ECE 477 Design Review Team 8(SLOW) Spring 2006

ECE 477 Design Review ECE 477 Design Review Team 8(SLOW) Team 8(SLOW) Spring 2006 Spring 2006

OutlineOutline• Project overview Project overview • Project-specific success criteriaProject-specific success criteria• Block diagramBlock diagram• Component selection rationaleComponent selection rationale• Packaging designPackaging design• Schematic and theory of operationSchematic and theory of operation• PCB layoutPCB layout• Software design/development statusSoftware design/development status• Project completion timelineProject completion timeline• Questions / discussionQuestions / discussion

Project OverviewProject Overview

• Designing an LED panel by cascading 10 5x7 LED Designing an LED panel by cascading 10 5x7 LED dot matrices.dot matrices.

• A built in embedded server on the microcontroller to A built in embedded server on the microcontroller to edit/display text messages on the LED panel via a edit/display text messages on the LED panel via a website.website.

• Scrolling feature to display long text messages.Scrolling feature to display long text messages.• Allows users to display the outdoor temperature Allows users to display the outdoor temperature

using a temperature sensor. using a temperature sensor. • Display current time using a highly accurate internal Display current time using a highly accurate internal

clock.clock.

Project-Specific Success CriteriaProject-Specific Success Criteria

• Ability to display ASCII character strings on Ability to display ASCII character strings on an LED matrix.an LED matrix.

• Ability to save messages and configuration Ability to save messages and configuration data in non-volatile memory.data in non-volatile memory.

• Ability to measure and display the outdoor Ability to measure and display the outdoor temperature.temperature.

• Ability to display the current time (based on Ability to display the current time (based on highly accurate internal clock).highly accurate internal clock).

• Ability to configure display and edit Ability to configure display and edit messages via an embedded server.messages via an embedded server.

SLOW Block DiagramSLOW Block Diagram

Component Selection RationaleComponent Selection RationaleMicrocontroller :Microcontroller :

Must have a timer module for the clock, a ATD port for the temperature sensor, built in Must have a timer module for the clock, a ATD port for the temperature sensor, built in ethernet controller, PWM module.ethernet controller, PWM module.

Choices :Choices :Freescale MC9S12NE64CPVFreescale MC9S12NE64CPV

- 80 pin package, 38 I/O pins and 10 input only80 pin package, 38 I/O pins and 10 input only- 64K of FLASH memory64K of FLASH memory- ATD portsATD ports- Timer ModuleTimer Module- A IEEE 802.3 compliant ethernet controllerA IEEE 802.3 compliant ethernet controller

Rabbit RCM 3750Rabbit RCM 3750- 33 I/O pins33 I/O pins- Built in Ethernet ControllerBuilt in Ethernet Controller- 512K of FLASH memory512K of FLASH memory

We decided with the MC9S12NE64CPV as it has a low cost, easily attainable and has a We decided with the MC9S12NE64CPV as it has a low cost, easily attainable and has a enough number of input output pins. Also, the MC9S12NE64CPV has good documentation enough number of input output pins. Also, the MC9S12NE64CPV has good documentation as compared to the Rabbit microcontroller.as compared to the Rabbit microcontroller.

Component Selection RationaleComponent Selection RationaleLED Driver LED Driver

Toshiba TB62708 with a 16 bit shift register and latching abilityToshiba TB62708 with a 16 bit shift register and latching ability

- Low costLow cost

- Programmable Output current from 5mA to 90mAProgrammable Output current from 5mA to 90mA

- Current sourcing deviceCurrent sourcing device

We required a 12 bit shift register for our design but we could only find current sinking We required a 12 bit shift register for our design but we could only find current sinking ones. ones.

ULN2003A Darlington Array ULN2003A Darlington Array

- 16 Bit package16 Bit package

- Sinks upto 500mA of current( our sink current came upto 105mA)Sinks upto 500mA of current( our sink current came upto 105mA)

- Recommended by our TA Brian as used by him for one of his LED projectsRecommended by our TA Brian as used by him for one of his LED projects

RJ45 JackRJ45 Jack

- Recommended by the microcontroller data sheetRecommended by the microcontroller data sheet

Packaging DesignPackaging Design

Considerations :Considerations :• LED’s panel is big enough and can be seen LED’s panel is big enough and can be seen

from a distance of up to 30 feet.from a distance of up to 30 feet.• Aluminum CaseAluminum Case• Weight estimation : around 3.4 lbs and Weight estimation : around 3.4 lbs and

mountable on a wall.mountable on a wall.• Dimension is 17” x 4” x 3”Dimension is 17” x 4” x 3”

Packaging Design – 3D viewPackaging Design – 3D view

Packaging Design – FrontPackaging Design – Front

Packaging Design - BottomPackaging Design - Bottom

Schematic/Theory of OperationSchematic/Theory of Operation

Schematic/Theory of OperationSchematic/Theory of Operation

Schematic/Theory of OperationSchematic/Theory of Operation

Schematic/Theory of OperationSchematic/Theory of Operation

Schematic/Theory of OperationSchematic/Theory of Operation

• Total Parts : 88Total Parts : 88

17 Capacitors17 Capacitors 2 Diodes 2 Diodes25 Resistors25 Resistors 3 Switches 3 Switches1 crystal1 crystal 10 LED drivers 10 LED drivers10 Darlington transistors 2 Inductors10 Darlington transistors 2 Inductors10 LED displays10 LED displays 1 Microcontroller 1 Microcontroller2 Power Regulators2 Power Regulators 1 RJ-45 1 RJ-451 BDM1 BDM 1 1 HeaderHeader1 Temperature Sensor1 Temperature Sensor 1 12V Power Adapter 1 12V Power Adapter

Schematic/Theory of OperationSchematic/Theory of Operation

PCB Layout – Whole LayoutPCB Layout – Whole Layout

PCB Layout – Top LayerPCB Layout – Top Layer

PCB Layout – Bottom LayerPCB Layout – Bottom Layer

PCB Layout - MicrocontrollerPCB Layout - Microcontroller

PCB Layout - MicrocontrollerPCB Layout - Microcontroller

PCB Layout – Power PCB Layout – Power

PCB Layout – Shift Register and PCB Layout – Shift Register and transistorstransistors

PCB Layout – RJ45PCB Layout – RJ45

Software Design/Development StatusSoftware Design/Development Status

– All programming and decoding will be done All programming and decoding will be done on on the Microcontrollerthe Microcontroller

– Even without the PCB, MC9S12NE64 Even without the PCB, MC9S12NE64 Development board can be used to write codeDevelopment board can be used to write code   and test our components.and test our components.

– LED matrices are driven by column therefore LED matrices are driven by column therefore making it possible to control text scrolling. making it possible to control text scrolling.

Project Completion TimelineProject Completion Timeline

• Week 8 (This week) – Finalize PCB / Design ReviewWeek 8 (This week) – Finalize PCB / Design Review• Week 9 – Start Software Development / Final PCB Week 9 – Start Software Development / Final PCB

ModificationModification• Week 10 – Testing hardware / Continue Software Week 10 – Testing hardware / Continue Software

DevelopmentDevelopment• Week 11 – Continue Software Development / Testing Week 11 – Continue Software Development / Testing

PCB FunctionalityPCB Functionality• Week 12 – Finalize Software / DebuggingWeek 12 – Finalize Software / Debugging• Week 13 – Packaging / Testing / DebuggingWeek 13 – Packaging / Testing / Debugging• Week 14 – Final Tweaking Week 14 – Final Tweaking • Week 15 – Documentation / Prepare for Final Week 15 – Documentation / Prepare for Final

PresentationPresentation• Week 16 – Final PresentationWeek 16 – Final Presentation

Questions / DiscussionQuestions / Discussion