DOE Review 4.1.7 DAQ

GLAST LAT Project DOE Review, February 18, 2005

4.1.7 DAQ & FSW V1 1

GLAST Large Area Telescope:GLAST Large Area Telescope:

G. HallerSLAC

haller@slac.stanford.edu(650) 926-4257

Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope

DOE Review DOE Review 4.1.7 DAQ 4.1.7 DAQ

GLAST LAT Project DOE Review, February 18, 2005

4.1.7 DAQ & FSW V1 2

ContentsContents

• Overview - Production & Testing - Schedule– TEM/TPS Flight Units – PDU Flight Units – GASU Flight Units– SIU/EPU Flight Units

• Testbed• Installation & Test Support• Budget

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LAT ElectronicsLAT Electronics

3 Event-Processor Units (EPU) (2 + 1 spare)

– Event processing CPU– LAT Communication Board– SIB

ACD

empty

EPU-3

EPU-2EPU-1

empty empty

Power Dist. Unit*

GASU*

empty

empty

SIU*SIU*

Spacecraft Interface Units (SIU)*

– Storage Interface Board (SIB): Spacecraft interface, control & telemetry

– LAT control CPU– LAT Communication

Board (LCB): LAT command and data interface

16 Tower Electronics Modules & Tower Power Supplies

* Primary & Secondary Units shown in one chassis

Power-Distribution Unit (PDU)*

– Spacecraft interface, power

– LAT power distribution

– LAT health monitoring

Global-Trigger/ACD-EM/Signal-Distribution Unit*

TKR

CAL

TKR Front-End Electronics (MCM)ACD Front-End Electronics (FREE)

CAL Front-End Electronics (AFEE)

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TEM/TPS Mounted to CAL TEM/TPS Mounted to CAL

LAT GRID with 16 CAL/TEM/TPS Modules

TEM

TPS

CAL

TKR not shown

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Tower Electronics Module (TEM) before coating/staking

• Tower Electronics Module: Main DAQ module, one on each tower

– Controls and reads out data from TKR MCM and CAL AFEE front-end electronics

– Assembles CAL and TKR event fragments to tower event

Tower Electronics Module/Tower Power SupplyTower Electronics Module/Tower Power Supply

• Tower Power Supply module, one on each tower– Input 28V– Generates low-noise voltages for

• TKR (2.65V analog, 2.65V Digital)• CAL (3.3V analog, 3.3V digital)• TEM (3.3V and 2.5V digital)• TKR Bias (20V-140V programmable)• CAL (20V to 90V programmable)

Tower Power Supply (TPS) before coating/staking

Shown upside-down

TEM

TPS

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TEM/TPS Status & ScheduleTEM/TPS Status & Schedule

• Status– Three Flight Tower-Electronics Modules/Tower Power Supplies

received• Fully assembled• Thermal-cycled• Vibration tested (one of them to qualification levels)• One unit finished thermal-vacuum testing• One unit in thermal-vacuum testing• Both units finished EMI/EMC testing• No issues/problems

– Balance of 19 TEM/TPS in surface-mount assembly at vendor• Schedule

– 2/17/05 First TEM/TPS to I&T– 2/25/05 Second TEM/TPS to I&T– 4/1/05 Third TEM/TPS to I&T– 4/22/05 Fourth TEM/TPS to I&T

• One week lag between delivery of consecutive assemblies– 7/26/05 Last TEM/TPS to I&T

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PDU & GASU Mounted on LAT PDU & GASU Mounted on LAT

GASU

PDU

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EM PDU enclosure with primary/redundant PDU circuit cards, no coating/staking

• Primary and Redundant Circuits in one Enclosure– Receives Primary and Redundant 28-V from spacecraft– Each, primary and redundant PDU can select between

primary and redundant spacecraft power– Filters 28V– Turns on/off 28V to 16 towers and 3 EPU’s under

program control– Protects PDU and down-stream circuits from over-

current and under-voltage • Over-current via poly-switches• Under-voltage via custom circuit in each power-

on branch – Receives command/clock from GASU– Digitizes voltages/temperatures from > 150 sources

• Includes temperatures from radiators, GRID; used for thermal control

– Reads back data to SIU via GASU– Provides PDU DAQ voltage and temperature analog

data to spacecraft for monitoring

Power Distribution Module (PDU)Power Distribution Module (PDU)

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PDU Status and SchedulePDU Status and Schedule

• Status– Design/documentation complete– Enclosures fabricated– All parts received (except recalled International Rectifier

regulator, due end of February)– Assembly contract awarded– All parts kitted and audited by assembly vendor– Assembly started

• Schedule for Flight Unit– 5/15/05 Precoat PDU assembly ready for electrical test– 5/30/05 Complete assembly ready for environmental test– 7/1/05 Flight PDU to I&T

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PDU enclosure with primary/redundant PDU circuit cards, no coating/staking

• Primary and Redundant Circuits in one Enclosure– Contains two types of circuit card assemblies

• GASU Power Supply CCA• GASU DAQ Board CCA

– GASU Power Supply• Receives 28-V supply voltages for

– Primary and redundant DAQ board, generates 3.3V and 2.5v

– ACD FREE cards» Filtering

for 28-V» 3.3V regulation

– GASU DAQ Board• Contains 9 FPGA’s• Includes Command Response Unit, Fan-out and

fan-in of commanding to 16 TEMs, PDU, EPU’s, ACD

• Includes Global Trigger Logic• Includes LAT Event-Builder Logic• Includes command/control/read-back for ACD

sub-system• Includes power-control for ACD FREE Boards

GASUGASU

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GASU Status and ScheduleGASU Status and Schedule

• Status– Design/documentation complete– Enclosures fabricated– All components/parts received – Assembly contract awarded– Parts being kitted– Flight assembly to start 3/10/05

• Schedule for Flight Unit– 5/20/05 Precoat GASU assembly ready for electrical test– 6/10/05 Complete assembly ready for environmental test– 7/13/05 Flight GASU to I&T

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SIU/EPUSIU/EPU

Enclosure Backplane

Power-SupplyCPU

SIB

LCB

• Spacecraft Interface Unit (SIU)• Event Processor Unit (EPU)• Difference is boot code loaded into RAD750 CPU

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SIU/EPU Status and ScheduleSIU/EPU Status and Schedule

• Status– Design/documentation complete– Enclosures fabricated– All components/parts received except BAE RAD750 CPU

• Uses recalled International Rectifier regulator• Boards to be sent back to BAE• Reworked boards expected 3 weeks after they receive

components; June 05– Assembly contract out for RFP

• Schedule– 6/1/05 Precoat cCPI boards ready for electrical test– 7/28/05 Complete assembly ready for environmental test– 8/19/05 First Flight SIU/EPU to I&T– 8/24/05 Second flight SIU/EPU to I&T– 8/27/05 Third flight SIU/EPU to I&T– 8/30/05 Fourth flight SIU/EPU to I&T– 9/2/05 Last flight SIU/EPU to I&T

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Testbed and I&T SupportTestbed and I&T Support

• Testbed– Upgrade of engineering modules to reflect flight designs– Scheduled over next 6 months– Labor to support upgrade– Labor to support testing of electronics and flight software

using data generated via front-end simulator boards– Labor to support test-stands for flight electronics

qualification and acceptance testing• I&T Support

– Design/fabrication/testing of virtual spacecraft simulator for I&T

– Support for integration and testing of DAQ modules on instrument

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Management & EGSEManagement & EGSE

• Management– Sub-system manager– Technical writer– Support for environmental test – Travel– Computer for test-stations (HW & SW) maintenance– Shipping charges for flight hardware

• EGSE (Electrical Ground Support Equipment)– Maintenance/repair of test-stations supplied to sub-

systems

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Costs & CommitsCosts & Commits

Explanation:

Dataflow Electronics = TEM/TPS Flight Units

ACD GASU FU & GLT FU = GASU

Power Conditioning = PDU

SIU & LAT Communication Card = SIU