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Automotive LPDDR SDRAMMT46H128M16LF – 32 Meg x 16 x 4 BanksMT46H64M32LF – 16 Meg x 32 x 4 BanksMT46H128M32L2 – 16 Meg x 32 x 4 Banks x 2MT46H256M32L4 – 32 Meg x 16 x 4 Banks x 4MT46H256M32R4 - 32 Meg x 16 x 4 Banks x 4
Features• VDD/VDDQ = 1.70–1.95V• Bidirectional data strobe per byte of data (DQS)• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle• Differential clock inputs (CK and CK#)• Commands entered on each positive CK edge• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs• 4 internal banks for concurrent operation• Data masks (DM) for masking write data; one mask
per byte• Programmable burst lengths (BL): 2, 4, 8, or 16• Concurrent auto precharge option is supported• Auto refresh and self refresh modes• 1.8V LVCMOS-compatible inputs• Temperature-compensated self refresh (TCSR)• Partial-array self refresh (PASR)• Deep power-down (DPD)• Status read register (SRR)• Selectable output drive strength (DS)• Clock stop capability• 64ms refresh; 32ms for the automotive temperature
range
Table 1: Key Timing Parameters (CL = 3)
Speed Grade Clock Rate Access Time
-5 200 MHz 5.0ns
-54 185 MHz 5.0ns
-6 166 MHz 5.0ns
-75 133 MHz 6.0ns
Options Mark• VDD/VDDQ
– 1.8V/1.8V H• Configuration
– 128 Meg x 16 (32 Meg x 16 x 4 banks) 128M16– 64 Meg x 32 (16 Meg x 32 x 4 banks) 64M32
• Addressing – JEDEC-standard LF– Reduced page-size1 LG– 4-die stack reduced page-size2 R4– 2-die stack standard L2– 4-die stack standard L4
• Plastic "green" package – 60-ball VFBGA (10mm x 10mm)3 B7– 90-ball VFBGA (9mm x 13mm)4 CX
• PoP (plastic "green" package) – 168-ball VFBGA (12mm x 12mm)4 JV– 168-ball WFBGA (12mm x 12mm)4 KQ– 168-ball WFBGA (12mm x 12mm)4 MA– 240-ball WFBGA (14mm x 14mm)4 MC
• Timing – cycle time – 5ns @ CL = 3 (200 MHz) -5– 5.4ns @ CL = 3 (185 MHz) -54– 6ns @ CL = 3 (166 MHz) -6– 7.5ns @ CL = 3 (133 MHz) -75
• Power – Standard IDD2/IDD6 None
• Product grade – Automotive (package-level burn-in) A
• Operating temperature range – From –40˚C to +85˚C IT– From –40˚C to +105˚C1 AT
• Design revision :B
Notes: 1. Contact factory for availability.2. Available in the 168-ball JV package only.3. Available only for x16 configuration.4. Available only for x32 configuration.
Preliminary‡
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 1
Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2012 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change byMicron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Table 2: Configuration Addressing – 2Gb
Architecture 128 Meg x 16 64 Meg x 32Reduced Page-Size
Option 128 Meg x 16Reduced Page-SizeOption 64 Meg x 32
Configuration 32 Meg x 16 x 4banks
16 Meg x 32 x 4banks
32 Meg x 16 x 4 banks 16 Meg x 32 x 4 banks
Refresh count 8K 8K 8K 8K
Row addressing 16K A[13:0] 16K A[13:0] 32K A[14:0] 32K A[14:0]
Column addressing 2K A11, A[9:0] 1K A[9:0] 1K A[9:0] 512 A[8:0]
See Package Block Diagrams (page 16) for descriptions of signal connections and die configurations for each re-spective architecture.
Figure 1: 2Gb Mobile LPDDR Part Numbering
MT 46 H 64M32 LF CX -6 AIT :B
Micron Technology
Product Family46 = Mobile LPDDR
Operating VoltageH = 1.8/1.8V
HC = 1.8/1.2V
Configuration128 Meg x 16
64 Meg x 32
128 Meg x 32
256 Meg x 32
AddressingLF = JEDEC-standard addressing
LG = reduced page-size
R4 = 4-die stack reduced page-size
L2 = 2-die stack standard addressing
L4 = 4-die stack standard addressing
Design Revision:B = Design generation
Operating TemperatureAIT = Industrial (–25°C to +85°C)
AAT = Automotive (–40°C to +105°C)
PowerBlank = Standard IDD2/IDD6
Cycle Time (CL = 3)-5 = 5ns tCK
-54 = 5.4ns tCK
-6 = 6ns tCK
-75 = 7.5ns tCK
Package CodesB7 = 60-ball (10mm x 10mm) VFBGA, “green”
CX = 90-ball (9mm x 13mm) VFBGA, “green”
JV = 168-ball (12mm x 12mm) VFBGA, “green”
KQ = 168-ball (12mm x 12mm) WFBGA, “green”
MA = 168-ball (12mm x 12mm) WFBGA, “green”
MC = 240-ball (14mm x 14mm) WFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from thepart number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 2
Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2012 Micron Technology, Inc. All rights reserved.
ContentsGeneral Description ......................................................................................................................................... 7Functional Block Diagrams ............................................................................................................................... 8Ball Assignments ............................................................................................................................................ 10Ball Descriptions ............................................................................................................................................ 14Package Block Diagrams ................................................................................................................................. 16Package Dimensions ....................................................................................................................................... 19Electrical Specifications .................................................................................................................................. 25Electrical Specifications – IDD Parameters ........................................................................................................ 28Electrical Specifications – AC Operating Conditions ......................................................................................... 34Output Drive Characteristics ........................................................................................................................... 39Functional Description ................................................................................................................................... 42Commands .................................................................................................................................................... 43
DESELECT ................................................................................................................................................. 44NO OPERATION ......................................................................................................................................... 44LOAD MODE REGISTER ............................................................................................................................. 44ACTIVE ...................................................................................................................................................... 44READ ......................................................................................................................................................... 45WRITE ....................................................................................................................................................... 46PRECHARGE .............................................................................................................................................. 47BURST TERMINATE ................................................................................................................................... 48AUTO REFRESH ......................................................................................................................................... 48SELF REFRESH ........................................................................................................................................... 49DEEP POWER-DOWN ................................................................................................................................. 49
Truth Tables ................................................................................................................................................... 50State Diagram ................................................................................................................................................ 55Initialization .................................................................................................................................................. 56Standard Mode Register .................................................................................................................................. 59
Burst Length .............................................................................................................................................. 60Burst Type .................................................................................................................................................. 60CAS Latency ............................................................................................................................................... 61Operating Mode ......................................................................................................................................... 62
Extended Mode Register ................................................................................................................................. 63Temperature-Compensated Self Refresh ...................................................................................................... 63Partial-Array Self Refresh ............................................................................................................................ 64Output Drive Strength ................................................................................................................................ 64
Status Read Register ....................................................................................................................................... 65Bank/Row Activation ...................................................................................................................................... 67READ Operation ............................................................................................................................................. 68WRITE Operation ........................................................................................................................................... 79PRECHARGE Operation .................................................................................................................................. 91Auto Precharge ............................................................................................................................................... 91
Concurrent Auto Precharge ......................................................................................................................... 92AUTO REFRESH Operation ............................................................................................................................. 97SELF REFRESH Operation ............................................................................................................................... 98Power-Down .................................................................................................................................................. 99
Deep Power-Down .................................................................................................................................... 101Clock Change Frequency ............................................................................................................................... 103Revision History ............................................................................................................................................ 104
Rev. B – 02/14 ............................................................................................................................................ 104Rev. A – 08/12 ............................................................................................................................................ 104
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 3
Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2012 Micron Technology, Inc. All rights reserved.
List of FiguresFigure 1: 2Gb Mobile LPDDR Part Numbering .................................................................................................. 2Figure 2: Functional Block Diagram (x16) ......................................................................................................... 8Figure 3: Functional Block Diagram (x32) ......................................................................................................... 9Figure 4: 60-Ball VFBGA – Top View, x16 only .................................................................................................. 10Figure 5: 90-Ball VFBGA – Top View, x32 only .................................................................................................. 11Figure 6: 168-Ball FBGA – 12mm x 12mm (Top View), x32 only ........................................................................ 12Figure 7: 240-Ball FBGA – 14mm x 14mm (Top View), x32 only ........................................................................ 13Figure 8: Single Rank, Single Channel (1 Die) Package Block Diagram .............................................................. 16Figure 9: Dual Rank, Single Channel (2 Die) Package Block Diagram ................................................................ 17Figure 10: Dual Rank, Single Channel (4 Die) Package Block Diagram .............................................................. 18Figure 11: 60-Ball FBGA (10mm x 10mm), Package Code: B7 ........................................................................... 19Figure 12: 90-Ball FBGA (9mm x 13mm), Package Code: CX ............................................................................. 20Figure 13: 168-Ball FBGA (12mm x 12mm), Package Code: JV .......................................................................... 21Figure 14: 168-Ball FBGA (12mm x 12mm), Package Code: KQ ......................................................................... 22Figure 15: 168-Ball FBGA (12mm x 12mm), Package Code: MA ........................................................................ 23Figure 16: 240-Ball FBGA (14mm x 14mm), Package Code: MC ........................................................................ 24Figure 17: Typical Self Refresh Current vs. Temperature .................................................................................. 33Figure 18: ACTIVE Command ........................................................................................................................ 45Figure 19: READ Command ........................................................................................................................... 46Figure 20: WRITE Command ......................................................................................................................... 47Figure 21: PRECHARGE Command ................................................................................................................ 48Figure 22: DEEP POWER-DOWN Command ................................................................................................... 49Figure 23: Simplified State Diagram ............................................................................................................... 55Figure 24: Initialize and Load Mode Registers ................................................................................................. 57Figure 25: Alternate Initialization with CKE LOW ............................................................................................ 58Figure 26: Standard Mode Register Definition ................................................................................................. 59Figure 27: CAS Latency .................................................................................................................................. 62Figure 28: Extended Mode Register ................................................................................................................ 63Figure 29: Status Read Register Timing ........................................................................................................... 65Figure 30: Status Register Definition .............................................................................................................. 66Figure 31: READ Burst ................................................................................................................................... 69Figure 32: Consecutive READ Bursts .............................................................................................................. 70Figure 33: Nonconsecutive READ Bursts ........................................................................................................ 71Figure 34: Random Read Accesses .................................................................................................................. 72Figure 35: Terminating a READ Burst ............................................................................................................. 73Figure 36: READ-to-WRITE ............................................................................................................................ 74Figure 37: READ-to-PRECHARGE .................................................................................................................. 75Figure 38: Data Output Timing – tDQSQ, tQH, and Data Valid Window (x16) .................................................... 76Figure 39: Data Output Timing – tDQSQ, tQH, and Data Valid Window (x32) .................................................... 77Figure 40: Data Output Timing – tAC and tDQSCK .......................................................................................... 78Figure 41: Data Input Timing ......................................................................................................................... 80Figure 42: Write – DM Operation .................................................................................................................... 81Figure 43: WRITE Burst ................................................................................................................................. 82Figure 44: Consecutive WRITE-to-WRITE ....................................................................................................... 83Figure 45: Nonconsecutive WRITE-to-WRITE ................................................................................................. 83Figure 46: Random WRITE Cycles .................................................................................................................. 84Figure 47: WRITE-to-READ – Uninterrupting ................................................................................................. 85Figure 48: WRITE-to-READ – Interrupting ...................................................................................................... 86Figure 49: WRITE-to-READ – Odd Number of Data, Interrupting ..................................................................... 87Figure 50: WRITE-to-PRECHARGE – Uninterrupting ....................................................................................... 88
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 4
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Figure 51: WRITE-to-PRECHARGE – Interrupting ........................................................................................... 89Figure 52: WRITE-to-PRECHARGE – Odd Number of Data, Interrupting .......................................................... 90Figure 53: Bank Read – With Auto Precharge ................................................................................................... 93Figure 54: Bank Read – Without Auto Precharge .............................................................................................. 94Figure 55: Bank Write – With Auto Precharge .................................................................................................. 95Figure 56: Bank Write – Without Auto Precharge ............................................................................................. 96Figure 57: Auto Refresh Mode ........................................................................................................................ 97Figure 58: Self Refresh Mode .......................................................................................................................... 99Figure 59: Power-Down Entry (in Active or Precharge Mode) .......................................................................... 100Figure 60: Power-Down Mode (Active or Precharge) ....................................................................................... 101Figure 61: Deep Power-Down Mode .............................................................................................................. 102Figure 62: Clock Stop Mode .......................................................................................................................... 103
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 5
Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2012 Micron Technology, Inc. All rights reserved.
List of TablesTable 1: Key Timing Parameters (CL = 3) ........................................................................................................... 1Table 2: Configuration Addressing – 2Gb .......................................................................................................... 2Table 3: Ball Descriptions .............................................................................................................................. 14Table 4: Absolute Maximum Ratings .............................................................................................................. 25Table 5: AC/DC Electrical Characteristics and Operating Conditions ............................................................... 25Table 6: Capacitance (x16, x32) ...................................................................................................................... 27Table 7: IDD Specifications and Conditions, –25°C to +85°C (x16) ..................................................................... 28Table 8: IDD Specifications and Conditions, –25°C to +85°C (x32) ..................................................................... 29Table 9: IDD Specifications and Conditions, –40°C to +105°C (x16) ................................................................... 30Table 10: IDD Specifications and Conditions, –40°C to +105°C (x32) .................................................................. 31Table 11: IDD6 Specifications and Conditions .................................................................................................. 32Table 12: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 34Table 13: Target Output Drive Characteristics (Full Strength) ........................................................................... 39Table 14: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 40Table 15: Target Output Drive Characteristics (One-Half Strength) .................................................................. 41Table 16: Truth Table – Commands ................................................................................................................ 43Table 17: DM Operation Truth Table .............................................................................................................. 44Table 18: Truth Table – Current State Bank n – Command to Bank n ................................................................ 50Table 19: Truth Table – Current State Bank n – Command to Bank m ............................................................... 52Table 20: Truth Table – CKE ........................................................................................................................... 54Table 21: Burst Definition Table ..................................................................................................................... 60
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFeatures
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 6
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General DescriptionThe 2Gb Mobile low-power DDR SDRAM is a high-speed CMOS, dynamic random-ac-cess memory containing 2,147,483,648 bits. It is internally configured as a quad-bankDRAM. Each of the x16’s 536,870,912-bit banks is organized as 16,384 rows by 2048 col-umns by 16 bits. Each of the x32’s 536,870,912-bit banks is organized as 16,384 rows by1024 columns by 32 bits. In the reduced page-size (LG) option, each of the x32's536,870,912-bit banks is organized as 32,768 rows by 512 columns by 32 bits. In the re-duced page-size (R4) option, each of the x16's 536,870,912-bit banks is organized as32,768 rows by 1024 columns x 16 bits.Note:
1. Throughout this data sheet, various figures and text refer to DQs as “DQ.” DQ shouldbe interpreted as any and all DQ collectively, unless specifically stated otherwise. Addi-tionally, the x16 is divided into 2 bytes: the lower byte and the upper byte. For the lowerbyte (DQ[7:0]), DM refers to LDM and DQS refers to LDQS. For the upper byte(DQ[15:8]), DM refers to UDM and DQS refers to UDQS. The x32 is divided into 4 bytes.For DQ[7:0], DM refers to DM0 and DQS refers to DQS0. For DQ[15:8], DM refers toDM1 and DQS refers to DQS1. For DQ[23:16], DM refers to DM2 and DQS refers toDQS2. For DQ[31:24], DM refers to DM3 and DQS refers to DQS3.
2. Complete functionality is described throughout the document; any page or diagrammay have been simplified to convey a topic and may not be inclusive of all require-ments.
3. Any specific requirement takes precedence over a general statement.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMGeneral Description
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 7
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Functional Block Diagrams
Figure 2: Functional Block Diagram (x16)
Row-address
Mux
Controllogic
Column-addresscounter/
latch
Standard mode register
Extended moderegister
Co
mm
and
d
eco
de
AddressBA0, BA1
CKE
CK#
CK
CS#
WE#
CAS#
RAS#
Addressregister
I/O gatingDM mask logic
Columndecoder
Bank 0memory
array
Bank 0row-
addresslatchand
decoder
Bankcontrollogic
Bank 1Bank 2
Bank 3
Refreshcounter
16
16
16
2
Inputregisters
2
2
2
2
RCVRS
2
32
32
2
2
432
CKout
Data
DQS
Mask
Data
CK
CKin
DRVRSMUX
DQSgenerator
16
16
16
161632
DQ[15:0]
LDQS,UDQS
2
Readlatch
WriteFIFOand
drivers
1
COL 0
COL 0
Sense amplifiers
LDM,UDM
CK
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFunctional Block Diagrams
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 8
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Figure 3: Functional Block Diagram (x32)
RAS#
CAS#
Row-address
MUX
CK
CS#
WE#
CK#
Controllogic
Column-addresscounter/
latch
Standard mode register
Extended mode
register
Co
mm
and
d
eco
de
Address,BA0, BA1
CKE
Addressregister
I/O gatingDM mask logic
Bank 0memory
array
Bank 0row-
addresslatchand
decoder
Bankcontrol
logic
Bank 1Bank 2
Bank 3
Refreshcounter
32
2
2
32
32
2
Inputregisters
4
4
4
4
RCVRS
4
64
64
864
CKout
Data
DQS
Mask
Data
CK
CKin
DRVRSMUX
DQSgenerator
32
32
32
323264
DQ[31:0]
DQS0DQS1DQS2DQS3
4
Readlatch
WriteFIFOand
drivers
1
COL 0
COL 0
Sense amplifiers
DM0DM1DM2DM3
CK
Columndecoder
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMFunctional Block Diagrams
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 9
Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2012 Micron Technology, Inc. All rights reserved.
Ball Assignments
Figure 4: 60-Ball VFBGA – Top View, x16 only
1 2 3 4 6 7 8 95
A
B
C
D
E
F
G
H
J
K
VSSQ
DQ14
DQ12
DQ10
DQ8
NC
CK#
A12
A8
A5
VSS
VDDQ
VSSQ
VDDQ
VSSQ
VSS
CKE
A9
A6
VSS
DQ15
DQ13
DQ11
DQ9
UDQS
UDM
CK
A11
A7
A4
VDDQ
DQ1
DQ3
DQ5
DQ7
A13
WE#
CS#
A10/AP
A2
DQ0
DQ2
DQ4
DQ6
LDQS
LDM
CAS#
BA0
A0
A3
VDD
VSSQ
VDDQ
VDDQ
VDD
RAS#
BA1
A1
VDD
TEST1
Notes: 1. D9 is a test pin that must be tied to VSS or VSSQ in normal operations.2. Unused address pins become RFU.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Assignments
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Figure 5: 90-Ball VFBGA – Top View, x32 only
VSSQ
DQ30
DQ28
DQ26
DQ24
NC
CK#
A12
A8
A5
DQ8
DQ10
DQ12
DQ14
VSSQ
VSS
VDDQ
VSSQ
VDDQ
VSSQ
VDD
CKE
A9
A6
A4
VSSQ
VDDQ
VSSQ
VDDQ
VSS
DQ31
DQ29
DQ27
DQ25
DQS3
DM3
CK
A11
A7
DM1
DQS1
DQ9
DQ11
DQ13
DQ15
VDDQ
DQ17
DQ19
DQ21
DQ23
A13
WE#
CS#
A10/AP
A2
DQ7
DQ5
DQ3
DQ1
VDDQ
DQ16
DQ18
DQ20
DQ22
DQS2
DM2
CAS#
BA0
A0
DM0
DQS0
DQ6
DQ4
DQ2
DQ0
VDD
VSSQ
VDDQ
VDDQ
VSS
RAS#
BA1
A1
A3
VDDQ
VSSQ
VDDQ
VSSQ
VDD
1 2 3 4 6 7 8 95
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
TEST1
Notes: 1. D9 is a test pin that must be tied to VSS or VSSQ in normal operations.2. Unused address pins become RFU.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Assignments
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 11
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Figure 6: 168-Ball FBGA – 12mm x 12mm (Top View), x32 only
Note: 1. Although not bonded to the die, these pins may be connected on the package sub-strate.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Assignments
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Figure 7: 240-Ball FBGA – 14mm x 14mm (Top View), x32 only
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
Top View – Ball Down
1
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
1
4
DQ31
DQ30
DNU
DNU
4
2
VSS
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
VSS
2
3
VDD
VSSQ
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
VDD
3
5
VDDQ
DQ29
DQ28
DNU
DNU
DNU
5
6
VSSQ
DQ27
DNU
DNU
6
7
DQ26
VDDQ
DQ25
DNU
DNU
DNU
7
8
DQ24
VSSQ
DNU
DNU
8
9
DQS3
DNU
VDDQ
DNU
DNU
DNU
9
11
DQ23
DQ22
VDDQ
VDD
VSS
DNU
11
13
VSSQ
DQ19
DQ18
A4
A7
A8
13
14
VDDQ
DQ17
VDD
VSS
14
15
DQ16
DNU
DQS2
A6
VSS
DNU
15
16
VSSQ
VDDQ
VDD
VSS
16
27
DNU
VSS
VDD
DNU
DQ7
VDDQ
VSSQ
DQ2
DQ0
VDD
VSS
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
A3
A1
DNU
DNU
27
10
DM3
VSSQ
DNU
DNU
10
12
DQ21
DQ20
A5
A9
12
18
DNU
VDD
CKE0
CKE1
18
19
VDDQ
DNU
DM1
A11
CS#0
CS#1
19
20
VSSQ
DQS1
A12
WE#
20
21
DQ15
DQ14
VDDQ
VSS
VSS
VDD
21
17
DNU
VSS
DM2
VDD
CK
CK#
17
22
DQ13
DQ12
CAS#
RAS#
22
23
VSSQ
DQ11
DQ10
TQ
VDD
DNU
23
24
VDDQ
DQ9
BA0
BA1
24
25
DNU
DQ8
VSSQ
DQ5
VDDQ
DNU
DNU
DNU
DNU
DNU
DNU
A15
A0
A10
25
26
VSSQ
DNU
DM0
VDDQ
DQS0
DQ6
DQ4
DQ3
DQ1
VSSQ
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
A14
A13
A2
VDD
VSS
26
GroundSupplyLPDDR
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Assignments
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Ball DescriptionsThe ball descriptions table is a comprehensive list of all possible balls for all supportedpackages. Not all balls listed are supported for a given package.
Table 3: Ball Descriptions
Symbol Type Description
CK, CK# Input Clock: CK is the system clock input. CK and CK# are differential clock inputs. All ad-dress and control input signals are sampled on the crossing of the positive edge of CKand the negative edge of CK#. Input and output data is referenced to the crossing ofCK and CK# (both directions of the crossing).
CKECKE0, CKE1
Input Clock enable: CKE HIGH activates, and CKE LOW deactivates, the internal clock signals,input buffers, and output drivers. Taking CKE LOW enables PRECHARGE power-downand SELF REFRESH operations (all banks idle), or ACTIVE power-down (row active inany bank). CKE is synchronous for all functions except SELF REFRESH exit. All inputbuffers (except CKE) are disabled during power-down and self refresh modes.CKE0 is used for a single LPDDR product.CKE1 is used for dual LPDDR products and is considered RFU for single LPDDR MCPs.
CS#CS0#, CS1#
Input Chip select: CS# enables (registered LOW) and disables (registered HIGH) the commanddecoder. All commands are masked when CS# is registered HIGH. CS# provides for ex-ternal bank selection on systems with multiple banks. CS# is considered part of thecommand code.CS0# is used for a single LPDDR product.CS1# is used for dual LPDDR products and is considered RFU for single LPDDR MCPs.
RAS#, CAS#, WE# Input Command inputs: RAS#, CAS#, and WE# (along with CS#) define the command beingentered.
UDM, LDM (x16)DM[3:0] (x32)
Input Input data mask: DM is an input mask signal for write data. Input data is maskedwhen DM is sampled HIGH along with that input data during a WRITE access. DM issampled on both edges of DQS. Although DM balls are input-only, the DM loading isdesigned to match that of DQ and DQS balls.
BA0, BA1 Input Bank address inputs: BA0 and BA1 define to which bank an ACTIVE, READ, WRITE, orPRECHARGE command is being applied. BA0 and BA1 also determine which mode reg-ister is loaded during a LOAD MODE REGISTER command.
A[13:0] Input Address inputs: Provide the row address for ACTIVE commands, and the column ad-dress and auto precharge bit (A10) for READ or WRITE commands, to select one loca-tion out of the memory array in the respective bank. During a PRECHARGE command,A10 determines whether the PRECHARGE applies to one bank (A10 LOW, bank selec-ted by BA0, BA1) or all banks (A10 HIGH). The address inputs also provide the op-codeduring a LOAD MODE REGISTER command. The maximum address range is dependentupon configuration. Unused address balls become RFU.
TEST Input Test pin: Must be tied to VSS or VSSQ in normal operations.
DQ[15:0] (x16)DQ[31:0] (x32)
Input/output
Data input/output: Data bus for x16 and x32.
LDQS, UDQS (x16)DQS[3:0] (x32)
Input/output
Data strobe: Output with read data, input with write data. DQS is edge-aligned withread data, center-aligned in write data. It is used to capture data.
TQ Output Temperature sensor output: TQ HIGH when LPDDR TJ exceeds 85°C.
VDDQ Supply DQ power supply.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Descriptions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 14
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Table 3: Ball Descriptions (Continued)
Symbol Type Description
VSSQ Supply DQ ground.
VDD Supply Power supply.
VSS Supply Ground.
NC – No connect: May be left unconnected.
RFU – Reserved for future use. Balls marked RFU may or may not be connected internally.These balls should not be used. Contact factory for details.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMBall Descriptions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 15
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Package Block Diagrams
Figure 8: Single Rank, Single Channel (1 Die) Package Block Diagram
LPDDR
Die 0
VDD VDDQ VSS VSSQ
CS0#
CKE0
CK
CK#
WE#
CAS#
RAS#
AddressBA0, BA1
DM[3:0]
DQ[31:0]
DQS[3:0]
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Block Diagrams
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Figure 9: Dual Rank, Single Channel (2 Die) Package Block Diagram
CKE1
CS1#
LPDDR
Die 1
LPDDR
Die 0
VDD VDDQ VSS VSSQ
CS0#
CKE0
CK
CK#
WE#
CAS#
RAS#
AddressBA0, BA1
DM[3:0]
DQ[31:0], DQS[3:0]
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Block Diagrams
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Figure 10: Dual Rank, Single Channel (4 Die) Package Block Diagram
CKE1
CS1#
LPDDR
Die 2
LPDDR
Die 0
LPDDR
Die 1
VDD VDDQ VSS VSSQ
CS0#
CKE0
CK
CK#
WE#
CAS#
RAS#
AddressBA0, BA1
DM[1:0] DM[3:2]
DQ[15:0], DQS[1:0]
DQ[31:16], DQS[3:2]
LPDDR
Die 3
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Block Diagrams
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 18
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Package Dimensions
Figure 11: 60-Ball FBGA (10mm x 10mm), Package Code: B7
Ball A1 ID
0.25 MIN
0.9 ±0.1
6.4 CTR
10 ±0.1
0.8 TYP
10 ±0.1
0.8 TYP
7.2 CTR
60X Ø0.45Dimensions applyto solder balls post-reflow on Ø0.40 SMDball pads.
Ball A1 ID
123789
A 0.12 A
ABCDEFGHJK
Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
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Figure 12: 90-Ball FBGA (9mm x 13mm), Package Code: CX
Ball A1 ID
Seatingplane
0.12 AA
0.9 ±0.1
0.25 MIN
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
9 ±0.1
Ball A1 ID
11.2CTR
Dimensions applyto solder balls post-reflow on Ø0.40 SMDball pads.
90X Ø0.45
13 ±0.1
0.8 TYP
6.4 CTR
0.8 TYP
Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 20
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Figure 13: 168-Ball FBGA (12mm x 12mm), Package Code: JV
Seating plane
Ball A1 ID
0.21 MIN
0.9 ±0.1
11 CTR
12 ±0.1
0.5 TYP
11 CTR
12 ±0.1
0.5 TYP
ABCDEFGHJKLMNPRTUVWYAAABAC
23 21 19 17 15 13 11 9 7 5 3 122 20 18 16 14 12 10 8 6 4 2
Ball A1 ID
168X Ø0.34Dimensionsapply to solderballs post-reflowon Ø0.28 SMDball pads.
0.08 AA
Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 21
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Figure 14: 168-Ball FBGA (12mm x 12mm), Package Code: KQ
0.08 A A
11 CTR
Ball A1 IDBall A1 ID
0.5 TYP
12 ±0.1
11 CTR
Seatingplane
12 ±0.1
0.5 TYP
168X Ø0.34Dimensionsapply to solderballs post-reflowon Ø0.28 SMDball pads.
0.65 ±0.1
0.21 MIN
23 21 19 17 15 13 11 9 7 5 3 122 20 18 16 14 12 10 8 6 4 2
ABCDEFGHJKLMNPRTUVWYAAABAC
Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 22
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Figure 15: 168-Ball FBGA (12mm x 12mm), Package Code: MA
0.08 A A
11 CTR
Ball A1 IDBall A1 ID
0.5 TYP
12 ±0.1
11 CTR
Seatingplane
0.5 TYP
12 ±0.1
168X Ø0.34Dimensionsapply to solderballs post-reflowon Ø0.28 SMD ball pads.
0.6 ±0.1
0.21 MIN
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
ABCDEFGHJKLMNPRTUVWYAAABAC
Notes: 1. All dimensions are in millimeters.2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 23
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Figure 16: 240-Ball FBGA (14mm x 14mm), Package Code: MC
Pin A1 index
Seatingplane
0.08 A
A
0.7 ±0.1
Pin A1 index(covered by SR)
0.5 TYP
0.5 TYP
13.0 CTR
Dimensions applyto solder ballspost-reflow onØ0.27 SMD OSPball pads.
240X Ø0.34
14 ±0.1
0.215 MIN
13.0CTR
14 ±0.1
27 25 23 21 19 17 15 13 11 9 7 5 3 1 26 24 22 20 18 16 14 12 10 8 6 4 2
ABCDEFGHJKLMNPRTUVWYAAABACADAEAFAG
Notes: 1. All dimensions are in millimeters.2. Solder ball material: LF35 with OSP plating (98.25% Sn, 1.2% Ag, 0.5% Cu, 0.05% Ni).
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMPackage Dimensions
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 24
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Electrical SpecificationsStresses greater than those listed may cause permanent damage to the device. This is astress rating only, and functional operation of the device at these or any other condi-tions above those indicated in the operational sections of this specification is not im-plied. Exposure to absolute maximum rating conditions for extended periods may affectreliability.
Table 4: Absolute Maximum Ratings
Note 1 applies to all parameters in this tableParameter Symbol Min Max Unit
VDD/VDDQ supply voltage relative to VSS VDD/VDDQ –1.0 2.4 V
Voltage on any pin relative to VSS VIN –0.5 2.4 or (VDDQ + 0.3V),whichever is less
V
Storage temperature (plastic) TSTG –55 150 ˚C
Note: 1. VDD and VDDQ must be within 300mV of each other at all times. VDDQ must not exceedVDD.
Table 5: AC/DC Electrical Characteristics and Operating Conditions
Notes 1–5 apply to all parameters/conditions in this table; VDD/VDDQ = 1.70–1.95VParameter/Condition Symbol Min Max Unit Notes
Supply voltage VDD 1.70 1.95 V 6, 7
I/O supply voltage VDDQ 1.70 1.95 V 6, 7
Address and command inputs
Input voltage high VIH 0.8 × VDDQ VDDQ + 0.3 V 8, 9
Input voltage low VIL –0.3 0.2 × VDDQ V 8, 9
Clock inputs (CK, CK#)
DC input voltage VIN –0.3 VDDQ + 0.3 V 10
DC input differential voltage VID(DC) 0.4 × VDDQ VDDQ + 0.6 V 10, 11
AC input differential voltage VID(AC) 0.6 × VDDQ VDDQ + 0.6 V 10, 11
AC differential crossing voltage VIX 0.4 × VDDQ 0.6 × VDDQ V 10, 12
Data inputs
DC input high voltage VIH(DC) 0.7 × VDDQ VDDQ + 0.3 V 8, 9, 13
DC input low voltage VIL(DC) –0.3 0.3 × VDDQ V 8, 9, 13
AC input high voltage VIH(AC) 0.8 × VDDQ VDDQ + 0.3 V 8, 9, 13
AC input low voltage VIL(AC) –0.3 0.2 × VDDQ V 8, 9, 13
Data outputs
DC output high voltage: Logic 1 (IOH = –0.1mA) VOH 0.9 × VDDQ – V
DC output low voltage: Logic 0 (IOL = 0.1mA) VOL – 0.1 × VDDQ V
Leakage current
Input leakage currentAny input 0V ≤ VIN ≤ VDD(All other pins not under test = 0V)
II –1 1 μA
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 25
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Table 5: AC/DC Electrical Characteristics and Operating Conditions (Continued)
Notes 1–5 apply to all parameters/conditions in this table; VDD/VDDQ = 1.70–1.95VParameter/Condition Symbol Min Max Unit Notes
Output leakage current(DQ are disabled; 0V ≤ VOUT ≤ VDDQ)
IOZ –1.5 1.5 μA
Operating temperature
Commercial TA 0 70 ˚C
Wireless TA –25 85 ˚C
Industrial TA –40 85 ˚C
Automotive TA –40 105 ˚C
Notes: 1. All voltages referenced to VSS.2. All parameters assume proper device initialization.3. Tests for AC timing, IDD, and electrical AC and DC characteristics may be conducted at
nominal supply voltage levels, but the related specifications and device operation areguaranteed for the full voltage range specified.
4. Outputs measured with equivalent load; transmission line delay is assumed to be verysmall:
I/O20pF
I/O10pF
Full drive strength Half drive strength
50 50
5. Timing and IDD tests may use a VIL-to-VIH swing of up to 1.5V in the test environment,but input timing is still referenced to VDDQ/2 (or to the crossing point for CK/CK#). Theoutput timing reference voltage level is VDDQ/2.
6. Any positive glitch must be less than one-third of the clock cycle and not more than+200mV or 2.0V, whichever is less. Any negative glitch must be less than one-third of theclock cycle and not exceed either –150mV or +1.6V, whichever is more positive.
7. VDD and VDDQ must track each other and VDDQ must be less than or equal to VDD.8. To maintain a valid level, the transitioning edge of the input must:
8a. Sustain a constant slew rate from the current AC level through to the target AC lev-el, VIL(AC) Or VIH(AC).8b. Reach at least the target AC level.8c. After the AC target level is reached, continue to maintain at least the target DC lev-el, VIL(DC) or VIH(DC).
9. VIH overshoot: VIHmax = VDDQ + 1.0V for a pulse width ≤3ns and the pulse width cannotbe greater than one-third of the cycle rate. VIL undershoot: VILmin = –1.0V for a pulsewidth ≤3ns and the pulse width cannot be greater than one-third of the cycle rate.
10. CK and CK# input slew rate must be ≥1 V/ns (2 V/ns if measured differentially).11. VID is the magnitude of the difference between the input level on CK and the input lev-
el on CK#.12. The value of VIX is expected to equal VDDQ/2 of the transmitting device and must track
variations in the DC level of the same.13. DQ and DM input slew rates must not deviate from DQS by more than 10%. 50ps must
be added to tDS and tDH for each 100 mV/ns reduction in slew rate. If slew rate exceeds4 V/ns, functionality is uncertain.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications
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Table 6: Capacitance (x16, x32)
Notes 1 and 2 apply to all the parameters in this tableParameter Symbol Min Max Unit Notes
Input capacitance: CK, CK# CCK 1.0 2.0 pF
Delta input capacitance: CK, CK# CDCK 0 0.25 pF 3
Input capacitance: command and address CI 1.0 2.0 pF
Delta input capacitance: command and address CDI – 0.5 0.5 pF 3
Input/output capacitance: DQ, DQS, DM CIO 1.25 2.5 pF
Delta input/output capacitance: DQ, DQS, DM CDIO – 0.6 0.6 pF 4
Notes: 1. This parameter is sampled. VDD/VDDQ = 1.70–1.95V, f = 100 MHz, TA = 25˚C, VOUT(DC) =VDDQ/2, VOUT (peak-to-peak) = 0.2V. DM input is grouped with I/O pins, reflecting thefact that they are matched in loading.
2. This parameter applies to die devices only (does not include package capacitance).3. The input capacitance per pin group will not differ by more than this maximum amount
for any given device.4. The I/O capacitance per DQS and DQ byte/group will not differ by more than this maxi-
mum amount for any given device.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 27
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Electrical Specifications – IDD Parameters
Table 7: IDD Specifications and Conditions, –25°C to +85°C (x16)
Notes 1–5 apply to all the parameters/conditions in this table; VDD/VDDQ = 1.70–1.95V
Parameter/Condition Symbol
Max
Unit Notes-5 -54 -6 -75
Operating 1 bank active precharge current: tRC = tRC (MIN); tCK= tCK (MIN); CKE is HIGH; CS is HIGH between valid commands;Address inputs are switching every 2 clock cycles; Data bus in-puts are stable
IDD0 75 75 75 70 mA 6
Precharge power-down standby current: All banks idle; CKE isLOW; CS is HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2P 900 900 900 900 μA 7, 8
Precharge power-down standby current: Clock stopped; Allbanks idle; CKE is LOW; CS is HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2PS 900 900 900 900 μA 7
Precharge nonpower-down standby current: All banks idle;CKE = HIGH; CS = HIGH; tCK = tCK (MIN); Address and controlinputs are switching; Data bus inputs are stable
IDD2N 15 15 15 12 mA 9
Precharge nonpower-down standby current: Clock stopped; Allbanks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2NS 9 9 8 8 mA 9
Active power-down standby current: 1 bank active; CKE = LOW;CS = HIGH; tCK = tCK (MIN); Address and control inputs areswitching; Data bus inputs are stable
IDD3P 5 5 5 5 mA 8
Active power-down standby current: Clock stopped; 1 bank ac-tive; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Addressand control inputs are switching; Data bus inputs are stable
IDD3PS 5 5 5 5 mA
Active nonpower-down standby: 1 bank active; CKE = HIGH; CS= HIGH; tCK = tCK (MIN); Address and control inputs are switch-ing; Data bus inputs are stable
IDD3N 17 17 16 15 mA 6
Active nonpower-down standby: Clock stopped; 1 bank active;CKE = HIGH; CS = HIGH; CK = LOW; CK# = HIGH; Address andcontrol inputs are switching; Data bus inputs are stable
IDD3NS 14 14 13 12 mA 6
Operating burst read: 1 bank active; BL = 4; tCK = tCK (MIN);Continuous READ bursts; Iout = 0mA; Address inputs areswitching every 2 clock cycles; 50% data changing each burst
IDD4R 90 90 90 90 mA 6
Operating burst write: 1 bank active; BL = 4; tCK = tCK (MIN);Continuous WRITE bursts; Address inputs are switching; 50%data changing each burst
IDD4W 90 90 90 90 mA 6
Auto refresh: Burst refresh; CKE = HIGH; Ad-dress and control inputs are switching; Databus inputs are stable
tRFC = 138ns IDD5 170 170 170 170 mA 10tRFC = tREFI IDD5A 12 12 12 12 mA 10, 11
Deep power-down current: Address and control balls are sta-ble; Data bus inputs are stable
IDD8 10 10 10 10 μA 7, 13
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – IDD Parameters
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 28
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Table 8: IDD Specifications and Conditions, –25°C to +85°C (x32)
Notes 1–5 apply to all the parameters/conditions in this table; VDD/VDDQ = 1.70–1.95V
Parameter/Condition Symbol
Max
Unit Notes-5 -54 -6 -75
Operating 1 bank active precharge current: tRC = tRC (MIN); tCK= tCK (MIN); CKE is HIGH; CS is HIGH between valid commands;Address inputs are switching every 2 clock cycles; Data bus in-puts are stable
IDD0 75 75 75 70 mA 6
Precharge power-down standby current: All banks idle; CKE isLOW; CS is HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2P 900 900 900 900 μA 7, 8
Precharge power-down standby current: Clock stopped; Allbanks idle; CKE is LOW; CS is HIGH, CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2PS 900 900 900 900 μA 7
Precharge nonpower-down standby current: All banks idle; CKE= HIGH; CS = HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2N 15 15 15 12 mA 9
Precharge nonpower-down standby current: Clock stopped; Allbanks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2NS 9 9 8 8 mA 9
Active power-down standby current: 1 bank active; CKE = LOW;CS = HIGH; tCK = tCK (MIN); Address and control inputs areswitching; Data bus inputs are stable
IDD3P 5 5 5 5 mA 8
Active power-down standby current: Clock stopped; 1 bank ac-tive; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Addressand control inputs are switching; Data bus inputs are stable
IDD3PS 5 5 5 5 mA
Active nonpower-down standby: 1 bank active; CKE = HIGH; CS= HIGH; tCK = tCK (MIN); Address and control inputs are switch-ing; Data bus inputs are stable
IDD3N 17 17 16 15 mA 6
Active nonpower-down standby: Clock stopped; 1 bank active;CKE = HIGH; CS = HIGH; CK = LOW; CK# = HIGH; Address andcontrol inputs are switching; Data bus inputs are stable
IDD3NS 14 14 13 12 mA 6
Operating burst read: 1 bank active; BL = 4; CL = 3; tCK = tCK(MIN); Continuous READ bursts; Iout = 0mA; Address inputs areswitching every 2 clock cycles; 50% data changing each burst
IDD4R 90 90 90 90 mA 6
Operating burst write: One bank active; BL = 4; tCK = tCK(MIN); Continuous WRITE bursts; Address inputs are switching;50% data changing each burst
IDD4W 90 90 90 90 mA 6
Auto refresh: Burst refresh; CKE = HIGH; Ad-dress and control inputs are switching; Databus inputs are stable
tRFC = 138ns IDD5 170 170 170 170 mA 10tRFC = tREFI IDD5A 12 12 12 12 mA 10, 11
Deep power-down current: Address and control pins are stable;Data bus inputs are stable
IDD8 10 10 10 10 μA 7, 13
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – IDD Parameters
PDF: 09005aef84e25f2et79m_ait_aat_mobile_lpddr.pdf - Rev. B 02/14 EN 29
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Table 9: IDD Specifications and Conditions, –40°C to +105°C (x16)
Notes 1–5 apply to all the parameters/conditions in this table; VDD/VDDQ = 1.70–1.95V
Parameter/Condition Symbol
Max
Unit Notes-5 -54 -6 -75
Operating 1 bank active precharge current: tRC = tRC (MIN); tCK= tCK (MIN); CKE is HIGH; CS is HIGH between valid commands;Address inputs are switching every 2 clock cycles; Data bus in-puts are stable
IDD0 100 100 80 70 mA 6
Precharge power-down standby current: All banks idle; CKE isLOW; CS is HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2P 1500 1500 1500 1500 μA 7, 8
Precharge power-down standby current: Clock stopped; Allbanks idle; CKE is LOW; CS is HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2PS 1500 1500 1500 1500 μA 7
Precharge nonpower-down standby current: All banks idle;CKE = HIGH; CS = HIGH; tCK = tCK (MIN); Address and controlinputs are switching; Data bus inputs are stable
IDD2N 19 19 19 16 mA 9
Precharge nonpower-down standby current: Clock stopped; Allbanks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2NS 13 13 12 12 mA 9
Active power-down standby current: 1 bank active; CKE = LOW;CS = HIGH; tCK = tCK (MIN); Address and control inputs areswitching; Data bus inputs are stable
IDD3P 9 9 9 9 mA 8
Active power-down standby current: Clock stopped; 1 bank ac-tive; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Addressand control inputs are switching; Data bus inputs are stable
IDD3PS 9 9 9 9 mA
Active nonpower-down standby: 1 bank active; CKE = HIGH; CS= HIGH; tCK = tCK (MIN); Address and control inputs are switch-ing; Data bus inputs are stable
IDD3N 21 21 20 19 mA 6
Active nonpower-down standby: Clock stopped; 1 bank active;CKE = HIGH; CS = HIGH; CK = LOW; CK# = HIGH; Address andcontrol inputs are switching; Data bus inputs are stable
IDD3NS 18 18 17 15 mA 6
Operating burst read: 1 bank active; BL = 4; tCK = tCK (MIN);Continuous READ bursts; Iout = 0mA; Address inputs areswitching every 2 clock cycles; 50% data changing each burst
IDD4R 130 125 115 105 mA 6
Operating burst write: 1 bank active; BL = 4; tCK = tCK (MIN);Continuous WRITE bursts; Address inputs are switching; 50%data changing each burst
IDD4W 130 125 115 105 mA 6
Auto refresh: Burst refresh; CKE = HIGH; Ad-dress and control inputs are switching; Databus inputs are stable
tRFC = 138ns IDD5 170 170 170 170 mA 10tRFC = tREFI IDD5A 13 13 13 13 mA 10, 11
Deep power-down current: Address and control balls are sta-ble; Data bus inputs are stable
IDD8 15 15 15 15 μA 7, 13
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – IDD Parameters
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Table 10: IDD Specifications and Conditions, –40°C to +105°C (x32)
Notes 1–5 apply to all the parameters/conditions in this table; VDD/VDDQ = 1.70–1.95V
Parameter/Condition Symbol
Max
Unit Notes-5 -54 -6 -75
Operating 1 bank active precharge current: tRC = tRC (MIN); tCK= tCK (MIN); CKE is HIGH; CS is HIGH between valid commands;Address inputs are switching every 2 clock cycles; Data bus in-puts are stable
IDD0 100 100 80 70 mA 6
Precharge power-down standby current: All banks idle; CKE isLOW; CS is HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2P 1500 1500 1500 1500 μA 7, 8
Precharge power-down standby current: Clock stopped; Allbanks idle; CKE is LOW; CS is HIGH, CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2PS 1500 1500 1500 1500 μA 7
Precharge nonpower-down standby current: All banks idle; CKE= HIGH; CS = HIGH; tCK = tCK (MIN); Address and control inputsare switching; Data bus inputs are stable
IDD2N 19 19 19 16 mA 9
Precharge nonpower-down standby current: Clock stopped; Allbanks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH; Ad-dress and control inputs are switching; Data bus inputs are sta-ble
IDD2NS 13 13 12 12 mA 9
Active power-down standby current: 1 bank active; CKE = LOW;CS = HIGH; tCK = tCK (MIN); Address and control inputs areswitching; Data bus inputs are stable
IDD3P 9 9 9 9 mA 8
Active power-down standby current: Clock stopped; 1 bank ac-tive; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Addressand control inputs are switching; Data bus inputs are stable
IDD3PS 9 9 9 9 mA
Active nonpower-down standby: 1 bank active; CKE = HIGH; CS= HIGH; tCK = tCK (MIN); Address and control inputs are switch-ing; Data bus inputs are stable
IDD3N 21 21 20 19 mA 6
Active nonpower-down standby: Clock stopped; 1 bank active;CKE = HIGH; CS = HIGH; CK = LOW; CK# = HIGH; Address andcontrol inputs are switching; Data bus inputs are stable
IDD3NS 18 18 17 15 mA 6
Operating burst read: 1 bank active; BL = 4; CL = 3; tCK = tCK(MIN); Continuous READ bursts; Iout = 0mA; Address inputs areswitching every 2 clock cycles; 50% data changing each burst
IDD4R 150 145 140 120 mA 6
Operating burst write: One bank active; BL = 4; tCK = tCK(MIN); Continuous WRITE bursts; Address inputs are switching;50% data changing each burst
IDD4W 150 145 140 120 mA 6
Auto refresh: Burst refresh; CKE = HIGH; Ad-dress and control inputs are switching; Databus inputs are stable
tRFC = 138ns IDD5 170 170 170 170 mA 10tRFC = tREFI IDD5A 13 13 13 13 mA 10, 11
Deep power-down current: Address and control pins are stable;Data bus inputs are stable
IDD8 15 15 15 15 μA 7, 13
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – IDD Parameters
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Table 11: IDD6 Specifications and Conditions
Notes 1–5, 7, and 12 apply to all the parameters/conditions in this table; VDD/VDDQ = 1.70–1.95VParameter/Condition Symbol Value Units
Self refresh:CKE = LOW; tCK = tCK (MIN); Address and control inputsare stable; Data bus inputs are stable
Full array, 105˚C IDD6 n/a14 μAFull array, 85˚C 2000 μAFull array, 45˚C 900 μA1/2 array, 85˚C 1450 μA1/2 array, 45˚C 700 μA1/4 array, 85˚C 1230 μA1/4 array, 45˚C 600 μA1/8 array, 85˚C 1090 μA1/8 array, 45˚C 575 μA1/16 array, 85˚C 1020 μA1/16 array, 45˚C 550 μA
Notes: 1. All voltages referenced to VSS.2. Tests for IDD characteristics may be conducted at nominal supply voltage levels, but the
related specifications and device operation are guaranteed for the full voltage rangespecified.
3. Timing and IDD tests may use a VIL-to-VIH swing of up to 1.5V in the test environment,but input timing is still referenced to VDDQ/2 (or to the crossing point for CK/CK#). Theoutput timing reference voltage level is VDDQ/2.
4. IDD is dependent on output loading and cycle rates. Specified values are obtained withminimum cycle time with the outputs open.
5. IDD specifications are tested after the device is properly initialized and values are aver-aged at the defined cycle rate.
6. MIN (tRC or tRFC) for IDD measurements is the smallest multiple of tCK that meets theminimum absolute value for the respective parameter. tRASmax for IDD measurements isthe largest multiple of tCK that meets the maximum absolute value for tRAS.
7. Measurement is taken 500ms after entering into this operating mode to provide settlingtime for the tester.
8. VDD must not vary more than 4% if CKE is not active while any bank is active.9. IDD2N specifies DQ, DQS, and DM to be driven to a valid high or low logic level.
10. CKE must be active (HIGH) during the entire time a REFRESH command is executed.From the time the AUTO REFRESH command is registered, CKE must be active at eachrising clock edge until tRFC later.
11. This limit is a nominal value and does not result in a fail. CKE is HIGH during REFRESHcommand period (tRFC (MIN)) else CKE is LOW (for example, during standby).
12. Values for IDD6 85˚C are guaranteed for the entire temperature range. All other IDD6 val-ues are estimated.
13. Typical values at 25˚C, not a maximum value.14. Self refresh is not supported for AT (85˚C to 105˚C) operation.
Preliminary
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Figure 17: Typical Self Refresh Current vs. Temperature
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
–45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85
Cu
rren
t [μ
A]
Temperature °C
Full Array
1/2 Array
1/4 Array
1/8 Array
1/16 Array
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – IDD Parameters
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Electrical Specifications – AC Operating Conditions
Table 12: Electrical Characteristics and Recommended AC Operating Conditions
Notes 1–9 apply to all the parameters in this table; VDD/VDDQ = 1.70–1.95V
Parameter Symbol
-5 -54 -6 -75
Unit NotesMin Max Min Max Min Max Min Max
Access window ofDQ from CK/CK#
CL = 3 tAC 2.0 5.0 2.0 5.0 2.0 5.0 2.0 6.0 ns
CL = 2 2.0 6.5 2.0 6.5 2.0 6.5 2.0 6.5
Clock cycle time CL = 3 tCK 5.0 – 5.4 – 6 – 7.5 – ns 10
CL = 2 12 – 12 – 12 – 12 –
CK high-level width tCH 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK
CK low-level width tCL 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK
CKE minimum pulse width(high and low)
tCKE 1 – 1 – 1 – 1 – tCK 11
Auto precharge write re-covery + precharge time
tDAL – – – – – – – – – 12
DQ and DM input holdtime relative to DQS (fastslew rate)
tDHf 0.48 – 0.54 – 0.6 – 0.8 – ns 13, 14,15
DQ and DM input holdtime relative to DQS (slowslew rate)
tDHs 0.58 – 0.64 – 0.7 – 0.9 – ns
DQ and DM input setuptime relative to DQS (fastslew rate)
tDSf 0.48 – 0.54 – 0.6 – 0.8 – ns 13, 14,15
DQ and DM input setuptime relative to DQS (slowslew rate)
tDSs 0.58 – 0.64 – 0.7 – 0.9 – ns
DQ and DM input pulsewidth (for each input)
tDIPW 1.8 – 1.9 – 2.1 – 1.8 – ns 16
Access window ofDQS from CK/CK#
CL = 3 tDQSCK 2.0 5.0 2.0 5.0 2.0 5.0 2.0 6.0 ns
CL = 2 2.0 6.5 2.0 6.5 2.0 6.5 2.0 6.5 ns
DQS input high pulsewidth
tDQSH 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK
DQS input low pulsewidth
tDQSL 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK
DQS–DQ skew, DQS to lastDQ valid, per group, peraccess
tDQSQ – 0.4 – 0.45 – 0.45 – 0.6 ns 13, 17
WRITE command to firstDQS latching transition
tDQSS 0.75 1.25 0.75 1.25 0.75 1.25 0.75 1.25 tCK
DQS falling edge from CKrising – hold time
tDSH 0.2 – 0.2 – 0.2 – 0.2 – tCK
DQS falling edge to CKrising – setup time
tDSS 0.2 – 0.2 – 0.2 – 0.2 – tCK
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – AC Operating Conditions
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Table 12: Electrical Characteristics and Recommended AC Operating Conditions (Continued)
Notes 1–9 apply to all the parameters in this table; VDD/VDDQ = 1.70–1.95V
Parameter Symbol
-5 -54 -6 -75
Unit NotesMin Max Min Max Min Max Min Max
Data valid output window(DVW)
n/a tQH - tDQSQ tQH - tDQSQ tQH - tDQSQ tQH - tDQSQ ns 17
Half-clock period tHP tCH,tCL
– tCH,tCL
– tCH,tCL
– tCH,tCL
– ns 18
Data-out High-Zwindow fromCK/CK#
CL = 3 tHZ – 5.0 – 5.0 – 5.5 – 6.0 ns 19, 20
CL = 2 – 6.5 – 6.5 – 6.5 – 6.5 ns
Data-out Low-Z windowfrom CK/CK#
tLZ 1.0 – 1.0 – 1.0 – 1.0 – ns 19
Address and control inputhold time (fast slew rate)
tIHF 0.9 – 1.0 – 1.1 – 1.3 – ns 15, 21
Address and control inputhold time (slow slew rate)
tIHS 1.1 – 1.2 – 1.3 – 1.5 – ns
Address and control inputsetup time (fast slew rate)
tISF 0.9 – 1.0 – 1.1 – 1.3 – ns 15, 21
Address and control inputsetup time (slow slewrate)
tISS 1.1 – 1.2 – 1.3 – 1.5 – ns
Address and control inputpulse width
tIPW 2.3 – 2.5 – 2.6 – tIS +tIH
– ns 16
LOAD MODE REGISTERcommand cycle time
tMRD 2 – 2 – 2 – 2 – tCK
DQ–DQS hold, DQS to firstDQ to go nonvalid, per ac-cess
tQH tHP -tQHS
– tHP -tQHS
– tHP -tQHS
– tHP -tQHS
– ns 13, 17
Data hold skew factor tQHS – 0.5 – 0.5 – 0.65 – 0.75 ns
ACTIVE-to-PRECHARGEcommand
tRAS 40 70,000 42 70,000 42 70,000 45 70,000 ns 22
ACTIVE to ACTIVE/ACTIVEto AUTO REFRESH com-mand period
tRC 55 – 58.2 – 60 – 67.5 – ns 23
Active to read or write de-lay
tRCD 15 – 16.2 – 18 – 22.5 – ns
Refresh period tREF – 64 – 64 – 64 – 64 ms 29
Average periodic refreshinterval: 64Mb, 128Mb,and 256Mb (x32)
tREFI – 15.6 – 15.6 – 15.6 – 15.6 μs 29
Average periodic refreshinterval: 256Mb, 512Mb,1Gb, 2Gb
tREFI – 7.8 – 7.8 – 7.8 – 7.8 μs 29
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – AC Operating Conditions
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Table 12: Electrical Characteristics and Recommended AC Operating Conditions (Continued)
Notes 1–9 apply to all the parameters in this table; VDD/VDDQ = 1.70–1.95V
Parameter Symbol
-5 -54 -6 -75
Unit NotesMin Max Min Max Min Max Min Max
AUTO REFRESH commandperiod
tRFC 72 – 72 – 72 – 72 – ns
PRECHARGE command pe-riod
tRP 15 – 16.2 – 18 – 22.5 – ns
DQS read preamble CL = 3 tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 0.9 1.1 tCK
CL = 2 tRPRE 0.5 1.1 0.5 1.1 0.5 1.1 0.5 1.1 tCK
DQS read postamble tRPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK
Active bank a to activebank b command
tRRD 10 – 10.8 – 12 – 15 – ns
Read of SRR to next validcommand
tSRC CL + 1 – CL + 1 – CL + 1 – CL + 1 – tCK
SRR to read tSRR 2 – 2 – 2 – 2 – tCK
Internal temperature sen-sor valid temperature out-put enable
tTQ 2 – 2 – 2 – 2 – ms
DQS write preamble tWPRE 0.25 – 0.25 – 0.25 – 0.25 – tCK
DQS write preamble setuptime
tWPRES 0 – 0 – 0 – 0 – ns 24, 25
DQS write postamble tWPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK 26
Write recovery time tWR 15 – 15 – 15 – 15 – ns 27
Internal WRITE-to-READcommand delay
tWTR 2 – 2 – 1 – 1 – tCK
Exit power-down mode tofirst valid command
tXP 2 – 2 – 1 – 1 – tCK
Exit self refresh to firstvalid command
tXSR 112.5 – 112.5 – 112.5 – 112.5 – ns 28
Notes: 1. All voltages referenced to VSS.2. All parameters assume proper device initialization.3. Tests for AC timing and electrical AC and DC characteristics may be conducted at nomi-
nal supply voltage levels, but the related specifications and device operation are guar-anteed for the full voltage ranges specified.
4. The circuit shown below represents the timing reference load used in defining the rele-vant timing parameters of the device. It is not intended to be either a precise represen-tation of the typical system environment or a depiction of the actual load presented bya production tester. System designers will use IBIS or other simulation tools to correlatethe timing reference load to system environment. Specifications are correlated to pro-duction test conditions (generally a coaxial transmission line terminated at the testerelectronics). For the half-strength driver with a nominal 10pF load, parameters tAC andtQH are expected to be in the same range. However, these parameters are not subject toproduction test but are estimated by design/characterization. Use of IBIS or other simu-
Preliminary
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lation tools for system design validation is suggested.
I/O20pF
I/O10pF
Full drive strength Half drive strength
50 50
5. The CK/CK# input reference voltage level (for timing referenced to CK/CK#) is the pointat which CK and CK# cross; the input reference voltage level for signals other thanCK/CK# is VDDQ/2.
6. A CK and CK# input slew rate ≥1 V/ns (2 V/ns if measured differentially) is assumed forall parameters.
7. All AC timings assume an input slew rate of 1 V/ns.8. CAS latency definition: with CL = 2, the first data element is valid at (tCK + tAC) after the
clock at which the READ command was registered; for CL = 3, the first data element isvalid at (2 × tCK + tAC) after the first clock at which the READ command was registered.
9. Timing tests may use a VIL-to-VIH swing of up to 1.5V in the test environment, but inputtiming is still referenced to VDDQ/2 or to the crossing point for CK/CK#. The output tim-ing reference voltage level is VDDQ/2.
10. Clock frequency change is only permitted during clock stop, power-down, or self refreshmode.
11. In cases where the device is in self refresh mode for tCKE, tCKE starts at the rising edgeof the clock and ends when CKE transitions HIGH.
12. tDAL = (tWR/tCK) + (tRP/tCK): for each term, if not already an integer, round up to thenext highest integer.
13. Referenced to each output group: for x16, LDQS with DQ[7:0]; and UDQS with DQ[15:8].For x32, DQS0 with DQ[7:0]; DQS1 with DQ[15:8]; DQS2 with DQ[23:16]; and DQS3 withDQ[31:24].
14. DQ and DM input slew rates must not deviate from DQS by more than 10%. If theDQ/DM/DQS slew rate is less than 1.0 V/ns, timing must be derated: 50ps must be addedto tDS and tDH for each 100 mV/ns reduction in slew rate. If the slew rate exceeds 4 V/ns,functionality is uncertain.
15. The transition time for input signals (CAS#, CKE, CS#, DM, DQ, DQS, RAS#, WE#, and ad-dresses) are measured between VIL(DC) to VIH(AC) for rising input signals and VIH(DC) toVIL(AC) for falling input signals.
16. These parameters guarantee device timing but are not tested on each device.17. The valid data window is derived by achieving other specifications: tHP (tCK/2), tDQSQ,
and tQH (tHP - tQHS). The data valid window derates directly proportional with the clockduty cycle and a practical data valid window can be derived. The clock is provided amaximum duty cycle variation of 45/55. Functionality is uncertain when operating be-yond a 45/55 ratio.
18. tHP (MIN) is the lesser of tCL (MIN) and tCH (MIN) actually applied to the device CK andCK# inputs, collectively.
19. tHZ and tLZ transitions occur in the same access time windows as valid data transitions.These parameters are not referenced to a specific voltage level, but specify when thedevice output is no longer driving (tHZ) or begins driving (tLZ).
20. tHZ (MAX) will prevail over tDQSCK (MAX) + tRPST (MAX) condition.21. Fast command/address input slew rate ≥1 V/ns. Slow command/address input slew rate
≥0.5 V/ns. If the slew rate is less than 0.5 V/ns, timing must be derated: tIS has an addi-tional 50ps per each 100 mV/ns reduction in slew rate from the 0.5 V/ns. tIH has 0ps add-ed, therefore, it remains constant. If the slew rate exceeds 4.5 V/ns, functionality is un-certain.
22. READs and WRITEs with auto precharge must not be issued until tRAS (MIN) can be satis-fied prior to the internal PRECHARGE command being issued.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMElectrical Specifications – AC Operating Conditions
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23. DRAM devices should be evenly addressed when being accessed. Disproportionate ac-cesses to a particular row address may result in reduction of the product lifetime.
24. This is not a device limit. The device will operate with a negative value, but system per-formance could be degraded due to bus turnaround.
25. It is recommended that DQS be valid (HIGH or LOW) on or before the WRITE command.The case shown (DQS going from High-Z to logic low) applies when no WRITEs werepreviously in progress on the bus. If a previous WRITE was in progress, DQS could beHIGH during this time, depending on tDQSS.
26. The maximum limit for this parameter is not a device limit. The device will operate witha greater value for this parameter, but system performance (bus turnaround) will de-grade accordingly.
27. At least 1 clock cycle is required during tWR time when in auto precharge mode.28. Clock must be toggled a minimum of two times during the tXSR period.29. For the Automotive Temperature parts, tREF = tREF /2 and tREF I = tREF I/2 .
Preliminary
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Output Drive Characteristics
Table 13: Target Output Drive Characteristics (Full Strength)
Notes 1–2 apply to all values; characteristics are specified under best and worst process variations/conditions
Voltage (V)
Pull-Down Current (mA) Pull-Up Current (mA)
Min Max Min Max
0.00 0.00 0.00 0.00 0.00
0.10 2.80 18.53 –2.80 –18.53
0.20 5.60 26.80 –5.60 –26.80
0.30 8.40 32.80 –8.40 –32.80
0.40 11.20 37.05 –11.20 –37.05
0.50 14.00 40.00 –14.00 –40.00
0.60 16.80 42.50 –16.80 –42.50
0.70 19.60 44.57 –19.60 –44.57
0.80 22.40 46.50 –22.40 –46.50
0.85 23.80 47.48 –23.80 –47.48
0.90 23.80 48.50 –23.80 –48.50
0.95 23.80 49.40 –23.80 –49.40
1.00 23.80 50.05 –23.80 –50.05
1.10 23.80 51.35 –23.80 –51.35
1.20 23.80 52.65 –23.80 –52.65
1.30 23.80 53.95 –23.80 –53.95
1.40 23.80 55.25 –23.80 –55.25
1.50 23.80 56.55 –23.80 –56.55
1.60 23.80 57.85 –23.80 –57.85
1.70 23.80 59.15 –23.80 –59.15
1.80 – 60.45 – –60.45
1.90 – 61.75 – –61.75
Notes: 1. Based on nominal impedance of 25Ω (full strength) at VDDQ/2.2. The full variation in driver current from minimum to maximum, due to process, voltage,
and temperature, will lie within the outer bounding lines of the I-V curves.
Preliminary
2Gb: x16, x32 Automotive LPDDR SDRAMOutput Drive Characteristics
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Table 14: Target Output Drive Characteristics (Three-Quarter Strength)
Notes 1–3 apply to all values; characteristics are specified under best and worst process variations/conditions
Voltage (V)
Pull-Down Current (mA) Pull-Up Current (mA)
Min Max Min Max
0.00 0.00 0.00 0.00 0.00
0.10 1.96 12.97 –1.96 –12.97
0.20 3.92 18.76 –3.92 –18.76
0.30 5.88 22.96 –5.88 –22.96
0.40 7.84 25.94 –7.84 –25.94
0.50 9.80 28.00 –9.80 –28.00
0.60 11.76 29.75 –11.76 –29.75
0.70 13.72 31.20 –13.72 –31.20
0.80 15.68 32.55 –15.68 –32.55
0.85 16.66 33.24 –16.66 –33.24
0.90 16.66 33.95 –16.66 –33.95
0.95 16.66 34.58 –16.66 –34.58
1.00 16.66 35.04 –16.66 –35.04
1.10 16.66 35.95 –16.66 –35.95
1.20 16.66 36.86 –16.66 –36.86
1.30 16.66 37.77 –16.66 –37.77
1.40 16.66 38.68 –16.66 –38.68
Recommended