLK
CAM_DATA4CAM_DATA5CAM_DATA6CAM_DATA7
LCD_SUB_CS
KEY_COL4
CAM_PWDN
VIBRATOR_P
LCD_ID_L
LCD_DATA14LCD_DATA15
KEY_ROW5
LCD_RSLCD_WR
LCD_RESET
LCD_DATA04LCD_DATA05
LCD_DATA11LCD_DATA10
LCD_DATA08LCD_DATA09
KEY_ROW4
LCD_DATA07LCD_DATA06
LCD_DATA03LCD_DATA02
LCD_DATA12LCD_DATA13
CIRCUIT
LCD BACKLIGHT
D50
3R
SB
6.8C
ST2
R
C518
1u
R50
3
100K
1u C51
7
VBAT
C5191u
EN_SET3
10GND
9IN
OUTCP6
PGND15
C5201u
AAT3169IFO-T1U501
C1+4
5C1-
C2+7
C2-8
11D1D2
1213
D314
D41
D52
D6MLED5
MLED
LCD_BACKLIGHT_CTRT
MLED1MLED2MLED3MLED4
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 81 -
Waveform
Graph 4-7-1. LCD Backlight Control Signal Waveform
Graph 4-7-2. LCD Data Waveform
- 82 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Is the connection ofCN802 with LCD
connector ok ?
YES
NOReassemble FPCB with LCD connector
NO
Check the Voltage Level of
C519 is about Battery voltage ?(LCD_BACKLIGHT_CTRT signal
is high Level)
NO
YES
YES
Check the Waveform ofEMI filter ?
Resoldering or Replace U501
NO
Resoldering EMI filter.(FL501,FL504,FL505,FL507,FL508)
Does LCD workproperly ?
Replace LCD module
LCD working well !
YES
Is the connection ofCN803 with CN500
connector ok ?
YES
NOReassemble FPCB with Main connector
NO
YES
Check the Waveform ofData pins on CN802 ?
Replace Main FPCB
CHECKING FLOW
- 83 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.8 Camera Trouble
CN500
FL500
FL502
FL503
FL506
Camera Connector
CN801
CN803
CN701 CN702
R501
R502
U500
C5
06
C523
C5
07
FB500
TEST POINT
Figure 4-8
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 84 -
CIRCUIT
FPCB CONNECTOR
0.1u0.1uC508 C509
D50
6R
SB
6.8C
ST2
R
C50456p
DNIC522
4.7K
R502
L500
INOUT_B46
18nH
FL506 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
INOUT_A22
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
2V8_IOVDD
RS
B6.
8CS
T2R
D50
1
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
39p
FL501 ICVE10054E250R201FR
C502
C500DNI
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
7INOUT_B3
6INOUT_B4
7
6INOUT_B4
ICVE10184E150R101FRFL508
5G
110
G2
1INOUT_A1
ICVE10054E250R201FRFL504
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B3
59
6
60
789
G1G2
G3G4
43444546474849
5
505152535455565758 3
30313233343536373839
4
404142
1516171819
2
20212223242526272829
CN500
1
1011121314
C5030.1u
RS
B6.
8CS
T2R
D50
2
100ohm R504
2
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL503
5G
110
G2
1INOUT_A1
INOUT_A2
D50
5R
SB
6.8C
ST2
R
2V93_VEXT
INOUT_B37
6INOUT_B4
DNI
C521
5G
110
G2
1INOUT_A1
2INOUT_A2
INOUT_A33
INOUT_A44
INOUT_B19
8INOUT_B2
ICVE10184E150R500FRFL500
C510
L50118nH
2V8_
AV
DD
0.1u
2V8_
IOV
DD
ZD501RSB6.8CST2R
VA
501
ICV
N05
05X
150F
R
ICVE10054E250R201FRFL507
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
C51127p
C50139p
RS
B6.
8CS
T2R
D50
4
DNI
R505
1V8_
DV
DD
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
INOUT_B46
R501
4.7K
ICVE10184E150R500FRFL502
5G
110
G2
1INOUT_A1
INOUT_A22
INOUT_A33
FL505 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
LCD_DATA01LCD_DATA00
MLED5MLED4MLED3
MLED1MLED2
CAM_RESET
CAM_VSYNCCAM_HSYNC
RCV_N
RCV_P
KEY_COL3
MLED
CAM_DATA3CAM_DATA2CAM_DATA1CAM_DATA0
LCD_VSYNC
LCD_MAIN_CS
CAM_PCLKCAM_MCLK
CAM_I2C_DATACAM_I2C_CLK
CAM_DATA4CAM_DATA5CAM_DATA6CAM_DATA7
LCD_SUB_CS
KEY_COL4
CAM_PWDN
VIBRATOR_P
LCD_ID_L
LCD_DATA14LCD_DATA15
KEY_ROW5
LCD_RSLCD_WR
LCD_RESET
LCD_DATA04LCD_DATA05
LCD_DATA11LCD_DATA10
LCD_DATA08LCD_DATA09
KEY_ROW4
LCD_DATA07LCD_DATA06
LCD_DATA03LCD_DATA02
LCD_DATA12LCD_DATA13
CAMERA POWER
(EB2_ADDR_00)
2.2uC506
2.2uC523
R500100K
2V8_AVDD
C5051u
2V8_IOVDD
FB50
0
1V8_DVDD
C5071u
RT9011-MGPQWU500
EN123
EN2GND
54NC1
6NC2
9P
GN
D
VIN1 8
VOUT1VOUT2
7
VBAT
CAM_LDO_EN
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 85 -
Waveform
Graph 4-8-1 I2C Data Waveform Graph 4-8-2 MCLK Waveform
Graph 4-8-3 CAM_VSYNC vs.CAM_HSYNC Waveform
Graph 4-8-4 CAM_HSYNC vs.CAM_PCLK Waveform
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 86 -
Is the connection ofCN702 with Camera
connector ok ?
Check the each voltage Level of
C506(1.8V), C507(2.8V), C523(2.8V) is right ?(CAM_LDO_EN
signal is high Level)
Check the Waveform ofI2C_CLK, I2C_DATA ?
Does Camera workproperly ?
Is the connection ofCN801 with CN701
connector ok ?
Is the connection ofCN803 with CN500
connector ok ?
Check the Waveform ofCAM_MCLK(13MHz) ?
Check the Waveform ofEMI filter ?
Check the Waveform ofData pins on CN701 ?
START
Camera working well !
YES
NO Reassemble KEY PCBwith camera connector.
NO
NO
YES
YES
Resoldering or Replace U500
NO
Resoldering R501, R502
Replace U101 or Change the board
YES
YES
NO Reassemble FPCB with KEY PCB connector
YES
YES
NOReassemble FPCB with Main connector
YES
NOReplace U101 or Change the board
YES
NO Resoldering EMI filter.(FL500,FL502,FL503,FL506)
NOReplace Camera Module.
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 87 -
4.9 Speaker Trouble
R313
R314
U100
U303
TEST POINT
C156DNI39p
C154DNIC155C152
39p
D1TCK
B1TDI
TDOC2
TMSC1
F10AOUT3R
G10
AOUT1NF11E11
AOUT1P
L8AOUT2N_1
M8AOUT2N_2
L9AOUT2P_1AOUT2P_2
M9
AOUT3L
39pC153C151
39p
C158100p
HP_LOUT
RCV_NRCV_PSPK_N
SPK_P
HP_ROUT
SPEAKER
(GAIN x6)
100K
R317
EVLC14S02050VA305
GN
D5
D2
GN
D6
GN
D7
D3
IN+C1
IN-D1
B1NC
B4VDD1
C4VDD2
D4VO+
VO-A4
A1_SD
TPA2005D1ZQYRU303
GN
D1
A2
A3
GN
D2
GN
D3
B3
C2
GN
D4
C3 C319
10u
1
2
CN302
0.01uC316
1000pC321
FB304
C3221000p
R314 47K
47KR315
DNIC320
VBAT
VA304EVLC14S02050
FB305
C317 0.01u
LOUD_SPK_EN
SPK_N
SPK_P
CIRCUIT
Figure 4-9
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 88 -
START
Check the state of contact of speaker
Speaker Working well!!
Check the Audio signalR313,R314
No
Yes
Change the U100
Replace/Change speakerNo
Check the Power voltageU303 = VBAT
And work properly ?
No
Yes
Change the Speaker
Yes
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 89 -
4.10 Earphone Trouble
TEST POINT
CIRCUIT
C303C302
C158
R307R309 R300
R302U304
FB301FB300
FB302L301
U100
C142
CN300
C331
(TX)
(GPIO_009)
(RX)
2V5_VJACK
10p
TX
DSR
C305FB301
VUSBIN VBAT
EV
LC14
S02
050
VA
303
EV
LC5S
0250
VA
301
100K
R305
1u
C310
100uVCHARGE
C302
100K
R304
47R310
R309 4.7
L301 100nH
R311 47
2V93_VEXT
R302
2.2K39p
C301
15161718
19
2
20
21
22
3456789
CN300
1
1011121314
C300
10u
R307 4.7
NO1
10NO2
1VCC
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2
NLAS5223BMNR2GU301
EXT_PWRON
10uC307
C30947p
1uC304
R300
1.5K
FB302
RX
2V93_VEXT
RS
B6.
8CS
T2R
ZD
300
47pC311
DNIC332
C308
1u
100uC303
VA
300
EV
LC5S
0250
100K
R306
1800FB300
DNIR303
1
R312
HP_MIC_P
L300270nH
HOOK_DETECTHP_MIC_N
HP_ENHP_ROUT
HP_LOUT
HP_EN
FM_ANT
MULTI_PORT_RXMULTI_PORT_TX
USC1USC2
EXT_PWRON
JACK_DETECT
DSR_DET
Figure 4-10
1VDD VOUT
3U304 R1114D251D
6CE
GND12
GND25
NC4
R32
9
100K C330 C331
1u
2V5_VJACKVBAT
1u
VJACK_LDO_EN
0.1uC139
0.1uC142
JACKSENSEK9
M12AIN1NAIN1P
M11
L12AIN2N
L11AIN2P
MIC_NMIC_P
HP_MIC_PHP_MIC_N
JACK_DETECT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 90 -
START
Is FB303(JACK DETECT)LOW?
NO
YES
Resolder CN300
YES
Earphone will work properly
Can you hear yourvoice from
the earphone?
Set the audio part of the testEquipment to echo mode
Change the earphoneand try again
NOCan you hearthe sound fromthe earphone?
Set the audio part of the test equipment to PRBS or Continuous wave mode
YES
YES
Resolder pin8 in CN300 Check the
pin(#8) in CN300 is LOW?
Resolder FB303
NO
YES
Can you hearthe sound fromthe earphone?
NO
Change the earphoneand try again
NO Can you hear yourvoice from
the earphone?
NO
Resolder C302, C303, R307 & R309, FB301&FB302
Resolder C142,FB300, R300 & R302 Or Change the U304 &U100
CHECKING FLOW
4.11 Receiver Trouble
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 91 -
TEST POINT
U100
L500L501
C156DNI39p
C154DNIC155C152
39p
D1TCK
B1TDI
TDOC2
TMSC1
F10AOUT3R
G10
AOUT1NF11E11
AOUT1P
L8AOUT2N_1
M8AOUT2N_2
L9AOUT2P_1AOUT2P_2
M9
AOUT3L
39pC153C151
39p
C158100p
HP_LOUT
RCV_NRCV_PSPK_N
SPK_P
HP_ROUT
L50018nH
39pC502
C500DNI
5960
G1G2
565758 3
4
2
CN500
1
L50118nH
2V8_
AV
DD
2V8_
IOV
DD
C50139p
1V8_
DV
DD
RCV_N
RCV_P
CAM_PWDN
Figure 4-11
CIRCUIT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 92 -
START
Does waveform atL500 and L501
fluctuate?
NOChange the U100
YES
Receiver will work properly.
SETTING : After initialize Agilent 8960, Test GSM850, PCS mode
Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.
Is receiver connectedProperly?
YES
NOResolder/Change the receiver
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 93 -
4.12 Microphone Trouble
TEST POINT
C139
R233
R317
R235
MIC200
CIRCUIT
MIC
2.2K
R32
7
10uC327
EV
LC14
S02
050
VA306
R31
8
1K
2V5_VMIC
100ohm
R324
VA307
EV
LC14
S02
050
R32
2
2.2K
R326
100ohm
OBG-415L42-C33LHMIC300
39pC328
C32639p
MIC_P
MIC_N
Figure 4-12
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 94 -
START
NO
YES
Microphone will workproperly.
SETTING : After initialize Agilent 8960, Test GSM850, PCS mode
YES
Check the signalLevel at each side
of MIC300.Is it a few tens
mV AC?
Check the soldering ofR323, R325 & C139
Make a phone call, then check R317 mic bias signal
comes from U100?
NO
Change the microphone
YES
NOResolder component
1. Check mic Bias signal line2. Change the U100
Check microphone sound hole
CHECKING FLOW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4. TROUBLE SHOOTING
- 95 -
4.13 SIM Card Interface Trouble
TEST POINT
PIN1 PIN3
PIN6 PIN4
J300
C318
TEST POINT
(5000-6T-1.8SL)
(GPIO_100)
220n
C318
2V85_VSIM
C324
22p
2V85_VSIM
C3251000p
4C5C6
5
C76
GND178
GND2GND39
10GND4
J3001
C12
C2C3
3
C323
DNI
R316
15KSIM_RST
SIM_DATA SIM_CLK
Figure 4-13
- 96 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
START
Does the SIM cardsupport 3V or 1.8V ?
NO Change the SIM Card. This phone supports 3V or 1.8V SIM card.
YES
Is Voltage at the pin1of J300 2.85V or 1.8V?
NOChange the U100
NO
YES
Resolder J300YES
Voltage output of VSIM LDO
Is 2.85V?
Change the SIM CardAnd try again.Does it work
Properly?
YES
SIM card is properly working
Redownload SW.Does it work
Properly?
NOChange the main board
NO
YES
SIM card is properly working.
CHECKING FLOW
- 97 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.14 KEY backlight Trouble
TEST POINT
LD400 LD401
VA400R400VA401R401
TOP
BOTTOM
Figure 4-14
- 98 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
47
R401
VBAT
LD400LEWWS44-E
ICV
N05
05X
150F
R
VA
401
VA
400
ICV
N05
05X
150F
R
LEWWS44-E LD401
R400
47KEY_BACKLIGHT3
CIRCUIT
Is the level Period at VA400,VA401 High Duty(80%)?
START
Is the level Period at VA400,VA401 Low Duty(20%)?
NOCheck U100
YES
Are all LEDsWorking?
NO
YES
Check the solderingeach R and LED
Backlight will work properly.
NO
Replace or resoldercomponent
NOCheck U100
YES
CHECKING FLOW
- 99 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.15 RTC Trouble
TEST POINT
X100
R103
CIRCUIT
22p
C141
OSCINA17A16
OSCOUT
PPI_DATA_1M22
PPI_DATA_2N21
PPI_DATA_3M21
PPI_DATA_4V22
PPI_DATA_5V21
PPI_DATA_6W22W21
PPI_DATA_7V19
PPI_DATA_8PPI_DATA_9
Y22
L1GPIO_000GPIO_001
M4
GPIO_002M1
GPIO_003M2
GPIO_004N6
12
32.768KHz
X100
FC-135
C135
22p
DNI
R104
10M
R103
BT_UART_RTSBT_UART_CTS
CAM_DATA7
CAM_DATA0CAM_DATA1CAM_DATA2CAM_DATA3CAM_DATA4CAM_DATA5CAM_DATA6
BT_UART_TXBT_UART_RX
Figure 4-15
- 100 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
RTC will work properly
Is frequencyat R103 about 32.768KHz?
START
Resolder the X100 or change the X100
NO
YES
YES
Is voltageat R103 about 400mV?
Resolder the X100 or change the X100
NO
Is RTC properly working?NO
Re-download software and try again
YES
CHECK FLOW
- 101 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.16 Folder on/off Trouble
TEST POINT
U400
R407
CIRCUIT
3N
CO
UT
21V
DD
4V
SS
U400
EM
-078
1-T5
C4021u
VA
405
ICV
N05
05X
150F
R
2V93_VEXT
R407
0FOLDER_DET
Figure 4-16
- 102 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Folder on/off willwork properly
Is there the magnetin the Folder?
START
Replace U100
Place the magnet properly.NO
YES
Voltage at pin 1of U400 = 2.93V?
YES
NOVoltage of VEXT at U100
= 2.93V?
NO
Resolder U400
YES
Open Folder.Voltage at pin 1 of U400
=2.93V
Resolder U400NO
YES
Close folder.Voltage at pin 1 of U400
= 0V
YES
Replace U400NO
YES
Check the solderingof R407
Resolder R407NO
CHECKING FLOW
- 103 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.17 Micro SD Trouble
TEST POINT
J301
R325 C329
CIRCUIT
(SCHB1A0202)
R325 0 9
GND210
GND31112
GND4
4VDD
6VSS
J301
5CLK
3CMD
7DAT0DAT1
8DAT2
1
DAT32
GND1
1M
R328
R319
100K 100K
R323
C329
2.2u
2V93_VEXT
100K
R320
2V93_VEXT
R321
100K
2V93_VEXT
MC_D3
MC_DET
MC_D0MC_D1MC_D2
MC_CMDMC_CLK
Figure 4-17
- 104 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Micro SD Card willwork properly
Micro SD DetectOK?
START
Re-attach orReplace J301
NO
YES
MC_DET(R325)Is High?
NO
YES
Check out MC_CLK & DataTiming OK?
Re-download SWNO
YES
YES
Replace Micro SD Card
Check theC329=2.93V?
YES
NO
Change U100
CHECKING FLOW
- 105 -
4. TROUBLE SHOOTING
4.18 Bluetooth Trouble
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
TEST POINT
C217R218
U201C212
X200
CIRCUIT
(EB2_ADDR_10)
(GPIO_055)(GPIO_172)
(EB2_ADDR_04)
BT_D_IQ
DNIR202
C2111u
47R219
2V93_VEXT
R206
47K
C2101u
47K
R207
FM_L
R203DNI
1V8_VGP
4
VBAT
19.2MHz
X200CSC3M192000EEVRS00
2GND
3OUT
TRI_OPEN1
VDD
BT_TX
100K
R218
BT_RTSBT_CTS
C217C218DNI 1u
C201
GND201
1000p
DNI
C202
2V93_VEXT
ANT201
FM_R
D_BT_IQ
BT_RX
VREG_CTL
XTALNI5I6
XTALP
B2
C2PCM_SYNC
A4REGBT
RESETB4C4
SLEEP_CLK
G4TM0
G3TM3
UART_CTSH2
UART_RTSG2
UART_RXG1H1
UART_TX
I3VAFLVAFR
I4
VBATTA3A2
VDDR3V
I2VIO
C3
GND4E6
GND5E7
GND6F1
GND7F2
GND8GND9
F3
H5GPIO0
H4GPIO1GPIO2
G6
GPIO3G5C6
GPIO4GPIO5
H7
GPIO6B3C7
GPIO7
PCM_CLKC1
PCM_INB1
PCM_OUT
D2
GND16D3
GND17D4
GND18D5
GND19D6
GND2E3
GND20D7A1
GND21GND22
H6I7
GND23I1
GND24A5
GND25GND26
A7
GND27B5B6
GND28
E4GND3
E5G7
A_GPIO4A_GPIO5
H3C5
A_GPIO6A_GPIO7
B7
BT_ANTE1A6
FM_ANT
GND1E2
GND10F4
GND11F5F6
GND12F7
GND13GND14
D1
GND15
U201 EWFMLBAXX
1000p
C203
1uC212C216
DNI
R201 0
BT_PCM_TX
BT_PCM_SYNC
BT_PCM_RX
BT_PCM_CLK
FM_LFM_R
BT_MAIN_CLK_EN
BT_19.2MHZ
BT_MAIN_CLK_ENBT_19.2MHZ
BT_32K
BT_LDO_EN
FM_ANT
BT_RESET
BT_WAKEUPBT_INT
BT_UART_TXBT_UART_RX
BT_UART_RTSBT_UART_CTS
Figure 4-18
- 106 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Check Bias Voltage2V93_Vext at C217
Vbat at C212
START
NO
YES
ReplaceU100
BT_MAIN_CLK_EN check at R218?
NO ReplaceU201
YES
19.2MHz checkat R 219?
YES
NO ReplaceX200
BT_Reset check at C203?
YES
NO ReplaceU101
Bluetooth on is OK?
YES
NORe-download SW and try again
Bluetooth willwork properly
CHECKING FLOW
- 107 -
4. TROUBLE SHOOTING
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
4.19 FM Radio Trouble
TEST POINT
C202
U201
C217
C212
CIRCUIT
(EB2_ADDR_10)
(GPIO_055)(GPIO_172)
(EB2_ADDR_04)
BT_D_IQ
DNIR202
C2111u
47R219
2V93_VEXT
R206
47K
C2101u
47K
R207
FM_L
R203DNI
1V8_VGP
4
VBAT
19.2MHz
X200CSC3M192000EEVRS00
2GND
3OUT
TRI_OPEN1
VDD
BT_TX
100K
R218
BT_RTSBT_CTS
C217C218DNI 1u
C201
GND201
1000p
DNI
C202
2V93_VEXT
ANT201
FM_R
D_BT_IQ
BT_RX
VREG_CTL
XTALNI5I6
XTALP
B2
C2PCM_SYNC
A4REGBT
RESETB4C4
SLEEP_CLK
G4TM0
G3TM3
UART_CTSH2
UART_RTSG2
UART_RXG1H1
UART_TX
I3VAFLVAFR
I4
VBATTA3A2
VDDR3V
I2VIO
C3
GND4E6
GND5E7
GND6F1
GND7F2
GND8GND9
F3
H5GPIO0
H4GPIO1GPIO2
G6
GPIO3G5C6
GPIO4GPIO5
H7
GPIO6B3C7
GPIO7
PCM_CLKC1
PCM_INB1
PCM_OUT
D2
GND16D3
GND17D4
GND18D5
GND19D6
GND2E3
GND20D7A1
GND21GND22
H6I7
GND23I1
GND24A5
GND25GND26
A7
GND27B5B6
GND28
E4GND3
E5G7
A_GPIO4A_GPIO5
H3C5
A_GPIO6A_GPIO7
B7
BT_ANTE1A6
FM_ANT
GND1E2
GND10F4
GND11F5F6
GND12F7
GND13GND14
D1
GND15
U201 EWFMLBAXX
1000p
C203
1uC212C216
DNI
R201 0
BT_PCM_TX
BT_PCM_SYNC
BT_PCM_RX
BT_PCM_CLK
FM_LFM_R
BT_MAIN_CLK_EN
BT_19.2MHZ
BT_MAIN_CLK_ENBT_19.2MHZ
BT_32K
BT_LDO_EN
FM_ANT
BT_RESET
BT_WAKEUPBT_INT
BT_UART_TXBT_UART_RX
BT_UART_RTSBT_UART_CTS
Figure 4-19
- 108 -
4. TROUBLE SHOOTING
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
A condition is good?
STARTCheck of ear_jack condition
NO
YES
YES
FM_radio willwork properly
Check condition of matching components
(L300, C305)
A condition is good?NO
YES
Give the additory solder inL300, C305
Replace CN300
Check Bias Voltage2V93_Vext at C217
Vbat at C212
YES
NO ReplaceU100
Check BT_32k?
YES
NO ReplaceU101
FM_Radio work is good?NO Replace
U201
CHECKING FLOW
- 109 -
5. DOWNLOAD
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5.1 Download
A. Download Setup
Figure 5-1 describes Download setupp
Figure 5-1 Download Setup
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
5. DOWNLOAD
- 110 -
B. Multi Download Procedure
1. Run GSM Multi Download program and select Setting
- 111 -
5. DOWNLOAD
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
2. Select Configuration from the menu and you may see this window
3. Press key to select DLL file and press Open
KF300.dll
KF300_DLL
OPEN
OPEN
CANCLE
File Name
File Type
Location
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 112 -
5. DOWNLOAD
4. Press key to select the mot files
5. Select AlchemyData.mot and press open
6. Repeat step 4-5 to select CodeData.mot
KF300.dll
OPEN
CANCLE
File Name
File Type
Location
OPEN
KF300Model
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 113 -
5. DOWNLOAD
7. Check if the ADI option is set to Hermes
8. Press OK to end Configuration
Select Rate
KF300.dllKF300Model
KF300ModelKF300Model KF300
KF300
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 114 -
5. DOWNLOAD
9. “Waiting phone connecting” pops up when you pushe the “Start” button in Multi download screen.
Then you need to conncect the mobile phone with I/O Cable to get downloaded.
10. Once downloading is started,
press STOP button to keep from re-downloading after downloading is completed.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 115 -
5. DOWNLOAD
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 116 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
- 117 -
PWRURXDUTXD
3G 2.5G
GNDRXTXVCHARON_SWVBAT
26MHz
8
(2012)
105
H
G
1 95
NOR BOOT
(GPIO_036)
2
2V93_VEXT
1V82_VINT
DOWNLOAD USB
ADI Application NOTE GSM-0164)
2
E
NAND BOOT
H
E
11
B B
(1%)
1
H
53
(CHANG TO 1K USING TRACE 32)
76
B
(MUXOUT_2)
0
LCD ID
6
D
4
3 12
1GPIO_099
BACK-UP BATTERY
9
6 9 12
7
C
(MUXOUT_1)
(1.8V LOGIC LEVEL)
1
1V88_VMEM
8
G
7
107
1V88_VMEM
8
E
F
4
4 5
1V88_VMEM
H
E
F
C
A
1
A
F
DOWNLOAD UART
F
BOOT CONTROL
1V88_VMEM
G
12
D
(USE GHOST FUNC. OF ROW4 ON POWER-UP)
2
2
A
(Change to Schemetic, Because of
4
0
D
(1%)
G
11
A
PIN
1V82_VINT
1
C
11 12
C
JTAG
11
106
13MHz
0
GPIO_098
D
83
GPIO_113
1
9
B
3
10
22p
C102
22p
C105
1u
C136
OJ101
R120 120K
C156DNI
VBAT
100K
1u
R101
0.1u
C128
C112
ANT_SW3
3
1
2
2V93_VEXT 1V5_VPLL
KDR331V
D100
C111
1u
39pC154
2V93_VEXT
VUSBIN
2V93_VEXT
VCXO_EN
ABBRESET
C149 0.1u
R109
10K
2V85_VSIM
1V8_VRTC
47K
R107
C124
22u
DNIC155
VUSB
C106
22u
C110
22p
2V5_VABB
0.1u
C100
C152
2V75_VCXO
1V5_VPLL
OJ100
39p
R110
10K
22p
C141
C133 1u
39p
VV
ID3
R14
K22WDDI
J22WDDQ
J21WUDI
WUDQH21
1V88_VMEM
C143
VE
XT2
P8
VE
XT3
R10
VE
XT4
R9
VIN
T1H
14L1
5V
INT2
VM
EM
1H
10H
9V
ME
M2
J8V
ME
M3
VM
EM
4K
8
J15
VM
MC
A15
VP
LL
VR
TCB
15
VS
IMK
15
H19VUSB
N19
VV
ID1
VV
ID2
P15
W12USC_2
AB10USC_3USC_4
W11AA10
USC_5U12
USC_6
VC
OR
E01
H11
H12
VC
OR
E02
VC
OR
E03
H13
L8V
CO
RE
04V
CO
RE
05M
15M
8V
CO
RE
06V
CO
RE
07N
15V
CO
RE
08R
11R
12V
CO
RE
09V
CO
RE
10R
13
VE
XT1
N8
PPI_HSYNCAB21AA22
PPI_VSYNC
PWRONA18
SCKEL6
SCLKOUTK1
K2SDA10
K19SIMCLK
L19SIMDATAIO
TESTMODEA2
H22UCLK
USB_DME22D22
USB_DP
USB_IDH17
USB_VBUSF19
USC_0U13AA11
USC_1
NSDWEJ2
NWAITC2
NWEB1
OSCINA17A16
OSCOUT
PPI_CLKY21L22
PPI_DATA_0PPI_DATA_1
M22
PPI_DATA_2N21
PPI_DATA_3M21
PPI_DATA_4V22
PPI_DATA_5V21
PPI_DATA_6W22W21
PPI_DATA_7V19
PPI_DATA_8PPI_DATA_9
Y22
E2NA1CS
E1NA2CS
H4NA3CS
NADVC1
NC1M17
V4NC2
NHWR_UBSB4
NLWR_LBSA3
M6NNDBUSY
NNDCSL4
NNDWPL2
A4NRD
G1NRESET
NSDCASH1
NSDCSJ1H2
NSDRAS
AA14KEYPADCOL_1
W14KEYPADCOL_2KEYPADCOL_3
AB14AB13
KEYPADCOL_4
U14KEYPADROW_0KEYPADROW_1
AA13
KEYPADROW_2AB12
KEYPADROW_3W13
KEYPADROW_4AA12
F22MC_CLK
J19MC_CMD
J17MC_DAT_0
E21MC_DAT_1MC_DAT_2
F21K17
MC_DAT_3
NA0CSD1
AB19GPIO_148GPIO_149
AA19
GPIO_150AB20
GPIO_151AA20U21
GPIO_152T21
GPIO_153T22
GPIO_154GPIO_155
R21R22
GPIO_156AB15
GPIO_172GPIO_173
U15
GPIO_174W16U16
GPIO_175V2
GPIO_177
JTAGENT2
KEYPADCOL_0W15
AB8GPIO_085
W9GPIO_086
U11GPIO_087
GPIO_098W10
GPIO_099AB9
GPIO_100L17
AA9GPIO_113
GPIO_123G22
GPIO_124G21
GPIO_141AA15
GPIO_142AB16AA16
GPIO_143AB17
GPIO_144GPIO_145
AA17AB18
GPIO_146GPIO_147
AA18
AA5GPIO_061
C22GPIO_062
GPIO_063C21W6
GPIO_064GPIO_065
U8
GPIO_066W7U9
GPIO_067GPIO_068
W8
GPIO_069AB5
GPIO_070AA6AB6
GPIO_071GPIO_072
AA7
GPIO_073AB7U10
GPIO_074
GPIO_076B22
GPIO_078AA8
T6GPIO_035GPIO_036
W5AB2
GPIO_037AA3
GPIO_038F2
GPIO_049K6
GPIO_050F1
GPIO_051J4
GPIO_052G2
GPIO_053GPIO_054
K4
GPIO_055U7
AB3GPIO_056
D21GPIO_057
E19GPIO_058
GPIO_059AA4
AB4GPIO_060
GPIO_011R1P6
GPIO_012GPIO_013
R4R2
GPIO_014T1
GPIO_015R6
GPIO_016U1
GPIO_017T4
GPIO_018GPIO_019
U2V1
GPIO_020GPIO_021
U4W1
GPIO_022GPIO_024
A13D15
GPIO_032GPIO_033
W2
GPIO_034Y2
N10
GN
D24
N11
GN
D25
N12
GN
D26
N13
GN
D27
GN
D28
Y1
L1GPIO_000GPIO_001
M4
GPIO_002M1
GPIO_003M2
GPIO_004N6N1
GPIO_005
N2GPIO_006
N4GPIO_007
P1GPIO_008
P2GPIO_009
GPIO_010P4
GN
D08
B16
B17
GN
D09
G19
GN
D10
GN
D11
K10
GN
D12
K11
K12
GN
D13
GN
D14
K13
GN
D15
L10
GN
D16
L11
L12
GN
D17
GN
D18
L13
M10
GN
D19
GN
D20
M11
GN
D21
M12
GN
D22
M13
M19
GN
D23
L21EB2_ADDR_07EB2_ADDR_08
P22
EB2_ADDR_09N22U19
EB2_ADDR_10T17
EB2_ADDR_11EB2_ADDR_12
W18
P19EB2_NRD
EB2_NWAITW17
EB2_NWEN17
GN
D01
A1
A14
GN
D02
A22
GN
D03
GN
D04
AA
1A
B1
GN
D05
AB
22G
ND
06B
13G
ND
07
DATA_07A8
DATA_08B9
DATA_09A9
DATA_10B10
DATA_11A10
DATA_12B11
DATA_13A11
DATA_14A12
DATA_15B12
EB2_ADDR_00P21P17
EB2_ADDR_01EB2_ADDR_02
R19T19
EB2_ADDR_03EB2_ADDR_04
U22R17
EB2_ADDR_05K21
EB2_ADDR_06
BSOFSB19
BURSTCLKD2
B14CLKIN
CLKONAB11
CLKOUTA21G17
CLKOUT_GATE
B20CSDI
CSDOA20D18
CSFS
B5DATA_00DATA_01
A5
DATA_02B6
DATA_03A6
DATA_04B7
DATA_05A7
DATA_06B8
ADD_14D9
F11ADD_15ADD_16
D10
ADD_17F12D11
ADD_18ADD_19
F13D12
ADD_20ADD_21
F14
ADD_22D13D14
ADD_23
B18ASDI
ASDOF15
ASFSD16
BSDID17
BSDOF16A19
BSIFS
ADD_00J6G4
ADD_01H6
ADD_02ADD_03
F4G6
ADD_04ADD_05
E4
ADD_06D5F7
ADD_07ADD_08
D6
ADD_09F8D7
ADD_10ADD_11
F9D8
ADD_12F10
ADD_13
RXON
AD6900XBCZ
U101
1u
C127
1u
C108
C117
C144
1u
39p
22u
C125
C104
TXON
0.1u
SD_CS
VCORE
OJ102
BAT100
C116
0.1u
C137 1u
0.1u
12
VCORE
C13932.768KHz
X100
FC-135
L100
OJ103
4.7uH
39p
C146
1uC134
1V82_VINT
2V93_VEXT
22p
C101
0.1u
C150
nWE
2V85_VSIM
1V8_VGP
1u
C122
C115
NC278
NC3
NC49
ON_SW5
RTS11
2RX
TX3
VBAT6
0.1u
UART
12CTS
10DSR
1GND
4NC1
22p
C107
C135
22p
2V93_VEXTC103
0.1u
C121
1u
2V93_VEXT
R1024.7K
0.1uC142
1V8_VRTC
VCORE
VBAT
CLKOUT
DNI
R104
VBAT
10K
R105
2V93_VEXT
R113 0
22pC140
C132
2.2u
1000pC120
C113
0.1u
VMEMOUT2
J5VMEMSEL
J12VMIC
F12VPLL
VRFC12
M7VRTC
VRTCSELJ6
M6VSIM
VUSBC11
A4VUSBCHG
VU
SB
IND
11
E3
E4
VC
OR
EG
ND
2
VCOREPWR1F1
VCOREPWR2F2
E1VCORESW1VCORESW2
E2
B2VCXOEN
VEXT1A3B3
VEXT2
C6
VG
ND
11D
6V
GN
D12
VGPM5
VINTK2
VINTOUTK1
VM
EM
FBL5
L4VMEMOUT1
M4
L1
G12VABB
VA
PP
E12
D3VAPPCFG
D12VAPPGATE
C4
VB
AT1
VB
AT2
D9
D10
VB
AT3
E10
VB
AT4
H4
VB
AT5
J4V
BA
T6K
5V
BA
T7K
6V
BA
T8
VBATSENSEB6
A1VCHG
VC
OR
EFB
D2
VC
OR
EG
ND
1
REFOUT
RESET1P8L3
RESET2P8C3
K4RXON
SG
ND
1K
7 L7S
GN
D2
SPWR1J9
SPWR2J10
D1TCK
B1TDI
TDOC2
C9TEMP1
A7TEMP2
TMSC1
B11TRKCHG1TRKCHG2
B10
TXON
H11
LIGHT2G11H12
LIGHT3
L2MCLK
K3MCLKEN
MP
WR
F4
MSCLKC5D4
MSDIMSFS
D5
A8PAPWREN
J11
QNA11A12
QPREFB9
REFBBB7
REFCHGB12
B8
CRST
J1CSDICSDO
H2
CSFSM1
L6DBBON
H5
DG
ND
GATEDRIVEA5
GN
D_J
07J7
INA10
F3INT
A9IP
A6ISENSE
JACKSENSEK9
M10KEYONKEYOUT
L10
H10
LGN
D
LIGHT1
F10AOUT3R
G10
G4ASDIASDO
G3
G1ASFS
J2ASM
C8AUXADC1AUXADC2
C7
BATTEMPB4
BATTYPEB5
H1BSDI
BSDOH3
J3BSIFS
G2BSOFS
A2CHGDET
K8CHGLIGHT
M3
AG
ND
09
AG
ND
2D
7E
9A
GN
D3
G9
AG
ND
4
M12AIN1NAIN1P
M11
L12AIN2N
L11AIN2P
K11AIN3LAIN3R
K12
AOUT1NF11E11
AOUT1P
L8AOUT2N_1
M8AOUT2N_2
L9AOUT2P_1AOUT2P_2
M9
AOUT3L
F9
AG
ND
012
G6
G7
AG
ND
013
G8
AG
ND
014
H6
AG
ND
015
AG
ND
016
H7
AG
ND
017
H8
H9
AG
ND
018
J8A
GN
D01
9
F5A
GN
D02
G5
AG
ND
03D
8A
GN
D04
AG
ND
05E
6E
7A
GN
D06
AG
ND
07E
8 F6A
GN
D08
F7
CHG_ABB
U100
AD6855ABCZ
ABBRESETM2
K10ACCDETECT
AFCDACC10
AG
ND
01E
5
AG
ND
010
F8
AG
ND
011
FB100
1u
1V82_VINT
C126
ABB_INT
DNI
R112
C145
39p
VUSB
100KR100
22u
VBAT
C118C119
CHG_ABB
2V93_VEXT
22p
1u
C130C129
1u
C123
1u
2V93_VEXT
C138 0.1u
C109
22p
ROM_CS
C131
1u
39p
10M
R103
C153
1V88_VMEM
68KR106
VUSBIN
CHG_ABB
VBAT
C15139p
C114
0.1u
1V88
_VM
EM
C158100p
2V5_VMIC
VBAT
DNI
R111
C157
0.1u
2V93_VEXT
USC5
HOOK_DETECT
VJACK_LDO_EN
HP_LOUT
LCD_ID_L
BT_UART_RTS
HP_EN
nRESET
BT_LDO_EN
RCV_N
LCD_SUB_CS
VBACKUP
FM_R
LCD_ID
MIC_N
GENIE_TXGENIE_RX
USB_DET
LCD_ID
26M
ADD24
MIC_P
HP_MIC_PHP_MIC_N
KEY_ROW5
KEY_BACKLIGHT3
CAM_MCLK
MC_DET
JACK_DETECT
LCD_DATA15
BT_UART_CTS
EXT_PWRON
RCV_P
VIBRATOR
ANT_SW2
CAM_PWDN
LOUD_SPK_EN
JTAGEN
TCK
FM_L
CAM_LDO_EN
BT_WAKEUP
BT_PCM_CLK
BT_PCM_SYNC
VBACKUP
BT_RESETCAM_RESETLCD_RESET
BT_PCM_RX
ADD25
DATA00DATA01DATA02DATA03DATA04DATA05DATA06DATA07DATA08DATA09DATA10DATA11DATA12
BT_PCM_TX
DSR_DET RTCK
PA_BAND
S_ENS_DATAS_CLK
SIM_RST
RPWRONPWRON
LCD_BACKLIGHT_CTRT
CAM_DATA7
CAM_DATA0CAM_DATA1CAM_DATA2
CAM_HSYNCCAM_VSYNC
CAM_PCLK
nRESET
PA_EN
ANT_SW1
BURSTCLK
SD_CLKSD_CKE
KEY_COL0KEY_COL1KEY_COL2KEY_COL3KEY_COL4
KEY_ROW1KEY_ROW2KEY_ROW3KEY_ROW4
CAM_DATA3CAM_DATA4CAM_DATA5CAM_DATA6
ADD20ADD21ADD22ADD23
DATA13DATA14DATA15
nWE
nADV
ROM_CS0
SD_RASSD_WE
SD_CASSD_CS
DQM0
DQM1
nWAIT
ADD04ADD05ADD06ADD07ADD08ADD09ADD10ADD11ADD12ADD13ADD14ADD15ADD16ADD17ADD18ADD19
ADD01ADD02ADD03
INIP
POWERKEYKEY_ROW4
TX_RAMP
QNQP
USC3USC4USC5USC6
AFC
SPK_N
SPK_P
HP_ROUTBATT_TEMP
RPWRON
MC_D1MC_D2MC_D3
nRD
PWRON
SIM_CLKSIM_DATA
USB_NUSB_P
USC0USC1USC2
LCD_DATA10LCD_DATA09LCD_DATA08LCD_DATA07LCD_DATA06LCD_DATA05LCD_DATA04LCD_DATA03LCD_DATA02LCD_DATA01LCD_DATA00
LCD_MAIN_CS
KEY_ROW0
MC_CLKMC_CMDMC_D0
TMSTDI
TDO
F_DPDBT_32K
BT_INT
CHG_EN
LCD_DATA14LCD_DATA13LCD_DATA12LCD_DATA11
LCD_RSLCD_VSYNC
CAM_I2C_DATACAM_I2C_CLK
LCD_WR
BT_UART_TXBT_UART_RX
FOLDER_DET
CHG_DET
USC4
RPWRON
USC1
DSR_DET
USC2
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 118 -
(INTEL, 512Mbit NOR + 128Mbit SDRAM)
11
1
ON BOARD JTAG
H
A
3
B
10
(RX)
G
2
D
(TX)
8
C
1
F
(EB2_ADDR_10)
2 9
MEMORY
4
7
E
12
(RTS)
5
E
A
F
G
95
7
H
G
96 118
E
10
1 127
C
E
1
(GPIO_055)
B
12
C
3
D
F
H
122
(GPIO_037)
Charging IC
8
11
BLUETOOTH & FM RADIO
C
44
6
(GPIO_059)
(1%)
6 10
6 9
A
F
H
G
4
3
D
(GPIO_172)
3
2 8
A
(CTS)
D
5
B
7 11
B
(GPIO_013)
10
5
(EB2_ADDR_04)
BT_D_IQ
R21610K
DNIR202
0.1u
R213
C204
36KR214100K
0.1uC207
C2111u
30K
R217
47R219
1V88_VMEM
2V93_VEXT
R206
47K
C2101u
47K
R207
R212100K
CHG_ABB
FM_L
R203DNI
100K
R205
1V8_VGP
R21010K
4
VBAT
19.2MHz
X200CSC3M192000EEVRS00
2GND
3OUT
TRI_OPEN1
VDD
BT_TX
0.1uC205
100K
R218
1V88_VMEM
BT_RTSBT_CTS
VUSBIN
18192021222324
G1 G2
G3 G4
23456789
16
252627282930
17
CN201
1
101112131415
BAT10
CRDL1
8GND
9ICDL
6IMIN
PGND11
2USB
USBON7
4_CHG
_EN5
_PPR3
ISL6299U203
C217C218DNI 1u
C201
1V88_VMEM
GND201
1000p
DNI
C202
2V93_VEXT
1V88_VMEM
ANT201
IN35
11NC1NC2
12
OUT16
7OUT2
_EN10
3_FLAG
VCHARGE
FM_R
NCP348MTR2GU204
GATE8
9GATE_OUT
GND2
1IN1
4IN2
2V93_VEXT
D_BT_IQ
CHG_ABB
BT_RX
C215
R208 DNI
1u
VREG_CTL
XTALNI5I6
XTALP
R211
30K
B2
C2PCM_SYNC
A4REGBT
RESETB4C4
SLEEP_CLK
G4TM0
G3TM3
UART_CTSH2
UART_RTSG2
UART_RXG1H1
UART_TX
I3VAFLVAFR
I4
VBATTA3A2
VDDR3V
I2VIO
C3
GND4E6
GND5E7
GND6F1
GND7F2
GND8GND9
F3
H5GPIO0
H4GPIO1GPIO2
G6
GPIO3G5C6
GPIO4GPIO5
H7
GPIO6B3C7
GPIO7
PCM_CLKC1
PCM_INB1
PCM_OUT
D2
GND16D3
GND17D4
GND18D5
GND19D6
GND2E3
GND20D7A1
GND21GND22
H6I7
GND23I1
GND24A5
GND25GND26
A7
GND27B5B6
GND28
E4GND3
E5G7
A_GPIO4A_GPIO5
H3C5
A_GPIO6A_GPIO7
B7
BT_ANTE1A6
FM_ANT
GND1E2
GND10F4
GND11F5F6
GND12F7
GND13GND14
D1
GND15
VBAT
U201 EWFMLBAXX
1000p
C203
1uC212
C209
R204
100K
0.1u
C6VSS4VSS5
C7C8
VSS6K2
VSS7VSS8
K3K4
VSS9
_ADVD5
_OEH7
E2_WE
E5N_CLE
N_RY__BYH1
F6N__RE_S__CS1N__WE_S_CS2
H2
G1RFU
S_VCCD2
VCCQ1J2J3
VCCQ2J7
VCCQ3VCCQ4
J8
C2VSS1
K6VSS10VSS11
K7K8
VSS12
VSS2C3C4
VSS3
D4F1_VCC1
J4F1_VCC3
G3F1__CE
D6F2_VCC2
J6F2_VCC4
F2__CEG2
F3__CEH3E6
F4__CE_A27F_CLK
K5
B6F_DPD
J1F_VPP
F_WAITJ9
F__RSTG7
E1F__WP1
F1F__WP2
D8N_ALE
M9DU4
D_BA0G4H4
D_BA1
G6D_CKE
J5D_CLK
D_DM0_S__LBH9H8
D_DM1_S__UB
D_LDQSM3M7
D_UDQS
D_VCC1C5D3
D_VCC2D7
D_VCC3
F3D__CAS
H5D__CLK
F4D__RAS
D__WEH6
L7DQ11DQ12
L8
DQ13K9L9
DQ14M8
DQ15
DQ2K1
DQ3L2M4
DQ4L3
DQ5DQ6
L4L5
DQ7DQ8
M5
DQ9L6
A1DU1
A9DU2DU3
M1
A6A23
A7A24A25
A8B8
A26
B2A3A4
A2B3
A5A3
A6A7
A4G8
A8F8
A9
D1__CSF2
D2__CSE3
M2DQ0
L1DQ1
M6DQ10
A0D1C1
A1
E8A10
G9A11A12
F9
A13E9
A14D9C9
A15A16
B9B4
A17A18
B5A5
A19
A2B1
A20F7
A21E7
A22B7
U202 PF38F5060M0Y0BE
C216DNI
R201 0
USB_DET
BT_PCM_TX
BT_PCM_SYNC
BT_PCM_RX
BT_PCM_CLK
FM_LFM_R
BT_MAIN_CLK_EN
BT_19.2MHZ
BT_MAIN_CLK_ENBT_19.2MHZ
BT_32K
BT_LDO_EN
FM_ANT
BT_RESET
BT_WAKEUPBT_INT
BT_UART_TXBT_UART_RX
BT_UART_RTSBT_UART_CTS
USC5USC6JTAGEN
TDITMSTCK
RTCKTDO
nRESET
CHG_EN
CHG_DET
ADD14ADD15ADD16
ROM_CS0
nRESET
USC0USC1USC2USC3USC4
F_DPD
ADD01ADD02ADD03ADD04ADD05ADD06ADD07ADD08ADD09ADD10ADD11ADD12ADD13
ADD18ADD19
nADV
SD_RASSD_CAS
BURSTCLK
nWAITnWE
nRD
SD_WE
DQM0DQM1
SD_CS
SD_CLK
SD_CKE
ADD24ADD25
DATA01DATA02DATA03DATA04DATA05DATA06DATA07DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15
DATA00
ADD17ADD18ADD19ADD20ADD21ADD22ADD23
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 119 -
D
SPEAKER
H
USB & DEBUG
9
9
1
10
(USB & DEBUG PATH Control)
(5000-6T-1.8SL)
(TX)
8
(GPIO_009)
C
DEBUG_TX/ RX
A
3
6
8
G
A
10
(GAIN x6)
4 11
H
EARJACK / I_O
A
F
SIM CONNECTOR
8
2 118
E
F
C
6
5 6
12
(GPIO_100)
A
B
10
73
E
95
USB_DET
9
11
12
51 6
G
H
GG
D
1 4
C
MIC
F
12
D
2
11
(RX)
(SCHB1A0202)
E
B
E
3
5
4
3
B
MICRO SD Connector
2
H
C
1
10
F
D
USB & DEBUG Links to
H
2
7
1277
B
4
L
USB_LINEP/ N
100K
R317
123
4
0.1uC306
2V5_VJACK
CN301
R325 0
10p
VBAT
TX
DSR
C305FB301
2.2K
R32
7
EVLC14S02050VA305
VUSBIN
GN
D5
D2
GN
D6
GN
D7
D3
IN+C1
IN-D1
B1NC
B4VDD1
C4VDD2
D4VO+
VO-A4
A1_SD
VBAT
TPA2005D1ZQYRU303
GN
D1
A2
A3
GN
D2
GN
D3
B3
C2
GN
D4
C3
EV
LC14
S02
050
VA
303
C31910u
VBAT
R30
8
100K
10uC327
EV
LC5S
0250
VA
301
100K
R305
3pC314
9
GND210
GND31112
GND4
4VDD
6VSS
J301
5CLK
3CMD
7DAT0DAT1
8DAT2
1
DAT32
GND1
1u
C310
100uVCHARGE
1
2
C302
CN302
1uC312
1VDD VOUT
3
0.01uC316
U304 R1114D251D
6CE
GND12
GND25
NC4
100K
R304
1000p
47
C321
R310
220n
C318
EV
LC14
S02
050
VA306
R309 4.7
NC15
7NC2
2NO1
10NO2
1VCC
SLAS4717EPMTR2GU302
COM13
COM29
GND6
4IN1
8IN2
L301 100nH
R31
8
1K
FB304
1M
R328
R311 47
2V93_VEXT
R302
2.2K39p
C301
15161718
19
2
20
21
22
3456789
CN300
1
1011121314
C300
R319
100K
10u
R307 4.7
NO1
10NO2
1VCC
2V5_VMIC
100K
R323
COM13
COM29
GND6
4IN1
8IN2
NC15
7NC2
2
C329
2V85_VSIM
NLAS5223BMNR2GU301
100ohm
R324
2.2u
R32
9
100K
2V93_VEXT
EXT_PWRON
10u
C315
C322
10uC307
C309
1000p
47p
1uC304
R300
1.5K
R314 47K
100K
R320
47pC313
VA307
EV
LC14
S02
050
FB302
RX
R32
2
2.2K
C324
22p
2V85_VSIM
2V93_VEXT
RS
B6.
8CS
T2R
ZD
300
47pC311
DNIC332
C308
1u
2V93_VEXT
100uC303
D+IC6
D-3
D-IC4
2GND
5VBUS
C3251000p
U300 STF203-22-TC1
D+
R321
4C5C6
5
C76
GND178
GND2GND39
10GND4
100K
J3001
C12
C2C3
3
2V93_VEXT
47KR315
DNI
VA
300
EV
LC5S
0250
C320C323
2V93_VEXT
100K
R306
DNI
1800
VBAT
FB300
R326
100ohm
VA304EVLC14S02050
C330 C3311u
2V5_VJACKVBAT
1u
DNIR303
OBG-415L42-C33LHMIC300
R316
15KFB305
39pC328
1
R312
C317
C32639p
0.01u
HP_MIC_P
GENIE_RX
USB_LINEN
L300270nH
HOOK_DETECT
VJACK_LDO_EN
BATT_TEMP
SIM_RST
HP_MIC_N
HP_ENHP_ROUT
HP_LOUT
HP_EN
FM_ANT
MULTI_PORT_RXMULTI_PORT_TX
USC1USC2
EXT_PWRON
JACK_DETECT
DSR_DET
USB_LINEN
USB_LINEPUSB_P
USB_N
MIC_P
MIC_N
USB_LINEP
GENIE_TX
MULTI_PORT_TX
MULTI_PORT_RX
USB_DET
USB_DET
MC_D3
MC_DET
SIM_DATA SIM_CLK
MC_D0MC_D1MC_D2
MC_CMDMC_CLK
LOUD_SPK_EN
SPK_N
SPK_P
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 120 -
A
G
UP
4
B
108
B
12
5
B
7
8
DOWN
12
C
#
10
1
D
VIBRATOR
C
7
5
KEYPAD
2
SEND
F
7 8
11
OK
E
6
99
RIGHT
10
8
7
HH
E
MENU
7 11
1
CLEAR
FLIP
3
5
G
D
3
FF
H
(VOLUME_DOWN)
D
A
4
0
G
B
113 5
1
END
LEFT
4
G
C
2
CONF
8
3
*
E
32
H
9
E
KEY BACKLIGHT
1211
C
6
(VOLUME_UP)
1264
1
5
21
9
SIDEKEY_PAD
D
9
2
F1
6
6
A
10
A
4
F
47
3N
CO
UT
21V
DD
4V
SS
R401
KB420
U400
EM
-078
1-T5
C402
KB412
1u
2.2
R408
KB409
VA502EVLC18S02015
680
R614
2
Q1_B
6
Q1_C
1
Q1_E
Q2_B
5
Q2_C
3
Q2_E
4
KB418
VBAT
Q400
VA
402
EV
LC18
S02
015
VA
405
ICV
N05
05X
150F
R
2V93_VEXT
KB421
KB416
KB404
LD400LEWWS44-E
KB402
KB413
ICV
N05
05X
150F
R
VA
401
KB411
VBAT
KB410
VA
400
ICV
N05
05X
150F
R
KB408
CN
400
1234
KB422
R407
0
680R402
R404 680
VA
404
EV
LC18
S02
015
KB403
KB405
KB400 KB401
VA
403
EV
LC18
S02
015
KB406
VBAT
KB407
680R403
LEWWS44-E LD401
KB415
R400
47
680
R405
KB419
VA503EVLC18S02015
KB414
10K
R40
6
KB417
KEY_COL1
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_COL0
KEY_ROW1
POWERKEY
KEY_COL3
KEY_COL4
VIBRATOR_P
VIBRATOR
KEY_BACKLIGHT3
FOLDER_DET
KEY_ROW0
KEY_ROW5
KEY_COL2
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 121 -
A
G
A
1
D
B
5 91
11
E
127
C
G
73 4
D
FPCB CONNECTOR B
H
G
F
9
9
12
8
3
C
E
B
F
112
C
2 83
2
72
3
1 12
C
4 105
12
5
A
116
4
105
7 10
8
6
6
B
G
E
CAMERA POWER
D
11
HH H
F
4
D
10
8 9
(EB2_ADDR_00)
E
F
6
A
LCD BACKLIGHT
1
0.1u0.1uC508 C509
D50
3R
SB
6.8C
ST2
R
C518
D50
6R
SB
6.8C
ST2
R
1u
2.2uC506
R50
3
100K
C50456p
DNIC522
2.2uC523
4.7K
R502
1u C51
7
L500
INOUT_B46
18nH
FL506 ICVE10184E150R500FR
G1
5
G2
10
INOUT_A11
INOUT_A22
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
2V8_IOVDD
RS
B6.
8CS
T2R
D50
1
R500100K
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
39p
FL501 ICVE10054E250R201FR
C502
2V8_AVDD
C500DNI
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
7INOUT_B3
6INOUT_B4
VBAT
7
6INOUT_B4
ICVE10184E150R101FRFL508
5G
110
G2
1INOUT_A1
ICVE10054E250R201FRFL504
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B3
59
6
60
789
G1G2
G3G4
43444546474849
5
505152535455565758 3
30313233343536373839
4
404142
1516171819
2
20212223242526272829
CN500
1
1011121314
C5030.1u
C5191u
C5051u
RS
B6.
8CS
T2R
D50
2
100ohm R504
2
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
ICVE10184E150R500FRFL503
5G
110
G2
1INOUT_A1
INOUT_A2
D50
5R
SB
6.8C
ST2
R
2V93_VEXT
2V8_IOVDD
INOUT_B37
6INOUT_B4
DNI
C521
5G
110
G2
1INOUT_A1
2INOUT_A2
INOUT_A33
INOUT_A44
INOUT_B19
8INOUT_B2
ICVE10184E150R500FRFL500
C510
L50118nH
2V8_
AV
DD
0.1u
FB50
0
2V8_
IOV
DD
ZD501RSB6.8CST2R
VA
501
ICV
N05
05X
150F
R
ICVE10054E250R201FRFL507
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
6INOUT_B4
1V8_DVDD
EN_SET3
10GND
9IN
OUTCP6
PGND15
C5201u
AAT3169IFO-T1U501
C1+4
5C1-
C2+7
C2-8
11D1D2
1213
D314
D41
D52
D6
C5071u
C51127p
C50139p
RS
B6.
8CS
T2R
D50
4
RT9011-MGPQWU500
EN123
EN2GND
54NC1
6NC2
9P
GN
D
VIN1 8
VOUT1VOUT2
7
DNI
R505
1V8_
DV
DD
INOUT_A44
INOUT_B19
8INOUT_B2
INOUT_B37
INOUT_B46
R501
4.7K
ICVE10184E150R500FRFL502
5G
110
G2
1INOUT_A1
INOUT_A22
INOUT_A33
FL505 ICVE10054E250R201FR
G1
5
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
VBAT
LCD_DATA01LCD_DATA00
MLED5MLED4MLED3
MLED1MLED2
CAM_RESET
CAM_VSYNCCAM_HSYNC
RCV_N
RCV_P
KEY_COL3
MLED
CAM_DATA3CAM_DATA2CAM_DATA1CAM_DATA0
LCD_VSYNC
LCD_MAIN_CS
CAM_PCLKCAM_MCLK
CAM_I2C_DATACAM_I2C_CLK
CAM_DATA4CAM_DATA5CAM_DATA6CAM_DATA7
MLED5
LCD_SUB_CS
KEY_COL4
CAM_LDO_EN
CAM_PWDN
VIBRATOR_P
LCD_ID_L
LCD_DATA14LCD_DATA15
KEY_ROW5
LCD_RSLCD_WR
LCD_RESET
MLED
LCD_BACKLIGHT_CTRT
MLED1MLED2MLED3MLED4
LCD_DATA04LCD_DATA05
LCD_DATA11LCD_DATA10
LCD_DATA08LCD_DATA09
KEY_ROW4
LCD_DATA07LCD_DATA06
LCD_DATA03LCD_DATA02
LCD_DATA12LCD_DATA13
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 122 -
12
C
F
1212
H
2
G
RX1900_N
A
8
A
D
5
D
9
B
RX850_P
65
3
2
H
G
8
E
GSM/EGSM TX L
D
A
(GPIO_060)
L
B
64
10
91
2
(GPIO_070)
L
H
1
ANT_SW2
12
10
F
RX1900_P
4
H
E
4
10
E
L
C
7
72
H
H
11
A
RX900_N
C
L
PCS RX
(GPIO_074)
9
B
G
(GPIO_073)
DCS RX
DCS/PCS TX
6
11
L
85
5
B
EGSM RX
ANT_SW1
L
GSM RX
RX850_N
4
3 7
H
3
H
(GPIO_072)
RX1800_N
11
H
11
D
6
F
1
E
1
8
RX1800_P
3 7
C
G
10
F
9
RX900_P
100pC644
0.1uC634
C6250.1u
VLDO1
0.01u
L604
18nH
C606
VLDO1
DNIC615
47pC618
C60439p
27pC614
2V75_VCXO4.7nHL601
R606 DNI
22uC601
0
R60
8
82pC617
0.01uC605
C629
15
GSM850_RX11
GSM850_RX223
GSM900_RX1GSM900_RX2
4
VC11413
VC2
12VDD 27p
FL601DGM1110M014
AN
T17
GND19
11GND2
16GND3
18GND4GND5
1920
GND6GSM1800_1900_TX
10
5GSM1800_RX1GSM1800_RX2
67
GSM1900_RX1GSM1900_RX2
8
GSM850_900_TX
4.7p
C6270.1u
C631
C608 22p
16
9VLDO3
5.6nHL602
3029
RX900B
SC
LK65
SD
ATA
7S
EN
11TXOP_HI
TXOP_LO10
18V
AFC
_NC
VBAT14
VC
C_B
BI
4
24V
CC
_BB
Q1
VC
C_F
E
VC
C_R
EF
17
12VCC_TXVCO
13VDD
15VLDO1VLDO2
GND33
I2 3
IB NC
8
Q23 22
QB
20R
EFI
NR
EFI
NB
19
RE
F_O
P21
RX18002827
RX1800BRX1900
26RX1900B
25
RX8503231
RX850BRX900
AD6548U602
2 34
C641100p
VBAT
26M
Hz X60
1TS
X-3
225_
26M
HZ1
0.1u
2V75_VCXO
C626
AN
TG
1
G2
RF
C6300.1u
DNI
SW601
RF500
C610
C640100p
C632
220n
C622
39p C633 10p
6pC621
C63639p
0.1u
C62
0
C612 4.3nH
82p
VBAT
C642
10pC637
0R613
C628
100p
0.1u
C639
TP603 TP604
C643100p
C60233p
27pC613
1K R603
L603
2V93_VEXT
18nH
6pC623
10pC638
R610
82
VLDO1
C603
C616
2.7p
0.01u
10K
R611
0.5pC609
51
R607
C624
10
R612
4.7p
10pC635
7G
ND
2G
ND
38
GN
D4
910G
ND
512
GN
D6
13G
ND
7G
ND
814
GN
D9
16
P_GND21
19RSVD_GND
VA
PC
20
VB
ATT
17 2V
CC
1A
6V
CC
1B
U601SKY77318
BS1
3DCS_PCS_INDCS_PCS_OUT
15
4EGSM_IN
11EGSM_OUT
ENABLE18
GN
D1
5
C611 33pDNIR609
1uC619
S_DATA
IP
QP
QN
IN
S_CLK
ANT_SW2
TX_RAMP
PA_EN
PA_BAND
26M
S_EN
AFC
ANT_SW1
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 123 -
HOT 3 HOT 4
E
1
KEY MATRIX (4 pi Dome)
MAIN-FPCB to KEY-PCB INTERFACE CONNECTORENBY0023901 (AXK7L30225G, 30pin, 0.9t, Socket)
B
7
G
D
F
C
9 12
A
F
5
3
E
66
D
8
B
H
8
H
9
D
3 4
4 5
2
E
2 9
10
A
4
9
B
G
D
Match Two Column Lines
11
KEY-PCB to CAMERA INTERFACE CONNECTORENBY0020401 (AXK7L24227J, 24pin, 0.9t, Socket)
G
8
E
1 11
21
CC
12
1 8
7
10
A
C
7
11
A
12
103
B
G
HOT 1
11
HOT 2
52 3 7
H
126
F
H
4 6
F
5 10
to Outer Circle of Buttons
VA
701
EV
LC18
S02
015
KB702
VA
702
EV
LC18
S02
015
R702 680
680R701
89
KB701 KB703
141516171819
2
2021222324
34567
CN702G1 G2
G3 G4
1
101112 13
2V8_
IOV
DD
2V8_
AV
DD
18192021222324
G1 G2
G3 G4
23456789
16
252627282930
17
CN701
1
101112131415
2V8_
AV
DD
1V8_
DV
DD
2V8_
IOV
DD
KB704
1V8_
DV
DD
CAM_DATA7
CAM_DATA3
CAM_DATA1
CAM_PWDN
CAM_VSYNCCAM_I2C_DATA
CAM_HSYNC
KEY_COL4
KEY_ROW5
KEY_COL3
KEY_COL4
KEY_ROW4
CAM_DATA4CAM_DATA5CAM_DATA6CAM_DATA7
KEY_ROW5
CAM_DATA5
CAM_PCLK
CAM_I2C_CLK
MUXOUT_1
KEY_COL3
CAM_DATA6
CAM_DATA4
CAM_DATA2
CAM_DATA0
KEY_ROW4
CAM_RESET
CAM_I2C_DATA
CAM_VSYNCCAM_HSYNCMUXOUT_1
CAM_I2C_CLK
CAM_PWDNCAM_RESET
CAM_PCLKCAM_DATA0CAM_DATA1CAM_DATA2CAM_DATA3
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 124 -
7. CIRCUIT DIAGRAM
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
H
6
FPCB to LCD INTERFACE CONNECTORENBY0023201 (AXK8L44125, 44pin, 0.9t, Header)
8
(0.1
5mm
)
(0.1
5mm
)
11
A
(SUB LCD VSYNC)
10
VISION MARK
G
(0.1
5mm
)
(0.1
5mm
)
(0.15mm)
(0.15mm)
(0.15mm)
(0.15mm)
(0.15mm)
(0.15mm)
(0.15mm)
(0.15mm)
(0.4mm)
(0.2mm/ Shield)
(0.15mm)
(0.2mm/ Shield)
(0.2mm/ Shield)
(0.2mm/ Shield)(0.15mm)
B
10
4
2
11
7
D
C
H
(IF_MODE = LOW : 16BIT)
(LCD_RD : Internally Pulled Up)
G
5
2
(0.1
5mm
)
(0.2
mm
)
(0.1
5mm
)
1
D
98
3
(0.2
mm
)
1 9
F
7
4
F
FPCB to KEY-PCB INTERFACE CONNECTOR
MAIN to FPCB INTERFACE CONNECTOR
(0.15mm)
(0.15mm)(0.4mm)
ENBY0023801 (AXK8L30125BG, 30pin, 0.9t, Header)
12
E
A
3
12
C
ENBY0020202 (AXK8L60125J, 60pin, 0.9t, Header)
B
E
2V8_
IOV
DD
789
G1 G2
G3 G4
313233343536373839
44041424344
56
171819
2
202122 23
242526272829
3
30
CN802
1
10111213141516
1V8_
DV
DD
2V93
_VE
XT
G2
G3 G4
2V8_
IOV
DD
16
252627282930
1718192021222324
G1
1
101112131415
23456789
CN801
575859
6
60
789
G1
G2
4243444546474849
5
50515253545556
2829
3
30313233343536373839
4
4041
13141516171819
2
2021222324252627
CN803
1
101112
2V8_
AV
DD
2V8_
AV
DD
1V8_
DV
DD
TP803TP804TP802TP801
MLED4MLED5
LCD_DATA00LCD_DATA01
LCD_RESET
LCD_ID
LCD_RS
2V93
_VE
XT
CAM_DATA2
KEY_ROW5
MUXOUT_1
KEY_ROW4
CAM_PWDN
CAM_I2C_CLKCAM_I2C_DATACAM_VSYNCCAM_HSYNC
MLED3MLED2MLED1
RCV_PRCV_N
KEY_COL4
CAM_DATA1CAM_DATA0
CAM_PCLK
CAM_RESET
KEY_COL3
CAM_DATA7CAM_DATA6CAM_DATA5CAM_DATA4CAM_DATA3
LCD_DATA15
LCD_DATA02
LCD_DATA00
LCD_DATA06
LCD_DATA04LCD_DATA11LCD_DATA10
LCD_DATA08LCD_DATA09
LCD_DATA15LCD_DATA14
LCD_DATA12LCD_DATA13
LCD_DATA01
LCD_DATA03
LCD_DATA05
LCD_DATA07
RCV_N
MLEDVIBRATOR_PKEY_COL4
LCD_DATA02LCD_DATA03LCD_DATA04LCD_DATA05LCD_DATA06LCD_DATA07
KEY_COL3
LCD_DATA08LCD_DATA09LCD_DATA10LCD_DATA11LCD_DATA12LCD_DATA13LCD_DATA14
CAM_PWDN
KEY_ROW4KEY_ROW5
LCD_SUB_CSLCD_MAIN_CS
RCV_P
CAM_DATA1CAM_DATA0
CAM_I2C_DATACAM_I2C_CLK
CAM_PCLK
LCD_WR
CAM_VSYNCCAM_HSYNC
LCD_VSYNC
CAM_RESET
MUXOUT_1
MLED5
MLED3
MLED1
LCD_RS
LCD_SUB_CS
LCD_MAIN_CS
LCD_WR
LCD_VSYNC
LCD_RESET
MLED
MLED2
MLED4
LCD_IDVIBRATOR_P
CAM_DATA7CAM_DATA6CAM_DATA5CAM_DATA4
CAM_DATA3CAM_DATA2
- 125 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
F
109
F
11
A
SUB KEY MATRIX
SIDEKEY_PAD
8
B
E
4
D
9
G
C
11
7 105
G
2 7
41
1
C
H
B
8
3
12
E
H
2
D
A
3
12
6
VOLUME_UP
VOLUME_DOWN
CN501
1 2 3 4
- 126 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 127 -
8. BGA IC Pin Check
8. BGA IC Pin Check
USE
NOT IN USE
- 128 -
8. BGA IC Pin Check
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
AD6855 Terminal Locations (Top view)
USE
NOT IN USE
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8. BGA IC Pin Check
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
USE
NOT IN USE
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8. BGA IC Pin Check
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
USE
NOT IN USE
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8. BGA IC Pin Check
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
USE
NOT IN USE
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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- 133 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
SW601 (mobile switch)- Can't make a call-Tx Low Power- Not good Rx BER- No service
U601 (RF PAM)- Can't make a call- Tx Low Power- No service
CN500- Can't take a picture- No LCD display
U501- Can't turn on the LCD Backlight
U303- The speaker working bad
FL601 (RF Front End module)- Can't make a call- Tx Low Powe- Not good Rx BER- No service
U602 (Transceiver)- Can't make a call- Tx Low Power- Not good Rx BER- No service
U500- The camera working bad
X100- RTC trouble
Q400- The vibrator working bad
U201- The Bluetooth working bad- The FM Radio working bad
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9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CN701Key_PCB conn.NO CameraNo Hot_Key
CN7022M CAM conn.NO Camera
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9. PCB LAYOUT
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
CN801Key_PCB Conn.No CameraNo Hot_Key
CN802LCD_Conn.No Display
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9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 138 -LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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10. ENGINEERING MODE
10. ENGINEERING MODE
A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functionsprovided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back tonon-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ keywill switch back to the original test menu.
D. Engineering Mode Menu Tree
Engineering Mode
BB Test RF Test MF Mode Traceoption
Call Timer
CAMERA
LCD
Backlight
Buzzer
Vibrator
ADC
Battery
Audio
DAI
Bluetooth
SAR Test All Auto Test
Backlight
Buzzer
Vibrator
LCD
Key PAD
MicSpkTest
Camera
Video Camera
UART On
UART Off
Bluetooth on
Bluetooth off
All Calls
Reset
Fact.Reset
S/WVersion
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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10. ENGINEERING MODE
10.1 BB Test [MENU 1]
10.1.1 CAMERA
This menu is to test the Camera.1) Main LCD preview: It shows the picture on Main LCD.
10.1.2 LCD
1) COLOUR : WHITE, RED, GREEN, BLUE, BLACK2) Contrast Value
10.1.3 Backlight
This menu is to test the LCD Backlight and Keypad EL Backlight.1) Backlight on : LCD Backlight and Keypad EL Backlight light on at the same time.2) Backlight off : LCD Backlight and Keypad EL Backlight light off at the same time.3) Backlight value: This controls brightness of Backlight. When entering into the menu,the present
backlight-value in the phone is displayed. Use Left/Right key to adjust the level ofbrightness. The value of the brightness set at last will be saved in the NVRAM.
10.1.4 Buzzer
This menu is to test the melody sound.1) Melody on : Melody sound is played through the speaker.2) Melody off : Melody sound is off.
10.1.5 Vibrator
This menu is to test the vibration mode.1) Vibrator on : Vibration mode is on.2) Vibrator off : Vibration mode is off.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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10. ENGINEERING MODE
10.1.6 ADC (Analog to Digital Converter)
This displays the value of each ADC.1) MVBAT ADC : Main Voltage Battery ADC2) AUX ADC : Auxiliary ADC3) TEMPER ADC : Temperature ADC
10.1.7 BATTERY
1) Bat Cal: This displays the value of Battery Calibration. The following menus are displayedin order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT,BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT
2) TEMP Cal: This displays the value of Temperature Calibration. The following menus aredisplayed in order : TEMP_HIGH_LIMIT, TEMP_HIGH_RECHARGE_LMT,TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
10.1.8 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip.Although the actual value can be written over, it returns to default value after switching off and on thephone.1) VbControl1 : VbControl1 bit Register Value Setting2) VbControl2 : VbControl2 bit Register Value Setting3) VbControl3 : VbControl3 bit Register Value Setting4) VbControl4 : VbControl4 bit Register Value Setting5) VbControl5 : VbControl5 bit Register Value Setting6) VbControl6 : VbControl6 bit Register Value Setting
9.1.9 DAI (Digital Audio Interface)
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.1) DAI AUDIO : DAI audio mode2) DAI UPLINK : Speech encoder test3) DAI DOWNLINK : Speech decoder test4) DAI OFF : DAI mode off
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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10. ENGINEERING MODE
10.2 RF Test [MENU 2]
10.2.1 SAR test
This menu is to test the Specific Absorption Rate.1) SAR test on: Phone continuously process TX only. Call-setup equipment is not required.2) SAR test off: TX process off
10.3 MF mode [MENU 3]
This manufacturing mode is designed to do the baseband test automatically. Selecting this menu willprocess the test automatically, and phone displays the previous menu after completing the test.
10.3.1 All auto test
LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
10.3.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
10.3.3 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2,Volume 3, Volume 0 (mute), Volume 4, Volume 5.
10.3.4 Vibrator
Vibrator is on for about 1.5 seconds.
10.3.5 LCD
1)LCDMain LCD screen resolution tests horizontally and vertically one by one and fills the screen.
10.3.6 Key pad
When a pop-up message shows °ÆPress Any Key°Ø, you may press any keys including side keys,but not [Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test willbe completed in 15 seconds automatically.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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10. ENGINEERING MODE
10.3.7 MicSpk Test
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically.
10.3.8 Camera Test
This menu is to test camera(preview and capture automatically)
10.4 Trace option [MENU 4]
This is NOT a necessary menu to be used by neither engineers nor users.
10.5 Call timer [MENU 5]
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.1) All calls : This displays total conversation time. User cannot reset this value.2) Reset settings : This resets total conversation time to this, [00:00:00].
10.6 Fact. Reset [MENU 6]
This Factory Reset menu is to format data block in the flash memory and this procedure set up thedefault value in data block.
Attention1 Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process.2 Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting
value, RF Calibration data, etc. cannot be restored again.
10.7 S/W version
This displays software version stored in the phone.
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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11. STAND ALONE TEST
11.1 Introduction
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
11.2 Setting Method
A. COM port
a. Move your mouse on the ‘Connect’ button, then click the right button of the mouse and select “Comsetting’.
b. In the “Dialog Menu”, select the values as explained below.- Port : select a correct COM port- Baud rate : 38400- Leave the rest as default values
B. Tx
1. Selecting Channel- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APCa. Select either Power level or Scaling Factor.b. Power level- Input appropriate value GSM (between 5 ~19) or DCS (between 0 ~15)
c. Scaling Factor- A ‘Ramp Factor’ appears on the screen.- You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0 ~ 26) and RSSI level- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain Control
Index.- Normal phone should indicate the value of RSSI close to -16dBm.
11. STAND ALONE TEST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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11. STAND ALONE TEST
11.3 Means of Test
a. Select a COM portb. Set the values in Tx or Rxc. Select band and channeld. After setting them all above, press connect button.e. Press the start button
Connect Button
Figure 11-1. HW test program
- 146 -
11. STAND ALONE TEST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 11-2. HW test setting
Figure 11-3. Ramping profile
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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12. AUTO CALIBRATION
12.1 Overview
Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery Calibrationwith Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply).Auto-cal generates calibration data by communicating with phone and measuring equipment then writeit into calibration data block of flash memory in GSM phone.
12.2 Equipment List
12. AUTO CALIBRATION
Equipment for Calibration Type / Model Brand
Wireless Communication Test Set HP-8960 Agilent
RS-232 Cable and Test JIG LG
RF Cable LG
Power Supply HP-66311B Agilent
GPIO interface card HP-GPIB Agilent
Calibration & Final test software LG
Test SIM Card
PC (for Software Installation) Pentium II class above 300MHz
Table 12-2-1. Calibration Equipment List.
Figure 12-2-2. Equipment Setup
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 148 -
12. AUTO CALIBRATION
Figure 12-2-3 The top view of Test JIG
12.3 Test Jig Operation
1 2 3 4
ADI-REMOTETI-REMOTE
PSVBAT
JTAG2 JTAG1 USB
TA +
PS
_
POWERON
OFF
TA
POWER
MON Status
UART Status
ON
OFF
MO
NU
AR
T
PH
ON
EPower Source Description
Power Supply Usually 4.2V
Table 12-3-1 Jig Power
Switch Number Name Description
Switch 1 ADI-REMOTE In ON state, phone is awaked. It is used ADI chipset.
Switch 2 TI-REMOTE In ON state, phone is awaked. It is used TI chipset.
Switch 3 VBAT Power is provided for phone from battery
Switch 4 PS Power is provided for phone from Power supply
Table 12-3-2 Jig DIP Switch
LED Number Name Description
LED 1 POWER Power is provided for Test Jig
LED 2 TA Indicate charging state of the phone battery
LED 3 UART Indicate data transfer state through the UART port
LED 4 MON Indicate data transfer state through the MON port
Table 12-3-3 LED Description
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 149 -
12. AUTO CALIBRATION
1. Connect as Fig 12-2(RS232 serial cable is connected between COM port of PC and MON port ofTEST JIG, in general)
2. Set the Power Supply 4.0V3. Set the 3rd, 4th of DIP SW ON state always4. Press the Phone power key, if the Remote ON is used, 1st ON state
12.4 Procedure
1. Copy the file to C:\Cm_Gsm_Multi2. Copy the files of((Windows XXX)MFCD DLL, vsflex7l_ocx_regist to C:\Cm_Gsm_Multi\dll,ocx3. Select MFCD DLL of your computer OS4. Click on “vsflex7l_ocx_regist”5. Click on “Multi_HK reg”6. Connect as Fig 12-2 (RS232 serial cable is connected between COM port of PC, in general.)7. Run HK_30exe to start calibration.8. Click “Logic Operation” of “SETTING” menu bar
9. Set PORT (using RS232 cable) that PC can communicate with the phone10. Select “LOGIC MODE” that you want
Logic mode: 1-> Calibration only2-> Auto test only3-> Cal & Auto
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12. AUTO CALIBRATION
11. Select the model name “KF300d/KF300/KF300c”
12. Click “start” button
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Model name Start button
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12. AUTO CALIBRATION
12.5 AGC
This procedure is for Rx calibration.
In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the resultwindow will show correction values per every power level and gain code and the same measure isperformed per every frequency.
12.6 APC
This procedure is for Tx calibration.In this procedure you can get proper scale factor value and measured power level.
12.7 ADC
This procedure is for battery calibration.You can get main Battery Config Table and temperature Config Table will be reset.
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1
2
3
4
7
8
9
10
1112
1314
18
7219
20
2122
23
24
25
2829
33
34
74
68
70
69
66
67
65
64
63
60
59
58
57
736261
55
54
53
52
48
47
4544
43
42
46
1
51
50
49
35
32
71
36
37
38
40
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
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55
54
53
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50
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48
47
46
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32
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28
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26
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22
21
20
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16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
3130
27
26
5
6
15
1617
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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A
CD
E F GJ
KM
NO
PQ
R S
L
S
R
Q
P
O
N
M
L
K
J
I
H
G
F
E
D
C
B
A
HI
ASS’Y EXPLODED VIEW
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 155 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
13.2 Replacement Parts<Mechanic component>
LevelLocation
No.Description Part number Spec Remark
1 GSM(FOLDER) TGFF0099601 Black
4 MCJZ00 COVER MCJZ0030501 1146*996*105_TDR_Reliance Without Color
4 MPCY00 PALLET MPCY0013701 COMPLEX, (empty), , , , , Without Color
4 MSCY00 SLEEVE MSCY0001001 Deadspace Keeping Off_TDR_RLC Without Color
2 APEY00 PHONE APEY0494001 Black
3 ACGG00 COVER ASSY,FOLDER ACGG0086101 Without Color
4 ACGH00COVERASSY,FOLDER(LOWER)
ACGH0051001 Without Color K
5 MCJH00 COVER,FOLDER(LOWER) MCJH0041001 MOLD, PC LUPOY SC-1004A, , , , , Black 32
5 MFBB01 FILTER,RECEIVER MFBB0024301 COMPLEX, (empty), , , , , Without Color 33
5 MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver 28
5 MPBJ00 PAD,MOTOR MPBJ0048401 COMPLEX, (empty), , , , , Without Color 30
5 MPBM00 PAD,RECEIVER MPBM0020401 COMPLEX, (empty), , , , , Without Color 31
5 MTAK00 TAPE,CAMERA MTAK0004201 COMPLEX, (empty), , , , , Without Color 29
4 ACGJ00COVERASSY,FOLDER(UPPER)
ACGJ0067101 Without Color A
5 MCJJ00 COVER,FOLDER(UPPER) MCJJ0050201 MOLD, PC LUPOY SC-1004A, , , , , Black 10
5 MDAE00 DECO,FOLDER(UPPER) MDAE0041401 PRESS, STS, , , , , Without Color 4
5 MGAD00 GASKET,SHIELD FORM MGAD0157901 COMPLEX, (empty), , , , , Without Color 18
5 MICC00 INSERT,FRONT(UPPER) MICC0010201 CUTTING, BeCu, , , , , Black
5 MPBJ00 PAD,MOTOR MPBJ0048301 COMPLEX, (empty), , , , , Without Color 15
5 MPBM00 PAD,RECEIVER MPBM0020301 COMPLEX, (empty), , , , , Without Color 16
5 MPBQ00 PAD,LCD(SUB) MPBQ0033701 COMPLEX, (empty), , , , , Without Color 17
5 MPBT00 PAD,CAMERA MPBT0049401 COMPLEX, (empty), , , , , Without Color 14
5 MPBU00 PAD,CONNECTOR MPBU0013301 COMPLEX, (empty), , , , , Without Color 12
5 MPBU01 PAD,CONNECTOR MPBU0013401 COMPLEX, (empty), , , , , Without Color 11
5 MPBU02 PAD,CONNECTOR MPBU0013501 COMPLEX, (empty), , , , , Without Color 13
5 MPBZ00 PAD MPBZ0202001 COMPLEX, (empty), , , , , Without Color
5 MPFZ00 PLATE MPFZ0030901 PRESS, STS, , , , , Without Color 5
5 MTAA00 TAPE,DECO MTAA0148601 COMPLEX, (empty), , , , , Without Color 9
5 MTAB00 TAPE,PROTECTION MTAB0197701 COMPLEX, (empty), , , , , Without Color 1
5 MTAD00 TAPE,WINDOW MTAD0076501 COMPLEX, (empty), , , , , Without Color 8
5 MTAE00 TAPE,WINDOW(SUB) MTAE0032801 COMPLEX, (empty), , , , , Without Color 3
5 MTAZ00 TAPE MTAZ0198001 COMPLEX, (empty), , , , , Without Color 6
Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
- 156 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
5 MWAE00 WINDOW,CAMERA MWAE0029401 COMPLEX, (empty), , , , , Without Color 7
5 MWAF00 WINDOW,LCD(SUB) MWAF0039001 COMPLEX, (empty), , , , , Without Color 2
4 ACGK00 COVER ASSY,FRONT ACGK0098801 Without Color O
5 MBJL00 BUTTON,SIDE MBJL0047101 COMPLEX, (empty), , , , , Without Color 48
5 MCCE00 CAP,RECEPTACLE MCCE0040901 COMPLEX, (empty), , , , , Without Color 50
5 MCJK00 COVER,FRONT MCJK0079201 MOLD, PC LUPOY SC-1004A, , , , , Black 44
5 MDAC01 DECO,SIDE MDAC0021301 MOLD, PC LUPOY SC-1004A, , , , , Without Color 43
5 MDAG00 DECO,FRONT MDAG0031401 MOLD, PC LUPOY SC-1004A, , , , , Without Color 49
5 MICC00 INSERT,FRONT(UPPER) MICC0008901 Silver
5 MPBH00 PAD,MIKE MPBH0033801 COMPLEX, (empty), , , , , Without Color 46
5 MSGB00 STOPPER,HINGE MSGB0022901 MOLD, Urethane Rubber S190A, , , , , Without Color 42
5 MSGC00 STOPPER,FOLDER MSGC0001801 MOLD, Urethane Rubber S190A, , , , , Without Color 41
5 MTAB00 TAPE,PROTECTION MTAB0197801 COMPLEX, (empty), , , , , Without Color 47
5 MTAB01 TAPE,PROTECTION MTAB0197901 COMPLEX, (empty), , , , , Without Color 51
4 ADBY00 DECO ASSY ADBY0011601 LOWER Without Color L
5 MDAF00 DECO,FOLDER(LOWER) MDAF0009801 PRESS, STS, , , , , Black 35
5 MTAA00 TAPE,DECO MTAA0148901 COMPLEX, (empty), , , , , Without Color 34
4 AWAB00 WINDOW ASSY,LCD AWAB0030501 Without Color M
5 MTAD00 TAPE,WINDOW MTAD0076601 COMPLEX, (empty), , , , , Without Color 36
5 MWAC00 WINDOW,LCD MWAC0087401 COMPLEX, (empty), , , , , Without Color 37
4 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 74
4 MBFF00 BRACKET,LCD MBFF0015901 CASTING, Mg Alloy, , , , , Without Color 19,B
4 MBJA00 BUTTON,DIAL MBJA0026401 COMPLEX, (empty), , , , , Black 25,J
4 MBJA01 BUTTON,DIAL MBJA0026601 COMPLEX, (empty), , , , , Black 52,P
4 MCCH01 CAP,SCREW MCCH0128401 COMPLEX, (empty), , , , , Black 39
4 MDAC00 DECO,SIDE MDAC0021201 MOLD, PC LUPOY SC-1004A, , , , , Without Color 45
4 MHFD00 HINGE,FOLDER MHFD0015701 CASTING, STS, , , , , Without Color 71,N
4 MTAB00 TAPE,PROTECTION MTAB0206001 COMPLEX, (empty), , , , , Without Color 40
4 MTAK00 TAPE,CAMERA MTAK0009601 COMPLEX, (empty), , , , , Without Color 72
4 MFBC00 FILTER,SPEAKER MFBC0035201 COMPLEX, (empty), , , , , Without Color 60
4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White 73
4 MLEA00 LOCKER,BATTERY MLEA0041901 MOLD, PC LUPOY SC-1004A, , , , , Black 65
4 MPBH00 PAD,MIKE MPBH0034201 COMPLEX, (empty), , , , , Without Color 61
4 MPBN00 PAD,SPEAKER MPBN0048501 COMPLEX, (empty), , , , , Without Color 59
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 157 -
LevelLocation
No.Description Part number Spec Remark
4 SACY00 PCB ASSY,FLEXIBLE SACY0065001 KF300_MAIN_FPCB 22,E
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0059301 KF300_MAIN_FPCB
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP
SACD0049001
7 CN801CONNECTOR,BOARD TOBOARD
ENBY0023801 30 PIN,.4 mm,ETC , ,H=0.9, Header
7 CN802CONNECTOR,BOARD TOBOARD
ENBY0023201 44 PIN,0.4 mm,ETC , ,H=0.9, Header
7 CN803CONNECTOR,BOARD TOBOARD
ENBY002020260 PIN,0.4 mm,STRAIGHT ,AU ,STACKING HEIGHT 0.9/ HEADDER FOR KEYPAD TO MAIN
6 SPCY PCB,FLEXIBLE SPCY0129001 FR-4 , mm,MULTI-6 , ,; , , , , , , , , ,
4 SAEY00 PCB ASSY,KEYPAD SAEY0060001 23,F
5 SAEB00PCBASSY,KEYPAD,INSERT
SAEB0022201
6 ADCA00 DOME ASSY,METAL ADCA0072801 FOLDER Without Color 24,G
5 SAEE00 PCB ASSY,KEYPAD,SMT SAEE0027001
6 SAEC00PCB ASSY,KEYPAD,SMTBOTTOM
SAEC0025401
7 CN701CONNECTOR,BOARD TOBOARD
ENBY0023901 30 PIN,0.4 mm,ETC , ,H=0.9, Socket
7 CN702CONNECTOR,BOARD TOBOARD
ENBY0020401 24 PIN,0.4 mm,ETC , ,H=0.9, Socket
7 R701 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
7 R702 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
7 VA701 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA702 VARISTOR SEVY0003801 18 V, ,SMD ,
6 SPEY PCB,KEYPAD SPEY0054801 FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,
4 SJMY00 VIBRATOR,MOTOR SJMY00084053 V,.08 A,10pi*2.7t ,12mm ,; ,3V , , ,12000rpm , , ,,31ohm
26,H
4 SURY00 RECEIVER SURY0013401 ASSY ,107 dB,32 ohm,11*07 , ,; , , , , , ,CONNECTOR , 27,I
4 SVCY00 CAMERA SVCY0016001 CMOS ,MEGA ,2M FF Toshiba 1/4" Sensor 21,D
4 SVLM00 LCD MODULE SVLM0026701MAIN ,M_240*320 S_128*160 ,41*57.5*3.3 ,262k ,TFT,TM ,M_LGDP4531 S_LGDP4512 ,
20,C
3 ACGM00 COVER ASSY,REAR ACGM0099701 Without Color
4 MCCF00 CAP,MOBILE SWITCH MCCF0047801 COMPLEX, (empty), , , , , Black 66
4 MCJN00 COVER,REAR MCJN0074801 MOLD, PC LUPOY SC-1004A, , , , , Black 63
4 MSDB00 SPRING,COIL MSDB0004501 COMPLEX, (empty), , , , , Silver
4 SNGF00 ANTENNA,GSM,FIXED SNGF00311013.0 ,-2.0 dBd,, ,internal, GSM850/1800/1900 ,; ,TRIPLE ,-2.0 ,50 ,3.0
57
<Main component> Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
- 158 -
LevelLocation
No.Description Part number Spec Remark
4 SNGF01 ANTENNA,GSM,FIXED SNGF00312023.0 ,-2.0 dBd,, ,internal, bluetooth ,; ,SINGLE ,-2.0 ,50,3.0
62
4 SUSY00 SPEAKER SUSY0025801 PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT 58
3 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 38
3 MCCH00 CAP,SCREW MCCH0115301 COMPLEX, (empty), , , , , Black 68
3 MCCH01 CAP,SCREW MCCH0115401 COMPLEX, (empty), , , , , Black 67
3 MLAK00 LABEL,MODEL MLAK0010802 PRINTING, (empty), , , , , Without Color
3 SAFY00 PCB ASSY,MAIN SAFY0245001 54
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0080301
5 ADCA00 DOME ASSY,METAL ADCA0073101 LOWER Without Color 53
5 MCBA00 CAN,SHIELD MCBA0024301 COMPLEX, (empty), , , , , Without Color 55
5 MGAD00 GASKET,SHIELD FORM MGAD0158101 COMPLEX, (empty), , , , , Without Color
5 SPKY00 PCB,SIDEKEY SPKY0056601 FR-4 , mm,DOUBLE , ,; , , , , , , , , ,
5 SUMY00 MICROPHONE SUMY0010301 FPCB ,-42 dB,4*1.5T ,Standard Holder
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0162201
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM
SAFC0103201
6 BAT100 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi4.8, Pb-Free
6 C100 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C101 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C102 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C103 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C104 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C105 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C106 CAP,CHIP,MAKER ECZH002550222000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C107 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C108 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C109 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C110 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C111 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C112 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C113 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C114 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C115 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C116 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C117 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
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13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 C118 CAP,CHIP,MAKER ECZH002550222000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C119 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C120 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C121 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C122 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C123 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C124 CAP,CHIP,MAKER ECZH002550222000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C125 CAP,CHIP,MAKER ECZH002550222000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C126 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C127 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C128 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C129 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C130 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C131 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C132 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C133 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C134 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C135 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C136 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C137 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C138 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C139 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C140 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C141 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C142 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C143 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C144 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C145 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C146 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C149 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C150 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C151 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C152 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C153 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C154 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
- 160 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 C157 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C158 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C202 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C203 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C204 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C205 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C207 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C209 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C210 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C211 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C212 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C215 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C217 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C300 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C301 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C302 CAP,TANTAL,CHIP ECTH0005202100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C303 CAP,TANTAL,CHIP ECTH0005202100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C304 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C306 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C308 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
6 C309 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C310 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
6 C311 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C313 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C314 CAP,CERAMIC,CHIP ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP
6 C315 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C316 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C317 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C318 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C319 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C321 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C322 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C324 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
- 161 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 C325 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C326 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C327 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6 C328 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C329 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C331 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C501 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C502 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C503 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C504 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C505 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C506 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C507 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C508 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C509 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C510 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C511 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C517 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C518 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C519 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C520 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C523 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C601 CAP,CHIP,MAKER ECZH002550222000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C602 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C603 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C604 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C605 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C606 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C609 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C611 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C612 INDUCTOR,CHIP ELCH0004733 4.3 nH,S ,1005 ,R/TP ,Coil
6 C613 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C614 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C616 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
- 162 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 C617 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP
6 C618 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C619 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C620 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C621 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
6 C622 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C623 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
6 C624 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C625 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C626 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C627 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C628 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C629 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C630 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C631 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C632 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C633 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C634 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C635 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C636 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
6 C637 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C638 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C639 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C640 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C641 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C642 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP
6 C643 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C644 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 CN300 CONNECTOR,I/O ENRY000680118 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE,RECEPTACLE ,SMD ,R/TP ,
6 CN301 CONNECTOR,ETC ENZY0020401 3 PIN,2.5 mm,BOTTOM , ,
6 CN500CONNECTOR,BOARD TOBOARD
ENBY002040260 PIN,0.4 mm,STRAIGHT ,AU ,STACKING HEIGHT 0.9/ SOCKET FOR KEYPAD TO MAIN
6 D100 DIODE,SWITCHING EDSY0017301 VSM ,15 V,100 mA,R/TP ,PB-FREE
6 D501 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 D502 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
- 163 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 D503 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 D504 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 D505 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 D506 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 FB100 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FB300 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6 FB301 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6 FB302 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6 FB304 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead
6 FB305 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead
6 FB500 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
6 FL500 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL501 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL502 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL503 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL504 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL505 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL506 FILTER,EMI/POWER SFEY0011601 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF)
6 FL507 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)
6 FL508 FILTER,EMI/POWER SFEY0010501SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF),Pb-free
6 FL601 FILTER,SEPERATOR SFAY0011101850.900 ,1800.1900 ,3.8 dB,4.1 dB, dB, dB,4532,4.5X3.2 Size Quad Band FEM
6 J300 CONN,SOCKET ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8
6 J301 CONN,SOCKET ENSY0017701 8 PIN,ETC , , mm,Micro-SD, Hinge type
6 L100 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6 L300 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP
6 L301 INDUCTOR,CHIP ELCH0003842 100 nH,J ,1005 ,R/TP ,MLCI
6 L500 INDUCTOR,CHIP ELCH0004714 18 nH,J ,1005 ,R/TP ,
6 L501 INDUCTOR,CHIP ELCH0004714 18 nH,J ,1005 ,R/TP ,
6 L601 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP ,
6 L602 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP ,
6 L603 INDUCTOR,CHIP ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE
6 L604 INDUCTOR,CHIP ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE
6 Q400 TR,BJT,ARRAY EQBA0004902TES6 ,200 mW,R/TP ,NPN/PNP dual, Vo1=50V,Io1=100mA, Vo2=-50V,Io2=-100mA
- 164 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 R100 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R101 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R102 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R103 RES,CHIP ERHY0000512 10M ohm,1/16W,J,1608,R/TP
6 R105 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R106 RES,CHIP,MAKER ERHZ0000312 68 Kohm,1/16W ,F ,1005 ,R/TP
6 R107 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R110 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R120 RES,CHIP,MAKER ERHZ0000213 120 Kohm,1/16W ,F ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R205 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R206 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R207 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R210 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R211 RES,CHIP,MAKER ERHZ0000460 30 Kohm,1/16W ,J ,1005 ,R/TP
6 R212 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R213 RES,CHIP ERHY0000140 36K ohm,1/16W,F,1005,R/TP
6 R214 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R216 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R217 RES,CHIP,MAKER ERHZ0000460 30 Kohm,1/16W ,J ,1005 ,R/TP
6 R218 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R219 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R300 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
6 R302 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R303 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R304 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R305 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R306 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R307 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
6 R308 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R309 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
6 R310 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R311 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R312 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
6 R314 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
6 R315 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
- 165 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 R316 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
6 R317 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R318 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R319 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R320 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R321 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R322 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R323 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R324 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R326 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R327 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R328 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP
6 R329 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R400 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R401 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R402 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
6 R403 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
6 R404 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
6 R405 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
6 R406 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R408 RES,CHIP,MAKER ERHZ0003701 2.2 ohm,1/16W ,J ,1608 ,R/TP
6 R500 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R501 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R502 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R503 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R504 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R603 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R607 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
6 R610 RES,CHIP,MAKER ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
6 R611 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R612 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R614 RES,CHIP,MAKER ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
6 SW601 CONN,RF SWITCH ENWY0004501 ,SMD , dB,H=3.6, Straight type
6 U100 IC EUSY0313101 BGA ,144 PIN,R/TP ,EGPRS Quad band ABB Stratos-S
6 U101 IC EUSY0313501 BGA ,291 PIN,R/TP ,EGPRS Digital Base band, LEMANS
6 U201 MODULE,ETC SMZY0015001 6.3 * 5.3 * 1.3mm , 63 PIN, Bluetooth Module(BT+FM)
- 166 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 U202 IC EUSY0286002BGA ,105 PIN,R/TP ,512M 65nm Nor+128MSDRAM,1.8V I/O,Pb Free , ,IC,MCP
6 U203 IC EUSY0254701DFN 3*3*0.9 ,10 PIN,R/TP ,Charger IC, I Max 1A, WallAdaptor/USB Charger
6 U204 IC EUSY0319201 DFN ,10 PIN,R/TP ,OVP
6 U300 DIODE,TVS EDTY0006501 SC70-6L ,5.25 V,100 W,R/TP ,
6 U301 IC EUSY0300101WQFN ,10 PIN,R/TP ,Small package Dual SPDT analogSwitch, PB-Free
6 U302 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75
6 U303 IC EUSY0160001MicroStar Junior ,15 PIN,R/TP ,1.1W Class-D Mono AudioAMP
6 U304 IC EUSY0299301 SON1612-6 ,6 PIN,R/TP ,2.5V 150mA LDO Pb-Free
6 U500 IC EUSY0319001WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V DualLDO
6 U501 IC EUSY0336502 , PIN,R/TP , ,; ,IC,Charge Pump
6 U601 PAM SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band
6 U602 IC EUSY0280101LFCSP-32 ,32 PIN,R/TP ,GSM QUAD BANDTRANSCEIVER, Othello G.
6 VA300 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA301 VARISTOR SEVY0005201 5.5 V, ,SMD ,1005, 50pF
6 VA303 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA304 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA305 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA306 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA307 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA400 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA401 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA402 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA403 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA404 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA501 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
6 VA502 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA503 VARISTOR SEVY0003801 18 V, ,SMD ,
6 X100 X-TAL EXXY001870132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,
6 X200 OSCILLATOR EXSY002220119.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5,1.0 , ,SMD ,R/TP
6 X601 X-TAL EXXY002440126 MHz,10 PPM,10 pF,.5 ohm,SMD ,32*25*0.6 ,. ,. ,.,10PPM ,10 ,. ,. ,SMD ,P/TP
6 ZD300 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
- 167 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use OnlyCopyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
6 ZD501 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0101701
6 C402 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 LD400 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P
6 LD401 DIODE,LED,CHIP EDLH0013701WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75,30mA , , ,120mW ,[empty] ,[empty] ,2P
6 SPFY00 PCB,MAIN SPFY0173101 FR-4 ,0.8 mm,STAGGERED-8 , ,; , , , , , , , , ,
6 U400 IC EUSY0313401QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size wide input voltageHall Switch
6 VA405 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
3 SMZY00 MODULE,ETC SMZY0014202 256MB MicroSD
- 168 -
13. EXPLODED VIEW & REPLACEMENT PART LIST
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LevelLocation
No.Description Part number Spec Remark
3 MCJA00 COVER,BATTERY MCJA0051801 MOLD, PC LUPOY SC-1004A, , , , , Black 70,S
3 SBPL00 BATTERY PACK,LI-ION SBPL00929013.7 V,800 mAh,1 CELL,PRISMATIC ,KM500 LatinAmerica BATT, Pb-Free ,; ,3.7 ,800 ,0.2C ,PRISMATIC,50x34x36 , ,BLACK ,Innerpack ,Latin America Label
Black 69
3 SGDY00 DATA CABLE SGDY0010904; ,[empty] ,[empty] ,[empty] ,18 ,BLACK ,6.2mm PlugDatacable ,[empty]
3 SGEY00EAR PHONE/EAR MIKESET
SGEY0005537 , , , , , , , , , ,
3 SSAD00 ADAPTOR,AC-DC SSAD0024601100-240V ,5060 Hz,5.1 V,.7 A,NOM ,AC-DC ADAPTOR ,;,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC SSAD0024602100-240V ,5060 Hz,5.1 V,.7 A,NOM ,AC-DC ADAPTOR ,;,85Vac~264Vac ,5.1V (+0.15V, -0.2V) ,700mA ,5060 ,,WALL 2P ,I/O CONNECTOR ,
13.3 Accessory Note: This Chapter is used for reference, Part orderis ordered by SBOM standard on GCSC
Note
Note
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