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MULTIELEMENT (8E-32E) MCT/InAsSb DETECTORS
CUSTOMIZED SOLUTIONS
APPLICATIONS
• Contactless temperaturemeasurements of fast moving objects
(monitoring of railway transport, maintenance, monitoring of the combustion
process, monitoring of the cooling profile) • Spectrophotometry (gas detection)
• Military (laser beam positioning)
MULTIELEMENT (8E-32E) MCT/InAsSb DETECTORS
Our technology allows us to create multi-element detectors (8-32 elements) dedicated to the client’s application. 32-element array, so far implemented only as part of research and development, are now also easily accessible with dedicated preamplifiers.
FEATURES
• High S/N ratio allows to operation with low powerthermal sources or IR diodes
• High accuracy of temperature measurements (mK)• USB digital interface for easy integration,
no electronic engineer required• Easy to test and redesign to various
applications and shapes• Microprocessor on board enables
algorithms implementation such as filtering and output
shape correction• Support in selecting the
solution for the application
8E - 32E HOT DETECTOR ARRAY SPECIFICATION
PRODUCT DEVELOPMENT CYCLE
Parameter Value
Detector material HgCdTe or InAsSb
Detector type PV, PC
Operating wavelengthMWIR (λcut-off: 3.0 µm – 8.0 µm)LWIR (λcut-off: 8.0 µm – 14.0 µm)
λcut-on can be optimized upon request
Pixel size To be defined by applicationMinimum 25 µm sensor size
Pixel pattern
To be defined by applicationArray or bi-array
Minimum 20 µm between pixels Maximum 6 mm array length
Enclosure/Dimensions TO8 16-pinButterfly 40-pin
TEC type 2 TE, 3TE
Active elements temperature 210 – 270 K
Temperature sensor Thermistor or diode (Accuracy up to +/- 1 K)
Cooler power 1-4 W
Time constant 1 ns - 500 ns
Window Si/Al2O3/Ge with anti-reflection coating
Ambient temperature 0 to 70 °C
Storage temperature, °C -20 to 50 °C
Detector array ava i lab le with:
TEC controller Onboard analog controller
Lens mount C-mount 1” or SM1 THORLABS
Preamplifier Ultra-low noise, selectable bandwidth
DAQ SPI or USB HS
Stage Descr ipt ionNumber of months
Simpledevelopment
Standard development
Advanced development
I – Specification, project• 3D model• Spice simulation• Project: schematic + PCB
1 2 3
II – Prototype
• PCB printing and assembly• Circuit startup• Detector integration• Report, photos and tests• Shipment
2 2 4
III – Production
• Corrections• PCB printing and assembly• Startup and integration• Test report and shipment
2 2 2
We offer help in formulating requirements and matching solutions to the application.The project is most often divided into 3 stages:- Specification preparation and design,- Launching, testing and approving the prototype,- Performing a trial series.
phone: +48 22 733 54 10fax: +48 22 665 21 55e-mail: info@vigo.com.plPoznańska 129/13305-850 Ożarów MazowieckiPOLAND
North American partners:
www.boselec.com boselec@boselec.com+1.617.566.3821
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