INTRODUCTION TO MICROELECTROMECHANICAL ......Kobrinsky, Senturia, Deutcsh, JMEMS 2000 Steve Senturia...

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MEMS 487Session #9Spring 03

INTRODUCTION TO

MICROELECTROMECHANICAL SYSTEMS

(MEMS)

520/530.487

Cantilever Beam Design

Cantilever Beam Design

Cantilever Beam Design

Cantilever Beam Design

Cantilever Beam Design

Cantilever Beam Design

Cantilever Beam Design

Lab 2 Beams

20 µµµµm Thick

100X1000

250X1000

Doubly Supported Beams9.6.2

Doubly Supported Beams9.6.2

Doubly Supported Beams9.6.2

M-Test

Kobrinsky, Senturia, Deutcsh, JMEMS 2000

Steve Senturia

Young’s modulus of polysilicon

1997 2001

169 GPaWNS

160 GPa

142 GPaSS

Buckling of Beams9.6.3

Buckling of Beams

Rarely Considered

Large Strains – 8.5

Plastic Deformation – 8.6

Large Deflections – 9.8

Plates10.4.6

Residual Stress

BendingStress

Stretching Stress

Square, LThick, HFixed

PlatesRoark

Membranes10.4. 7

Membranes

MembranesJayaraman and Hemker, 1998

MembranesJayaraman and Hemker

MembranesJayaraman and Hemker

Resonant Frequencies10.5.1

Resonant FrequenciesNathanson

Resonant FrequenciesNathanson

Finite Element Analysis

Sandia Polysilicon

Sandia Polysilicon

Sandia Polysilicon

Sandia Polysilicon

Sandia Polysilicon

Sandia Polysilicon

Boundary Conditions

Bulge Test Results by Stu Brown

• E = 328 GPa in 2000

• E = 258 GPa in 2002

from considering deformation of supports

Tensile Specimen

Bulge Specimen

Boundary Conditions

Cantilever Beam

Substrate

What you want

Oxide

Substrate

What you get

Oxide

Motion Measurement

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