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High-end solutions for high-tech industries – Meyer Burger
Annegret Lewak, Head of Sales MNS
We are a leading technology
company for innovative and cost
efficient solutions based on semi-
conductor technologies and with
a focus on photovoltaics.
We decisively shape the future
energy mix to the advantage to
our customers by combining our
technologies with the infinite power
of the sun.
Meyer Burger Vision
Corporate Presentation April 20182
▪ the pioneering project, Solar Impulse, relied on PV technology from Meyer Burger?
▪ functional inkjet printingtechnology was revolutionisedby Meyer Burger?
▪ cutting technologies from Meyer Burger set quality standards atthe core of computer chips?
Did you know that
Corporate Presentation April 20183
Technology competence centers
Hig
h-e
nd s
olu
tio
ns for
hig
h-t
ech in
dustr
ies
4
MB (Netherlands) B.V.▪ Printing (Inkjet)
MB (Germany) AG (former R&R)
▪ Plasma coating
▪ Vacuum components
MB (Switzerland) AG▪ Machining and handling of
hard and brittle materials
MB others▪ Muegge (Vacuum
components)
▪ Hennecke Systems and
Pasan (inspection systems)
At a glance
Corporate Presentation April 2018 Source: annual report 20175
Diamond Wire slicing
Short HistorySlicing & Wafering Equipment
7
Slicing hard- & Brittle Materials
History
▪ 1953 Foundation by Mr. Meyer and Mr. Burger
▪ 1973 ID Blade saw TS23
▪ 1991 First multi wire saw
▪ 2003 Intro first diamond wire saw
▪ 2006 Stock Listing (MBTN)
▪ 2012 DW288 Diamond Wire Platform
▪ 2016 DWMS Wire Management System
▪ 2018 DW291 Platform Introduced
Technologies
▪ ID Saws (~1000 units installed)
▪ Multi wire saws (>3000 units installed)
▪ Bricking / Cropping (~ 100 units installed)
8
Slurry / Loose abbrasive
▪ A mixture of silicon carbide and
glycol is used as an abrasive that
erodes rather than cuts the ingot
▪ 3 body erosion
▪ Grits roll between wire and material
▪ Grits speed max ½ of the wire
▪ Slurry: Carrier (Glycol or Oil) +
Grid (SiC or Diamonds)
Diamond wire / Fixed abbrasive
▪ Diamonds are coated on the wire
to generate a true cutting action
▪ 2 body erosion
▪ Grits slide over silicon
▪ Grits speed equal to wire speed
▪ Theoretically doubling of removal
rate compared to slurry process
▪ Cutting fluid, coolant: Water +
Additive (<10%)
Moving wire
Silicon
Fracturezone
Moving wire
Silicon
Cuttingzone
Diamond based slicing
DS261 Series 6Defining Quality
• Multi wire saw for 300mm
• Qualified at TIER-1 Front-end companies
• Fast cutting times and highest precision wafers
9
Specification
Work piece Ø 300mm or 450mm version available
Load length 400 mm
Wire speed 15m/s
Wire acceleration 2.5 m/s²
Wire thickness 120-175 µm
Technology Slurry
DW 288S SemiconductorThe new area begins
• Qualified Diamond Wire process for 8” Semiconductor Wafers
• Semiconductor Version of the Reliable DW288S
• Includes the patented DWMS for optimized wire handling
1
0
Specification
Work piece Ø 8”/200mm
Load length 420mm
Wire speed 25m/s
Wire acceleration 8 m/s²
Rocking 12°
Technology Diamond Wire
MB Global footprint
• Total > 80 tools used for Semi application
• 80% of tools used outside of China
MB Core Competences
11
EXELENCE IN
WAFERING
DW
Knowledge
Innovative
ConceptsMaterial
KnowledgeSlicing
Fundamentals
Machine
Design
Software
Expertise
Inkjet printing
Focus applications for Inkjet printing
Engineering
Versatile
Pilot Production
Flexible
\
Mass Production
Efficient rQFNSemiconductor
Printed Circuit Boards
\
Printed Electronics
Soldermask
AdhesiveDamsPhotoresist
BarriersPVFlexible Hybrid PE
14
Inkjet well positioned for (Semiconductor) special applications
To
ol C
ost
€ M
IO
Feature size (µm)
>500 100 10 1
2
20+
0.2
Low Resolution
(>50 µm)
Medium Resolution
( 50 - 10 µm)
High Resolution
(< 10 µm)
Screen printing
Shadow Masking
Lithography
Ink Jet Printing
Positive features Negative features
Inkjet printing feature size
Cost reduction via reductionof process steps
Cost benefits of moving from subtractive to additive process:
• less process steps, less equipment, less chemical waste, less material consumption
• optimal use of precious materials
• better economies-of-scale in small production runs
50 µm
Inkjet printing opens broad process window
Application Process Material
Masking Etching or galvanic bath Wax based or polymer
Conductive lines Direct contact printing Metal nano-particles
Dielectric material Isolation layers Polymers
Encapsulation Protection Polymers
Doping Emitter forming Dopant source
Aggressive Inks Direct Etching Etchant
Source: Infineon Multilayer printed polyimide
topview
Typical feature size 20 – 50 µm
Example: printed interconnects(dieelectric insulator)
To protect the wafer from non-uniform processing steps that lead to particles generated at the edge.
Example: Wafer edge protection
With edge clearance
Partial edge
coverage
Full edge coverage
Angled view
Edge protection
Load
cassette
Inkjet print first
sideDrying Flip
Inkjet print
second side
DryingUnload
cassette
To protect the wafer from non-uniform processing steps that lead to particles generated at the edge.
Example: Wafer edge protection
With edge clearance
Partial edge
coverage
Full edge coverage
Angled view
Edge protection
Load
cassette
Inkjet print first
sideDrying Flip
Inkjet print
second side
DryingUnload
cassette
Meyer Burger product portfolio
Displays
PCB
Photovoltaics
Semiconductors
Printed Electronics
IP410
Engineering
&
Pilot line
JETx
Mass
production
LP50
R&D
Welcome to our booth at A4-225
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