APIC Company Proprietary Ver 3.5 Introduction to APIC September 2003

APIC Company Proprietary Ver 3.5

Introduction to APIC

September 2003

A P I C

APIC Company ProprietarySlide 2Ver 3.6 (Sept 2003)

Advanced Photonics Integrated Circuits CorporationAdvanced Photonics Integrated Circuits Corporation

•Founded in September 1999 Founded in September 1999 •Currently about 40 employees Currently about 40 employees •80% with advanced technical and 80% with advanced technical and

business degreesbusiness degrees•Two business locationsTwo business locations

• Honolulu (10,000 sq ft) - Headquarter & processing• Culver City (26,000 sq ft) - Design center & R&DCulver City (26,000 sq ft) - Design center & R&D

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APIC Culver City Building

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APIC Honolulu Building

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Technology and Product Areas

• HIP (Highly Integrated Phontonics) Chips

• “System-on-a-chip” - convergence of photonics and electronics on one chip

• Ultra-sensitive homeland defense sensors

• Multi-band translithic imager

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Value Proposition

• Reduce footprint

• Reduce customers’ parts count

• Reduce losses associated with pigtailing

• Reduce customers’ costs

Integrate active and passive photonic devices:

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BUSINESS AREASBUSINESS AREAS

• PIC components/optical modules for military and commercial markets

• Government Contracts

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Key Business Milestones

• Intel Capital Investment: May 2001

• ASML Development Agreement: July 2002

• Silicon Genesis Development Agreement: Sept 2002

• Intel Collaboration Agreement: October 2002

• Applied Material Etching Support Jan 2003

• 1st Military contract (Sub to Lockheed-Martin) March 2003

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Current Government Contracts

ID Award Date Customer

380575 3/13/2003 LMT

N00014-03-C-0342 4/11/2003 ONR

N00421-03-9-0002 7/11/2003 NAVAIR

Plus other smaller contracts for a total of $8.5M.

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SOI Fabricated Wafer

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EA-6B Jammer Application

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E-2C Radar Applications

APIC Company Proprietary Ver 3.5

1011000011101011110001

UAV Laser Communication

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Photoacoustic Effect

LaserIn

Pressure Wavesfrom laser absorption

Microphone PowerLaser S

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Photoacoustic System

LaserDetectionCell

PowerMeter

ComputerSignal Output

W0

Coated WindowLock-InAmplifier

Microphone

Gas SampleInlet

Gas Exit

r

Pump

ModulatedCurrent Driver

Modulated at natural resonant frequency of the cell =1

Sample is held for integration period 1 – 10 sec.

Anti-reflective coating

Each discrete wavelength is stepped through and any addition of spectrais done at each step before moving on. It takes 2-3 sec to scan laser rangedependent on actuator speed

l

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Chemical Agents--VX and GB

CO2 Range

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Carbon Nanotube Sensor

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TIVISIT : Multi-Band Imager

Back-side illuminated sensor(Thinned to 10-20 microns)

SLM (LC or MQW)SLM (LC or MQW)PitchPitch: : 10 um for vis/NIR10 um for vis/NIR

Output: coherent, Output: coherent, monochromatic,monochromatic,

grey-scale optical grey-scale optical imageimage

Smart Signal Processing Layer

• Pre-filtering (Difference of Gaussian for object of interest detection)

• Signal conditioning (gain ranging for SLM drive

• Sampling capacitors for SLM

IR Sensing Layer IR Sensing Layer Uncooled NIR: Uncooled NIR:

Ge, AlGaAs or Ge, AlGaAs or InGaAsInGaAs

Cooled LWIR:Cooled LWIR:AlGAAs QWIPs or AlGAAs QWIPs or InSbInSb

SOI CMOSSOI CMOSVisible/UV Sensing Visible/UV Sensing

LayerLayerHigh resolution, low-High resolution, low-

noisenoise visible IR

1

23

4

Input: wide Input: wide spectral band, spectral band, optical imageoptical image

laser

BOX

BOXGe

BOX

Metal1Metal2

Metal3

SLM input

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Our Product Categories

Optical-electrical conversion– Transmitters, detectors, transceivers

Amplification– EDWA, SOA

DWDM (mux/demux)– AWG, gratings, interlevers

Optical switching– MEMS, PZT fiber, thermo-optic & electro-optical

switches

Optical signal control and management– Dispersion, ICOM, VMUX

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Optical Networking Food Chain

Proposed positionfor APIC

Network Services

Photonic and ICComponents

Network Equipment

Modules / Subsystems

Network Software

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Technology: Materials

SOI Substrate

• Mature process; reliable substrate

• Capitalize on standard, high-volume semiconductor manufacturing processes

• Inherently low polarization sensitivity

• Potential for integration of active optoelectronic devices (including electronic control circuits)

Ge and InGaAsP

• High yields for simple devices

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PICPIC“foundation”“foundation”

2. Reconfigurable OADM; Integrated mux + VOA

4. Tunable WDMA Tx/Rx

1. Mux/demux (AWG)

3. Multi-channelreceivers

Common Platform for Products

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Fabricated SOI Chip

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SOI Chip OutputP (dB/nm)

-100

-90

-80

-70

-60

-50

-40

1.510 1.520 1.530 1.540 1.550 1.560 1.570 1.580 1.590

Wavelength (um)

P (

dB

/nm

)

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Fabricated Thermo-Optic Switch

• On/Off switch

• Mach Zender-based

• 1x2 and 2x2 in development

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Heater Bias

Optical output

Thermo-Optic Switch Response

30 µs cycle time(On -> Off -> On)

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Tunable Receiver/Channel Equalizer on one chip

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Integrated Ge detector with SOI waveguide

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Product:Multiple Channel Receiver

• SOI + Ge Photo Detector array + Circuit amplifiers +Clock Recovery• Patented Germanium integrated Array Photo Detectors• Prototype has been fabricated in the lab

DataTIAArray

CDR

AWG Demux

Input Aperture

PWR

Object Plane

Input Waveguide

Output Aperture

Image Plane

PWR

Array of Detectors

Geor

InGaAs

Clock Data Recovery (CDR); Trans-Impedance Amplifier(TIA)

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DropAdd

Elimination of 4 N interconnections (e.g. 160 for a 40-channel system)

Reconfigurable Optical ADM

ControlElectronics

AWG Mux

Output Waveguide

AWG Demux

Input Aperture

PWR

Object Plane

Input Waveguide

Output Aperture

Image Plane

PWR

Array of 2x2Switches

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Honolulu Cleanroom Facility

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Culver City Cleanroom

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Strategic Relationships

Waferfabricator

Semiconductorfabricator

Optical Commselectronics

manufacturer

EquipmentVendors

APIC

UniversityResearch

DefenseContractors

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Summary - Capitalize on Advantages• Skilled technical people

– Defense electronics

– University research

• Focus on materials handling and fabrication

• Benefits of SOI IC manufacturing technology

• Convergence of Photonics and Electronics on one chip

• “System-on-a chip” implementation

• Translithic and nano technolgy

• Ultra-sensitive chemical & biological sensors