06 3M Technical Presentation - smp- · PDF fileGear grinding Surface ... For finishing:...

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…..grinding redefined…

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PRECISIONDefinition of Grinding

German DIN Standard 8580

Grinding = Machining with geometrically undefinedcutting edges

Milling / Turning = Machining with geometricallydefined cutting edges

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(made of PSG = Precision Shaped Grain)

DIN definition of grinding is no longer valid!

New = Grinding can be machining with geometrically defined cutting edges

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grinding wheel structure

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PRECISIONWheel structure

Standard Ceramic Structure Structure

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PRECISION Shape of grain

Standard Ceramic

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PRECISIONCutting Behavior

of Conventional Abrasive Grains

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Chip Formation withCubitronTM II Grinding Wheels

Idealized image

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PRECISIONFlowing Chips

Grinding swarf that looks like the chips generated by turning ormilling operations.

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Chips generated with CubitronTM II Grinding

Wheels

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Economic factor: Universality

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Economic factor: Universality

fewer tool changing = less down timefew wheel specs = lower stock keeping cost

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Specification guide: OD grinding

5 specifications

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Specification guide: ID and Centerless

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Economic benefit: Grinding performance

• Up to 4x higher removal rates• Half of the grinding time – high energy

efficiency• Half amount of dressing

Energy costEfficiency

Hig

h

Low

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PRECISIONParameters :

• Surface speed vc (m/s)

• Feed-rate vw (mm/min)

• Speed ratio (wheel – workpiece) qs

• Dressing: Overlap ratio ud

• Specific material removal rate (Q-prime) Q‘w(mm3/mm/sec)

• Specific chip volume V‘w (mm3/mm)

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PRECISIONSurface speed vc

Gear grinding

Surface grinding

Cylindrical grinding

30-35m/sOD 45-80m/sID 45-80m/s30-45m/s

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Range of speed ratios qs

OD, ID, OD, ID, Surface,CL grinding

Critical range

burning

Creep-feed grinding

Speed ratio qs =Vc / Vw

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Dressing BehaviorStandard Ceramic versus CubitronTM II

Idealized image

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PRECISIONDressing Strategy

For roughing:Overlap ratio ud = 1, synchronous 0.6

For finishing:Overlap ratio ud = 4 to 6, asynchronous – 0.6 to – 0.8

Dressing interval compared to standard ceramic abrasives:Rule of thumb: 2 x more parts between dressing cycles, at 50% dressing depth

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Specific Material RemovalRate Q‘w

Q’w as performance factor

Materialremoval in mm3 per mmwheel width per second

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Q`w Values for Cubitron II (30%)

• OD grinding: 5-20 mm3/mm/s

• ID-grinding: 8-15 mm3/mm/s

• Centerless : 15-60 mm3/mm/s

• Surface grinding: 5-20 mm3/mm/s

• Gear grinding: 16-30 mm3/mm/s

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Economic and Quality Benefits of CubitronTM II

• No grinding burn if used properly

• Constant surface finish

• Half of standard grinding time

• Half of dressing amounts

• Half the number of dressing cycles

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• The next part– Blaser Swisslube Microbiology